KR101002305B1 - Film package mounted chip and liquid crystal display module using the same - Google Patents

Abstract

The present invention relates to a chip mounted film package (TCP or COF) in which an output channel is increased within a range that does not increase manufacturing cost, and a liquid crystal display module using the same.

The chip mounted film package of the present invention has at least 618 or 624 output pads on a base film having a width of at least 48 mm as the output pads connected to the output pins of the driving integrated circuit are formed to have a pitch of at least 45 μm. Done.

Description

Chip-mounted film package and liquid crystal display module using same {FILM PACKAGE MOUNTED CHIP AND LIQUID CRYSTAL DISPLAY MODULE USING THE SAME}             

1 is a plan view showing a rear structure of a conventional liquid crystal display module.

2 is a plan view specifically showing the data TCP (or COF) shown in FIG.

3 is a plan view illustrating a rear structure of a liquid crystal display module according to an exemplary embodiment of the present invention;

4 is a plan view specifically showing the data TCP (or COF) shown in FIG.

5 is a block diagram showing a detailed configuration of the data D-IC shown in FIG.

FIG. 6 is a block diagram showing another detailed configuration of the data D-IC shown in FIG. 4; FIG.

<Description of Symbols for Main Parts of Drawings>

10, 40: liquid crystal panel 12, 42: data TCP (or COF)

14, 44, 70, 100: Data D-IC 16, 46: Gate TCP (or COF)

18, 48: gate D-IC 20, 60: data PCB

22, 62: Gate PCB

32, 52: dummy areas 34, 54: sprocket holes

IP: input pad OP: output pad                 

CL: cutting line 72, 102: shift register

74, 104: First latch portion 76, 108: MUX1 portion

78, 106: second latch portion 80, 112: DAC portion

82, 114: Output buffer section 84, 110: MUX2 section

116: MUX part 3 118: DEMUX part

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display module, and more particularly, to a chip mounted film package capable of reducing the number of data drive integrated circuits by increasing the number of output channels within a range that does not increase manufacturing cost, and a liquid crystal display module using the same. will be.

The liquid crystal display displays an image by adjusting the light transmittance of the liquid crystal having dielectric anisotropy using an electric field. To this end, the liquid crystal display device includes a liquid crystal display panel for displaying an image and a driving circuit for driving the liquid crystal display panel.

In a liquid crystal display panel, liquid crystal cells arranged in a matrix form display an image by adjusting light transmittance according to a pixel signal.

The driving circuit may include a gate driver for driving gate lines of the liquid crystal display panel, a data driver for driving data lines, a timing controller for controlling driving timing of the gate driver and the data driver, and the liquid crystal display panel and the driving circuit. And a power supply unit supplying power signals required for driving.

The data driver and the gate driver are separated into a plurality of drive integrated circuits (D-ICs). Each of the D-ICs is mounted on an open IC area of a Tape Carrier Package (hereinafter referred to as TCP) or mounted on a base film in a Chip On Film (hereinafter referred to as COF) scheme and is tape automated. It is electrically connected to the liquid crystal display panel by a tape automated bonding (hereinafter referred to as TAB) method. Alternatively, the D-IC may be directly mounted on the liquid crystal display panel using a chip on glass (COG) method. Among them, the TAB method is mainly used because the liquid crystal display panel can secure a relatively wide pixel matrix area and an easy attachment process.

FIG. 1 shows a data TCP (or COF) 12 and a gate D-IC 18 connected between the data PCB 20 and the liquid crystal display panel 10 by mounting the data D-IC 14. A gate TCP (or COF) 16 connected between the gate PCB 22 and the liquid crystal display panel 10 is provided.

The liquid crystal display panel 10 is formed by bonding a thin film transistor array substrate and a color filter array substrate to each other with a liquid crystal interposed therebetween. The liquid crystal display panel includes liquid crystal cells defined by intersections of gate lines and data lines, and each of the liquid crystal cells includes a thin film transistor that is a switch element. The thin film transistor supplies the pixel signal from the data line to the liquid crystal cell in response to the scan signal from the gate line.                         

The data D-IC 14 is connected to the data line of the liquid crystal display panel 10 via the data TCP (or COF) 12. The data D-IC 14 converts digital pixel data from an external timing controller (not shown) into an analog pixel signal and supplies it to a data line.

The gate D-IC 18 is connected to the gate line of the liquid crystal display panel 10 through the gate TCP (or COF) 16. The gate D-IC 10 supplies the turn-on voltage (gate high voltage VGH) of the thin film transistor to the gate line in the corresponding scan period, and the turn-off voltage (gate off voltage ( GL)).

The data TCP (or COF) 12 and gate TCP (or COF) 16 shown in FIG. 1 are formed on a polyimide roll type base film and then molded in a cutting process.

For example, the data TCP (or COF) 12 is formed on the roll type base film 32 as shown in FIG. On this data TCP (or COF) 12, a data D-IC 14 is mounted, and a plurality of input pads IP connected to the input pins of the data D-IC 14, and connected to the output pins. A plurality of output pads OP is formed. Here, the input pad IP and the output pad OP of the data TCP (or COF) 12 are usually stretched (not shown) to the base film outside the cutting line CL. This is to check whether the data D-IC 14 is defective in the state where the data TCP (or COF) 12 is not molded. And in order to convey the base film 32 and determine a conveyance position, the sprocket hole 34 is formed in the both sides of the base film 32. As shown in FIG. The data TCP (or COF) 12 formed on the base film 32 is molded in a cutting process in which the base film 32 is cut off the cutting line CL. The molded data TCP (or COF) 12 is attached to the liquid crystal display panel 10 shown in FIG. 1 through an anisotropic conductive film (hereinafter referred to as ACF) and to the data PCB 20.

On the other hand, the data TCP (or COF) 12 is formed to have a 384 output channel on the base film 32 having a line width of 35 mm in general, in view of the manufacturing cost. Since the 384 output channels of the data TCP (or COF) 12 correspond to the output channels of the data D-IC 14, the number of uses of the data D-IC 14, which is a relatively high unit cost, for manufacturing cost reduction. It is necessary to increase the number of output channels thereof in order to reduce the power.

For example, in the case of XGA resolution having a size of 1024 × 768, 3072 data lines are formed in the liquid crystal display panel 10 in consideration of including R, G, and B subpixels per pixel. When these 3072 data lines are driven by the data D-IC 12 of the 384 output channel shown in FIG. 2, the liquid crystal display panel 10 shown in FIG. 1 has eight data D- of each (3072/384). IC 14 and data TCP (or COF) 12 must be provided. Here, as the unit costs of the data D-IC 14 and the data TCP (or COF) 12 are relatively high, a method of reducing their number of uses is required to reduce manufacturing costs.

By the way, the data D-IC 14 includes a digital-to-analog converter (DAC) proportional to the number of data lines in order to convert 6-bit or 8-bit pixel data supplied per data line into an analog pixel signal. . Accordingly, when the output channel of the data D-IC 14 is increased, the corresponding chip size is increased, and the size of the data TCP (or COF) 12 on which the data D-IC 14 is mounted is also increased. Will increase. However, when the size of TCP (or COF) or COF is increased, the cost is relatively high compared to the area, and thus, the manufacturing cost is further increased when the number of output channels is increased.

In order to solve this disadvantage, a method of increasing the output channel per unit area by reducing the pitch between the output pads in TCP (or COF) can be considered. However, the limitation in reducing the output pad pitch (P1) in consideration of reliability and manufacturing process variation is considered. There is. In addition, the effective area occupied by the data TCP (or COF) is further reduced by the dummy area where the sprocket hole is formed on the base TCP (or COF).

For example, the effective area occupied by the data TCP (or COF) 12 even on the base TCP 30 of the 35 mm standard as shown in FIG. 2 is further reduced by the dummy area in which the sprocket hole 34 is formed, which is about 27 mm. It has width. As a result, the data TCP (or COF) 12 having the effective width of 27 mm shown in FIG. 2 increases the 384 output pads OP, that is, the output channels formed with a pitch P1 of about 60 μm. There is no limit.

Therefore, there is a need for a method of setting the size of TCP (or COF) or COF in a range that does not increase the manufacturing cost of the liquid crystal display panel, and increasing the output channel in the size range.

Accordingly, it is an object of the present invention to provide a chip mounted film package (TCP or COF) with an increased output channel within a range that does not increase manufacturing costs and a liquid crystal display module using the same.

In order to achieve the above objects, the chip mounted film package according to the present invention comprises: input pads connected to input pins of a driving integrated circuit; And output pads connected to the output pins of the driving integrated circuit and having a pitch of at least 45 [mu] m.

The pitch of the bump connecting the output pin of the drive integrated circuit and the output pad is made small so that the output pad has a pitch of at least about 45 μm.

The film package is formed on a base film having a width of at least 48 mm and has at least 618 or 624 output pads.

The liquid crystal display module according to the present invention includes the film package mounted with a driving chip for driving a pixel matrix and connected to a liquid crystal display panel having the pixel matrix.

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.

The present applicant discloses a data D-IC for time-divisionally driving a data line through Patent Application No. 2002-41769, and proposes a method of reducing the number of uses of the D-IC by at least 1/2. By the way, while the number of data D-ICs has been reduced to 1/2, the output channel has been doubled to increase the area occupied by the output pads, thereby requiring TCP having a larger standard than that of the existing 35 mm standard. However, when using the 70mm TCP instead of the existing 35mm TCP that can form 384 output channels, the number of data D-IC and TCP can be reduced by half, while the manufacturing cost increases. The cost savings are inadequate.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 6.

3 illustrates a base film on which a TCP (or COF) 42 is formed according to an embodiment of the present invention.

The TCP (or COF) 42 shown in FIG. 4 is formed on a roll type base film 52. On this TCP (or COF) 42, a D-IC 44 is mounted, a plurality of input pads (IP) connected to the input pins of the D-IC 44, and a plurality of outputs connected to the output pins. The pad OP is formed. Here, the input pad IP and the output pad OP of the TCP (or COF) 42 are usually stretched (not shown) to the base film outside the cutting line CL. This is to check whether the D-IC 44 is defective while the TCP (or COF) 42 is not molded. And sprocket holes 54 are formed in both sides of the base film 52 in order to convey the base film 52 and to determine the conveyance position. The TCP (or COF) 42 formed on the base film 52 is formed by a cutting process of cutting the base film 52 along the cutting line CL. The molded TCP (or COF) 42 is attached to the liquid crystal display panel and the PCB through an anisotropic conductive film (ACF).

In particular, the base film 52 shown in Figure 4 has a width of about 48mm larger than the conventional 35mm. In the base film 52 having a width of 48 mm, a TCP (or COF) 42 having 618 to 624 channels may be formed together with the D-IC 44. This is because the pitch P2 of the output pad OP is adjusted to a fine pitch within 45 μm in the manufacturing process of the TCP (or COF) 42 and the assembly process of the TCP (or COF) 42. It is possible by setting.

The output pad OP having a pitch P2 within 45 μm is possible by reducing the short or open defect rate by strengthening a cleaning process for removing foreign matter in the manufacturing and assembly process of the TCP 42. To this end, an ashing process of removing foreign matters using an oxygen plasma may be added as a cleaning process. In addition, in the case of patterning the output pad OP, it is possible to reduce the short or open defect rate caused by adjusting the over etching rate. Alternatively, the pitch P2 of the output pad OP may be reduced by reducing the size of the output pad OP while maintaining the gap between the output pad OP and the pad OP at the existing interval in consideration of short and open defects. Can be reduced. Here, although the design value may be reduced by a method of reducing the size of the output pad OP, a photo for determining the size of the output pad OP in a photolithography process for patterning the output pad OP while maintaining the existing design value. It is also possible by causing the resist to over develop. In addition, the pitch of the output pad OP may be reduced even when the pitch or the size of the bumper connected between the output pad OP and the output pin of the drive IC determines the size and pitch P2 of the output pad OP. P2) can be reduced to within 45 m.

Thus, the TCP (or COF) 42 according to the present invention has 618 to 624 channels by setting the pitch P2 of the output pad OP to within 45 μm on the base film 52 having a width of 48 mm. Accordingly, as shown in FIG. 2, the output channel is increased compared to the case of using the conventional TCP (or COF) 12 having 384 channels on the base film 32 having a width of 35 mm. Alternatively, the number of uses of the CPF) 42 and the D-IC 44 may be reduced.

For example, when the TCP (or COF) 42 according to the present invention is applied to the data TCP (or COF) 42 of the liquid crystal display module 40 shown in FIG.

The liquid crystal display panel 40 of the liquid crystal display module illustrated in FIG. 3 includes a total of 3072 data lines in consideration of including R, G, and B subpixels per pixel when the XGA resolution of 1024 × 768 is used. . In order to drive the 3072 data lines, the liquid crystal display module 40 is driven by five data D-ICs 44 and data when driven with the data D-ICs 44 of the 618 or 624 output channels shown in FIG. 3. It is sufficient to use TCP (or COF) 42. In other words, the liquid crystal display module 40 according to the present invention utilizes 618 or 624 channels of data D-IC 44 and data TCP (or COF) 42 so that 384 channels of 8 as shown in FIG. In the case of using the data D-IC 2 and the data TCP (or COF) 12, the number of uses can be reduced to five, thereby reducing the manufacturing cost of the liquid crystal display module.

In this FIG. 3, the data D-IC 44 is connected to the data line of the liquid crystal display panel 40 via the data TCP (or COF) 42. The data D-IC 44 converts digital pixel data from an external timing controller (not shown) into an analog pixel signal and supplies it to a data line.

The gate D-IC 48 is connected to the gate line of the liquid crystal display panel 10 through the gate TCP (or COF) 46. The gate D-IC 10 supplies the turn-on voltage (gate high voltage VGH) of the thin film transistor to the gate line in the corresponding scan period, and the turn-off voltage (gate off voltage ( GL)).

FIG. 5 shows a configuration of an example 624 channel data D-IC 70 that can be applied to the data D-IC 42 shown in FIG.

The data D-IC 70 shown in FIG. 5 includes a shift register 72 for shifting an input start pulse according to an input clock signal to generate and output a sampling signal, and input pixel data RGB in response to the sampling signal. A multiplexer for outputting input pixel data to an output channel having a polarity determined according to an input polarity control signal between the first and second latch portions 78 and the first and second latch portions 74 and 78 which are latched and output. A multiplexer (hereinafter referred to as MUX) 1 part 76 is provided. The data D-IC 70 includes a DAC unit 80 for converting pixel data from the second latch unit 78 into an analog pixel signal using input gamma voltages, and an analog pixel from the DAC unit 80. An output buffer 82 for buffering and outputting a signal, and a pixel signal from the output buffer 82 to the 624 data lines DL1 to DL624 through an output channel whose polarity is determined according to the polarity control signal. It has a MUX2 part. The data D-IC 70 having such a configuration employs the MUX1 unit 76 and the MUX2 unit 84 controlled according to the polarity control signal with the DAC unit 80 interposed therebetween. The number of P decoders and N decoders constituting can be reduced by half than when using a pair of P and N decoders per data line. Accordingly, the data D-IC 70 shown in FIG. 5 can increase the output channel to 624 without significantly increasing the chip area.

FIG. 6 shows a configuration of a data D-IC 100 of another example 624 channel that can be applied to the data D-IC 42 shown in FIG.

The data D-IC 100 shown in FIG. 6 shifts an input start pulse according to an input clock signal to generate a sampling signal and outputs a sampling signal, and input pixel data RGB in response to the sampling signal. The first and second latch units 104 and 106 for latching and outputting, the MUX1 unit 108 for time division and outputting pixel data from the second latch unit 106, and the pixels time-divided in the MUX1 unit 108 And a MUX2 unit 110 for outputting data to an output channel whose polarity is determined according to an input polarity control signal. The data D-IC 100 converts the pixel data from the MUX2 unit 110 into an analog pixel signal using input gamma voltages, and the analog pixel signal from the DAC unit 112. An output buffer section 114 for buffering and outputting, a MUX3 section 116 for supplying a pixel signal from the output buffer section 114 to an output channel whose polarity is determined according to the polarity control signal, and the MUX3 section 116. And a DEMUX unit 118 for time-division-dividing the pixel signal from and supplying the divided data to the data lines DL1 to DL624 of the 624 channel. The data D-IC 100 having such a configuration employs the MUX1 unit 106 and the DEMUX unit 118 to time-divisionally drive the pixel data to thereby show the number of P decoders and N decoders constituting the DAC unit 112. You can cut it in half. Accordingly, the data D-IC 70 shown in FIG. 6 can increase the output channel to 624 without significantly increasing the chip area.

As described above, the chip-mounted film package (TCP or COF) according to the present invention has a pitch P2 of the output pad OP within 45 μm by a fine pitch process on a base film having a width of 48 mm by a fine process application. By setting, it is possible to form 618 to 624 output channels. Accordingly, the liquid crystal display module using the chip mounted film package (TCP or COF) according to the present invention can reduce the number of necessary TCP (or COF) and D-IC. Further, the liquid crystal display module using the chip mounted film package (TCP or COF) according to the present invention can improve the productivity and quality per unit process by reducing the number of TCP (or COF) and D-IC.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (5)

In the film package mounting the drive integrated circuit, The driving integrated circuit A shift register for generating and outputting a sampling signal, First and second latch units for latching and outputting input pixel data in response to the sampling signal; A multiplexer for outputting input pixel data to an output channel having a polarity determined according to an input polarity control signal between the first and second latches; A DAC unit converting pixel data from the second latch unit into an analog pixel signal using input gamma voltages; An output buffer unit for buffering and outputting the analog pixel signal from the DAC unit; Two multiplexers for supplying a pixel signal from the output buffer unit to 618 or 624 data lines through an output channel whose polarity is determined according to the polarity control signal; The film package is Input pads connected to input pins of the driving integrated circuit; And output pads connected to the output pins of the driving integrated circuit and configured to have a pitch within 45 μm. The method of claim 1, And a pitch of bumps connecting the output pins of the driving integrated circuits and the output pads to be smaller so that the output pads have a pitch within 45 µm. The method of claim 1, The film package is A chip-mounted film package formed on a base film having a width within at least 48 mm and having at least 618 or 624 output pads. A plurality of driving integrated circuits for driving the pixel matrix, and A liquid crystal display module comprising a plurality of film packages mounted on the plurality of driving integrated circuits and connected to a liquid crystal display panel having a pixel matrix. Each of the driving integrated circuits is configured to have characteristics of the driving integrated circuit of claim 1, The film package is a liquid crystal display module, characterized in that configured to have the characteristics of at least one of the first to third. The method of claim 4, wherein Each of the driving integrated circuits And a multiplexer unit for time-dividing and outputting pixel data from the first or second latch unit.

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