KR100988554B1 - Work process and system for dispensing resin - Google Patents

Abstract

The resin application system according to the present invention comprises a first transfer means having a first transfer path for substrate transfer, a second transfer means having a second transfer path parallel to the first transfer path for substrate transfer, and a first transfer means. Operation of the head unit by the head unit for applying the resin to the substrate transported along the transport path and the second transport path, the movement unit for moving the head unit, and the substrate transported along the first transport path and the second transport path And a control unit which controls each of the first transfer means and the second transfer means to be paused within the range and then transferred again when the resin application is completed. The control unit controls the head unit such that the head unit alternately applies resin to the stationary substrate on the first transfer path and the stationary substrate on the second transfer path. According to the present invention, since the head unit alternately applies resin to the substrates conveyed along the plurality of transfer paths, the resin coating operation can be executed continuously without waiting time of the head unit.

Description

WORK PROCESS AND SYSTEM FOR DISPENSING RESIN}

The present invention relates to a resin coating system, and more particularly, it is possible to continuously perform a resin coating operation without waiting time by placing a plurality of resin coating zones on which a resin can be applied to a substrate within the operating range of the head for injecting the resin. The present invention relates to a resin application method and a resin application system.

In general, a semiconductor chip is electrically connected to a substrate on which a circuit pattern is formed through a fine conductive member such as a metal ball. When a plurality of metal balls are arranged on one surface of the substrate, the semiconductor chip is placed on the substrate, and heat is applied to the semiconductor chip to be bonded to the substrate while a part of the metal balls are melted. However, since the bonding force between the semiconductor chip and the substrate is weak only by the adhesive force of the metal ball, a viscous resin such as epoxy resin should be applied between the semiconductor chip and the substrate to increase the bonding strength.

When the resin is applied around the semiconductor chip connected to the substrate by the metal balls, the resin penetrates into the space between the semiconductor chip and the substrate by capillary action to fill the space between the metal balls. This process is called underfill, and a resin coating system is used for this underfill process. The resin filling the space between the metal balls not only increases the bonding force between the semiconductor chip and the substrate, but also alleviates external impact, provides insulation, and responds to the thermal stress generated by the difference in thermal expansion coefficient of the materials. It serves to hold chips, metal balls, and substrates reliably.

The resin application system includes a head for injecting a resin onto a target site, which is mounted on a moving device to move the resin back, forth, left, and right to perform the resin application. Since the moving range of the head by the moving device is limited, the substrate is transferred by the conveyor to the operating range of the head. When the resin coating operation is finished, the substrate is transferred back to the unloading position by the conveyor.

By the way, in the conventional resin application system, the resin application area | region in which resin application operation | work is performed by the head is formed on one conveyor, and resin application operation | work cannot be performed continuously. That is, after the resin is applied to the substrate located in the resin application zone, the head is in the standby state while moving the finished substrate to the unloading position and transferring the new substrate to the resin application zone. Therefore, the working time is long and the work is inefficient.

In addition, since the resin injection speed of the head is gradually increased due to the development of the technology, the longer the waiting time of the head, the less the effect of improving the structure of the head.

The present invention is to solve the above problems, by placing a plurality of resin coating area in which the resin is applied to the substrate within the operating range of the head for discharging the resin to execute the resin coating operation continuously without waiting time with one head The purpose of the present invention is to provide a resin coating method and a resin coating system.

Resin coating system according to the present invention for achieving the above object, the first transfer means having a first transfer path for substrate transfer, and the second transfer path having a second transfer path parallel to the first transfer path for substrate transfer A conveying means, a head unit for applying resin to the substrate conveyed along the first conveying path and the second conveying path, a moving unit for moving the head unit, the first conveying path and the second conveying path And a control unit for controlling each of the first transfer means and the second transfer means to pause the substrate to be transferred along a transfer path within an operating range of the head unit and to transfer the resin again when the resin is applied. The control unit controls the head unit such that the head unit alternately applies resin to the substrate stationary on the first transport path and the substrate stationary on the second transport path.

Resin coating system according to the present invention, the first sensing device for detecting the substrate transferred to the operating range of the head unit to stop the substrate conveyed by the first transfer means within the operating range of the head unit, and The apparatus may further include a second sensing device configured to sense the substrate transferred to the operating range of the head unit to stop the substrate transferred by the second transfer means within the operating range of the head unit.

The resin application system according to the present invention is controlled by the control unit, and if the resin-coated substrate is out of the operating range of the head unit along the first conveyance path and the second conveyance path, the first conveyance And a loading unit for loading a new substrate into the means and the second transfer means.

Resin coating system according to the present invention, the first heating means disposed in the first conveying path for heating the substrate conveyed along the first conveying path and the substrate conveyed along the second conveying path It may further include a second main heater disposed in the second transfer path.

Resin coating method according to the present invention for achieving the above object, a) using a first transfer means for transferring the substrate to the first resin coating area of the first transfer path, and b) a head for applying the resin Moving a unit to the first resin application zone to apply resin to the substrate in the first resin application zone, and c) using a second transfer means before the application of resin in the first resin application zone is completed. Transferring the substrate to a second resin application zone in a second transport path arranged in parallel with the first transport path; and d) when the resin is applied in the first resin application zone, the head unit is moved. 2 is applied to the substrate in the second resin coating zone by moving to the resin coating zone, and e) the first transfer path to the substrate on which the resin coating is completed in the first resin coating zone Accordingly, leaving the first resin application zone, and f) transferring the new substrate to the first resin application zone by using the first transfer means before the resin is applied in the second resin application zone. And g) when step d) is completed, moving the head unit to the first resin application zone to apply resin to a substrate waiting in the first resin application zone; and h) the second transfer. And using the means to separate the substrate from which the resin is applied in the second resin application zone from the second resin application zone along the second transfer path.

Here, in step a), when the substrate is transferred to the first resin application zone by using the first sensing device, the first sensing means is stopped by using the second sensing device in step c). When the substrate is transferred to the second resin application zone, the sensing unit stops the second transfer means, and the step e) operates the first transfer means to transfer the resin-coated substrate to the second transfer path. The first step of transferring the resin downstream than the resin coating zone, and in step h) may operate the second transfer means to transfer the substrate on which the resin is applied to the downstream of the second resin coating zone in the second transfer path.

The resin coating method according to the present invention may further include heating the substrate transferred along the first transfer path, and heating the substrate transferred along the second transfer path.

In the resin application system according to the present invention, since the substrate is supplied to the operating range of the head unit in a double row along a plurality of transport paths, and the head unit alternately applies resin to the substrates transported along the plurality of transport paths, The application operation can be carried out continuously without waiting time of the head unit. Therefore, the working time can be greatly reduced, and the operating efficiency of the components including the head unit can be improved.

In addition, since the resin coating system according to the present invention can be supplied simultaneously to the operating range of the head unit through a plurality of transfer paths, it is possible to carry out a resin coating operation for other substrates at the same time. .

Hereinafter, a resin coating system according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the size and shape of the components, etc. may be exaggerated or simplified to aid in understanding the invention.

As shown in Figure 1 and 2, the resin coating system 100 according to an embodiment of the present invention, the first conveyor 110 and the second conveyor 120, the second conveyor for transferring the substrate (S) The head unit 130 for applying the resin to the substrate S transported by the first conveyor 110 and the second conveyor 120, the moving unit 140 for moving the head unit 130, and the transported substrate S ) A heating unit 170 and a first conveyor for loading the substrate S on the first and second heating means, the first conveyor 110 and the second conveyor 120. An unloading unit 180 for unloading the substrate S from the 110 and the second conveyor 120, and a control unit 190 for controlling the overall operation of the system.

In the resin coating system 100 according to the exemplary embodiment of the present invention, the substrate S and the second conveyor 120 transferred by the first conveyor 110 while the head unit 130 moves within a certain operating range. Since the resin can be applied alternately to the substrate S to be transported by), the resin application can be carried out continuously and the working time can be shortened.

As shown in FIG. 3, the first conveyor 110 and the second conveyor 120 are disposed parallel to each other on the base 101. The first conveyor 110 is for transferring the substrate S from the loading unit 170 to the unloading unit 180, and the first conveyance of the straight line extending from the loading unit 170 to the unloading unit 180. Has a path 111. The second conveyor 120 has a second transfer path 121 in parallel with the first transfer path 111.

The first conveyor 110 is composed of a first moving rail 112 and a second moving rail 113 arranged side by side at intervals corresponding to the width of the substrate (S). The first moving rail 112 and the second moving rail 113 are operated at the same speed by the first driving unit 114, and the substrate S is removed while supporting each of both sides of the substrate S. FIG. 1 Transfer along the transfer path 111. The second conveyor 120 is composed of a third moving rail 122 and a fourth moving rail 123 arranged side by side at intervals corresponding to the width of the substrate (S). The third moving rail 122 and the fourth moving rail 123 are operated at the same speed by the driving force of the second driving device 124, and the substrate S is supported on both sides of the substrate S. Is transferred along the second transfer path 121.

The transfer operation of the substrate S by the first conveyor 110 and the second conveyor 120 is controlled by the operations of the first driving unit 114 and the second driving unit 124. In addition, the first driving unit 114 and the second driving unit 124 are controlled by the control unit 190. When the substrate S is loaded on the first conveyor 110 and the second conveyor 120, the control unit 190 operates the first driving unit 114 and the second driving unit 124 to operate the substrate S. To the operating range of the head unit 130. In the first transfer path 111, there is a first resin application zone 115 in which the substrate S transferred by the first conveyor 110 is stopped, and the second conveyor 120 is included in the second transfer path 121. There is a second resin application zone 125 in which the substrate S to be transported is stopped. The first resin application zone 115 and the second resin application zone 125 are located within the operating range of the head unit 130 so that the head unit 130 can apply the resin to the substrate S. FIG.

In order to stop the substrate S conveyed by the first conveyor 110 and the second conveyor 120 to each of the first resin application zone 115 and the second resin application zone 125, the first transfer path ( Each of the 111 and the second transfer path 121 is provided with a first sensing device 116 and a second sensing device 126 for sensing the substrate S. The first sensing device 116 is disposed in front of the first resin spreading area 115 adjacent to the first resin spreading area 115, and the second sensing device 126 is disposed in the second resin spreading area 125. Adjacent to the second resin application zone 125 is disposed.

When the substrate S is transferred along the first transfer path 111 and one end of the substrate S passes through the first sensing device 116, the first sensing device 116 detects this to detect a detection signal. Transfer to the control unit 190. In this case, the control unit 190 may stop the first driving unit 114 to position the substrate S in the first resin application region 115. Similarly, when the substrate S is transported along the second transfer path 121, the second drive device 124 is stopped by the detection signal of the second sensing device 126, so that the substrate S becomes the second resin. May be located at applicator station 125.

In the present invention, each conveying means for conveying the substrate S from the loading position to the unloading position is not limited to the conveyor structure shown and described. The transfer means may be changed to various other structures having a plurality of transfer paths so as to transfer the substrate S in a double row. In addition, the first sensing device 116 and the second sensing device 126 for sensing the substrate S transferred to the first resin spreading region 115 and the second resin spreading region 125 are changed to ones having different structures. Can be. In addition, the widths of the first conveyor 110 and the second conveyor 120 may be different from each other. In this case, since different types of substrates can be simultaneously transferred, resin coating operations for different types of substrates can be simultaneously performed.

Referring to FIG. 4, the head unit 130 is parked at a standby position, and then the substrate S is transferred to the first resin application region 115 and / or the second resin application region 125. When it comes to operation, the resin is applied to the substrate (S). The head unit 130 includes a head 131 for spraying the resin and a vision device 135 that detects a position to be applied on the substrate S while moving with the head 131. The head 131 includes a syringe 132 which is a resin storage means, a nozzle 133 for injecting the resin, and pumping means 134 for pumping the resin stored in the syringe 132 into the nozzle 133. Since the head unit 130 is the same as the conventional one, a detailed description thereof will be omitted.

The head unit 130 is parallel to the first conveying path 111 and the second conveying path 121 by the moving unit 140 and perpendicular to the first conveying path 111 and the second conveying path 121. Move in the direction of. The moving unit 140 may include a first fixed beam 141 and a second fixed beam 144 disposed perpendicularly to the first transfer path 111 and the second transfer path 121, and the first transfer path 111. ) And a moving beam 147 extending in a direction parallel to the second transfer path 121. The first fixed beam 141 is supported by a pair of pillars 142 fixed to the base 101, and the second fixed beam 144 is a pair of pillars supporting the first fixed beam 141. 142 is supported by a pair of pillars 146 fixed to the base 101 so as to be spaced apart from each other. Both ends of the moving beam 147 are supported by the first fixed beam 141 and the second fixed beam 144 so as to cross the first fixed beam 141 and the second fixed beam 144.

A first guide rail 143 is coupled to the first fixed beam 141 in parallel with the first fixed beam 141, and a second guide rail 145 is connected to the second fixed beam 144 in the second fixed beam. The first guide rail 148 is coupled to the moving beam 147 in parallel with the moving beam 147. The moving beams 147 are slidably coupled to the first slider 151 and the second guide rail 145 that both ends are slidably coupled to the first guide rail 143. Are coupled to each.

Therefore, the moving beam 147 may move along the first guide rail 143 and the second guide rail 145 in a direction perpendicular to the first transfer path 111 and the second transfer path 121. The head unit 130 is coupled to the third slider 153 that is slidably coupled to the third guide rail 148. Therefore, the head unit 130 may move along the third guide rail 148 along the third guide rail 148 in a direction parallel to the first transfer path 111 and the second transfer path 121, As the moving beam 147 moves, the moving beam 147 may move in a direction perpendicular to the first and second transfer paths 111 and 121.

The range in which the head unit 130 is movable by the moving unit 140 includes the first resin spreading zone 115 and the second resin spreading zone 125. Therefore, the head unit 130 may apply the resin to the substrate S transferred along the first transfer path 111 and the substrate S transferred along the second transfer path 121. The operation of the mobile unit 140 is controlled by the control unit 190.

As shown in FIG. 5, the first transfer path 111 is provided with first heating means for heating the substrate S transferred along the first transfer path 111, and the second transfer path 121. The second heating means for heating the substrate (S) to be transferred along the second transfer path 121 is installed. The first heating means includes a first preheating heater 161, a first main heater 162, and a first curing heater 163 sequentially disposed in the upstream direction of the first transport path 111. The first preheat heater 161 is disposed close to the loading position of the substrate S to preheat the loaded substrate S, and the first main heater 162 can heat the substrate S during resin application. And the first curing heater 163 is disposed downstream from the first resin application zone 115 so as to be able to heat the resin-coated substrate S before unloading. do. The second heating means includes a second preheat heater 164, a second main heater 165, and a second curing heater 166 corresponding to each of the heaters disposed in the first transfer path 111. The operation of these heaters is controlled by the control unit 190.

Referring to FIG. 5, the loading unit 170 is disposed in front of the first conveyor 110 and the second conveyor 120, and in front of the first preheat heater 161 of the first conveyor 110 and the second. The substrate S is loaded in front of the second preheat heater 164 of the conveyor 120. The unloading unit 180 is disposed at the rear of the first conveyor 110 and the second conveyor 120, and unloads the substrate S from the first conveyor 110 and the second conveyor 120. . Each of the loading unit 170 and the unloading unit 180 has a plurality of pallets 171 and 181 on which the substrate S may be loaded.

In addition, the loading unit 170 pushes the substrate S loaded on the pallet 171 and loads the first loading pusher 172 and the second loading to load the first conveyor 110 and the second conveyor 120, respectively. It has a pusher 173. The unloading unit 180 includes a first unloading pusher 182 and a second unloading for unloading the substrate S transferred along the first conveyor 110 and the second conveyor 120 into the pallet 181. And a loading pusher 183. The loading unit 170 for loading the substrate S and the unloading unit 180 for unloading the substrate S are not limited to the illustrated structure and may be variously changed.

Hereinafter, a resin spreading method of a resin spreading system according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 6, the head unit 130 stands by in the parking position away from the first resin application zone 115 and the second resin application zone 125 when not in operation. When the resin coating operation is started, one substrate S is loaded on the first conveyor 110 by the loading unit 170, and the loaded substrate S is loaded by the first conveyor 110 by the first conveyance mirror. It is conveyed along the furnace 111. The substrate S loaded on the first conveyor 110 is heated when passing through the first preheat heater 161.

When the substrate S is transferred to the first resin application zone 115, the first driving unit 114 stops and the substrate S is positioned in the first resin application zone 115. In this case, the substrate S is heated by the first main heater 162, and the head unit 130 is moved to the first resin application zone 115 by the moving unit 140.

As shown in FIG. 7, when the head unit 130 moves, the vision device 135 first detects a position where the resin is to be applied onto the substrate S. As shown in FIG. When the position to which the resin is to be applied is detected, the head unit 130 moves to match the position and applies the resin to the substrate S. While the resin spreading operation is performed in the first resin spreading region 115, the substrate S is loaded onto the second conveyor 120 by the loading unit 170. The loaded substrate S is heated along the second transfer path 121 and heated when passing through the second preheat heater 164.

As shown in FIG. 8, the substrate S passing through the second preheating heater 164 is transferred to the second resin application zone 125 before the resin is applied in the first resin application zone 115. 2 Stand by in the resin application zone (125). In the second resin application zone 125, the substrate S is heated by the second main heater 165.

As shown in FIG. 9, when the resin spreading operation is completed in the first resin spreading region 115, the head unit 130 moves to the second resin spreading region 125 without waiting time. At this time, the vision device 135 first detects the position at which the resin is to be applied on the substrate S located in the second resin application zone 125, and after the resin application position is detected, the head unit 130 is at this position. Resin is applied to the substrate (S) while moving to fit. While the resin spreading operation is performed in the second resin spreading region 125, the substrate S on which the resin is applied in the first resin spreading region 115 is completed by the operation of the first conveyor 110. It is heated through 163 and then conveyed to the unloading position. The substrate S transferred to the unloading position is unloaded to the pallet 181 by the first unloading pusher 182.

Subsequently, while the resin spreading operation is performed in the second resin spreading zone 125, a new substrate S is loaded onto the first conveyor 110 by the loading unit 170, so that the first resin spreading zone 115 is carried out. Are transported until. As described above, since the substrate S is positioned in the first resin application region 115 before the resin application operation is finished in the second resin application region 125, the head unit 130 may have the second resin application region 125. After applying the resin in the first resin coating area 115 may be moved to the resin coating operation.

As shown in FIG. 10, when the resin coating operation is finished in the second resin application zone 125 and the head unit 130 moves to the first resin application zone 115, the second conveyor 120 operates to provide the resin. The substrate S on which the coating is completed is transferred to the unloading position through the second curing heater 166. The substrate S transferred to the unloading position is unloaded on the second conveyor 120 by the unloading unit 180, and a new substrate S is loaded on the second conveyor 120. The newly loaded substrate S on the second conveyor 120 is transferred from the first resin application zone 115 to the second resin application zone 125 before the application of the resin is finished.

As described above, in the resin coating system 100 according to the present invention, the substrate S is supplied to the operating range of the recuperator head unit 130 along the first transfer path 111 and the second transfer path 121. Since the head unit 130 alternately applies resin to the substrate S of the first transfer path 111 and the substrate S of the second transfer path 121, the resin coating operation can be continuously performed.

The resin coating system 100 according to the present invention may be used in various manufacturing processes using the resin as an adhesive, including an underfill process.

The present invention described above is not limited to the configuration and operation as shown and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

1 is a perspective view schematically showing a resin coating system according to an embodiment of the present invention.

Figure 2 is a schematic diagram showing the configuration of a resin coating system according to an embodiment of the present invention.

Figure 3 is a perspective view showing the first and second conveyors and the surroundings of the resin coating system according to an embodiment of the present invention.

Figure 4 is a perspective view showing a head unit and a moving unit of the resin coating system according to an embodiment of the present invention.

5 is a plan view showing a resin coating system according to an embodiment of the present invention.

6 to 10 is a perspective view showing a resin coating process of the resin coating system according to an embodiment of the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

100: resin coating system 110, 120: 1st, 2nd conveyor

111, 121: 1st, 2nd transfer path 114, 124: 1st, 2nd drive device

116, 126: first and second detection device 130: head unit

131: head 135: vision device

141 and 144: first and second fixed beams 147: moving beams

143, 145, 148: 1st, 2nd, 3rd guide rail

151, 152, 153: 1st, 2nd, 3rd slider 161, 164: 1st, 2nd preheating heater

162, 165: first and second main heaters 163 and 166: first and second curing heaters

170: loading unit 171, 181: pallet

180: unloading unit 190: control unit

Claims (7)

First transfer means having a first transfer path for transferring the substrate; Second transfer means having a second transfer path parallel to the first transfer path for substrate transfer; Applying a resin to the substrate to be transported along the first transfer path and the second transfer path having a storage means for receiving the resin, a nozzle for injecting the resin, pumping means for forcing the resin of the storage means to the nozzle A head unit; A moving unit for moving the head unit; Each of the first conveying means and the second conveying means is configured to temporarily stop the substrate conveyed along the first conveyance path and the second conveyance path within an operating range of the head unit, and then convey it again when the resin is applied. And a control unit for controlling the head unit such that the head unit alternately applies resin to the substrate stationary on the first transport path and the substrate stationary on the second transport path. Resin Coating System. The method of claim 1, A first sensing device for sensing the substrate transferred to the operating range of the head unit to stop the substrate transferred by the first transfer means within the operating range of the head unit; And a second sensing device for sensing the substrate transferred to the operating range of the head unit to stop the substrate transferred by the second transfer means within the operating range of the head unit. . The method of claim 1, If the resin-coated substrate controlled by the control unit is out of the operating range of the head unit along the first conveyance path and the second conveyance path, a new substrate is added to the first conveyance means and the second conveyance means. Resin coating system further comprises a loading unit for loading. The method of claim 1, First heating means disposed in the first transfer path to heat the substrate transferred along the first transfer path; And a second main heater disposed in the second transfer path to heat the substrate transferred along the second transfer path. a) transferring the substrate to the first resin application zone in the first transport path by using the first transport means; b) applying a resin to a substrate in the first resin application zone by moving the head unit for resin application to the first resin application zone; c) before the application of the resin in the first resin application zone is completed, transferring the substrate to the second resin application zone in the second transfer path arranged in parallel with the first transfer path by using a second transfer means; ; d) when resin application is completed in the first resin application zone, moving the head unit to the second resin application zone to apply resin to the substrate in the second resin application zone; e) leaving the substrate on which the resin is applied in the first resin application zone from the first resin application zone along the first transfer path; f) transferring the new substrate to the first resin application zone by using the first transfer means before the resin application is completed in the second resin application zone; g) when the step d) is completed, moving the head unit to the first resin application zone and applying resin to a substrate waiting in the first resin application zone; and h) removing the substrate from which the resin is applied in the second resin application zone from the second resin application zone along the second transport path by using the second transfer means. work method. The method of claim 5, In step a), when the substrate is transferred to the first resin application zone by using the first sensing device, the first transfer means is stopped by detecting the substrate. In step c), when the substrate is transferred to the second resin application zone by using the second sensing device, the second transfer means is stopped by detecting the substrate. In the step e), the first transfer means is operated to transfer the substrate on which the resin is applied to the downstream side of the first resin application zone in the first transfer path, In the step h), the second conveying means is operated to transfer the resin-coated substrate to a lower portion than the second resin spreading region in the second conveying path. The method of claim 5, Heating the substrate transported along the first transport path; And heating the substrate to be transported along the second conveyance path.

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