KR100987075B1 - 고주파 회로 기판 조립체 - Google Patents
고주파 회로 기판 조립체 Download PDFInfo
- Publication number
- KR100987075B1 KR100987075B1 KR1020090088033A KR20090088033A KR100987075B1 KR 100987075 B1 KR100987075 B1 KR 100987075B1 KR 1020090088033 A KR1020090088033 A KR 1020090088033A KR 20090088033 A KR20090088033 A KR 20090088033A KR 100987075 B1 KR100987075 B1 KR 100987075B1
- Authority
- KR
- South Korea
- Prior art keywords
- high frequency
- frequency circuit
- circuit boards
- intermediate substrate
- board assembly
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (4)
- 고주파 회로 기판 조립체에 있어서,서로 적층된 상태로 배치되는 적어도 한 쌍의 고주파 회로 기판들;상기 고주파 회로 기판들의 서로 대면하는 면에 각각 배치되는 접속 패드들;상기 고주파 회로 기판들 사이에 개재되는 중간 기판;상기 중간 기판의 양면을 관통하게 형성된 관통홀;상기 중간 기판을 관통하게 설치되어 상기 접속 패드들을 서로 전기적으로 접속시키는 퍼즈 버튼(fuzz button); 및상기 퍼즈 버튼의 양단에 각각 제공되는 접촉 부재들을 포함하고,상기 퍼즈 버튼은 상기 관통홀 내에 수용되며, 상기 접촉 부재들은 상기 관통홀 내에 수용되면서 상기 중간 기판의 양면으로 돌출되어 상기 접속 부재들과 접촉됨을 특징으로 하는 고주파 회로 기판 조립체.
- 제1 항에 있어서, 상기 고주파 회로 기판들은 각각 제1의 면에 형성된 회로 패턴을 구비하고, 제2의 면에 상기 접속 패드를 구비하며, 상기 고주파 회로 기판들의 양면을 관통하게 형성된 비아 홀(via hole)을 통해 상기 접속 패드가 상기 회로 패턴에 접속됨을 특징으로 하는 고주파 회로 기판 조립체.
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090088033A KR100987075B1 (ko) | 2009-09-17 | 2009-09-17 | 고주파 회로 기판 조립체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090088033A KR100987075B1 (ko) | 2009-09-17 | 2009-09-17 | 고주파 회로 기판 조립체 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100987075B1 true KR100987075B1 (ko) | 2010-10-11 |
Family
ID=43135327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090088033A KR100987075B1 (ko) | 2009-09-17 | 2009-09-17 | 고주파 회로 기판 조립체 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100987075B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793459A (zh) * | 2016-12-20 | 2017-05-31 | 中国航空工业集团公司雷华电子技术研究所 | 一种多层微波电路板互连结构 |
CN106785694A (zh) * | 2016-11-22 | 2017-05-31 | 上海无线电设备研究所 | 一种集成式大功率高密度高频传输结构 |
CN106785435A (zh) * | 2017-02-08 | 2017-05-31 | 成都雷电微力科技有限公司 | 一种tr模块垂直互连结构件 |
CN110739538A (zh) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Tr组件与天线阵面的射频互联方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001210959A (ja) | 2000-01-27 | 2001-08-03 | Kanji Otsuka | 配線基板及びその製造方法 |
US20040016114A1 (en) * | 2002-07-25 | 2004-01-29 | International Business Machines Corporation | Land grid array structures and methods for engineering change |
JP2005286331A (ja) | 2004-03-30 | 2005-10-13 | Internatl Business Mach Corp <Ibm> | Lga相互接続を改善するための微小バンプ |
-
2009
- 2009-09-17 KR KR1020090088033A patent/KR100987075B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001210959A (ja) | 2000-01-27 | 2001-08-03 | Kanji Otsuka | 配線基板及びその製造方法 |
US20040016114A1 (en) * | 2002-07-25 | 2004-01-29 | International Business Machines Corporation | Land grid array structures and methods for engineering change |
JP2005286331A (ja) | 2004-03-30 | 2005-10-13 | Internatl Business Mach Corp <Ibm> | Lga相互接続を改善するための微小バンプ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106785694A (zh) * | 2016-11-22 | 2017-05-31 | 上海无线电设备研究所 | 一种集成式大功率高密度高频传输结构 |
CN106793459A (zh) * | 2016-12-20 | 2017-05-31 | 中国航空工业集团公司雷华电子技术研究所 | 一种多层微波电路板互连结构 |
CN106785435A (zh) * | 2017-02-08 | 2017-05-31 | 成都雷电微力科技有限公司 | 一种tr模块垂直互连结构件 |
CN110739538A (zh) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Tr组件与天线阵面的射频互联方法 |
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