KR100977982B1 - manufacture apparatus of array circuit for LCD and method thereof - Google Patents

Abstract

According to another aspect of the present invention, there is provided a method of manufacturing an array substrate for a liquid crystal display device, the method comprising: placing an array substrate in a chamber in which a predetermined temperature is maintained; Positioning a metal mask having a predetermined pattern on the array substrate; Attaching a magnet to a lower region of the array substrate corresponding to the metal mask to adsorb the metal mask and the array substrate; Spraying predetermined metal particles onto the metal mask; And depositing the predetermined metal particles on the array substrate through the predetermined pattern formed on the metal mask.

According to the present invention, it is possible to significantly reduce the time required and manufacturing cost in the manufacturing process of the array substrate, and to accurately pattern the pattern by overcoming the problem of adhesion with the substrate, cleaning problem of the mask while using a metal mask. There is an advantage that can be formed.

Description

Manufacturing apparatus for array substrate for liquid crystal display device and method for manufacturing same

1 is a cross-sectional view showing an example of a liquid crystal panel employed in a conventional liquid crystal display device.

2 is a process flowchart showing an example of a method of manufacturing a lower substrate of a conventional liquid crystal display device.

Figure 3 is a schematic view showing an array substrate manufacturing apparatus for a liquid crystal display device according to the present invention.

4 is a flowchart illustrating a method for manufacturing an array substrate for a liquid crystal display device according to the present invention.

<Explanation of symbols for the main parts of the drawings>

300: chamber 310: array substrate

320: metal mask 330: magnet

340 metal particles 350 target

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to an array substrate manufacturing apparatus for a liquid crystal display device and a method of manufacturing the same, which simplify the manufacturing process of the array substrate for a liquid crystal display device.

In general, the driving principle of the liquid crystal display device uses the optical anisotropy and polarization of the liquid crystal. Since the liquid crystal is thin and long in structure, the liquid crystal has directivity in the arrangement of molecules, and the direction of the molecular arrangement can be controlled by artificially applying an electric field to the liquid crystal.

Accordingly, if the molecular arrangement direction of the liquid crystal is arbitrarily adjusted, the molecular arrangement of the liquid crystal is changed, and light polarized by optical anisotropy may be arbitrarily modulated to express image information. The liquid crystal may be classified into a positive liquid crystal having a positive dielectric anisotropy and a negative liquid crystal having a negative dielectric anisotropy according to an electrical property classification. The long axes are arranged in parallel, and the liquid crystal molecules having negative dielectric anisotropy are arranged in the direction in which the electric field is applied and the long axes of the liquid crystal molecules are perpendicular to each other.

Currently, an active matrix LCD in which a thin film transistor and pixel electrodes connected to the thin film transistor are arranged in a matrix manner is generally used because of its excellent resolution and video performance.

Looking at the structure of the liquid crystal panel constituting such a liquid crystal display device as follows.

1 is a cross-sectional view showing an example of a liquid crystal panel employed in a conventional liquid crystal display device.

As shown in FIG. 1, the upper substrate 112, which is a color filter substrate, and the lower substrate 114, which is a thin film transistor substrate, face each other at a predetermined interval in the liquid crystal panel 100. The liquid crystal 116 is filled between the substrates 114.

Here, a gate electrode 118 is formed on the transparent substrate 102 constituting the lower substrate 114, and a gate insulating film 120 is formed over the entire surface of the gate electrode 118. In addition, the semiconductor layer 122 including the active layer 122a and the ohmic contact layer 122b is formed on the gate insulating film 120. A source electrode 124 and a drain electrode 126 are formed on the semiconductor layer 122, and a protective layer 128 including a contact hole 130 on the source electrode 124 and the drain electrode 126. ) Is formed. In addition, a pixel electrode 132 is formed through the contact hole 130 to be in contact with the drain electrode 126 and serve as one electrode for applying a voltage to the liquid crystal 116. 118, semiconductor layer 122, and source electrode 124 and drain electrode 126 are referred to as a thin film transistor (T).

Meanwhile, a black matrix 134 is formed at a position corresponding to the thin film transistor T under the transparent substrate 101 constituting the upper substrate 112, and at a position corresponding to the pixel electrode 132. R, G, and B color filters 136 are formed. A planarization layer 138 is formed under the black matrix 134 and the R, G, and B color filters 136, and an electric field is applied to the liquid crystal 116 under the planarization layer 138. The common electrode 140 serving as another electrode is formed.

In addition, a spacer 142 is disposed on an inner surface between the common electrode 140 and the pixel electrode 132 to maintain a constant gap between the upper substrate 112 and the lower substrate 114.

In addition, a seal pattern 144 is formed on the outer portion of the liquid crystal panel 100 to maintain a constant cell gap like the spacer 142 and to bond the upper substrate 112 and the lower substrate 114 together. It is.

2 is a process flowchart showing an example of a conventional method of manufacturing a lower substrate of a liquid crystal display device.

1 and 2, first, a predetermined metal material is deposited on the transparent substrate 102 and patterned using a first mask to form a gate wiring and a gate electrode 118 (step 201). In order to form a gate wiring using the mask, a deposition process, a photolithography process, and the like are required, and the photo process is a chemical reaction when a photoresist (PR) receives light. By using the principle that the property changes to cause the process of forming the same pattern as the pattern of the mask by selectively irradiating light to PR using a mask of the pattern to be obtained. PR coating process for applying photoresist corresponding to film of general picture, exposure process for selectively irradiating light with mask, then present By removing the PR portion of the received light by the liquid it consists of a developing process to form a pattern.

Next, the gate insulating layer 120, amorphous silicon, and amorphous silicon containing impurities are sequentially deposited, and then the active layer 122a and the impurity semiconductor layer 122 are subjected to a photo process using a second mask. (Step 202). Then, a predetermined metal layer is deposited and patterned using a third mask, thereby forming the data wiring, the source electrode 124, and the drain electrode 126, and forming the source electrode 124 and the drain. The impurity semiconductor layer exposed between the electrodes 126 is etched to complete the ohmic contact layer 122b (step 203).

Next, the protective layer 128 is deposited and patterned using a fourth mask to form a contact hole 130 exposing a predetermined region of the drain electrode 126 (step 204).

The protective layer 128 is formed to prevent damage or deterioration of a thin film transistor caused by a rubbing process in a liquid crystal cell process of a liquid crystal display device or a scratch and a penetration of moisture in the process, and a silicon nitride film (SiNx ) And BCB (BenzoCycloButene), which is an organic insulating film.

Finally, the transparent conductive material is deposited and patterned using a fifth mask to form a pixel electrode 132 made of a transparent conductive material electrically connected to the drain electrode 126 through the contact hole 130 ( Step 205).

According to the conventional manufacturing process as described above, five mask processes are required, and each mask process has to undergo a deposition and photo process, and thus, there is a disadvantage in that the manufacturing time and manufacturing cost of the array substrate are significantly increased.

In order to overcome this problem, researches to reduce the number of the five mask processes to four or less have been actively conducted. However, even in this case, since each mask process requires the deposition and photo process, the limitation of reducing the manufacturing cost is limited. have.

The present invention provides a metal mask having a predetermined pattern and a magnet on a lower surface of the substrate corresponding to the metal mask when forming a pattern for each layer on a substrate, thereby forming a predetermined pattern at a time through the metal mask. The present invention relates to an array substrate manufacturing apparatus for a liquid crystal display device and a method of manufacturing the same, which minimizes the time and manufacturing cost of the array substrate by minimizing a photo process.

In order to achieve the above object, an array substrate manufacturing apparatus for a liquid crystal display device according to the present invention comprises: a metal mask having a predetermined pattern located on an array substrate; A magnet attached to a lower region of the array substrate corresponding to the metal mask position; And a chamber for maintaining a predetermined temperature so that predetermined metal particles are deposited on the array substrate through a predetermined pattern formed on the metal mask.

The predetermined pattern formed on the metal mask may be formed to form a gate electrode, a gate line, and a gate lower pad on the array substrate, or may be formed to form a source / drain electrode, a data line, and a data lower pad. Or a shape for forming the pixel electrode and the gate / data upper pad.

In addition, the predetermined metal particles may be particles of aluminum (Al), copper (Cu), chromium (Cr), molybdenum (Mo) and the like.

In addition, to achieve the above object, a method for manufacturing an array substrate for a liquid crystal display device according to the present invention includes the steps of: positioning the array substrate in a chamber in which a predetermined temperature is maintained; Positioning a metal mask having a predetermined pattern on the array substrate; Attaching a magnet to a lower region of the array substrate corresponding to the metal mask to adsorb the metal mask and the array substrate; Spraying predetermined metal particles onto the metal mask; And depositing the predetermined metal particles on the array substrate through the predetermined pattern formed on the metal mask.

Herein, the predetermined temperature is maintained at 100 ° C. or less, and further, a method of periodically performing dry etching in the chamber with reactive ion etching (RIE) for the metal mask is further added. It is characterized by.

In addition, when the predetermined metal particles are aluminum (Al), the gas used for the dry etching is boron chloride (BCl ₃ ) + chlorine (Cl ₂ ) gas, and in the case of copper (Cu), chlorine (Cl ₂ ) or Carbon tetrachloride (CCl ₄ ) gas, chromium (Cr) is characterized in that chlorine (Chlorine) + oxygen gas, molybdenum (Mo) is characterized in that chlorine (oxygen) + oxygen gas.

According to the present invention, it is possible to significantly reduce the time required and manufacturing cost in the manufacturing process of the array substrate, and to accurately pattern the pattern by overcoming the problem of adhesion with the substrate, cleaning problem of the mask while using a metal mask. There is an advantage that can be formed.

That is, in the case of the present invention, in forming a gate line, a data line, a pixel electrode, etc. on the array substrate, a metal mask having a predetermined pattern is positioned on the array substrate to overcome the inconvenience of having to undergo a deposition and photo process. By sputtering a predetermined metal particle on the metal mask by using a sputtering method or the like to form a metal line having a desired pattern, and more precisely, by attaching a magnet to a lower region of the array substrate corresponding to the metal mask. The key contents of the present invention are to prevent the pattern from being changed during the process by adsorbing the metal mask and the array substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view schematically showing an array substrate manufacturing apparatus for a liquid crystal display according to the present invention.

Referring to FIG. 3, the chamber 300 maintains a constant temperature when various patterns are formed on the array substrate, and the predetermined pattern disposed on the array substrate 310 as provided in the chamber 300. A metal mask 320 and a magnet 330 attached to a lower region of the array substrate 310 corresponding to the metal mask 320, and a predetermined metal particle 340 is formed on the metal mask 320. The gate line, the data line, the pixel electrode, etc. to be provided in each layer on the array substrate 310 are formed by being deposited on the array substrate 310 through a predetermined pattern formed on the array substrate 310.

Here, as an embodiment of the method for forming the gate line by spraying the predetermined metal particles 340 will be described through a sputtering method.

The sputtering method refers to a target 350 that is a material of a metal layer forming respective layers in which the gate line, the data line, the pixel electrode, and the like are patterned with an inert gas such as argon introduced into the vacuum chamber 300. By applying electric power from a power source to the electrode portion included, the introduced gas is converted into plasma to cause the target material of the target 350, that is, the predetermined metal particles 340 to be protruded by gas ions, and consequently the metal mask. The deposition method is performed on the array substrate 310 through a predetermined pattern formed at 320.

Here, aluminum (Al), copper (Cu), chromium (Cr), molybdenum (Mo), or the like may be used as the metal used as the material of the target 350.

In the plasma formed inside the chamber 300, positive ions of the processing gas, typically argon ions, collide with the target surface of the cathode to sputter the target atoms, that is, the metal particles 340, on the anode side of the substrate. That is, to form a pattern on the array substrate 310, the magnetron method is widely used to increase the sputter efficiency by increasing the plasma density near the surface of the target 350.

In the magnetron method, a magnet device, generally called a magnetron device, is used to generate a magnetic field parallel to the surface of the target 350. Since the magnetic field intersects with the electric field between the target 350 and the array substrate 310, electrons emitted from the target 350 are trapped in the vicinity of the target surface, thereby increasing the plasma density of the region.

In the present invention, the predetermined metal particles 340 sputtered through the target are transmitted through the metal mask 320 having a predetermined pattern and are deposited on the array substrate 310 so as to conform to the pattern. A gate line, a data line, a pixel electrode, etc., which should be provided in each layer of the array substrate 310 at one time without going through a process, are formed.

To this end, a predetermined pattern formed on the metal mask 320 is formed to form a gate electrode, a gate line, and a gate lower pad on the array substrate 310, or a source / drain electrode, data line, and data lower portion. It is formed in the form for forming the pad, or in the form for forming the pixel electrode, the gate / data upper pad.

In addition, a magnet 330 is attached to a lower region of the array substrate 310 corresponding to the metal mask 320 so that the metal mask 320 and the array substrate 310 are attracted by the magnet 330. This prevents the pattern from being changed during the process.

4 is a flowchart illustrating a method of manufacturing an array substrate for a liquid crystal display device according to the present invention.

3 and 4, the method for manufacturing an array substrate for a liquid crystal display device according to the present invention will be described.

First, the array substrate 310 is positioned in the chamber 300 where a predetermined temperature is maintained. (Step 401).

However, when the sputtering method is used as described above, the chamber 300 becomes a vacuum chamber, and the predetermined temperature is maintained at 100 ° C. or less. This is because when the metal mask 320 to be used later is 100 ° C. or more, the shape may be deformed by thermal expansion and patterning the metal mask.

Next, a metal mask 320 having a predetermined pattern is positioned on the array substrate 310 (step 402).

As described above, the predetermined pattern formed on the metal mask 320 is formed to form a gate electrode, a gate line, and a gate lower pad on the array substrate 310, or a source / drain electrode, a data line, It may be formed in the form for forming the data lower pad, or may be in the form for forming the pixel electrode, the gate / data upper pad. That is, the pattern of the metal mask 320 is changed according to each layer of the array substrate 310.

Next, a magnet is attached to a lower region of the array substrate 310 corresponding to the metal mask 320 to adsorb the metal mask 320 and the array substrate 310 (step 403).

This is to prevent the pattern to be formed on the array substrate 310 by changing the position of the metal mask 320 and the array substrate 310 during the process.

Next, predetermined metal particles 340 are sprayed onto the metal mask 320, and the predetermined metal particles 340 are arrayed through the predetermined pattern formed on the metal mask 320. Is deposited on. (Steps 404, 405)

Since the metal particles 340 are sprayed and deposited on a specific region of the array substrate 310, the description thereof will be omitted.                     

Through such a step, a gate line or the like can be simply formed on the array substrate, thereby significantly reducing the time required and manufacturing cost of the manufacturing process.

However, a step of periodically performing dry etching in the chamber with reactive ion etching (RIE) for the metal mask in the vacuum chamber should be further added, since the metal particles are deposited. This is to minimize the contamination of the metal mask by the.

Here, when the predetermined metal, that is, the target material is aluminum (Al), the gas used for the dry etching is boron chloride (BCl ₃ ) + chlorine (Cl ₂ ) gas, and in the case of copper (Cu), chlorine ( Cl ₂ ) or carbon tetrachloride (CCl ₄ ) gas, and chromium (Cr) is chlorine (oxygen) + oxygen gas, molybdenum (Mo) is characterized in that chlorine (oxygen) + oxygen gas.

According to the array substrate manufacturing apparatus and the manufacturing method of the liquid crystal display device according to the present invention as described above, there is an advantage that the required time and manufacturing cost in the manufacturing process of the array substrate can be significantly reduced.

In addition, there is an advantage that the pattern can be formed more accurately by overcoming the problem of adhesion with the substrate, the problem of cleaning the mask while using a metal mask.

Claims (10)

delete delete delete delete delete Positioning the array substrate in a chamber in which a constant temperature is maintained; Positioning a metal mask having a predetermined pattern on the array substrate; Attaching a magnet to a region of the lower region of the array substrate corresponding to the metal mask so that the metal mask and the array substrate are bonded together; Spraying predetermined metal particles onto the metal mask; And And depositing the predetermined metal particles on the array substrate through a predetermined pattern formed on the metal mask. The method of claim 6, The predetermined temperature is less than 100 ℃ array substrate manufacturing method for a liquid crystal display device. The method of claim 6, And performing a dry etching of Reactive Ion Etching (RIE) in the chamber with respect to the metal mask. The method of claim 6, And said predetermined metal particles are selected from the group consisting of particles of aluminum (Al), copper (Cu), chromium (Cr) and molybdenum (Mo). The method of claim 8, When the predetermined metal particles are aluminum (Al), the gas used for the dry etching is boron chloride (BCl ₃ ) + chlorine (Cl ₂ ) gas, and in the case of copper (Cu), chlorine (Cl ₂ ) or carbon tetrachloride ( CCl ₄ ) gas, chromium (Cr) is Chlorine + oxygen gas, molybdenum (Mo) is Chlorine + oxygen gas manufacturing method of an array substrate for a liquid crystal display device.

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