KR100965411B1 - Apparatus for processing substrate - Google Patents

Apparatus for processing substrate Download PDF

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Publication number
KR100965411B1
KR100965411B1 KR1020080134752A KR20080134752A KR100965411B1 KR 100965411 B1 KR100965411 B1 KR 100965411B1 KR 1020080134752 A KR1020080134752 A KR 1020080134752A KR 20080134752 A KR20080134752 A KR 20080134752A KR 100965411 B1 KR100965411 B1 KR 100965411B1
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KR
South Korea
Prior art keywords
transfer
rollers
chamber
substrate
arms
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KR1020080134752A
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Korean (ko)
Inventor
고영배
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엘아이지에이디피 주식회사
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Priority to KR1020080134752A priority Critical patent/KR100965411B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B65G13/02—Roller-ways having driven rollers
    • B65G13/06—Roller driving means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus for processing a substrate is provided to minimize the volume of a device, thereby efficiently using a space. CONSTITUTION: A plurality of standby rollers(210) supports a substrate inputted into a standby chamber(200). Transfer rollers(310) support a substrate inputted into a transfer chamber(300). Transfer arms(330) are arranged between the transferring rollers. A transfer arm driver elevates the transfer arms for the transfer rollers. The transfer arm driver transfers the transfer arms in the second direction.

Description

Substrate Processing Equipment {APPARATUS FOR PROCESSING SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for processing a substrate for manufacturing a flat panel display device.

Representative examples of flat panel displays include LCD, PDF, and OLED. Most of these flat panel display devices manufacture a panel by bonding two glass substrates together after processing a display element on two glass substrates.

Recently, the LCD manufacturing process, which has the highest market share among flat panel display devices, is developing to the 8th generation. In the 8th generation, the size of the board is about 2200 ㅧ 2500mm, and one board of this size can produce up to eight 46-inch panels at the same time. As such, panel manufacturers are increasing the size of the substrate used in the process to reduce the manufacturing efficiency and cost of the panel.

However, as the substrate is enlarged, the substrate treating apparatus for treating the substrate is also enlarged. If the substrate processing apparatus for substrate processing is enlarged, the factory area for the process should be wider, and many problems occur in the substrate transfer process between the unit processes.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus capable of linear transfer of a substrate, thereby improving the structure for processing the substrate.

The substrate processing apparatus includes an atmosphere chamber, a transfer chamber disposed in a first direction from the standby chamber, a process chamber disposed in a second direction crossing the first direction from the transfer chamber, and disposed in the standby chamber. A plurality of atmospheric rollers supporting the substrate carried into the atmospheric chamber, spaced apart from each other in the first direction, and rotating in the opposite directions of the first direction and the first direction, and disposed in the transfer chamber to the transfer chamber; A plurality of transfer arms disposed between the plurality of transfer rollers supporting the substrate to be loaded and spaced apart from each other in the first direction and rotated in a reverse direction of the first direction and the first direction; And a transfer arm driver for elevating the plurality of transfer arms with respect to the plurality of transfer rollers and transferring the plurality of transfer arms in the second direction. The.

The plurality of standby rollers may be arranged in a plurality of layers, and may further include a support frame for supporting the plurality of standby rollers arranged in a plurality of layers, and a standby roller lifting unit for lifting the plurality of standby rollers.

It may include a standby roller rotating unit for rotating a plurality of the atmospheric roller.

It may include a feed roller rotating unit for rotating a plurality of the feed roller.

The plurality of transfer arms may include a plurality of first transfer arms and a plurality of second transfer arms disposed in a plurality of layers between the plurality of transfer rollers.

The transfer arm driver includes a transfer arm lifting unit for elevating the plurality of transfer arms, and a transfer arm transfer unit for transferring the plurality of transfer arms in the second direction, wherein the transfer arm transfer unit includes a plurality of the first transfer units. The arm and the plurality of second transfer arms may be transferred respectively.

On the other hand, the substrate processing apparatus supports a chamber and a plurality of rollers which are disposed in the chamber and support the substrate to be carried into the chamber and are spaced apart from each other in a first direction and rotated in opposite directions of the first direction and the first direction. It may include.

The plurality of rollers may be disposed in a plurality of layers, and may further include a support frame for supporting the plurality of rollers disposed in a plurality of layers, and a standby roller lifting unit for lifting the support frame.

The substrate processing apparatus may include a roller rotating unit for rotating the plurality of rollers.

The substrate processing apparatus includes a plurality of transfer arms disposed between the plurality of rollers, a plurality of transfer arms to lift and lower the plurality of transfer arms with respect to the plurality of rollers, and a plurality of the transfer arms crossing the first direction. It may further include a transfer arm driver for transferring in the direction.

The plurality of transfer arms may include a plurality of first transfer arms and a plurality of second transfer arms disposed in a plurality of layers between the rollers adjacent to each other in the second direction.

The transfer arm driver includes a transfer arm lifting unit for elevating the plurality of transfer arms, and a transfer arm transfer unit for transferring the plurality of transfer arms in the second direction, wherein the transfer arm transfer unit includes a plurality of the first transfer units. The arm and the plurality of second transfer arms may be transferred respectively.

The substrate processing apparatus according to the present invention can shorten the processing time according to the substrate transfer, and can effectively utilize the space by minimizing the volume of the equipment according to the substrate transfer.

Hereinafter, a substrate processing apparatus according to the present embodiment will be described in detail with reference to the accompanying drawings.

1 is a plan view showing the arrangement of each chamber in the substrate processing apparatus according to the present embodiment. Referring to FIG. 1, the substrate processing apparatus 100 includes an atmospheric chamber 200, a transfer chamber 300, and a process chamber 400. The process chamber 400 is a chamber for processing a substrate according to a process. The transfer chamber 300 transfers the substrate to the process chamber 400 and recovers the substrate processed in the process chamber 400. The standby chamber 200 transfers the substrate to the transfer chamber 300, and is a chamber that waits for the substrate to transfer the substrate of the transfer chamber 300 to the outside.

On the other hand, the substrate transfer apparatus 10 which transfers a board | substrate to the atmospheric chamber 200 and conveys a board | substrate from the atmospheric chamber 200 to the exterior of the substrate processing apparatus 100 is arrange | positioned. The standby chamber 200 is disposed on the side where the substrate is transferred from the substrate transfer apparatus 10. The transfer chamber 300 is disposed in the first direction in which the substrate is transferred from the atmospheric chamber 200. The process chamber 400 is disposed in a second direction that intersects with respect to the first direction.

On the other hand, the standby chamber 200 includes a first entrance 201 formed on the substrate processing apparatus 100 side, and a second entrance 203 formed on the transfer chamber 300 side. The first entrance 201 is opened and closed by the first gate valve 101 disposed between the atmospheric chamber 200 and the substrate processing apparatus 100, and the second entrance 203 is transferred to the atmospheric chamber 200. It is opened and closed by a second gate valve 103 disposed between the chambers 300.

The transfer chamber 300 includes a third entrance 301 communicating with the second entrance 203 and a fourth entrance 303 formed at the process chamber 400. The third entrance 301 is opened and closed by the second gate valve 103, and the fourth entrance 303 is connected to the third gate valve 105 disposed between the transfer chamber 300 and the process chamber 400. By opening and closing.

The process chamber 400 includes a fifth entrance 401 in communication with the fourth entrance 303. The fifth entrance 401 is opened and closed by the third gate valve 105. Therefore, the atmosphere chamber 200, the transfer chamber 300, and the process chamber 400 may be internally communicated with each other according to opening and closing of the first, second, and third gate valves 101, 103, and 105, respectively. Sealing is possible.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1, FIG. 3 is a cross-sectional view taken along line II-II ′ of FIG. 1, and FIG. 4 is a substrate treatment according to the present embodiment. A perspective view of the interior of the atmosphere chamber of the apparatus. 1 to 4, the substrate transfer apparatus 10 includes a plurality of end effectors 11. Although not shown, the plurality of end effectors 11 are arranged in multiple layers. The plurality of end effectors 11 arranged in a plurality of layers is provided so that the upper and lower end effectors 11 can move forward and backward in the second direction, respectively.

The substrate processing apparatus 100 includes a plurality of atmospheric rollers 210 disposed in the atmospheric chamber 200. The plurality of atmospheric rollers 210 are arranged to be spaced apart from each other in the first direction. The plurality of atmospheric rollers 210 are provided to be rotatable in a first direction and in a reverse direction of the first direction.

The substrate processing apparatus 100 includes a standby roller rotating part 270 for rotating the plurality of atmospheric rollers 210. The standby roller rotating part 270 is axially coupled to the rotating rollers of the standby roller rotating motor 271 that provides rotational power, the standby roller screw 273 rotated by the rotational power, and the plurality of atmospheric rollers 210, and the standby roller. It includes a standby roller power transmission member 275 orthogonal to the screw (273) receives the rotational power of the standby roller rotary motor 271.

The plurality of atmospheric rollers 210 are supported by the support frame 230 for supporting both ends of the rotating shaft are arranged in a multi-layer. The plurality of atmospheric rollers 210 arranged in a plurality of layers includes a plurality of first atmospheric rollers 211 and a plurality of second atmospheric rollers 212 disposed below the plurality of first atmospheric rollers 211. The support frame 230 preferably includes a first opening 231 communicating with the first entrance 201 and a second opening 233 communicating with the second entrance 203.

The substrate processing apparatus 100 includes an atmospheric roller lifting unit 250 for elevating the plurality of atmospheric rollers 210. The atmospheric roller lifting unit 250 includes a roller support shaft 251 for supporting the support frame 230, and a roller lifting pump 253 for elevating the roller support shaft 251.

5 is a perspective view showing the inside of the transfer chamber of the substrate processing apparatus according to the present embodiment. 1 to 3 and 5, the substrate processing apparatus 100 includes a plurality of transfer rollers 310 disposed inside the transfer chamber 300. The plurality of feed rollers 310 are arranged to be spaced apart from each other in the first direction. The plurality of feed rollers 310 are provided to be rotatable in a first direction and in a reverse direction of the first direction. The plurality of feed rollers 310 are supported by a plurality of supports 311 disposed respectively at one end and the other end of the rotating shaft.

The substrate processing apparatus 100 includes a feed roller rotating part 320 for rotating the plurality of feed rollers 310. The feed roller rotating part 320 is axially coupled to the feed roller rotating motor 321 providing the rotational power, the feed roller screw 322 rotated by the rotational power, and the rotating shafts of the plurality of feed rollers 310, and the feed roller. It includes a feed roller power transmission member 275 orthogonal to the screw 322 to receive the rotational power of the feed roller rotary motor 321.

The substrate processing apparatus 100 is disposed inside the transfer chamber 300 and includes a plurality of transfer arms 330 disposed between the plurality of transfer rollers 310. The plurality of transfer arms 330 includes a plurality of first transfer arms 331 and a plurality of second transfer arms 332 disposed below the plurality of first transfer arms 331.

The substrate processing apparatus 100 includes a transfer arm driver 360 for driving the plurality of transfer arms 330. The transfer arm driver 360 supports the plurality of transfer arms 330 to transfer the plurality of first transfer arms 331 and the plurality of second transfer arms 332 in the second direction, respectively. And a transfer arm lifting unit 350 for raising and lowering the transfer arm transfer unit 340.

The transfer arm transfer unit 340 includes a housing 345 forming a transfer path of the plurality of transfer arms 330. The transfer arm transfer unit 340 includes a plurality of first and second screws 341a and 341b that are screwed to the plurality of first and second transfer arms 331 and 332, respectively, and the first and second to provide rotational power. Two arm rotary motors 342a and 342b and first and second arm rotary motors 342a and 342b are coupled to rotation axes and are orthogonal to the plurality of first and second screws 341a and 341b, respectively. And first and second arm power transmission members 343a and 343b for transmitting rotational power of the arm rotation motors 342a and 342b.

The transfer arm lifter 350 includes an arm support shaft 351 for supporting the housing 345, and an arm lift pump 352 for lifting the arm support shaft 351.

6 is a perspective view showing the inside of the process chamber of the substrate processing apparatus according to the present embodiment. 1 to 3 and 6, the substrate processing apparatus 100 includes a stage 410 disposed inside the process chamber 400. The stage 410 is spaced apart from the bottom surface of the process chamber 400. The substrate processing apparatus 100 includes a plurality of lifting pins 430 penetrating the stage 410. The plurality of lifting pins 430 are arranged to be lifted between the plurality of transfer arms 330 carried into the process chamber 400. The substrate processing apparatus 100 includes a support plate 450 for supporting the plurality of lifting pins 430, and a substrate lifter 470 for elevating the substrate on the stage 410 by elevating the support plate 450. The substrate lift 470 includes a support plate support shaft 471 for supporting the support plate 450, and a support plate lift pump 472 for elevating the support plate support shaft 471.

Hereinafter, the operation of the substrate treating apparatus according to the present embodiment will be described in detail with reference to the accompanying drawings.

7, 9, 10, 13, 15, 17, 19, 21, 23, and 25 are cross-sectional views illustrating a transfer state of a substrate by cutting the substrate processing apparatus according to the present embodiment based on line II ′ shown in FIG. 1. 8, 10, 12, 14, 16, 18, 20, 22, and 24 are cross-sectional views showing a substrate transfer state by cutting the substrate processing apparatus according to the present embodiment with reference to the II-II 'line.

7 and 8, in the atmospheric chamber 200, the second unprocessed substrate S2 is supported by the first atmospheric roller 211, and the first unprocessed substrate S1 is supported by the second atmospheric roller 212. It is supported. In the process chamber 400, the processing substrate Sa is supported by the stage 410.

Subsequently, the second gate valve 103 opens the second entrance 203 and the third entrance 301. The atmospheric roller rotating part 270 rotates the second atmospheric roller 212 in the first direction. The first unprocessed substrate S1 is transferred to the transfer chamber 300 and supported by the transfer roller 310. In this case, the plurality of transfer arms 330 are positioned below the transfer roller 310.

As such, when the first unprocessed substrate S1 is transferred to the transfer chamber 300, the second gate valve 103 closes the second entrance 203 and the third entrance 301.

9 and 10, the transfer arm lifting unit 350 raises the plurality of transfer arms 330. As the plurality of transfer arms 330 are raised, the first unprocessed substrate S1 is supported by the plurality of first transfer arms 331. In this case, the plurality of first transfer arms 331 and the plurality of second transfer arms 332 are positioned above the transfer roller 310.

On the other hand, the substrate lift 470 raises the plurality of lifting pins 430. The processing substrate Sa is spaced apart from the stage 410 and is supported by the plurality of lifting pins 430.

11 and 12, the third gate valve 105 opens the fourth inlet 303 and the fifth inlet 401. The transfer arm transfer unit 340 advances the plurality of second transfer arms 332 in the second direction. The plurality of second transfer arms 331 enters between the plurality of lifting pins 430 and is positioned below the processing substrate Sa supported by the plurality of lifting pins 430. The transfer arm lifting unit 350 raises the plurality of second transfer arms 332. The processing substrate Sa is spaced apart from the plurality of lifting pins 430 and is supported by the plurality of second transfer arms 332.

13 and 14, the transfer arm transfer unit 340 reverses the plurality of second transfer arms 332 in the reverse direction in the second direction. The processing substrate Sa is transferred to the transfer chamber 300.

15 and 16, the transfer arm lifting unit 350 lowers the plurality of transfer arms 330. As the plurality of transfer arms 330 are lowered, the processing substrate Sa is supported by the transfer roller 310, and the plurality of second transfer arms 332 are positioned below the transfer roller 310. In this case, the plurality of first transfer arms 331 supporting the first unprocessed substrate S1 is positioned above the transfer roller 310.

17 and 18, the transfer arm transfer unit 340 advances the plurality of second transfer arms 332 in the second direction. The first unprocessed substrate S1 is positioned above the plurality of lifting pins 430. The transfer arm lifting unit 350 lowers the plurality of transfer arms 330. As the plurality of transfer arms 330 descend, the first unprocessed substrate S1 is supported by the plurality of lifting pins 430 and spaced apart from the plurality of first transfer arms 331.

19 and 20, the transfer arm transfer unit 340 reverses the plurality of second transfer arms 332 in the reverse direction in the second direction. The third gate valve 105 closes the fourth entrance and the fifth entrance 401, and the substrate lifting unit 470 lowers the plurality of lifting pins 430. As the plurality of lifting pins 430 are lowered, the first unprocessed substrate S1 is supported by the stage 410. The process chamber 400 applies a process according to a process to the first unprocessed substrate S1.

21 and 22, the second gate valve 103 opens the second entrance 203 and the third entrance 301. The feed roller rotating part 320 rotates the plurality of feed rollers 310 in the reverse direction of the first direction. The processing substrate Sa is transferred to the atmospheric chamber 200 and supported by the plurality of second atmospheric rollers 212.

Referring to FIGS. 23 and 24, when the processing substrate Sa is supported by the plurality of second atmospheric rollers 212, the atmospheric roller lifting unit 250 lowers the plurality of atmospheric rollers 210. The atmospheric roller rotating part 270 rotates the plurality of first atmospheric rollers 211 in the first direction. The second unprocessed substrate S2 is transferred to the transfer chamber 300 and supported by the transfer roller 310. The second gate valve 103 seals the second entrance 203 and the third entrance 301.

Referring to FIG. 25, the first gate valve 101 opens the first entrance 201. The substrate transfer device 10 enters the end effector 11 disposed in the lower side of the multilayer end effector 11 into the atmospheric chamber 200. The end effector 11 entering the atmospheric chamber 200 enters the lower side of the plurality of second atmospheric rollers 212, respectively. The end effector 11 is raised to support the processing substrate Sa. The end effector 11 supporting the processing substrate Sa moves backward to convey the processing substrate Sa to the outside of the substrate processing apparatus 100.

Subsequently, the substrate transfer device 10 enters the end effector 11 disposed above the end effector 11 of the multilayer layer into the atmospheric chamber 200. At this time, the end effector 11 enters the upper side of the plurality of first standby rollers 211 while the third unprocessed substrate S3 is supported. The end effector 11 is lowered, and the third unprocessed substrate S3 is supported by the plurality of first atmospheric rollers 211.

As described above, the unprocessed substrate and the processed substrate may be linearly transferred between the transfer chamber, the atmospheric chamber 200, and the process chamber 400. In addition, the transfer chamber 300 and the atmospheric chamber 200 may accommodate the unprocessed substrate Sa and the processed substrate Sa together.

1 is a plan view showing the arrangement of each chamber in the substrate processing apparatus according to the present embodiment.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

3 is a cross-sectional view taken along line II-II ′ of FIG. 1.

4 is a perspective view showing the inside of the atmospheric chamber of the substrate treating apparatus according to the present embodiment.

5 is a perspective view showing the inside of the transfer chamber of the substrate processing apparatus according to the present embodiment.

6 is a perspective view showing the inside of the process chamber of the substrate processing apparatus according to the present embodiment.

7, 9, 10, 13, 15, 17, 19, 21, 23 and 25 are cross-sectional views showing the substrate transfer state by cutting the substrate processing apparatus according to this embodiment with reference to the line II ′ shown in FIG. to be.

8, 10, 12, 14, 16, 18, 20, 22, and 24 are cross-sectional views showing the substrate transfer state by cutting the substrate processing apparatus according to the present embodiment based on the II-II 'line.

<Description of Signs of Major Parts of Drawings>

100: substrate processing apparatus 200: atmospheric chamber

210: standby roller 300: transfer chamber

310: feed roller 400: process chamber

Claims (13)

The atmospheric chamber, A transfer chamber disposed in a first direction from the standby chamber; A process chamber disposed in a second direction crossing the first direction from the transfer chamber; A plurality of atmospheric rollers disposed in the atmospheric chamber to support the substrates carried into the atmospheric chamber, spaced apart from each other in the first direction, and rotated in opposite directions of the first direction and the first direction; A plurality of transfer rollers disposed in the transfer chamber to support the substrate to be carried into the transfer chamber, spaced apart from each other in the first direction, and rotated in opposite directions of the first direction and the first direction; A plurality of transfer arms disposed between the plurality of transfer rollers, And a transfer arm driver for elevating the plurality of transfer arms with respect to the plurality of transfer rollers and transferring the plurality of transfer arms in the second direction. According to claim 1, wherein the plurality of the atmospheric rollers are arranged in multiple layers, A support frame for supporting the plurality of atmospheric rollers arranged in multiple layers; Substrate processing apparatus further comprises a standby roller lifting unit for lifting a plurality of the atmospheric rollers. The substrate processing apparatus of claim 2, wherein the support frame comprises a first opening opening in the second direction and a second opening opening in the first direction. The substrate processing apparatus according to claim 1, further comprising a standby roller rotating portion for rotating the plurality of the atmospheric rollers. The substrate processing apparatus of claim 1, further comprising a feed roller rotating unit configured to rotate the plurality of feed rollers. The substrate processing apparatus of claim 1, wherein the plurality of transfer arms include a plurality of first transfer arms and a plurality of second transfer arms disposed in a plurality of layers between the plurality of transfer rollers. The method of claim 1, wherein the transfer arm driver A transfer arm lifting unit for elevating a plurality of the transfer arms; Includes a transfer arm transfer unit for transferring a plurality of the transfer arm in the second direction, And the transfer arm transfer unit transfers the plurality of first transfer arms and the plurality of second transfer arms, respectively. Chamber, And a plurality of rollers disposed in the chamber to support the substrates to be carried into the chamber, spaced apart from each other in a first direction, and rotated in opposite directions of the first direction and the first direction. . The method of claim 8, wherein the plurality of the rollers are arranged in multiple layers, A support frame for supporting the plurality of rollers arranged in multiple layers; And a roller lifting unit for elevating the support frame. The substrate processing apparatus according to claim 9, further comprising a roller rotating portion for rotating the plurality of rollers. The method of claim 8, A plurality of transfer arms disposed between the plurality of rollers, And a transfer arm driver for elevating the plurality of transfer arms relative to the plurality of rollers and transferring the plurality of transfer arms in a second direction intersecting the first direction. The substrate of claim 11, wherein the plurality of transfer arms include a plurality of first transfer arms and a plurality of second transfer arms disposed in a plurality of layers between the rollers adjacent to each other in the second direction. Processing unit. The method of claim 12, wherein the transfer arm driver A transfer arm lifting unit for elevating a plurality of the transfer arms; Includes a transfer arm transfer unit for transferring a plurality of the transfer arm in the second direction, And the transfer arm transfer unit transfers the plurality of first transfer arms and the plurality of second transfer arms, respectively.
KR1020080134752A 2008-12-26 2008-12-26 Apparatus for processing substrate KR100965411B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060588A (en) * 2010-12-02 2012-06-12 주성엔지니어링(주) Substrate processing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070060640A (en) * 2005-12-09 2007-06-13 주식회사 테라세미콘 Display panel manufacturing system
JP2008174361A (en) * 2007-01-19 2008-07-31 Tokyo Electron Ltd Substrate conveying device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070060640A (en) * 2005-12-09 2007-06-13 주식회사 테라세미콘 Display panel manufacturing system
JP2008174361A (en) * 2007-01-19 2008-07-31 Tokyo Electron Ltd Substrate conveying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060588A (en) * 2010-12-02 2012-06-12 주성엔지니어링(주) Substrate processing apparatus
KR101688842B1 (en) * 2010-12-02 2017-01-03 주성엔지니어링(주) Substrate processing apparatus

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