KR100961713B1 - 도금 방법 - Google Patents

도금 방법 Download PDF

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Publication number
KR100961713B1
KR100961713B1 KR1020057004708A KR20057004708A KR100961713B1 KR 100961713 B1 KR100961713 B1 KR 100961713B1 KR 1020057004708 A KR1020057004708 A KR 1020057004708A KR 20057004708 A KR20057004708 A KR 20057004708A KR 100961713 B1 KR100961713 B1 KR 100961713B1
Authority
KR
South Korea
Prior art keywords
weight
ink
parts
metal
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057004708A
Other languages
English (en)
Korean (ko)
Other versions
KR20050071496A (ko
Inventor
알랜 존 호퍼
마크 로버트 제임스
Original Assignee
후지필름 이미징 컬러런츠 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 이미징 컬러런츠 리미티드 filed Critical 후지필름 이미징 컬러런츠 리미티드
Publication of KR20050071496A publication Critical patent/KR20050071496A/ko
Application granted granted Critical
Publication of KR100961713B1 publication Critical patent/KR100961713B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemically Coating (AREA)
KR1020057004708A 2002-09-20 2003-08-22 도금 방법 Expired - Fee Related KR100961713B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0221891.5 2002-09-20
GBGB0221891.5A GB0221891D0 (en) 2002-09-20 2002-09-20 Process

Publications (2)

Publication Number Publication Date
KR20050071496A KR20050071496A (ko) 2005-07-07
KR100961713B1 true KR100961713B1 (ko) 2010-06-10

Family

ID=9944477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057004708A Expired - Fee Related KR100961713B1 (ko) 2002-09-20 2003-08-22 도금 방법

Country Status (11)

Country Link
US (1) US7314573B2 (https=)
EP (1) EP1543703B1 (https=)
JP (1) JP4392350B2 (https=)
KR (1) KR100961713B1 (https=)
CN (1) CN1695406A (https=)
AT (1) ATE341187T1 (https=)
AU (1) AU2003260730A1 (https=)
DE (1) DE60308705T2 (https=)
GB (1) GB0221891D0 (https=)
TW (1) TWI317251B (https=)
WO (1) WO2004028224A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE412714T1 (de) * 2003-05-30 2008-11-15 Fujifilm Imaging Colorants Ltd Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
GB0324947D0 (en) * 2003-10-25 2003-11-26 Avecia Ltd Process
EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
KR102787541B1 (ko) 2015-06-04 2025-03-26 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
JP6975463B2 (ja) 2015-08-13 2021-12-01 カティーバ， インコーポレイテッド 金属表面上のエッチレジストパターンの製造方法
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
EP3786239B1 (en) * 2019-08-26 2023-11-15 Agfa-Gevaert Nv Radiation curable composition for plating applications

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10282662A (ja) 1997-04-07 1998-10-23 Nippon Kayaku Co Ltd 液状フォトレジストインク組成物及びその硬化物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315985A (en) * 1972-11-30 1982-02-16 International Business Machines Corporation Fine-line circuit fabrication and photoresist application therefor
US4270985A (en) 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10282662A (ja) 1997-04-07 1998-10-23 Nippon Kayaku Co Ltd 液状フォトレジストインク組成物及びその硬化物

Also Published As

Publication number Publication date
JP2005539389A (ja) 2005-12-22
US7314573B2 (en) 2008-01-01
TW200421952A (en) 2004-10-16
US20060049129A1 (en) 2006-03-09
CN1695406A (zh) 2005-11-09
KR20050071496A (ko) 2005-07-07
JP4392350B2 (ja) 2009-12-24
ATE341187T1 (de) 2006-10-15
DE60308705T2 (de) 2007-08-16
AU2003260730A1 (en) 2004-04-08
EP1543703A1 (en) 2005-06-22
EP1543703B1 (en) 2006-09-27
WO2004028224A1 (en) 2004-04-01
TWI317251B (en) 2009-11-11
DE60308705D1 (de) 2006-11-09
GB0221891D0 (en) 2002-10-30

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