KR100939646B1 - 급속열처리장치용 기판지지수단 - Google Patents
급속열처리장치용 기판지지수단 Download PDFInfo
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- KR100939646B1 KR100939646B1 KR1020070124415A KR20070124415A KR100939646B1 KR 100939646 B1 KR100939646 B1 KR 100939646B1 KR 1020070124415 A KR1020070124415 A KR 1020070124415A KR 20070124415 A KR20070124415 A KR 20070124415A KR 100939646 B1 KR100939646 B1 KR 100939646B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (12)
- 기판이 올려 놓여지는 에지링을 지지하는 기판지지수단에 있어서,윗면에 플랜지 삽입홈이 형성되며 상기 플랜지 삽입홈의 내측벽 안쪽면에는 링 스프링이 끼워질 수 있는 스프링 홈이 형성되는 지지 하우징;상기 스프링 홈에 끼워지는 링 스프링;상기 플랜지 삽입홈에 끼워져서 상기 링 스프링의 탄성력에 의해서 바깥쪽으로 밀려 상기 플랜지 삽입홈의 내측벽 바깥쪽 면에 밀착되는 지지 플랜지;상기 지지 플랜지가 상기 링 스프링에 의해 바깥쪽으로 밀리는 힘에 의하여 안쪽면이 상기 지지 플랜지의 위쪽 바깥쪽면에 밀착되도록 상기 지지 플랜지의 위에 끼워져서 상기 에지링을 지지하는 지지 실린더;를 포함하는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 하우징은 기판회전수단의 회전자에 연결되도록 설치되는 것을 특징으로 하는 기판지지수단.
- 제2항에 있어서, 상기 기판회전수단이 자기부상모터인 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 하우징은 고리 형태를 하는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 플랜지 삽입홈은 적어도 세군데 형성되는 것을 특징으로 하는 기판지지수단.
- 제5항에 있어서, 상기 지지 하우징은 고리 형태를 하며, 상기 플랜지 삽입홈은 상기 지지 하우징의 중심을 기준으로 하여 120도의 간격으로 3군데 형성되는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 스프링 홈은 상하로 적어도 2개 형성되는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 링 스프링은 완전한 폐곡선 형태의 링이 아닌 일부분이 절개되어 개방된 링 형태를 하는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 플랜지는,상기 플랜지 삽입홈에 끼워지는 삽입부;상기 삽입부의 윗단에서 안쪽으로 연장되어 상기 지지 실린더가 걸려서 밑으로 더 이상 내려오지 못하도록 하는 절곡부;상기 절곡부의 안쪽 끝단에서 위로 연장되어 상기 지지 실린더가 끼워지는 고정부;를 포함하여 이루어지는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 실린더는 석영으로 이루어지는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 실린더가 석영 또는 실리콘 카바이드로 이루어지는 것을 특징으로 하는 기판지지수단.
- 제1항에 있어서, 상기 지지 하우징은 세라믹으로 이루어지는 것을 특징으로 하는 기판지지수단.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070124415A KR100939646B1 (ko) | 2007-12-03 | 2007-12-03 | 급속열처리장치용 기판지지수단 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070124415A KR100939646B1 (ko) | 2007-12-03 | 2007-12-03 | 급속열처리장치용 기판지지수단 |
Publications (2)
Publication Number | Publication Date |
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KR20090057714A KR20090057714A (ko) | 2009-06-08 |
KR100939646B1 true KR100939646B1 (ko) | 2010-02-03 |
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KR1020070124415A KR100939646B1 (ko) | 2007-12-03 | 2007-12-03 | 급속열처리장치용 기판지지수단 |
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KR (1) | KR100939646B1 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000023849A (ko) * | 1997-05-16 | 2000-04-25 | 조셉 제이. 스위니 | 알 티 피 챔버용 자기 부양 로터 시스템 |
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- 2007-12-03 KR KR1020070124415A patent/KR100939646B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20000023849A (ko) * | 1997-05-16 | 2000-04-25 | 조셉 제이. 스위니 | 알 티 피 챔버용 자기 부양 로터 시스템 |
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KR20090057714A (ko) | 2009-06-08 |
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