KR100923242B1 - Method for auto socket off of test handler - Google Patents

Abstract

The present invention relates to an automatic socket off method of a test handler, wherein in a test handler using two or more test trays individually assigned an identification ID, a plurality of test objects stored in each test tray A method of turning off a specific socket among a plurality of sockets provided in a test head performing a test in a state in which a semiconductor device is connected to each other, so as to perform a pocket off for each test tray identified by an identification ID. Obtaining information; Placing a specific test tray to a loading site for loading the semiconductor device under test; Obtaining an identification ID of a specific test tray located at the loading site; And turning off the socket corresponding to the turned off pocket when the specific test tray is located at the test site and the test is performed using the pocket off execution information on the specific test tray identified through the obtained identification ID. Include. Therefore, the socket-off can be performed more accurately in consideration of both the defect caused by the socket of the test head as well as the defect caused by the abnormality of the pocket of the test tray, thereby improving the production yield and the work efficiency.

Test handler, socket off, test tray, pocket off

Description

Automatic socket off method of test handler {METHOD FOR AUTO SOCKET OFF OF TEST HANDLER}

The present invention relates to a test handler, and more particularly, a test handler which can automatically turn off the socket on the test head side to more accurately apply a test signal, thereby improving production yield and work efficiency. It relates to a socket off method.

In general, the semiconductor devices produced in the production line are then mounted in various electronic products such as computers to perform a core function, so that the test process to determine and determine whether the product is good or defective and the degree of reliability of the product before shipment. To do this, we use the usual test handler.

That is, a semiconductor chip separated from a wafer is mounted on one package substrate, such as a lead frame or a printed circuit board (PCB), and then attached to the package. Each semiconductor device formed by electrically connecting the package substrate with a metal wire or the like is tested by a test handler and selected.

The test handler connects the input / output terminals of the semiconductor device with the test signal generator to test the normal operation and disconnection, and connects several input / output terminals such as the power input terminal of the semiconductor device to the test signal generator for normal operation. A burn-in test is performed to test the life of the semiconductor device and whether a defect occurs while applying stress at a temperature, voltage, and current higher than the condition.

1 illustrates a test handler according to a conventional example.

Referring to FIG. 1, after a customer tray in which semiconductor elements of a test target are stored is supplied to be loaded in the loading unit 10, each customer tray of the loading unit 10 is transferred to a first tray transfer. It is conveyed by the (20) and is supplied to the loading buffer unit 30.

Then, the loading picker robot 40 picks up and transfers the semiconductor elements in the customer tray positioned in the loading buffer unit 30 and waits in the exchange area unit 50 in advance. transfer to tray.

Thereafter, the test tray in which all the semiconductor devices are accommodated is transferred to the chamber part 60 located at the rear side by a separate transfer means (not shown) and tested in the chamber part 60.

Here, the chamber part 60 tests the semiconductor devices under the temperature conditions while sequentially transferring the test trays by creating a predetermined high or low temperature environment. In general, the three closed chambers are arranged in contiguous manner. The preheating chamber (not shown) for preheating the semiconductor elements to a high or low temperature, and a plurality of sockets provided in the test head connected to the tester for the semiconductor elements passed through the preheating chamber A test chamber (not shown) connected to perform a test at a high temperature or a low temperature, and a defrosting chamber which cools or heats the tested semiconductor devices through the test chamber to remove frost and return to the original room temperature state. (Not shown).

Subsequently, the test tray which has passed through the defrosting chamber of the chamber part 60 is transferred to the exchange area 50 and positioned, and unloads the tested semiconductor elements in the test tray located in the exchange area 50. 70, the pick-up transfer is carried out according to the test result, and is classified and transferred into the empty customer tray located in the unloading buffer unit 80, classified by good or bad or grade.

Thereafter, the customer tray containing the semiconductor devices classified according to the test result is transferred by the second tray transfer 90 and loaded in the unloading unit 100.

Thus, one cycle of the process is completed.

The test head of the tester applies a test input signal through the socket in a state in which the semiconductor devices to be tested are individually connected to the plurality of sockets provided therein, and receives the output signal output from the semiconductor device. Proceed.

The test tray is transported in a state in which a predetermined number of semiconductor elements are stored so that a test is performed. As illustrated in FIG. 2, a plurality of pockets 202 each containing a semiconductor element d are accommodated. Pockets 202 are arranged to form a matrix structure.

And, of course, a plurality of sockets are arranged on the test head side so as to correspond to the arrangement and the pitch of the pocket 202.

In addition, each socket of the test head has a contact portion such as a lead, and the semiconductor element d has an external connection terminal, and the contact portion of the socket and the external connection terminal of the semiconductor element d contact each other and are electrically connected.

As described above, when the socket itself of the test head is in an abnormal state during the test, the semiconductor element d may be determined to be defective due to this, for example, the contact portion of the socket repeatedly contacting the external connection terminal of the semiconductor element d. When a failure occurs, all of the semiconductor devices d tested with the socket may be determined to be defective.

Therefore, in the case where the failure of the semiconductor element d continuously occurs in a specific socket, it is determined that the socket itself is not the abnormality of the semiconductor element d, and that the socket is automatically turned off. The production signal and the working efficiency of the semiconductor device d are improved by preventing the test signal from being applied through the socket so that the semiconductor device d is not tested.

3 is a flowchart illustrating an automatic socket off method of a conventional test handler.

Referring to FIG. 3, first, all of the semiconductor elements d are loaded in the test tray 200 (S300), and then the corresponding test tray 200 is moved to a test site having a test head by a transfer means. After (S310), a test is performed at the test site (S320).

Thereafter, the controller (not shown) obtains a test result from the tester (S330), and analyzes the obtained test result to continuously fail the semiconductor device d several times in a specific socket. Automatically turn off the socket (S340).

Subsequently, the test tray 200 is moved to an unloading site for unloading the semiconductor devices d (S350), and then the semiconductor devices d are unloaded at the unloading site (S360).

The test tray 200 unloading the semiconductor devices d is then used for the test again.

In other words, the socket is immediately turned off at the test site according to the test result.

However, this conventional automatic socket off method has the following problems.

That is, since the socket-off is performed in consideration of only the defect due to the abnormality of the socket itself, the loss of the semiconductor element due to the abnormality of the pocket 202 of the test tray 200, that is, the occurrence of the defect cannot be considered. There is a problem that the accuracy is lowered.

For example, the semiconductor device in the pocket 202 is separated beyond the specific pocket 202 of the test tray 200 while the test tray 200 is transferred from the test site to the unloading site after the end of the test at the test site. Can be lost.

Specifically, the test tray 200 is frequently deformed due to the high temperature environment during the test, and accordingly, the semiconductor element d in the pocket 202 may be detached and lost while the specific pocket 202 is deformed and transferred. Can be.

In this case, when it is determined that the socket corresponding to the corresponding pocket 202 has no abnormality at the test site, the semiconductor device d may be stored and lost in the pocket 202 afterwards, thereby producing a production yield and operation. The efficiency will be reduced.

The present invention was devised to solve the above problems, and by performing socket-off considering defects caused by abnormal pockets of the test tray, a test handler which can further improve production yield and work efficiency of a semiconductor device. Its purpose is to provide an automatic socket off method.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

The automatic socket-off method of the test handler of the present invention for achieving the above object, in the test handler using two or more test trays, each of which is individually assigned an identification ID, and a plurality of test target semiconductor elements housed in each test tray; A method of turning off a specific socket among a plurality of sockets provided in a test head for performing a test in each connected state, so as to obtain pocket-off execution information for each test tray identified by an identification ID. step; Placing a specific test tray to a loading site for loading the semiconductor device under test; Obtaining an identification ID of a specific test tray located at the loading site; And turning off the socket corresponding to the turned off pocket when the specific test tray is located at the test site and the test is performed using the pocket off execution information on the specific test tray identified through the obtained identification ID. Include.

Preferably, the off pocket does not load the semiconductor device under test.

Also preferably, the pocket off execution information may be obtained from a test result and abnormal pocket information.

Also preferably, the abnormal pocket information is information on a pocket in which the semiconductor element to be unloaded does not exist at the unloading site.

Also preferably, the test result is information on a pocket in which a defect of a semiconductor element occurs.

Also preferably, the obtaining of the pocket off execution information may include obtaining an identification ID of a test tray located at a loading site; Performing a test at a test site after the test target semiconductor devices are loaded in the test tray of the obtained identification ID; Obtaining a test result which is information on a pocket in which a semiconductor element determined to be defective is received among the pockets provided in the test tray of the obtained identification ID; Unloading the tested semiconductor device from the test tray of the identification ID obtained at the unloading site; Acquiring abnormal pocket information which is information on a pocket in which the semiconductor element of the unloading target does not exist among the pockets provided in the test tray of the obtained identification ID; and including the test result and the abnormal pocket information. The method of determining a pocket off of a specific pocket of a test tray of the acquired identification ID through the process of comparing with the reference is characterized in that the pocket off execution information is obtained for each test tray distinguished through the identification ID.

Also preferably, the acquiring of the pocket off execution information may include at least one of a manual mode for manually determining the pocket off of each test tray and an automatic mode for automatically determining the pocket off of each test tray. When the mode is set to the automatic mode, the automatic mode is performed according to any one mode that is selectively set among absolute automatic mode or relative automatic mode.

Also preferably, the absolute automatic mode may include: determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than a set yield; And determining to turn off the corresponding pocket when less than the determination result.

Also preferably, the relative automatic mode may include: determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than the total pocket average yield minus the set yield; And determining to turn off the corresponding pocket when less than the determination result.

On the other hand, the automatic pocket off method of the test tray according to another aspect of the present invention,
Obtaining, in a test handler using two or more test trays individually assigned identification IDs, an identification ID of a test tray located at a loading site by turning off a specific pocket of a specific test tray in which a pocket abnormality has occurred; Performing a test at a test site after the test target semiconductor devices are loaded in the test tray of the obtained identification ID; Obtaining a test result which is information on a pocket in which a semiconductor element determined to be defective is received among the pockets provided in the test tray of the obtained identification ID; Unloading the tested semiconductor device from the test tray of the identification ID obtained at the unloading site; Acquiring abnormal pocket information which is information on a pocket in which the semiconductor element to be unloaded does not exist among the pockets provided in the test tray of the obtained identification ID; By comparing the test result and the abnormal pocket information with a set failure criterion, the pocket off for a specific pocket of the test tray of the identification ID obtained is determined, the pocket for each test tray distinguished by the identification ID Obtaining off implementation information; Obtaining an identification ID of a test tray located at the loading site to be used for the test again; And loading the semiconductor device into only the pockets excluding the off pockets of the test tray located at the loading site by using the obtained pocket off execution information about the test tray located at the loading site. It is characterized by.

According to the present invention, the socket-off can be performed more accurately in consideration of not only the defects caused by the sockets of the test head but also the defects caused by the pockets of the test tray, so that the effect of improving production yield and working efficiency is achieved. Can be.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to the present invention, in a test handler using two or more test trays to which an ID is individually identified, in performing an automatic socket-off for a specific socket among a plurality of sockets provided in the test head, all of the factors that can be considered first are attributable to As described later, a pocket off is performed for each test tray, and then socket-off is performed so as to correspond to the pocket off performed on the specific test tray when the specific test tray is used for the test again.

First, the automatic pocket off method of the test tray will be described.

4 is a flowchart illustrating an automatic pocket off method of a test tray according to a preferred embodiment of the present invention.

In describing the present invention, the same reference numerals are given to the same components as in the related art, and detailed description thereof will be omitted.

Referring to FIG. 4, first, an empty test tray 200 is moved to a loading site to be loaded with a semiconductor device d under test (S400).

At this time, the identification ID (id) of the test tray 200 is detected by a separate sensor means (not shown) while the test tray 200 in the empty state is moved to the loading site or is located at the loading site. The control unit obtains an identification ID of the test tray 200 in step S410.

That is, since a predetermined pattern corresponding to the identification ID is displayed in the outer region of each test tray 200, the identification means may be confirmed by the sensor means detecting the identification pattern.

Subsequently, the loading picker robot 40 loads all the semiconductor devices d under test into the empty test tray 200 in which the identification ID located at the loading site is confirmed (S420).

Then, the test tray 200 loaded with all the semiconductor devices d under test is moved to the test site by a separate transfer means (S430).

Thereafter, the semiconductor devices d in the test tray 200 located at the test site are connected to sockets of the test head connected to the tester, respectively, and the test is performed (S440).

Then, as all the tests are finished, the tester sends a test result to the control unit, and the control unit obtains the test result and stores the test result so that it matches with the identification ID of the test tray that has been acquired.

Subsequently, the test tray 200 in which the test is completed is transferred to the unloading site by the transfer means and positioned (S460).

Thereafter, the semiconductor devices d tested from the test tray 200 located at the unloading site are classified and unloaded by the unloading picker robot 70 (S470).

At this time, the sensor means (not shown) provided in each pickup portion of the unloading picker robot 70 detects the pocket 202 as long as the semiconductor element d to be unloaded is not present. Pocket information "is sent to the control unit, and the control unit obtains the" abnormal pocket information "and stores it so as to match the identification ID of the test tray 200 that has been planned and acquired (S480).

Here, the absence of the semiconductor element d to be unloaded from the specific pocket 202 means that the semiconductor element d in the pocket 202 is transferred while the test tray 200 is transferred from the test site to the unloading site. It means that it has been lost and lost.

Subsequently, when all the semiconductor devices d are unloaded from the test tray 200, the controller determines whether the mode set for determining the pocket off is the "manual mode" or the "auto mode" (S490).

As a result of the determination, when it is set to the manual mode, the operator inputs to turn off the designated specific pocket 202 at a necessary time point (S495), that is, to turn off the designated specific pocket 202 of the specific test tray.

Here, the meaning of turning off the specific pocket 202 means that the corresponding pocket 202 of the specific test tray does not load the semiconductor device d under test at the loading site at all.

On the other hand, as a result of the determination, if the automatic mode is set, the "absolute automatic mode" or "relative automatic mode" is identified again, and then proceeds to the pocket off process for each mode (S500 / S600).

A detailed automatic pocket off method for each of the " absolute auto mode " and " relative auto mode "

First, the absolute automatic mode 500 will be described with reference to FIG. 5.

In the case of the absolute automatic mode 500, the control unit uses each of the pockets 202 of the corresponding test tray 200 by using the "test result" and "abnormal pocket information" for the "specific test tray identified through the identification ID". It is determined whether the failure (F) for each (S510).

Here, the failure F includes not only the failure according to the test result but also the failure due to the unloading due to the abnormal pocket 202.

As a result of the determination, when a failure F occurs in a specific pocket 202 of a specific test tray, the controller increases the failure count value of the specific pocket 202, that is, "F count" by "1" to increase the failure count value. Update (S520).

Subsequently, the controller determines whether the updated "F count" exceeds (or exceeds) a preset setting count value, that is, "setting count" (S530).

In other words, it is determined whether or not a failure determination of a set number of times or more occurs in the pocket 202.

As a result of the determination, when "F count" exceeds "setting count", the corresponding pocket 202 decides to immediately turn off the corresponding pocket 202 because the pocket itself is abnormal or the socket of the corresponding test head is abnormal. (S560).

On the other hand, if the determination result that "F count" is less than (or less than) "setting count", the corresponding pocket 202 is that the pocket itself or the socket of the corresponding test head is not abnormal, so that in the corresponding pocket 202 Calculate the yield (Y ₁ ) of (S540).

In this case, the pocket yield Y ₁ is a percentage of the quantity of semiconductor elements d finally determined to be good after unloading with respect to the total quantity of semiconductor elements d tested in the corresponding pocket 202.

Then, it is determined whether the calculated pocket yield (Y ₁ ) is less than (or less than) the predetermined set yield (Y ₀ ) (S550), and the calculated pocket yield (Y ₁ ) is less than the set yield (Y ₀ ). In this case, the pocket 202 determines whether to turn off the pocket 202 immediately because the pocket itself is abnormal or the socket of the test head corresponding thereto is strange (S560).

On the other hand, if the determined pocket yield (Y ₁ ) exceeds (or exceeds) the set yield (Y ₀ ), the corresponding pocket 202 has no abnormality in the pocket itself or the corresponding test head socket. It ends.

The absolute automatic mode described above is to determine to turn off the pocket 202 unconditionally when the defective rate of the specific pocket 202 exceeds a predetermined reference value.

Meanwhile, the relative automatic mode 600 will be described with reference to FIG. 6.

In the case of the relative automatic mode 600, the control unit uses each of the pockets 202 of the corresponding test tray 200 by using the "test result" and "abnormal pocket information" for the "specific test tray identified through the identification ID". It is determined whether the failure (F) for each (S610).

Here, the defect (F) includes not only the failure according to the test result but also the failure due to the unloading due to the pocket 202 or more.

As a result of the determination, when a defect F occurs in the specific pocket 202, the controller updates the defect count value by increasing the defect count value of the specific pocket 202, that is, "F count" by "1" ( S620).

Subsequently, the controller determines whether the updated "F count" exceeds (or exceeds) a preset setting count value, that is, "setting count" (S630).

In other words, it is determined whether or not a failure determination of a set number of times or more occurs in the pocket 202.

As a result of the determination, when "F count" exceeds "setting count", the corresponding pocket 202 decides to immediately turn off the corresponding pocket 202 because the pocket itself is abnormal or the socket of the corresponding test head is abnormal. (S660).

On the other hand, if the determination result that "F count" is less than (or less than) "setting count", the corresponding pocket 202 is that the pocket itself or the socket of the corresponding test head is not abnormal, so that in the corresponding pocket 202 Calculate the yield (Y ₁ ) of (S640).

In this case, the pocket yield Y ₁ is a percentage of the quantity of semiconductor elements d finally determined to be good after unloading with respect to the total quantity of semiconductor elements d tested in the corresponding pocket 202.

In addition, it is determined whether the calculated pocket yield (Y ₁ ) is less than (or less than) a value obtained by subtracting a predetermined set yield (Y ₀ ) from the total pocket average yield (Y _T ) (S650). The pocket 202 determines that the pocket 202 is turned off immediately because the pocket itself is abnormal or the socket of the test head corresponding thereto is strange (S660).

On the other hand, if the calculated pocket yield (Y ₁ ) is exceeded (or over) the pocket 202 is terminated as it is because the pocket itself or the socket of the test head corresponding thereto is not abnormal.

The relative automatic mode as described above is to decide to turn off relatively when the failure rate of the specific pocket 202 is lower than the average of the failure rates of the entire pockets.

In addition, the meaning of turning off the specific pocket 202 of the specific test tray 200 in the absolute automatic mode or the relative automatic mode means that the semiconductor device d under test is applied to the specific pocket 202 of the specific test tray. ), The loading picker robot 40 does not load the semiconductor device at all.

In the above, two cases of the absolute automatic mode and the relative automatic mode are representatively described as an auxiliary mode of the automatic mode for determining the pocket off. The relative automatic mode is shown using the set count value, the set yield, and the total pocket yield, but it is of course possible to set other modes to which different reference values are applied.

On the other hand, after the pocket off is performed for a specific pocket 202 of a specific test tray 200 through the above process, when the test is performed with the specific test tray is located at the test site thereafter, The socket is turned off.

7 is a flowchart illustrating an automatic socket off method according to a preferred embodiment of the present invention.

In the test handler, a test is performed using two or more test trays, and each test tray 200 is repeatedly used for a test. Therefore, the specific test tray 200 that has undergone the pocket off process is used again for the test later.

That is, the test tray 200 is moved to the loading site in an empty state to be used again for the test (S700).

In this case, the identification ID of the corresponding test tray 200 is detected by a separate sensor means and sent to the controller while being moved to the loading site or positioned, and the controller acquires the identification ID of the corresponding test tray 200. (S710).

Then, the control unit loads the semiconductor device d not to be loaded into the pocket-off specific pocket 202 according to the pocket-off execution information for the specific test tray already stored to match the obtained “identification ID”. Operation control of the picker robot 40 (S720).

When the test is performed using the specific test tray including the pocket 202 pocketed off at the test site, the controller turns off the socket of the test head corresponding to the pocketed pocket 202 (S730).

Accordingly, the semiconductor device d may not be loaded into the specific pocket 202 of the specific test tray that has been pocketed off in a subsequent test process, and the test through the socket of the corresponding test head does not proceed at all. do.

In summary, while in the past, the socket was immediately turned off at the test site according to the test result while overlooking that there may be an abnormality in a specific pocket of a specific test tray, but in the present invention, all the tested semiconductor devices d are After the unloading, the pocket off is performed for each test tray first, and then the socket off is performed at that time so that the specific test tray corresponds to the specific pocket 202 that is pocketed off at the time of use.

As a result, according to the present invention, the automatic socket-off can be performed more accurately in consideration of not only the defect caused by the socket of the test head but also the defect caused by the abnormality of the pocket 202 of the test tray 200. The efficiency can be improved.

In addition, the control unit is a function circuit for acquiring and storing information transmitted from the tester and various sensor means, and controlling the operation of the tester and the picker robots 40 and 70 to perform pocket-off and socket-off. And a computer or the like.

In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

1 is a schematic diagram illustrating a test handler according to a conventional example;

2 is a schematic diagram showing a conventional test tray;

3 is a flowchart of an automatic socket off method of a conventional test handler;

4 is a flow chart for an automatic pocket off method of a test tray according to a preferred embodiment of the present invention;

5 is a flow chart for the absolute automatic mode of FIG.

6 is a flow chart for the relative automatic mode of FIG.

7 is a flowchart illustrating an automatic socket off method of a test handler according to an exemplary embodiment of the present invention.

Claims (13)

In a test handler using two or more test trays individually assigned an identification ID, a plurality of sockets provided in a test head for performing a test in connection with a plurality of test target semiconductor elements stored in each test tray. By turning off the socket so that the test signal is not applied, Acquiring pocket off execution information for each test tray identified by the identification ID; Placing a specific test tray to a loading site for loading the semiconductor device under test; Obtaining an identification ID of a specific test tray located at the loading site; And Using the pocket-off implementation information for the specific test tray identified through the obtained identification ID, turning off the socket corresponding to the off-pocket when the specific test tray is located at the test site and the test is in progress; Automatic socket off method of the test handler. The method of claim 1, And the semiconductor device under test is not loaded into the pocket which is turned off. The method of claim 1, The pocket off conduct information, Automatic socket off method of a test handler, characterized in that obtained from the test results and abnormal pocket information. The method of claim 3, wherein The abnormal pocket information, An automatic socket-off method of a test handler, wherein the information is about a pocket in which an unloading semiconductor element does not exist at an unloading site. The method of claim 3, wherein The test results, An automatic socket-off method of a test handler, characterized in that it is information on a pocket in which a defect of a semiconductor element has occurred. The method according to claim 1 or 3, Acquiring the pocket off implementation information, Obtaining an identification ID of a test tray located at the loading site; Performing a test at a test site after the test target semiconductor devices are loaded in the test tray of the obtained identification ID; Obtaining a test result which is information on a pocket in which a semiconductor element determined to be defective is received among the pockets provided in the test tray of the obtained identification ID; Unloading the tested semiconductor device from the test tray of the identification ID obtained at the unloading site; And acquiring abnormal pocket information which is information on a pocket in which the semiconductor element to be unloaded does not exist among the pockets provided in the test tray of the obtained identification ID. By comparing the test result and the abnormal pocket information with a set failure criterion, the pocket off for a specific pocket of the test tray of the identification ID obtained is determined, the pocket for each test tray distinguished by the identification ID And an off implementation information. The method of claim 6, Acquiring the pocket off implementation information, It is performed according to any one mode which is selectively set between the manual mode which manually determines the pocket off of each test tray and the automatic mode which automatically determines the pocket off of each test tray, If the automatic mode is set, the automatic socket-off method of the test handler, characterized in that performed in accordance with any one of the modes selectively set to the absolute automatic mode or the relative automatic mode. The method of claim 7, wherein The absolute silent mode, Determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than a set yield; And And determining to turn off the corresponding pocket when less than the determination result. The method of claim 7, wherein The relative automatic mode, Determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than the total pocket average yield minus the set yield; And And determining to turn off the corresponding pocket when less than the determination result. In test handlers that use two or more test trays with individually identified IDs, by turning off a specific pocket in a particular test tray where a pocket anomaly occurs, Obtaining an identification ID of a test tray located at the loading site; Performing a test at a test site after the test target semiconductor devices are loaded in the test tray of the obtained identification ID; Obtaining a test result which is information on a pocket in which a semiconductor element determined to be defective is received among the pockets provided in the test tray of the obtained identification ID; Unloading the tested semiconductor device from the test tray of the identification ID obtained at the unloading site; Acquiring abnormal pocket information which is information on a pocket in which the semiconductor element to be unloaded does not exist among the pockets provided in the test tray of the obtained identification ID; By comparing the test result and the abnormal pocket information with a set failure criterion, the pocket off for a specific pocket of the test tray of the identification ID obtained is determined, the pocket for each test tray distinguished by the identification ID Obtaining off implementation information; Obtaining an identification ID of a test tray located at the loading site to be used for the test again; And Loading the semiconductor device into only the pockets excluding the off pockets of the test trays located at the loading site, using the already obtained pocket off execution information on the test trays located at the loading site; Automatic pocket off method for test trays. The method of claim 10, Acquiring the pocket off implementation information, It is performed according to any one mode which is selectively set between the manual mode which manually determines the pocket off of each test tray and the automatic mode which automatically determines the pocket off of each test tray, When the automatic mode is set, the automatic pocket-off method of the test tray, characterized in that performed in accordance with any one of the modes selectively set to the absolute automatic mode or the relative automatic mode. The method of claim 11, The absolute silent mode, The absolute silent mode, Determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than a set yield; And And determining to turn off the corresponding pocket when less than the determination result. The method of claim 11, The relative silent mode, Determining a failure in each pocket; If a failure occurs in a specific pocket as a result of the determination, updating the failure count value for the corresponding pocket by 1; Determining whether the updated bad count value exceeds a set count value; Determining to turn off the corresponding pocket if it exceeds the determination result; Calculating a pocket yield if less than the determination result; Determining whether the calculated pocket yield is less than the total pocket average yield minus the set yield; And And determining to turn off the corresponding pocket when less than the determination result.

Images