KR100922359B1 - Organic light emitting display - Google Patents

Abstract

The present invention provides an organic light emitting display device capable of suppressing damage of a panel assembly to a drop impact. In the organic light emitting diode display according to the present invention, the panel assembly includes a first substrate of a glass material having a display area and a pad area and forming a plurality of organic light emitting elements in the display area, and a plurality of organic light emitting diodes fixed to the first substrate. And a second substrate covering and protecting the device. The second substrate is formed of a material different from that of the first substrate.

 Panel Assembly, Bezel, Flexible Circuit Board, Printed Circuit Board, Organic Light Emitting Diode

Description

Organic Light Emitting Display {ORGANIC LIGHT EMITTING DISPLAY}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display, and more particularly, to an improved organic light emitting display of a material of a second substrate covering and protecting organic light emitting elements formed on a first substrate.

The organic light emitting diode display includes organic light emitting devices including a hole injection electrode, an organic light emitting layer, and an electron injection electrode, and when an exciton generated by combining electrons and holes in the organic light emitting layer falls from an excited state to a ground state Light emission is caused by the generated energy.

In this way, the organic light emitting diode display has a self-luminous property and, unlike a liquid crystal display, does not require a separate light source, thereby reducing thickness and weight. In addition, the organic light emitting display device has high quality characteristics such as low power consumption, high luminance, and high response speed, and thus is considered as a next generation display device of portable electronic devices.

In general, an organic light emitting display device includes a panel assembly for forming organic light emitting diodes therein, a bezel coupled to the panel assembly at the rear of the panel assembly, and a printed circuit board electrically connected to the panel assembly through a flexible circuit board. .

The organic light emitting display device has a structure in which two glass substrates constituting the panel assembly have a thin thickness, and unlike the liquid crystal display device in which the inside of the panel assembly is filled with liquid crystal, an empty space exists inside the panel assembly. It is vulnerable to the same external shock.

In particular, since the second substrate covering and protecting the organic light emitting diodes formed on the first substrate in the panel assembly has a structure formed by processing the inside thereof, the second substrate has a thinner thickness at the center portion where the space is formed. Therefore, when the impact is applied from the front surface of the organic light emitting diode display, the second substrate may be damaged, causing product defects.

An object of the present invention is to provide an organic light emitting display device capable of suppressing breakage of a second substrate against a drop impact by improving a material of a second substrate covering and protecting the organic light emitting elements formed on the first substrate.

An organic light emitting display device according to an embodiment of the present invention includes a first substrate made of a glass material having a display area and a pad area and forming a plurality of organic light emitting elements in the display area, and fixed to the first substrate. And a second substrate covering and protecting the light emitting device. The second substrate is formed of a material different from that of the first substrate.

The second substrate may be formed of a transparent synthetic resin film having a thickness smaller than that of the first substrate. The second substrate may be formed of any one of polyethylene film, polypropylene film, polyamide film, polyacetal film, polymethyl methacrylate film, polybutylene terephthalate film, polycarbonate film, cellulose film, and moisture proof cellophane. have.

The second substrate surrounds the entire upper surface, the entire side surface, and the lower portion of the first substrate, and the first substrate and the second substrate may be joined by a bonding member provided between the first substrate and the second substrate to the lower surface of the first substrate. have.

The OLED display further includes a bezel coupled to the first substrate at the rear of the first substrate, a flexible circuit board fixed to the pad region and folded to the rear of the bezel, and a printed circuit board electrically connected to the flexible circuit board. Can be.

The organic light emitting diode display according to the present invention can further reduce the thickness and weight of the panel assembly by improving the material of the second substrate, thereby making the whole product slimmer and lighter. In addition, since the second substrate has a high strain rate, the second substrate may absorb an external impact by itself. Therefore, the organic light emitting diode display according to the present invention can minimize the occurrence of defects by preventing the second substrate from being damaged by an external impact such as a drop impact.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 and 2 are exploded perspective views and a combined perspective view of an organic light emitting display device according to an exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view of the organic light emitting display device shown in FIG. 2.

1 to 3, the organic light emitting display device 100 according to the present exemplary embodiment includes a panel assembly including a display area A10 and a pad area A20 and displaying a predetermined image in the display area A10. 12, a bezel 14 coupled to the panel assembly 12 at the rear of the panel assembly 12, and a printed circuit board 18 electrically connected to the panel assembly 12 via the flexible circuit board 16. It includes.

The panel assembly 12 is formed of a first substrate 20 and a smaller size than the first substrate 20, and a second edge of which the edge is fixed to the first substrate 20 by the bonding member 22 (see FIG. 3). And a substrate 24. The display area A10 where an actual image is displayed is located in an area where the first substrate 20 and the second substrate 24 overlap with each other inside the bonding member 22, and the first substrate 20 outside the bonding member 22 is positioned. The pad area A20 is positioned on the top surface of the pad.

Subpixels are arranged in a matrix form in the display area A10 of the first substrate 20, and a scan is performed to drive the subpixels between the display area A10 and the bonding member 22 or outside the bonding member 22. Drivers (not shown) and data drivers (not shown) are located. Pad electrodes for transmitting electrical signals to the scan driver and the data driver are positioned in the pad region A20 of the first substrate 20.

4 is a diagram illustrating a subpixel circuit structure of the panel assembly illustrated in FIG. 1, and FIG. 5 is a partially enlarged cross-sectional view illustrating the inside of the panel assembly illustrated in FIG. 1.

4 and 5, the subpixel of the panel assembly 12 includes an organic light emitting element L1 and a driving circuit unit. The organic light emitting element L1 includes an anode electrode 26, an organic emission layer 28, and a cathode electrode 30, and the driving circuit unit includes at least two thin film transistors and one storage capacitor C1. The thin film transistor basically includes a switching transistor T1 and a driving transistor T2.

The switching transistor T1 is connected to the scan line SL1 and the data line DL1, and converts the data voltage input from the data line DL1 into the driving transistor T2 according to the switching voltage input to the scan line SL1. send. The storage capacitor C1 is connected to the switching transistor T1 and the power supply line VDD and stores a voltage corresponding to a difference between the voltage received from the switching transistor T1 and the voltage supplied to the power supply line VDD.

The driving transistor T2 is connected to the power supply line VDD and the storage capacitor C1 to convert the output current I _OLED proportional to the square of the difference between the threshold voltages stored in the storage capacitor C1 to the organic light emitting element L1. The organic light emitting element L1 emits light by the output current I _OLED . The driving transistor T2 includes a source electrode 32, a drain electrode 34, and a gate electrode 36, and the anode electrode 26 of the organic light emitting element L1 is the drain electrode 34 of the driving transistor T2. ) Can be connected. The configuration of the subpixel is not limited to the above-described example, and may be variously modified.

Referring back to FIGS. 1 to 3, the second substrate 24 may be bonded to the first substrate 20 by a bonding member 22 at a predetermined distance, and may include driving circuit parts formed on the first substrate 20. The organic light emitting diodes are sealed and protected from the outside. A polarizing film (not shown) that suppresses reflection of external light may be positioned outside the display area A10 of the second substrate 24, and an absorbent material (not shown) is attached to an inner surface of the second substrate 24. Can be.

In the present embodiment, the second substrate 24 of the panel assembly 12 is formed of a material different from that of the first substrate 20 of glass material. That is, the second substrate 24 is formed of a transparent synthetic resin film rather than glass, and has a thickness smaller than that of the first substrate 20.

For example, the second substrate 24 may be a polyethylene (PET) film, polypropylene (PP) film, polyamide (PA) film, polyacetal (POM) film, polymethyl methacrylate (PMMA) film, polybutyl It may be formed of any one of a lenterephthalate (PBT) film, a polycarbonate (PC) film, a cellulose film, and a moisture proof cellophane.

The second substrate 24 formed of such a synthetic resin film has high transparency, wear resistance, impact resistance, and moisture resistance, and has tough and durable characteristics. As shown in FIG. 3, the second substrate 24 may be fixed to the first substrate 20 by using the bonding member 22 positioned outside the first substrate 20 and the second substrate 24. .

On the other hand, as shown in FIG. 6, the transparent bonding member 22 ′ is filled between the first substrate 20 and the second substrate 24 to fill the second substrate 24 with the first substrate 20. 7, the second substrate 24 ′ is disposed to cover the entire upper surface, the entire side surface, and the lower surface portion of the first substrate 20 as shown in FIG. 7, and then on the lower surface of the first substrate 20. The second substrate 24 ′ may be bonded to the first substrate 20 using the bonding member 22.

When the three methods described above are applied, the second substrates 24 and 24 'may be firmly fixed to the first substrate 20 while ensuring the flatness of the second substrates 24 and 24'.

1 to 3 again, the integrated circuit chip 38 is mounted on the pad region A20 of the panel assembly 12 by a chip on glass (COG) method and a chip on film (chip on). The flexible circuit board 16 is mounted in a film (COF) method. A protective film 40 is formed around the integrated circuit chip 38 and the flexible circuit board 16 to cover and protect the pad electrodes formed in the pad region A20.

The printed circuit board 18 is equipped with electronic elements (not shown) for processing a driving signal, and a connector (not shown) for transmitting an external signal to the printed circuit board 18 is provided. The flexible circuit board 16 fixed to the pad area A20 is folded to the rear of the bezel 14 so that the printed circuit board 18 is located at the rear of the bezel 14.

The bezel 14 extends toward the panel assembly 12 from the edge of the bottom portion 42 except the bottom portion 42 on which the panel assembly 12 is raised and the flexible circuit board 16 is folded. A side wall 44 facing the side of the panel assembly 12. A double-sided tape 46 may be positioned between the bottom 42 of the bezel 14 and the panel assembly 12 to fix the panel assembly 12 to the bezel 14.

The structure of the bezel 14 is not limited to the illustrated example and can be variously modified. For example, the bezel 14 forms a flange (not shown) of various shapes for strength reinforcement at the edge of the bottom portion 42 on which the flexible circuit board 16 is folded, or the side wall 44 is folded several times. It is possible to form so-called hemming sidewalls with increased strength.

The bezel 14 may be formed of a material having high rigidity, for example, stainless steel, cold rolled steel, aluminum, aluminum alloy, nickel alloy, or the like. On the other hand, the bezel 14 may be formed of a synthetic resin material, for example, may be formed of a polymer-based engineering plastic such as polycarbonate.

As described above, since the second substrate 24 is formed of a transparent synthetic resin film instead of glass in the organic light emitting display device 100 of the present embodiment, the organic light emitting display device 100 may be further reduced by reducing the thickness and weight of the panel assembly 12. It can be made slim and light.

In addition, since the second substrate 24 formed of the synthetic resin film has a high deformation rate, when the external shock such as a drop impact is applied to the organic light emitting display device 100, the external shock may be absorbed by itself. Therefore, as compared with the glass material, the second substrate 24 of the present embodiment may not easily be broken under a condition in which an external impact is applied, thereby minimizing the occurrence of defects.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is an exploded perspective view of an organic light emitting display device according to an embodiment of the present invention.

2 is a perspective view illustrating a combined state of an organic light emitting display device according to an exemplary embodiment of the present invention.

3 is a cross-sectional view of the organic light emitting display device illustrated in FIG. 2.

4 is a diagram illustrating a subpixel circuit of the panel assembly illustrated in FIG. 1.

FIG. 5 is a partially enlarged cross-sectional view illustrating the interior of the panel assembly shown in FIG. 1.

6 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention.

7 is a cross-sectional view illustrating a panel assembly of an organic light emitting display device according to another exemplary embodiment of the present invention.

Claims (6)

A first substrate made of a glass material having a display area and a pad area and forming a plurality of organic light emitting diodes in the display area; And A second substrate fixed to the first substrate to cover and protect the organic light emitting devices; The second substrate is formed of a material different from that of the first substrate, The second substrate surrounds the entire upper surface, the entire side surface, and a portion of the lower surface of the first substrate, and the first substrate and the second substrate are provided between the first substrate and the second substrate as the bottom surface of the first substrate. An organic light emitting display device coupled by a bonding member. The method of claim 1, And the second substrate is formed of a transparent synthetic resin film having a thickness smaller than that of the first substrate. The method of claim 2, The second substrate is formed of any one of polyethylene film, polypropylene film, polyamide film, polyacetal film, polymethyl methacrylate film, polybutylene terephthalate film, polycarbonate film, cellulose film, and moisture-proof cellophane Light emitting display. delete delete The method of claim 1, A bezel coupled to the first substrate at the rear of the first substrate; A flexible circuit board fixed to the pad area and folded to the rear of the bezel; And Printed circuit board electrically connected to the flexible circuit board Organic light emitting display comprising a.

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