KR100918345B1 - Anisotropic conductive film composition?and film ?thereof - Google Patents

Abstract

The present invention relates to an anisotropic conductive composition and an anisotropic conductive film using the same, and more particularly, to provide an anisotropic conductive composition comprising a quinolinol or a quinolinol derivative as an adhesion promoter and a film using the same. By introducing a quinolinol or a quinolinol derivative, it is possible to implement excellent initial adhesion and low connection resistance, and because the adhesion and connection resistance can exhibit high reliability even under high temperature / high humidity and thermal shock conditions, various micropatterns are required. It can be effectively applied to a display device.

Anisotropic Conductive Film, Quinolinol, Derivatives, Adhesion, Accelerator, Connection Resistance

Description

Composition for Anisotropic Conductive Film and Anisotropic Conductive Film Using the Same {ANISOTROPIC CONDUCTIVE FILM COMPOSITIONOSAND FILM THEREOF}

The present invention relates to a composition for an anisotropic conductive film and an anisotropic conductive film using the same, more particularly quinolinol or quinolinol derivatives; Thermoplastic polymer resins; (Meth) acrylate or epoxy resins; Initiator or curing agent; Electroconductive particle; And at least one additive selected from the group consisting of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator, and a coupling agent.

The anisotropic conductive film is generally a film in which conductive particles such as metal particles such as nickel (Ni) and gold (Au) or polymer particles coated with such metals are dispersed. Such anisotropic conductive films are generally used in LCD panels and tape carrier packages (hereinafter referred to as TCP) or in electrical connections such as printed circuit boards and TCP.

However, in accordance with the trend of the display industry, which has recently become larger and thinner, the pitch between electrodes and circuits is gradually miniaturized, and an anisotropic conductive film plays a very important role as one of wiring devices for connecting such fine circuit terminals. .

As a conventional anisotropic conductive film, (i) an epoxy type in which a cured portion composed of an epoxy or phenolic resin and a curing agent is mixed in a binder resin portion which acts as a matrix for film formation, and (ii) a (meth) acrylic type in a binder resin portion. There is a (meth) acrylate type in which a cured portion composed of an oligomer, a monomer and a radical initiator is mixed.

The 'epoxy-type' anisotropic conductive film has a network structure formed after curing due to the aromatic benzene rings contained in the epoxy resin, so that it can express good reliability. However, when connecting at high temperature and high pressure, a large amount of bubbles are generated due to the polymer resin, the epoxy resin or the phenoxy resin, and the aromatic benzene rings of the binder portion of the film, thereby achieving low adhesive force and between circuits to be connected. There is a problem that the conductive particles are not sufficiently mounted. In addition, due to very high reaction temperature and long reaction time, maintenance of the process control and the connecting device is difficult.

On the other hand, the (meth) acrylate type has the advantage that the rapid curing speed of the radical curing reaction can be achieved in a few seconds to achieve fast curing, significantly reduce the take time (Take Time) product production speed is greatly improved However, due to the low glass transition temperature polymer resin mainly used for film formation and flow control, shrinkage and expansion are repeated in a state connected between circuits, and thus there is a problem in that reliability is weak in the long term in terms of connection and adhesion. On the other hand, when the polymer resin of a high glass transition temperature is used, the flowability is not controlled, and thus deterioration of initial physical properties such as poor connection and low adhesive strength occurs.

Therefore, the demand for the composition for anisotropic conductive films which can implement | achieve excellent initial adhesive force and low connection resistance, and can maintain high reliability, and the film using the same is increasing.

The present invention is to solve the problems of the prior art as described above, one object of the present invention is to implement a good initial adhesion and low connection resistance, high reliability of adhesion and connection resistance even under high temperature / high humidity and thermal shock conditions It is providing the composition for an anisotropic conductive film which can hold | maintain.

Another object of the present invention is to provide an anisotropic conductive film using the composition.

One aspect of the present invention for achieving the above object is a quinolinol or quinolinol derivative represented by the following formula (1) and (2); Thermoplastic polymer resins; (Meth) acrylate or epoxy resins; Initiator or curing agent; Electroconductive particle; And at least one additive selected from the group consisting of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator, and a coupling agent.

[Formula 1]

In Chemical Formula 1

R is an organic moiety; Alkyl group, pentyl group, hexyl group, heptyl group or octyl group.

[Formula 2]

Another aspect of the present invention for achieving the above object relates to a composition for radically curable anisotropic conductive films using the composition.

Another aspect of the present invention for achieving the above object relates to an epoxy curable anisotropic conductive film composition using the composition.

The composition according to an embodiment of the present invention comprises a quinolinol or a quinolinol derivative as an adhesion promoter, thereby realizing excellent initial adhesion and low connection resistance, and the connection structure and zinc, even under high temperature / high humidity and thermal shock conditions High reliability of adhesion and connection resistance to various adherends such as copper and polyimide can be maintained, so that the present invention can be effectively applied to display devices and high-performance electronic components requiring fine connection.

Hereinafter, the present invention will be described in more detail with reference to Examples and the like. The composition for anisotropic conductive films according to one embodiment of the present invention includes a quinoquinol or a quinolinol derivative; Thermoplastic polymer resin forming a binder portion; Hardening part which consists of (meth) acrylate or an epoxy resin; Radical "initiators" or curing agents; Electroconductive particle; And at least one additive selected from the group consisting of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator, and a coupling agent.

The composition for anisotropic conductive film according to an embodiment of the present invention,

(Iii) quinolinol or quinolinol derivatives X 1 to 20 wt%;

(Ii) 5 to 50 weight percent of a thermoplastic polymer resin;

(Iii) from 5% to 60% by weight of a (meth) acrylate oligomer;

(Iii) a (meth) acrylate monomer X1 to 30% by weight;

(Iii) 1 to 15% by weight of radical initiators;

(Iii) 10 to 9% by weight of conductive particles; And

(Iii) at least one selected from the group consisting of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator and a coupling agent, in an additive group of 0.01 to 5% by weight; It may be configured to include.

The composition for anisotropic conductive film according to an embodiment of the present invention,

(Iii) quinolinol or quinolinol derivatives X 1 to 20 wt%;

(Ii) 5 to 50 weight percent of a thermoplastic polymer resin;

(Iii) from 5 to 60 weight percent epoxy resin;

(Iii) 1-15 wt% of a curing agent;

(Iii) electroconductive particles # 1 to 10% by weight;

(Iii) 0.01 to 5% by weight of one or more selected from the group of additives consisting of a polymerization inhibitor, an antioxidant, a heat stabilizer, a curing accelerator, and a coupling agent; It can be configured to include.

Hereinafter, each component which comprises the composition by one embodiment of this invention is demonstrated in detail.

The quinolinol (hydroxy quinoline) or quinolinol derivative used as the adhesion promoter according to the present invention is a compound containing a quinolinol moiety (moiety), and includes the structure represented by the following formula (1) One or more selected from the group of compounds may be used, but is not limited thereto.

[Formula 1]

　　　　　　　　　　　

　　　　　　　　　

In Chemical Formula 1

R is an organic moiety; Alkyl group, pentyl group, hexyl group, heptyl group or octyl group.

The quinquinolinol derivative may be prepared by Fischer Esterification reaction of quinolinol having a hydroxy group represented by Chemical Formula 1 with a predetermined di-acid, and bridge characteristics of the quinolinol functional groups. Since silver is determined by the structure of the acid, an appropriate acid can be selected to control properties such as melting point and solubility.

The adhesion of the cured structure can be improved by introducing a reactive functional group to the quinolinol derivative to participate in a curing reaction. The reactive functional groups to be introduced include (meth) acrylate groups, styrene groups, maleimide groups, and epoxy groups. , Oxetane group, benzotriazole group, cinnamil compound, styrene compound and vinyl ether, and the like. According to the preparation example shown in Scheme 1, a quinolinol derivative compound represented by the following Formula 2 may be prepared. In the present invention, one or more of the quinolinol derivatives represented by the following Chemical Formula 2 may be used as the adhesion promoter, but is not limited thereto.

Scheme 1

[Formula 2]

In order to achieve the object of the present invention, the above quinolinol or quinolinol derivatives were synthesized and used, and the synthesis process will be described in more detail in the following synthesis examples.

The quinolinol and quinolinol derivatives listed above as adhesion promoters for the anisotropic conductive film according to the object of the present invention are not necessarily limited to the compounds described in the formulas (1) and (2). It can be used 1 type or in mixture of 2 or more types of a nolinol compounds.

When the content of the quinolinol and quinolinol derivatives is less than 1% by weight, it is difficult to expect the improvement of adhesion by quinolinol, and when used in excess of 20% by weight, the quinolinol or the quinolinol derivative having a low molecular weight is used. Since it will contain a large amount and will hardly form a film, it is preferable to contain 1 to 20 weight% with respect to the whole composition.

The polymer resin according to the present invention can form a binder portion that acts as a matrix required to form a film, and 로는 the polymer resin is acrylonitrile-based, styrene-acrylonitrile-based, methyl methacrylate-butadiene-styrene-based , Butadiene, acrylic, urethane, epoxy, phenoxy, polyamide, olefin, silicone resin, polyvinyl butyral, polyvinyl formal, polyester, phenol resin, epoxy resin, phenoxy resin, acrylic polymerizable One or two or more selected from the group consisting of resin and the like can be used, but is not limited thereto.

Preferably, a styrene-acrylonitrile-based one is used, and the styrene-acrylonitrile-based one selected from the group consisting of styrene-acrylonitrile (SAN) copolymer, styrene-acrylonitrile-styrene (ASA), and the like. More than one species can be used, but is not limited thereto.

The styrene-acrylonitrile copolymer resin is SAN resin, which is AP series of Cheil Industries, SAN resin, which is SAN series of Kumho Petrochemical, SAN resin, which is Lustran series of Bayer, and ASA, Luran S series of BASF. One or two or more selected from the group consisting of resins and the like may be used, but is not limited thereto.

Among the polymer resins, polymer resins such as acrylonitrile, methyl methacrylate-butadiene-styrene, butadiene, acrylic, and urethane resins having low glass transition temperature and rubber characteristics are cured under high temperature / high humidity conditions. Since the problem of deterioration of reliability caused by expansion of the anisotropic conductive film is used, a minimum amount should be used, but a rubber-like polymer resin having a low glass transition temperature such as butadiene is produced as a core, and then a glass such as acrylic or styrene Stress inside the anisotropic conductive film cured by using a polymer-copolymer resin having a specific structure of a core-shell type in which a shell is surrounded by a polymer resin having a relatively high transition temperature. Solve the problem and expansion problem related to the reliability can be solved at the same time.

The core-shell-type polymer copolymer resin is made of Gantz AC series, Resinous Kasei RKB series, epoxy resin, methyl methacrylate-butadiene-styrene, etc. One type or two or more types may be used in the RKB series of Regina, which is a dispersion of the shell copolymer resin, or the like, but is not limited thereto.

The polymer resin according to the present invention preferably uses an average molecular weight in the range of 1,000 to 1,000,000, but if the molecular weight is less than 1,000, the film properties are not properly formed due to excessive tack characteristics, which are disadvantageous for film molding, and the molecular weight is 1,000,000. If exceeded, compatibility with a (meth) acrylate oligomer and a monomer participating in the curing reaction may deteriorate, and phase separation may occur during the preparation of the composition mixture solution.

When the content of the polymer resin in the binder portion is less than 5% by weight, it may cause a problem that the film formation becomes difficult during the production of the anisotropic conductive film, and the curing is made of (meth) acrylate monomers and oligomers during hot connection under high temperature / high pressure conditions. It is difficult to control the excessive flow of the negative, which may cause a problem that the physical properties are greatly reduced. If the content exceeds 50% by weight due to the large amount of polymer resins, the flowability is very low at the time of high temperature / high pressure conditions due to the conductive particles Since the problem of not sufficiently contacting may occur, the polymer resin is preferably used in a range of 5 to 50 wt% based on the entire composition.

The (meth) acrylate oligomers of the present invention are urethane-based (meth) acrylates, epoxy-based (meth) acrylates, polyester-based (meth) acrylates, fluorine-based (meth) acrylates, and fluorene-based (meth) acrylates. In the oligomer group consisting of silicone-based (meth) acrylate, phosphoric acid-based (meth) acrylate, maleimide modified (meth) acrylate, acrylate (methacrylate) 수, etc. It is not limited to this.

The urethane-based (meth) acrylate oligomer has an intermediate molecular structure of polyester polyol, polyether polyol, polycarbonate polyol, polycaprolactone polyol, ring-opening tetrahydro Tetrahydrofurane-propyleneoxide ring opening copolymer, polybutadiene diol, polydimethylsiloxane diol, ethylene glycol, propylene glycol, 1,4-butanediol (1,4-butanediol), 1,5-pentanediol, 1,6-hexanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexane 1,4-cyclohexane dimethanol, bisphenol A, hydrogenated bisphenol A, 2,4-toluene diisocyanate, 1,3-xyl Rend Di 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, 1,5-naphthalene diisocyanate, 1,6-hexane diisocyanate Isocyanate (1,6-hexan diisocyanate), isophorone diisocyanate () and the like synthesized using one or more selected from the group consisting of, but is not limited thereto.

The epoxy (meth) acrylate-based oligomer has a bisphenol molecule such as 2-bromohydroquinone, resorcinol, catechol, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, 4,4'-dihydride, etc. It may contain one or more selected from the group consisting of a skeleton such as oxybiphenyl, bis (4-hydroxyphenyl) ether, wherein the epoxy (meth) acrylate-based oligomer containing the skeleton is an alkyl group, an aryl group, a methylol group, It may include one or more selected from the group consisting of an allyl group, a cyclic aliphatic group, a halogen (such as tetrabromobisphenol A), and nitro group, but is not limited thereto.

The said maleimide modified (meth) acrylate type oligomer contains at least 2 or more maleimide groups in the molecule | numerator, and is -1-methyl- 2, 4-bismaleimide benzene, N, N'-m- phenylene bismaleimide , N, N'-p-phenylene bismaleimide, N, N'-m-toylene bismaleimide, N, N'-4,4- biphenylene bismaleimide, N, N'-4, 4- (3,3'-dimethylbiphenylene) bismaleimide, N, N'-4,4- (3,3'- dimethyl diphenyl methane) bismaleimide, N, N'-4,4- (3,3'- diethyl diphenyl methane) bismaleimide, N, N'-4,4- diphenylmethane bismaleimide, N, N'-4,4- diphenyl propane bismaleimide, N, N'-4,4-diphenyl ether bismaleimide, N, N'-3,3'- diphenyl thrubis bismaleimide, 2,2-bis (4- (4-maleimide phenoxy) phenyl) propane , 2, 2-bis (3-s-butyl-4-8 (4-maleimide phenoxy) phenyl) propane, 1, 1-bis (4- (4-horse) Imidephenoxy) phenyl) decane, 4,4'- cyclohexyrylidebis (1- (4 maleimide phenoxyshi) -2-cyclohexyl benzene, 2,2-bis (4- (4 maleimide phenoxy) C) phenyl) hexafluoro propane, etc. may be used, but not limited to one or two or more selected from the group consisting of.

Preferably, the fluorene-based (meth) acrylate oligomer is composed of a fluorene-based epoxy (meth) acrylate oligomer, a fluorene-based urethane (meth) acrylate oligomer and the like containing a fluorene structure represented by the formula (3) One or more selected from the group can be used, but is not limited thereto.

By including the fluorene structure represented by the following formula (3), it is possible to exert excellent insulation to increase the possibility of short circuit between circuits, and to further improve the initial low connection resistance and high reliability to improve the productivity and reliability of the final product Can be.

[Formula 3]

Where

Each R is independently an alkyl group, an alkoxy group, an aryl group, or a cycloalkyl group,

m is each independently an integer of 0 to 4,

n is independently an integer of 2-5.

The fluorene derivative including the structure of Chemical Formula 3 is a method of producing aryl radicals by reaction of an aromatic diazoaluminum compound with copper ions (Pschorr reaction) and diels of indenes and butadienes (Otto A phenol compound obtained by air oxidation of fluorene prepared by Paul Hermann Diels) -Kurt Alder reaction t can be obtained by condensation reaction in the presence of a hydrochloric acid solution and a thiol compound such as mercaptocarboxylic acid. . The fluorene-based epoxy (meth) acrylate oligomer having the fluorene skeleton is reacted with glycidyl (meth) acrylate for a fluorene compound for 5 to 30 hours in a temperature range at 50 to 120 ° C. using an appropriate solvent. And fluorene-based urethane (meth) acrylate oligomers can be obtained by reacting fluorene derivative diols with (meth) acrylates having hydroxyl groups on diisocyanates and esters. Examples of the solvent include alkylene monoalkyl ether acetates such as methyl cellosolve acetate, propylene glycol monomethyl ether acetate, and 3-methoxy butyl-1-acetate; Methyl ethyl ketone, methyl amyl ketone and the like.

The average molecular weight of the (meth) acrylate oligomer is preferably in the range of 1,000 to 100,000, it is preferable to use in the range of 5 to 60% by weight based on the entire radical curable composition, which is used when the oligomer is used in excess of 60% by weight This is because it is very difficult to control the rheological properties, excessive flow under high temperature and high pressure connection conditions may cause bubbles (Bubble) can occur severely, the problem that the shrinkage rate is somewhat severe.

The (meth) acrylate monomer of the present invention serves as a reactive diluent, the monomer as the (meth) acrylate can be used without limitation one or more monomers selected from the group of (meth) acrylate monomers known in the prior art, Preferably 1,6-hexanediol mono (meth) acrylate, 2-hydroxy ethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate, 2-hydroxy butyl (meth) acrylate, 2- Hydroxy-3-phenyl oxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyalkyl (meth) acryloyl phosphate, 4-hydroxy cyclohexyl (meth) acrylate Neopentylglycol mono (meth) acrylate, trimethylol-epan di (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, Dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, t-hydroperfuryl (meth) acrylate, iso -Decyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylic Elate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxyaddition nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene Glycol di (meth) acrylate, t-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (meth) a Relate, ethoxy addition bisphenol-A di (meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxyethyl phosphate, dimethyl One or two or more selected from the group consisting of all tricyclo decaine di (meth) acrylate, trimethylolpropanebenzoate acrylate, and fluorene-based (meth) acrylate may be used, but is not limited thereto. .

More preferably, a fluorene-based (meth) acrylate monomer is used as the (meth) acrylate monomer, and a conventionally known conventional one can be used without limitation as long as it includes the fluorene structure of the above formula (3).

The fluorene-based (meth) acrylate monomer is one selected from the group consisting of fluorene-based epoxy (meth) acrylate monomer and fluorene-based urethane (meth) acrylate monomer having a fluorene structure represented by the formula (3) Or it can mix and use 2 or more types.

The fluorene-based (meth) acrylate monomer may be BPEF-A (Osaka Gas) and the like, but is not limited thereto.

When the content of the (meth) acrylate monomer is less than 1% by weight, it is made of only a large amount of polymer resin and (meth) acrylate oligomer, so that the flowability is very low when the connection is performed under high temperature / high pressure conditions, so that the conductive particles may not be sufficiently contacted. If it exceeds 30% by weight, it is difficult to control the excessive flow of the low molecular weight monomers may cause a problem that the physical properties are greatly reduced, the (meth) acrylate monomer is 1 to 30 with respect to the entire radical curable composition It is preferable to use about% by weight.

The epoxy resin according to the present invention may be used by mixing one or two or more of the epoxy resin selected from the group consisting of bisphenol, novolak, glycidyl, aliphatic and alicyclic, but is not limited thereto.

Preferably, the epoxy resin which is solid at normal temperature and the epoxy resin which is liquid at normal temperature can be used together, and a plastic epoxy resin can be used together further here. Examples of the solid epoxy resin include phenol novolac epoxy resins, cresol novolac epoxy resins, and dicyclo pentadiene epoxy resins and bisphenol A compounds. Or an F-type polymer or a modified epoxy resin, but is not necessarily limited thereto. As the liquid epoxy resin at room temperature, bisphenol A or F or mixed epoxy resin may be used. It is not limited to this.

Non-limiting examples of the plastic epoxy resin may include a dimer acid modified epoxy resin, an epoxy resin mainly composed of propylene glycol, and a urethane modified epoxy resin.

In addition to the general epoxy resins described above, the excellent insulation properties inherent in the molecular structure can reduce the possibility of short circuits, especially between circuits, and ensure low initial connection resistance and excellent reliability, thereby improving productivity and reliability of the final product. A fluorene-based epoxy resin may be additionally used, and the fluorene base structure is as shown in Chemical Formula 3 above. The fluorene-based epoxy resin is preferably used in the range of 1 to 30% by weight based on the total composition for the epoxy curable anisotropic conductive film. When the epoxy resin is used in excess of 30% by weight, the structure itself after curing Too rigid can lead to problems.

Examples of the epoxy resin include DER-331 (DOW Chemical), YDCN-500-80P (Kukdo Chemical), YDCN-500-90P (Kukdo Chemical), YP-50 (Dongdo Chemical), and PKFE (INCHEMREZ). As the fluorene-based epoxy resin, BPFG, BPEGF (Osaka Gas) and the like can be used, but are not limited thereto.

The epoxy resin made of the bisphenol-type, novolak-type, glycidyl-type, aliphatic, and cycloaliphatic according to the present invention is preferably used in the range of 5 to 60 wt% based on the total composition for the epoxy curable anisotropic conductive film.

The radical initiator for causing a curing reaction according to the present invention may be used at least one selected from the group consisting of a kappa peroxide and azo, but is not limited thereto. Examples of the peroxide initiator include t-butyl peroxylaurate, 1,1,3,3-t-methylbutylperoxy-2-ethyl hexanonate, 2,5-dimethyl-2,5-di ( 2-ethylhexanoyl peroxy) hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethyl hexanonate, 2,5-dimethyl-2,5-di (m-toluyl peroxy) hexane, t-butyl peroxy isopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxy benzoate, t-butyl peroxy acetate, dicumyl peroxide, 2,5, -dimethyl- 2,5-di (t-butyl peroxy) hexane, t-butyl cumyl peroxide, t-hexyl peroxy neodecanoate, t-hexyl peroxy-2-ethyl hexanonate, t-butyl peroxy- 2-2-ethylhexanoate, t-butyl peroxy isobutylate, 1,1-bis (t-butyl peroxy) cyclohexane, t-hexyl peroxy isopropyl monocarbonate, t-butyl peroxy-3 , 5,5-trimethyl hexanonate, t-butyl per Cifivalate, cumyl peroxy neodecanoate, di-iso-propyl benzene hydroperoxide, cumene hydroperoxide, iso-butyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-tri Methyl hexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, lauryl peroxide, stearoyl peroxide, succinic peroxide, benzoyl peroxide, 3,5,5-trimethyl hexanoyl peroxide, benzoyl peroxide Oxy toluene, 1,1,3,3-tetramethyl butyl peroxy neodecanoate, 1-cyclohexyl-1-methyl ethyl peroxy nodecanoate, di-n-propyl peroxy dicarbonate, di- iso-propyl peroxy carbonate, bis (4-t-butyl cyclohexyl) peroxy dicarbonate, di-2-ethoxy methoxy peroxy dicarbonate, di (2-ethyl hexyl peroxy) dicarbonate, dimethoxy butyl Peroxy dicarbonate, di (3-meth 3-methoxy butyl peroxy) dicarbonate, 1,1-bis (t-hexyl peroxy) -3,3,5-trimethyl cyclohexane, 1,1-bis (t-hexyl peroxy) cyclohexane, 1,1-bis (t-butyl peroxy) -3,3,5-trimethyl cyclohexane, 1,1- (t-butyl peroxy) cyclododecane, 2,2-bis (t-butyl peroxy) Decane, t-butyl trimethyl silyl peroxide, bis (t-butyl) dimethyl silyl peroxide, t-butyl triallyl silyl peroxide, bis (t-butyl) diallyl silyl peroxide, tris (t-butyl) aryl silyl Peroxide, and the like,

Examples of the azo initiators include 2,2'-azobis (4-methoxy-2,4-dimethyl valeronitrile), dimethyl 2,2'-azobis (2-methyl propionate), and 2,2 '. Azobis (N-cyclohexyl-2-methyl propionide), 2,2-azobis (2,4-dimethyl valeronitrile), 2,2'-azobis (2-methyl butyronitrile), 2,2'-azobis [N- (2-propenyl) -2-methylpropionamide], 2,2'-azobis (N-butyl-2-methyl propionide), 2,2'- Azobis [N- (2-propenyl) -2-methyl propionide], 1,1'-azobis (cyclohexane-1-carbonitrile), 1-[(cyano-1-methylethyl) azo ] Formamide.

It is preferable that the said radical initiator contains 1-15 weight% with respect to the whole radical curable composition.

The curing agent according to the present invention is a thermosetting agent for epoxy, any of the epoxy curing type thermosetting agent commonly used as the thermosetting agent for epoxy can be used without limitation, specific examples thereof include acid anhydride, amine, One or two or more selected from the group consisting of imidazole-based, hydrazide-based and cationic epoxy thermosetting agents may be used, but is not particularly limited thereto.

If the epoxy thermosetting agent is used in less than 1% by weight, it will not be able to induce sufficient curing reaction within the required curing time, resulting in very poor curing properties, and if used in excess of 15% by weight, the curing reaction rate will be controlled. Not only it is not easy to be hardened, but the cured product may be formed around low molecular weight to exhibit insufficient initial physical properties and reliability. Therefore, it is preferable to contain the thermosetting agent for epoxy in the range of 1 to 15 weight% with respect to the whole composition for epoxy hardening type | mold anisotropic conductive films of this invention.

The electrically conductive particles according to the present invention are applied as a filler for imparting a conductive performance to the composition for an anisotropic conductive film according to the embodiment of the present invention.

Such conductive particles may be any conventionally known conductive particles without limitation, and preferably include metal particles including Au, Ag, Ni, Cu, solder, and the like; Carbon; And particles formed of particles including a resin including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol and the like, and a modified resin thereof, which are plated and coated with a metal including Au, Ag, Ni, and the like; One or more kinds selected from the above-described insulating conductive particles coated with additional insulating particles may be used, but the present invention is not limited thereto.

The size of the conductive particles can be selected and used depending on the application in the range of 2 to 30 ㎛ by the pitch of the circuit to be applied, 1 to 10% by weight, more preferably 3 to 8 Pa by weight relative to the entire composition May contain%.

When the conductive particles, which are one of the main factors of the anisotropic conductive film, are used at less than 1% by weight, very little particles are mounted between the channels to be connected, thereby preventing sufficient connection area. Therefore, the resistance may increase. If it is used in excess of the weight% may be a problem of short when connecting the fine pitch is preferably applied within the above content.

In order to add additional physical properties without impairing the basic physical properties of the composition according to the present invention, one or more other additives such as polymerization inhibitors, antioxidants, thermal stabilizers, curing accelerators, coupling agents, etc. About 0.01 to 5% by weight may be included.

As the polymerization inhibitor, one or two or more kinds selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine and the like can be used. In addition, the antioxidants used for the purpose of preventing oxidation reaction and imparting thermal stability of the composition induced by heat may be added phenolic or hydroxy cinnamate-based substances. Kis- (methylene- (3,5-di-t-butyl-4-hydro cinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di -2,1-ethanediyl ester, octadecyl 3,5-di-t-butyl-4-hydroxy hydrocinnamate (above manufactured by Ciba), 2,6-di-tertiary-p-methylphenol and the like It can be used one or more selected from the group consisting of.

The curing accelerator for improving the reaction rate may be used at least one selected from the group consisting of a solid imidazole accelerator, a solid phase and a liquid amine curing accelerator, but is not limited thereto.

Examples of the coupling agent include vinyl trichloro silane, vinyl trimethoxy silane, 3-glycidoxy propyl trimethoxy silane, 3-methacryloxy propyl trimethoxy silane and 2-aminoethyl-3-aminopropyl methyldimethoxy One or more selected from the group consisting of silane coupling agents such as silane and 3-ureidopropyl triethoxy silane can be used, but is not limited thereto.

In addition to the basic constituents and the essential containing factors for achieving the object of the present invention may additionally include hydrophobic nano-silica particles having a size of about 5 to 20 nanometers (nm) surface-treated with an organic silane, By introducing nano-silica particles, anisotropic conductivity is achieved, which leads to excellent initial adhesion and low connection resistance because it smoothly controls flowability according to process conditions and induces a hardened structure of the cured anisotropic conductive film so that expansion does not occur at high temperatures. Films may also be produced.

Hydrophobic nano silica particles having a size of about 5 to 20 nanometers (nm) surface-treated with such organic silanes include Aerosil R-972, Aerosil R-202, Aerosil R-805, Aerosil R-812, Aerosil R-8200 ( Degussa) or the like selected from the group consisting of but may be used, but is not limited thereto.

The invention may be better understood by the following examples, which are intended to illustrate the invention and are not intended to limit the scope of the invention as defined by the appended claims.

[ Synthesis Example ]

Quinolinol  Synthesis of Compound

In order to achieve the object of the present invention, a quinolinol compound having a hydroxy group was prepared by reacting 8-quinolinol with formaldehyde in an aqueous solution of hydrochloric acid under a molar molar condition, and the kinematic reaction mechanism is shown in Scheme 2 below.

Scheme 2

First, 8-quinolinol (120.0 g, 0.8267 mol), hydrochloric acid (37%, 352 mL) in a 1 liter round bottom four-necked flask equipped with a magnetic stir bar, thermometer, reflux condenser, and a hot oil bath. And formaldehyde (37%, 67.7 g). By the mixing reaction of the reactants, a clear gold clear solution was obtained. The solution was heated in an oil bath at 125 ° C. and a yellow solid precipitated from the solution almost immediately after heating, and heated at reflux for about 65 minutes at about 95-110 ° C., the yellow reaction mixture obtained in this process. Was cooled to room temperature.

The solid precipitated from the yellow reactant was filtered, and the filtered yellow solution was mixed with 800 ml of distilled water, and the pH was measured to show a value between 0 and 1. The yellow solution was neutralized by the slow addition of ammonium hydroxide, the pH began to change to an opaque red-orange color between about 3 and 4, and fine particles began to form at pH 5. The ammonium hydroxide was slowly added to a pH value of about 10 to give a yellow slurry having fine particles. Fine particles were filtered from the yellow slurry, and the obtained fine particles were mixed with 500 ml of dimethylformamide, followed by vigorous stirring for 30 minutes, followed by filtration. A white cake was obtained after filtration, and the quinolinol compound having a hydroxyl group was obtained by drying in a vacuum oven at 45 ° C. after five times of washing with water. A quinolinol-based urethane acrylate was prepared by reacting a quinolinol compound having a hydroxy group prepared in the above synthesis example with isophorone diisocyanate (IPDI), and a quinolin by reacting the quinolinol compound with epichlorohydrin. Nonole epoxy and epoxy acrylates were prepared.

[ Example  One]

The binder resin portion serving as the matrix for forming the film was dissolved in methyl ethyl ketone at 30% by volume of 15% by weight of NBR-based resin (N-21, Nippon Xeon) and 25% by volume, dissolved in toluene / methyl ethyl 비 ketone azeotropic mixed solvent. 10% by weight of a quinolinol compound (synthetic product) having a hydroxyl group dissolved in a toluene / methyl ethyl ketone azeotropic mixed solvent at 33% by weight and 90% by volume of the acrylic acrylic copolymer resin (KLS-1022, Fujikura Kasei); As a hardening part with hardening reaction, it is 25 weight% of urethane (meth) acrylate oligomer (Miramer J-01, Miwon Corporation), and 2-methacryloyl oxyethyl phosphate which is a radical polymerization type (meth) acrylate monomer as a reactive monomer. 2% by weight, 5% by weight of pentaerythritol tri (meth) acrylate, 5.5% by weight of 1,6-hexanedioldi (meth) acrylate; 1.5% by weight of benzoyl peroxide as the thermosetting radical initiator; In addition, 3 wt% of the conductive particles (23GNR5.0-MX, NCI Co., Ltd.) having a size of 5 μm was insulated as a filler for imparting conductive performance to the anisotropic conductive film, and then 3 wt% was added to complete the configuration.

[ Example  2]

As a binder resin part which acts as a matrix for forming a film, 20 wt% of an acrylic resin (KLS-1035, Fujikura Kasei) dissolved in toluene / methyl ethyl ketone at 20% by volume, and a toluene / methyl ethyl ketone azeotropic mixed solvent at 50% by volume 15% by weight of soluble styrene-acrylonitrile copolymer resin (Luran S 776SE, BASF); As a hardening part with hardening reaction, 20 volume% of quinolinol-type urethane acrylate (synthetic product) melt | dissolved in the toluene / methyl "ethyl" ketone "azeotropic mixed solvent at 50 volume%, the" epoxy (meth) acrylate oligomer (EB-600, SK-) CYTEC.) 15% by weight 15% by weight of fluorene-based epoxy (meth) acrylate monomer (BPEF-A, Osaka Gas) 2% by weight of phosphate, 3% by weight of pentaerythritol tri (meth) acrylate, 5.5% by weight of # 1,6-hexanediol-di (meth) acrylate; 1.5 wt% of benzoyl peroxide as a thermoset radical initiator; Then, as a filler for imparting conductive performance to the anisotropic conductive film, 3 wt% of conductive particles (23GNR5.0-MX, NCI Co., Ltd.) having a size of 5 µm was insulated, and then 3 wt% was added to complete the configuration.

[ Example  3]

The binder resin portion serving as the matrix for forming the film was 17% by weight of NBR resin (N-34, Nippon Xeon) dissolved in toluene / methyl ethyl ketone at 30% by volume, and toluene / methyl ethyl ketone azeotropic mixture at 50% by volume. 20 wt% of styrene-acrylonitrile copolymer resin (SAN 350, Kumho Petrochemical) dissolved in a solvent; As a hardening part with hardening reaction, 20 volume% of quinolinol type | system | group epoxy acrylate (synthetic product) melt | dissolved in the toluene / methyl "ethyl" ketone "azeotropic mixed solvent at 50 volume%, a" fluorene type epoxy (meth) acrylate monomer (BPEF-A) , Osaka gas) 10% by weight, 20% by weight of other epoxy (meth) acrylate oligomers (EB-600, SK-CYTEC.), 2-methacryloyloxy which is a radical polymerization type (meth) acrylate monomer as a reactive monomer. 3% by weight ethyl phosphate, 3% by weight pentaherythritol tri (meth) acrylate, 2% by weight 2-hydroxyethyl (meth) acrylate; 2% by weight of benzoyl peroxide as a thermosetting radical catalyst; In addition, 3 wt% of conductive particles (AULEB-004A, Sekisui Co., Ltd.) having a size of 5 μm was insulated as a filler for imparting conductive performance to the anisotropic conductive film, and then 3 wt% was added to complete the configuration.

[ Example  4]

As the binder resin part serving as a matrix for film formation, 20% by weight of acrylic resin (SG-280, Nagase Chemtex) dissolved in toluene / methyl ethyl ketone at 20% by volume, and phenoxy 녹 resin dissolved in toluene at 40% by volume ( E-4275, JER) 20 weight percent; As a hardening part with hardening reaction, it is 50 volume% of 20 weight% of quinolinol-type epoxy acrylate (synthetic product) dissolved in toluene / methyl ethyl ketone azeotropic mixed solvent, urethane (meth) acrylate oligomer (EB-4883, SK- CYTEC.) 15% by weight, urethane (meth) acrylate oligomer (UV-3000B, Nippon Synthetic Chemical) 12% by weight, 2-methacryloyloxyethyl phosphate as a radical polymerization type (meth) acrylate monomer as a reactive monomer 3 wt%, Copentaerythritol tri (meth) acrylate 2.5 wt%, # 2-hydroxyethyl (meth) acrylate 3 wt%; 1.5% by weight of benzoyl peroxide as the thermosetting radical initiator; In addition, 3 wt% of conductive particles (AULEB-004A, Sekisui Co., Ltd.) having a size of 5 μm was insulated as a filler for imparting conductive performance to the anisotropic conductive film, and then 3 wt% was added to complete the configuration.

[ Example  5]

As the binder resin part serving as a matrix for forming a film, 15% by weight of acrylic core-shell copolymer resin (AC-3355, Ganz) dispersed in toluene / methylethylketone at 30% by volume and 40% by volume 33% by weight of a phenoxy resin (E-4275, JER) dissolved in toluene / methyl ethylketone azeotropic mixed solvent in%; As a hardening part with hardening reaction, 25 volume% of quinolinol type | system | group epoxy (synthetic product) melt | dissolved in the propylene glycol methyl ethyl acetate solvent at 50 volume%, and 15 weight% of "fluorene type epoxy resin (BPEFG, Osaka gas)"; 5 wt% of a solid-state modified imidazole curing agent (PN-21, Aginomoto) as the thermosetting epoxy curing agent; 3 wt% of a solid imidazole accelerator (EH-3293, Adeka) as a hardening accelerator additive; 1 wt% γ-glycidoxy propyl methyl diethoxy silane (KBE-402, ShinEtsu) as coupling agent; Then, as a filler for imparting conductive performance to the anisotropic conductive film, conductive particles (23GNR5.0-MX, NCI Co., Ltd.) having a size of 5 µm were insulated, and 3 k% by weight was added to complete the configuration.

[ Example  6]

As the binder resin portion serving as a matrix for forming a film, bisphenol-A type epoxy resin / reactive epoxy diluent / methyl methacrylate-butadiene-styrene core-shell copolymer resin is in a ratio of 30/30/40. 25% by weight of a mixed resin (RKB-2023, Reginous Kasei), 20% by weight of phenoxy resin (PKHH, INCHEMREZ) dissolved in a toluene / methyl ethyl ketone azeotropic mixed solvent at 25% by weight and 40% by volume; As a hardening part with hardening reaction, 23 volume% of quinolinol type | system | group epoxy (synthetic products) melt | dissolved in the propylene glycol methyl ethyl acetate solvent by 50 volume%, and 14 weight% of "fluorene type epoxy resin (BPEFG, Osaka gas)"; 10 wt% 실리카 of hydrophobic nano silica particles (Aerosil R-805, Degussa) surface treated with octylsilane; As thermosetting epoxy curing agent, 아로마 3% by weight of an aromatic sulfonium hexafluoro antimonate system (San aid SI-60L, SANSHIN chemical) which induces cationic curing reaction; 1 wt% γ-glycidoxy propyl trimethoxy silane (KBM-403, ShinEtsu) as coupling agent; In addition, after insulating the conductive particles (AULEB-004A, Sekisui Co., Ltd.) having a size of 5 μm as a filler for imparting conductive performance to the anisotropic conductive film, 4 k% by weight was added to complete the configuration.

[ Comparative example  One]

20% by weight of NBR-based resin (N-34, Nippon Xeon) dissolved in toluene / methyl ethyl ketone at 30% by volume as binder resin part, acrylic resin (SG-280, Nagase Chemtex) dissolved in toluene at 30% by volume 10 wt% of cresol novolac-type epoxy resin (YDCN-500-90P, Kukdo Chemical) dissolved in toluene at 15% by weight and 40% by volume; It carried out by the same method as Example 1 except having used the epoxy (meth) acrylate oligomer (EB-600, SK-CYTEC.) 13 weight% in the hardening part, and the quinolinol compound (synthetic product).

[ Comparative example  2]

As the binder resin part, 10% by weight of NBR-based resin (N-34, Nipon Xeon) dissolved in toluene / methyl ethyl ketone at 30% by volume, and acrylic resin (KLS-1025, Fujikura Kasei) dissolved in toluene at 30% by volume 12% by weight of a cresol novolac-type epoxy resin (YDCN-500-90P, Kukdo Chemical) dissolved in toluene at 25% by weight and 40% by volume; As a hardening part with hardening reaction, it is [the epoxy (meth) acrylate oligomer (SP-4010, Showa high molecular weight) # 33 weight%, pentaerythritol hexa (meth) acrylate 12 which is a radical polymerization type (meth) acrylate monomer as a reactive monomer. % By weight, 2% by weight of —2-methacryloyloxyethyl phosphate, 2% by weight of —2-hydroxyethyl (meth) acrylate; 0.5% by weight of benzoyl peroxide and 0.5% by weight of lauryl peroxide as thermally curable radical initiators; Then, in order to impart conductive performance to the anisotropic conductive film, conductive particles (NCI) having a size of 5 μm were insulated, and then 3 wt% was added to complete the configuration.

[ Comparative example  3]

As the binder resin part, 25% by weight of NBR resin (N-34, Nippon Xeon) dissolved in toluene / methyl ethyl ketone at 30% by volume, and acrylic resin (KMM-34, Fujikura Kasei) dissolved in toluene at 30% by volume 10 wt% of cresol novolac-type epoxy resin (YDCN-500-90P, Kukdo Chemical) dissolved in toluene at 15% by weight and 40% by volume; In the hardening part, except for the fluorene-based urethane (meth) acrylate oligomer, 32% by weight of commercially available urethane (meth) acrylate oligomer (UV-3000B, Nippon Synthetic Chemical) and quinolinol epoxy (synthetic product) are used. Except for the exclusion, the same procedure as in Example 6 was carried out.

Each said combination liquid was stirred for 60 minutes at normal temperature (25 degreeC) within the speed range which electroconductive particle does not grind | pulverize. The combination solution formed a film having a thickness of 20 μm on a polyethylene release film treated with a silicone release surface, and a casting knife was used to form the film. The drying time of the film was from 10 ° C. to 50 minutes. It was.

Evaluation of Physical Properties and Reliability of Anisotropic Conductive Film

In order to evaluate the initial properties and reliability of the anisotropic conductive films prepared from Examples 1 to 6 and Comparative Examples 1 to 3, each film was left at room temperature for 1 hour, and then ITO glass (indium tin oxide glass) and COF, The connection was carried out using a TCP (Tape Carrier Package) under the conditions of 160 ° C., 1 sec. And 1 ° C., and 180 ° C., 5 sec., And 3 MPa. Each specimen was prepared seven times, and the 90 ° adhesive force was measured (ASTM D3330 / D3330M-04) using the specimen thus prepared, and the connection resistance (ASTM F43-64T) was measured by a four-terminal probe measurement method. It was. In addition, the high temperature / high humidity reliability evaluation (ASTM D117) was performed at a temperature of 85 ° C. and a relative humidity of 85 ° C. for 1000 hours, and the thermal shock reliability evaluation (ASTM D1183) was repeated 1000 times a temperature condition of −40 ° C. to 80 ° C. The results are shown in Tables 1 and 2 below.

(Measurement result of initial adhesion and reliable adhesion) Compare [ g _f Of cm ] Initial measurement High temperature and high humidity  responsibility Post evaluation Thermal shock  responsibility Post evaluation Example 1 929 1028 1032 Example 2 941 1100 1092 Example 3 965 1043 1024 Example 4 948 1017 1000 Example 5 920 1005 1018 Example 6 919 1042 1006 Comparative Example 1 857 925 943 Comparative Example 2 916 948 950 Comparative Example 3 896 950 951

As shown in the 90 ° adhesion after the initial and reliability evaluation of Table 1 measurement results, the anisotropic conductive film using an adhesion promoter selected from the group of quinolinol or quinolinol derivatives according to an embodiment of the present invention, the (quinolinol Compared to the anisotropic conductive film of the comparative example, which does not use the quinolinol derivatives) or the quinolinol derivative), it can be seen that the initial adhesive strength and the adhesive strength after the reliability evaluation show excellent results.

(Initial connection resistance and reliability connection resistance measurement results) Compare [Ω, Ohm ] Initial measurement High temperature and high humidity  responsibility Post evaluation Thermal shock  responsibility Post evaluation Example 1 0.65 1.14 1.28 Example 2 0.62 1.14 1.34 Example 3 0.68 1.18 1.20 Example 4 0.64 1.09 1.08 Example 5 0.66 1.02 1.10 Example 6 0.68 1.00 1.27 Comparative Example 1 0.73 1.49 1.47 Comparative Example 2 0.77 1.37 1.45 Comparative Example 3 0.69 1.20 1.40

As shown in the measurement of the connection resistance of Table 2, the anisotropic conductive film using an adhesion promoter selected from the group of quinolinol or quinolinol derivatives according to the embodiment of the present invention has low resistance at both initial connection resistance and connection resistance after reliability evaluation. It can be seen that it has a value, and according to these results, an anisotropic conductive film using an adhesion promoter selected from the group of quinolinol or quinolinol derivatives according to an embodiment of the present invention is conventionally commercialized with conventional thermoplastic resins and acrylic or It can be seen that it has excellent initial properties and high reliability compared to the anisotropic conductive film made of only phenoxy resin.

Claims (25)

delete delete delete (Iii) quinolinol or quinolinol derivatives X 1 to 20 wt%; (Ii) from 5 to 50 weight percent of thermoplastic polymer resin; (Iii) from 5% to 60% by weight of a (meth) acrylate oligomer; (Iii) a (meth) acrylate monomer X1 to 30% by weight; (Iii) a radical initiator X1 to 15 weight percent; (Iii) 10 to 9% by weight of conductive particles; And (Iii) at least 0.01 to 5% by weight of an additive selected from the group consisting of polymerization inhibitors, antioxidants, heat stabilizers, curing accelerators and coupling agents; Composition for anisotropic conductive film comprising a. delete The composition for an anisotropic conductive film according to claim 4, wherein the quinolinol or quinolinol derivative is at least one member selected from the group consisting of compounds comprising a structure represented by the following formula (1). [Formula 1]

R is an organic moiety; Alkyl group, pentyl group, hexyl group, heptyl group or octyl group. The composition for anisotropic conductive film according to claim 4, wherein the quinolinol or quinolinol derivative is at least one selected from the group consisting of compounds represented by the following general formula (2). [Formula 2] 　

The composition for anisotropic conductive film according to claim 4, wherein the thermoplastic polymer resin has a weight average molecular weight of 1,000 to 1,000,000. The method of claim 8, wherein the thermoplastic polymer is acrylonitrile-based, n-styrene-acrylonitrile, n-methyl methacrylate-butadiene-styrene, butadiene, acrylic, urethane, epoxy, phenoxy, polyamide, olefin A composition for an anisotropic conductive film, characterized in that at least one selected from the group consisting of silicone, polyvinyl butyral, polyvinyl formal, and polyester. The composition for anisotropic conductive films according to claim 4, wherein the (meth) acrylate oligomer has a weight average molecular weight of 1,000 to 100,000. The said (meth) acrylate oligomer is urethane type (meth) acrylate, epoxy type (meth) acrylate, polyester type (meth) acrylate, fluorine type (meth) acrylate, and fluorene type (meth). Anisotropic conductivity, characterized in that at least one oligomer selected from the group consisting of acrylate, silicone (meth) acrylate, phosphate (meth) acrylate, maleimide modified (meth) acrylate and acrylate (methacrylate) Composition for film. The method of claim 11, wherein the fluorene-based (meth) acrylate oligomers in the group consisting of fluorene-based epoxy (meth) acrylate and fluorene-based urethane (meth) acrylate oligomer having a fluorene skeleton of the formula The composition for anisotropic conductive films, characterized in that at least one selected. [Formula 3] 　　　　

Each R is independently an alkyl group, an alkoxy group, an aryl group, or a cycloalkyl group, m is each independently an integer of 0 to 4, n is independently an integer of 2-5. The method according to claim 4, wherein the (meth) acrylate monomer is 1,6-hexanediol mono (meth) acrylate, 2-hydroxy ethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate, 2 -Hydroxy butyl (meth) acrylate, 2-hydroxy-3-phenyl oxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyalkyl (meth) acryloyl phosphate, 4-hydroxy cyclohexyl (meth) acrylate, neopentylglycol mono (meth) acrylate, trimethylol-epan di (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylic Latex, dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, t-hydroperfuryl (meth ) Acrylate, iso-decyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxy Ethyl (meth) acrylate, isobonyl (meth) acrylate, tridecyl (meth) acrylate, ethoxyaddition nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) Acrylate, triethylene glycol di (meth) acrylate, t-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol Di (meth) acrylate, ethoxy addition bisphenol-A di (meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxy Ethyl phosphate, For anisotropic conductive films, characterized in that it is one kind or a mixture of two or more kinds selected from the group consisting of methylol tricyclo decaine di (meth) acrylate, trimethylolpropanebenzoate acrylate and fluorene (meth) acrylate. Composition. The method of claim 13, wherein the fluorene-based (meth) acrylate monomer in the group consisting of a fluorene-based epoxy (meth) acrylate monomer and a fluorene-based urethane (meth) acrylate monomer comprising a structure of the formula The composition for anisotropic conductive films, characterized in that at least one selected. [Formula 3]

Each R is independently an alkyl group, an alkoxy group, an aryl group, or a cycloalkyl group, m is each independently an integer of 0 to 4, n is independently an integer of 2-5. delete delete The composition for anisotropic conductive films according to claim 4, wherein the radical initiator is a peroxide-based or azo-based. delete The method of claim 4, wherein the conductive particles are Au, Ag, Ni, Cu, metal particles including solder; carbon; And resins comprising polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol and particles thereof coated with a metal comprising Au, Ag or Ni on the modified resin particles. Composition for anisotropic conductive film. 20. The composition for anisotropic conductive film according to claim 19, wherein the conductive particles are insulated conductive particles coated with insulating particles on the particles. The composition for an anisotropic conductive film according to claim 4, wherein the polymerization inhibitor is one or a mixture of two or more selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, and phenothiazine. The method of claim 4, wherein the antioxidant is tetrakis- (methylene- (3,5-di-t-butyl-4-hydro cinnamate) methane, 3,5-bis (1,1-dimethylethyl)- 4-hydroxy benzene propanoic acid thiol di-2,1-ethanediyl ester, octadecyl 3,5-di-t-butyl-4-hydroxy hydro cinnamate, '2,6-di-tertiary- Composition for an anisotropic conductive film, characterized in that at least one member selected from the group consisting of p-methylphenol. The composition for anisotropic conductive film according to claim 4, wherein the curing accelerator is at least one selected from the group consisting of a solid imidazole accelerator, a solid phase and a liquid amine curing accelerator. The method of claim 4, wherein the coupling agent is vinyl trichloro silane, vinyl trimethoxy silane, 3-glycidoxy propyl trimethoxy silane, 3-methacryloxy propyl trimethoxy silane, 2-aminoethyl-3 -Aminopropyl methyldimethoxy silane, 3-ureidopropyl triethoxy silane composition for an anisotropic conductive film, characterized in that at least one member selected from the group consisting of. Anisotropic conductive film prepared by comprising the composition of claim 4.