KR100916250B1 - Optical element holding apparatus - Google Patents

Abstract

 The holding device for holding the optical element includes a support member for supporting the optical element, a cylindrical member for supporting the support member, a plurality of sensors for detecting positions of the optical element and the support member, and the plurality of sensors. And a drive unit for driving the support member based on the output from the same. The support member includes a plurality of protrusions in contact with the optical element. The direction of each vertex of the polygon formed by connecting the plurality of protrusions in a straight line substantially coincides with the direction of each vertex of the polygon formed by connecting the plurality of sensors in a straight line.

Optical elements, holding devices, sensors, support members, protrusions, exposure devices

Description

Optical element holding device {OPTICAL ELEMENT HOLDING APPARATUS}

The present invention relates to a holding device for holding an optical element.

In a device such as a semiconductor exposure apparatus, a holding device for holding an optical element is used.

A semiconductor exposure apparatus is a device used to transfer a pattern of a reticle onto a silicon wafer to form a circuit. In order to form a highly integrated circuit, it is necessary to improve the overlapping accuracy of the multilayer pattern transferred onto the silicon wafer.

In order to improve the overlapping accuracy, it is necessary to reduce the alignment error, magnification error, and image distortion. Alignment error can be reduced by adjusting the relative position of a reticle and a wafer. Magnification error can be reduced by moving a part of optical elements which form part of the projection optical system in the optical axis direction.

When moving the optical element in the optical axis direction, it is necessary to control so that error components having directions other than the optical axis, in particular parallel eccentricity and tilt error, do not become large. The image distortion can be reduced by parallel eccentric or oblique eccentricity of a part of the optical elements constituting the projection optical system.

As mentioned above, the holding | maintenance apparatus with the mechanism which moves an optical element attracts attention in order to improve the overlapping precision. Such a holding device is described in, for example, Japanese Patent Laid-Open No. 2001-343575. Fig. 14 shows the structure of the holding apparatus described in JP-A-2001-343575.

In FIG. 14, the movable lens 38a is supported by a plurality of receiving seats protruding from the inner circumferential side of the first lens cell 46, and is supported by the first lens cell 46 by a lens pressing member or the like. It is fixed. In addition, the first lens cell 46 is fixed to an inner ring portion 44a. The inner ring portion 44a is driven in the optical axis direction by the actuator 50 via the connecting arm 59.

Three actuators 50 are provided at equal angular intervals along the outer periphery of the outer ring portion 44b disposed outside the inner ring portion 44a. In addition, a sensor 72 is provided in the middle of the actuator 50. This sensor 72 measures the position of the inner ring portion 44a with respect to the outer ring portion 44b. When the number of the sensors 72 is three, each of these sensors 72 can measure the relative displacement amount in the optical axis direction between the inner ring portion 44a and the outer ring portion 44b.

The holding apparatus of Unexamined-Japanese-Patent No. 10-054932 is shown in FIG.

In the projection optical system 10 shown in FIG. 15, each of the plurality of lens elements 2a is held by an annular lens frame. Each lens frame is supported by the inner protrusions of the barrels 62a, 62b, 62c. In addition, the outer projections 36a, 36b, 36c of the barrels 62a, 62b, 62c have actuators 60b, 60c for driving the barrels 62a, 62b, 62c, and displacement detectors 64a, 64b for detecting the displacement between the barrels 62a, 62b, 62c. Is installed.

In the structure described in JP-A-2001-343575, the inner ring portion 44a can be deformed if the inner ring portion 44a is inclined. This deformation is caused by insufficient margin in the rotational direction at the connection portion between the inner ring portion 44a and the actuator 50 which mainly drives the inner ring portion 44a. And deformation | transformation of the inner ring part 44a adversely affects the detection result of the inclination amount by the sensor 72, and the sensor 72 cannot detect the inclination of the inner ring part 44a correctly. Therefore, the inclination deviation may occur between the movable lens 38a and the inner ring portion 44a.

In the holding device described in JP-A-10-04932, the displacement detectors 64a and 64b detect displacements between the barrels 62a, 62b and 62c, and the actuators 60b and 60c drive the barrels 62a, 62b and 62c. . Therefore, it is difficult to accurately position relatively heavy barrels 62a, 62b, 62c.

The present invention is directed to a holding apparatus capable of measuring the position of an optical element while reducing measurement errors caused by the deformation of the support member supporting the optical element or the difference in inclination between the optical element and the support member.

According to an aspect of the present invention, a holding device for holding an optical element includes a support member for supporting the optical element, a cylindrical member for supporting the support member, and a position for detecting the optical element and the support member. A plurality of sensors and a drive unit for driving the support member based on the outputs from the plurality of sensors are provided. The support member includes a plurality of protrusions in contact with the optical element. The direction of each vertex of the polygon formed by connecting the plurality of protrusions in a straight line substantially coincides with the direction of each vertex of the polygon formed by connecting the plurality of sensors in a straight line.

According to another aspect of the present invention, a holding device for holding an optical element includes a support member for supporting the optical element, a cylindrical member for supporting the support member, and a plurality of positions for detecting positions of the optical element and the support member. And a drive unit that drives the support member based on outputs from the plurality of sensors. The support member includes a plurality of protrusions in contact with the optical element. The plurality of protrusions are on substantially the same plane. When setting the axis perpendicular to the plane as the rotation axis passing through the center of the polygon formed by connecting the plurality of projections in a straight line, the plurality of projections are disposed substantially in the same direction as the plurality of sensors in the rotation direction around the rotation axis. do.

According to still another aspect of the present invention, a holding device for holding an optical element includes a support member for supporting the optical element, a cylindrical member for supporting the support member, and a position of the optical element and the support member. A plurality of sensors and a drive unit for driving the support member based on the outputs from the plurality of sensors. The support member includes a plurality of protrusions in contact with the optical element. The plurality of protrusions are on substantially the same plane. When setting an axis passing through the center of the optical element and perpendicular to the plane as the axis of rotation, the plurality of protrusions are disposed substantially in the same direction as the plurality of sensors in the direction of rotation around the axis of rotation.

Further features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings.

According to the present invention, it is possible to provide a holding apparatus capable of measuring the position of an optical element while reducing measurement errors caused by the deformation of the support member for supporting the optical element or the difference in inclination between the optical element and the support member.

Hereinafter, various exemplary embodiments, features, and aspects of the present invention will be described in detail with reference to the drawings.

(First Exemplary Embodiment)

An optical element holding apparatus according to a first exemplary embodiment of the present invention is described. In the present exemplary embodiment, the holding device holds the optical elements constituting part of the projection optical system of the exposure apparatus. However, this holding device can also be used for other devices such as a positioning device used for accurately positioning the optical element.

1 is a schematic view of a scanning exposure apparatus provided with a holding device. The exposure apparatus includes an illumination unit 4 for irradiating slit light to the reticle (original) 5, a reticle stage 6 for holding and moving the reticle, and a pattern of the reticle 5 on the wafer 8 (substrate). The projection optical system 7 to project, the wafer stage 9 etc. which hold and move the wafer 8 (substrate) are provided.

The projection optical system 7 includes a plurality of barrels 11 (cylindrical members), which are fastened to each other by being mounted in an optical axis direction, which is a direction parallel to the Z axis direction in FIG. 1. The projection optical system 7 is supported by the barrel support member 12 as a support. The barrel support member 12 is supported via the vibration suppression mechanism 14 by the main body 13 installed on the floor. This vibration damping mechanism 14 can suppress transmission of vibrations from the floor to the projection optical system 7.

By the above-described configuration, when the exposure is started, the reticle stage 6 moves in a scanning manner in synchronization with the movement of the wafer stage 9. The wafer stage 9 includes a moving mechanism for moving the wafer stage 9 in the optical axis direction. By this moving mechanism, the focus can be adjusted during exposure.

FIG. 2A is an internal plan view of the barrel 11 as viewed from the optical axis direction. It is sectional drawing of the 2B-2B line in FIG. 2A. In FIG. 2B, the axis extending in the optical axis direction is referred to as the Z axis. The axes orthogonal to each other on a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In addition, the optical axis of the optical element 1 is shown by the dashed-dotted line AX.

The projection optical system 7 includes a plurality of optical elements 1 having a predetermined optical power. The optical element 1 is arranged inside the barrel 11. In the present exemplary embodiment, a lens is used as the optical element 1. However, other optical elements such as a mirror may be used as the optical element 1. Moreover, the shape of the optical element 1 is not limited, either.

Hereinafter, the holding device 100 holding the optical element 1 will be described with reference to FIGS. 2A to 5B.

The holding device 100 includes a support frame (support member) 104. The support frame 104 contacts the peripheral portion of the optical element 1 at a plurality of locations to support the optical element 1. Furthermore, the holding device 100 is based on the optical element 1 or the plurality of position sensors 102 for detecting the displacement of the target member mounted on the optical element 1 and the output of the position sensor 102. And a drive mechanism 110 including an actuator for moving the optical element 1. This position sensor 102 is provided in several places.

The support frame 104 contacts the optical element 1 in the direction of the optical axis at the protrusion 106 installed on the support frame 104 and supports the optical element 1. The optical element 1 is supported radially by an adhesive filled in a small gap between the support frame 104 and the optical element 1. The protrusion 106 is a portion where the optical element 1 and the support frame 104 contact each other, as shown in FIG. 9B. The protrusions 106 are provided at three angular intervals around the optical axis along the outer periphery of the optical element 1 at an angular interval of approximately 120 °.

That is, the support frame 104 supports the optical element 1 at equal intervals in the rotational direction at three places around the optical axis. By supporting by the support frame 104 in this way, the influence on the optical performance by the deformation | transformation of the optical element 1 can be reduced. The gap between the optical element 1 and the support frame 104 is sufficient to be 0.05 to 0.2 mm. The adhesive is preferably filled over all four sides of the optical element 1. Due to the viscosity and surface tension of the adhesive, the adhesive cures in the gap.

Six notches are provided along the outer periphery of the support frame 104 supporting the optical element 1. Each of the three notches of the six notches is fastened by a support frame mounting screw 105 to the output of the drive mechanism 110. The support frame 104 and the height of the three fastening portions of the three notches are adjusted to the same height by using a spacer (not shown) provided between the drive mechanism 110 and the support frame 104. Note that deformation can be prevented from being transmitted to the optical element 1. In addition, the remaining notches are arranged at positions facing the position sensor 102. The holding device can be miniaturized by arranging the to-be-detected part of the position sensor 102 inside the notch of the support frame 104.

The drive mechanism 110 and the position sensor 102 are attached to the flat part of the barrel 11, and are arrange | positioned at the angle space of about 120 degrees in three places around an optical axis, respectively. The drive mechanism 110 (or the piezo actuator 112) and the position sensor 102 are arrange | positioned at the position which mutually shifted 60 degrees. This structure improves the space efficiency and can reduce the size of the holding device. The drive mechanism 110 is controlled by the optical element control system 20. By driving the predetermined optical element, the drive mechanism 110 can optimize the optical performance of the projection optical system 7. The optical element control system 20 controls the drive mechanism 110 based on information transmitted from various sensors such as a barometric pressure sensor and a program stored in a memory in advance.

Next, the detail of the position sensor 102 is demonstrated.

The position sensor 102 is used to detect the displacement in the optical axis direction of the optical element 1 and in the radial direction perpendicular to the optical axis. Various mechanisms such as an interference type measuring instrument, a capacitance displacement meter, a linear encoder, a differential transformer displacement meter, and an eddy current displacement meter using a semiconductor laser can be used as a position sensor depending on the required precision. Use a displacement meter

3A is a cross-sectional perspective view of the position sensor 102 shown in FIG. 1. 3B is a perspective view of the sensor head and the bracket.

The position sensor 102 includes a sensor bracket 122 and a sensor head fixed to the sensor bracket 122 with screws. The sensor head includes a Z-sensor head 120 and an R-sensor head 121. The Z-sensor head 120 measures the relative displacement of the support frame 104 with respect to the barrel 11 in the optical axis direction. The R-sensor head 121 measures the relative displacement of the support frame 104 in the radial direction orthogonal to the optical axis.

Also, a target member 123 is provided on the side of the optical element 1. The target member 123 is detected by the position sensor 102. The target member 123 may be formed integrally with the optical element 1, or may be fixed to the optical element 1 by adhesion, welding, or screwing. The target member 123 may be made of a material having substantially the same linear thermal expansion coefficient as the optical element 1, and may also be made of the same material as the optical element 1.

However, in the case of using the capacitive sensor as the position sensor 102, the portion to be detected must be conductive. For this reason, a metal film such as an aluminum film must be covered on the surface (detected portion) of the target member 123 by sputtering, vacuum evaporation, or the like. As an example, when the target member 123 is made of a glass material, a metal film may be formed on the portion to be detected of the target member 123.

In the case of using the capacitive sensor as the position sensor 102, the electrode of the target member 123 and the transducer of the position sensor 102 must be wired. In the present exemplary embodiment, the wiring is fixed to the support frame 104 so that vibration is not transmitted to the optical element 1 through the wiring.

As described in FIG. 2A, the position sensors 102 are provided at three positions around the optical axis at an angular interval of approximately 120 °. Each position sensor 102 is disposed at approximately equal intervals from the optical axis. With such a configuration, it is possible to measure the displacement in the X-axis direction, the Y-axis direction, the Z-axis direction and the angular displacement (the amount of rotation) in the rotational direction around the X-axis and the rotational direction around the Y-axis. That is, the average value of the three displacement values acquired from the three Z-sensor heads is calculated as the displacement in the Z axis direction of the center of the optical element 1. Further, the angular displacements around the X and Y axes can be calculated based on the angle formed by the plane including three points corresponding to the three displacement values and the plane orthogonal to the optical axis.

In this exemplary embodiment, the drive mechanism 110 can drive the optical element 1 in three directions (Z-axis direction, rotational direction around the X-axis, rotational direction around the Y-axis). Therefore, the position of the optical element 1 can be controlled based on the three displacement values in the three axial directions obtained from the three position sensors 102. In addition, the displacement in the X-axis direction and the Y-axis direction obtained from the position sensor 102 can be used to correct the amount of drive of the wafer stage 9 or the amount of drive of the drive mechanism provided in other optical elements.

In the present exemplary embodiment, the displacement of the target member 123 mounted to the optical element 1 is detected. However, it is possible to detect the displacement of the optical element 1 or the support frame 104. In such a configuration, it is possible to reduce the error of the slope between the optical element 1 and the support frame 104, which is caused by the deformation of the support frame 104. For example, by detecting the displacement of the optical element 1 or the target member 123 mounted to the optical element 1, the measurement error due to the deformation of the support frame 104 or the support frame 104 and the optical element ( 1) can reduce the difference between the slope.

In addition, the optical element 1 deforms in the optical axis direction by gravity except for the portion supported by the protrusion 106. Furthermore, when the optical element 1 rotates around the X or Y axis by the drive mechanism 110, the support frame 104 is slightly deformed.

According to the present exemplary embodiment, the contact portion where the protrusion 106 contacts the optical element 1 and the portion to be detected (target member 123) of the position sensor 102 are substantially in the rotational direction around the rotation axis. Are arranged in the same direction. Here, the contact portion in which the protrusion 106 contacts the optical element 1 is substantially above the first plane and passes through the center of the optical element 1 and assumes an axis perpendicular to the first plane as the axis of rotation. In this same direction, the range of the allowable difference between the contact portion where the protrusion 106 contacts the optical element 1 and the detected portion of the position sensor 102 is the optical sensitivity of the optical element 1, that is, the optical element ( It depends on the allowable error of 1). For example, if the difference is within a range of ± 5 degrees, the difference often does not affect the inclination angle detection error. In addition, even when the diameter of the optical element 1 is relatively small, it is possible to arrange the optical element 1 so as not to interfere with the drive mechanism 110. Thereby, detection can be performed in the location where the deformation | transformation mentioned above is small. In other words, the measurement error due to deformation can be further reduced.

It is also possible to use, as the rotation axis, an axis passing through the center of the polygon formed by connecting a plurality of contact portions in a straight line and perpendicular to the first plane, instead of the rotation axis passing through the center of the optical element 1. Of course, the axis of rotation passing through the center of the optical element 1 and the axis passing through the center of the polygon may coincide.

In the present exemplary embodiment, the optical axis of the optical element 1 coincides with the rotation axis described above. However, the present invention is applicable even when the optical axis does not coincide with the rotation axis. This is described in the third exemplary embodiment. That is, in the first exemplary embodiment, it is also possible to replace the optical axis with the above-described rotation axis.

In other words, when there are three or more contact parts and sensors as in the present exemplary embodiment, the direction of the vertices of the polygon formed by connecting the plurality of contact parts in a straight line and the polygon formed by connecting the detected part of the sensor in a straight line The direction of the vertices may be substantially coincident.

As described above, the position sensor 102 detects the relative displacement of the optical element 1 or the target member 123 with respect to the barrel 11.

Next, the detail of the drive mechanism 110 is demonstrated. 4A is an enlarged plan view of the drive mechanism 110 seen from the optical axis direction in which the drive mechanism 110 is disassembled. 4B is a side view, and FIG. 4C is a perspective view.

The drive mechanism 110 is provided with the piezo actuator 112, the main body 111 which conveys the displacement of the piezo actuator 112, the direction change member 115 which changes the direction of the displacement transmitted from the main body 111, etc. do. The piezo actuator 112 includes a drive source in which electrostrictive elements and electrodes are alternately stacked, and an expandable hermetic cylindrical container configured to include the drive source. The length of the piezo actuator 112 extends in the X-axis direction approximately in proportion to the applied voltage. In addition, although the piezoelectric actuator is used in the present exemplary embodiment, it is noted that a linear motion mechanism or the like combining a motor and a ball screw may be used.

The main body 111 has a substantially "H" shape and includes a plurality of links (for example, 111a, 111b, 111h, etc.) constituting a link mechanism. The direction changing member 115 has two openings and includes a plurality of links (for example, 115a, 115b, 115c, 115d, etc.) constituting another link mechanism. By this link mechanism, the X-direction displacement of the piezo actuator 112 is transmitted from the main body 111 to the direction changing member 115, and is further output by the direction changing member 115 as a displacement in the Z direction. The details of the link mechanism will be described later.

Next, the manufacturing method of the main body 111 and the direction changing member 115 is demonstrated.

First, the outer shape or the link mechanism of a main body is formed by movable processing of the base material which is a metal block, by milling, or by wire discharge machining. Next, after forming the screw hole of the fixing link 111h by the drilling machine, the hole before the thread of the installation screw hole from the side of displacement retrieval links 111a, 111b, and an installation screw hole. Machine relief holes. And the piezo adjustment screw hole 111m for loading the piezo adjustment screw 113 is processed.

Similarly, the outer shape or the link mechanism of the direction change member 115 is formed by processing the base material which is a metal block, by milling, or by wire-discharge machining. Next, after the hole before threading of the lens frame mounting screw hole 115j is formed, the hole before threading of the mounting screw hole and the relief hole of the mounting screw hole are processed on both sides of the block. Next, the hole of the lens frame mounting screw hole 115j and the horizontal links 115a and 115b before the thread of the hole is machined.

Next, the assembly procedure of the drive mechanism 110 is demonstrated.

First, the displacement retrieving links 111a and 111b and the connecting links 111e and 111f are inserted into two openings formed on the direction changing member 115. Next, the displacement retrieving link and the connecting link are fastened by the conversion member coupling screw 116. Next, the piezo actuator 112 is fixed to the displacement retrieving links 111a and 111b via the piezo receiving links 111q and 111r. Thereafter, the piezo actuator 112 is attached to the piezo receiving links 111q and 111r by screwing the piezo adjusting screw 113 to the displacement retrieving link 111a from the outside of the piezo adjusting screw hole 111m.

As described above, the piezo adjustment screw 113 is used to correct the dimensional error of the piezo actuator 112 and is used to further preload. Since the amount by which the piezo adjusting screw 113 is screwed to this displacement retrieving link 111a or 111b is generally proportional to the amount of preload of the piezo actuator 112, adjusting the amount changes the characteristics of the piezo actuator 112. It can reduce the influence of

The amount by which the piezo adjusting screw 113 is screwed into the displacement retrieving link can be adjusted by a dial gage or the like. For example, the amount by which the lens frame drive link 115g is moved in the Z-axis direction can be measured by a dial gauge. In addition, the piezo adjustment screw 113 can be held in place by a nut.

Finally, the part which does not displace in the direction changing member 115 and the fixed link 111h are fastened to the flat part of the barrel 11 using a drive mechanism mounting screw, and an assembly process is completed. In FIG. 4C, the direction change member 115 is attached to the barrel 11 at three places of its lower surface. This contributes to preventing the measurement error from occurring due to the driving force of the drive mechanism. When the direction change member 115 is attached to the barrel 11 at three places of its lower surface, a driving force is transmitted to the barrel 11, causing unnecessary deformation, and further deforming the mounting surface of the position sensor 102. Let's do it. For example, when the rigidity of the barrel 11 is made high enough by making the flat part of the barrel 11 thick, the front surface of the lower surface of the direction changing member 115 can be fastened to the barrel 11.

Next, the operation of the link mechanism of the main body 111 and the direction changing member 115 will be described with reference to FIGS. 5A and 5B. 5A and 5B schematically show the driving mechanism 110 of FIGS. 4A and 4B.

Displacement retrieval link 111a, 111b and piezo receive link 111q, 111r are connected via elastic hinges H11, H21. Further, the displacement retrieving links 111a and 111b and the fixed link 111h are connected via the elastic hinges H12 and H22. Furthermore, the displacement retrieving links 111a and 111b and the connecting links 111e and 111f are connected via elastic hinges H13 and H23.

It is possible to adjust the position of this elastic hinge by the above-mentioned piezo adjustment screw 113 provided in both piezo receiving link 111q, 111r. The elastic hinges H11, H12 and H13 arranged on the main body 111 can be aligned on a straight line parallel to the Y axis, and the elastic hinges H21, H22 and H23 are aligned on a straight line parallel to the Y axis. It is preferable for the precision of the movement.

When voltage is applied to the two electrode terminals (not shown) of the piezo actuator 112, the total length L of the piezo actuator 112 extends by the length dL in the X-axis direction. Then, the piezo receive link 111q is displaced to the left by dX1 = dL / 2, and the piezo receive link 111r is displaced to the right by dX2 = dL / 2. As a result, the displacement retrieving link 111a is rotated at a small angle with respect to the Z axis about the hinge H12, and the connecting link 111e is displaced by dX3 to the right. Similarly, the displacement retrieval link 111b is rotated at a small angle with respect to the Z axis about the hinge H22, and the connecting link 111f is displaced by dX4 to the right.

As shown in Fig. 5A, when the lengths of the displacement retrieving links 111a and 111b before the displacement of the piezo actuator 112 (as indicated by the solid line) are defined as a + b, the displacement amounts dX3 and dX4 are the displacement amounts dX1, It is approximately b / a times dX2. In this exemplary embodiment, this magnification is defined as the geometric magnification α of the main body 111. At the point where the geometrical magnification α decreases due to the bending deformation of the displacement retrieving links 111a and 111b, the elongation of the elastic hinge, and the like, driving loss is generated, and attention should be paid to the link shape.

The displacement in the X-axis direction of the link links 111e and 111f is transmitted to the horizontal links 115a and 115b of the direction change member 115, as shown in FIG. 5B. When the horizontal links 115a and 115b are displaced in the X-axis direction, the direction change links 115c and 115d which are arranged at an angle θ with respect to the X axis are rotated, and the lens frame drive link 115g connected with the direction change links 115c and 115d is moved in the Z axis direction. Displacement by length dZ5.

Here, the horizontal links 115a and 115b and the direction change links 115c and 115d are connected through the elastic hinges H15 and H25, and the direction change links 115c and 115d and the lens frame drive link 115g are connected through the elastic hinges H14 and H24.

The displacement dZ5 becomes approximately cotθ times the displacement (average value) of the horizontal links 115a and 115b. According to the present exemplary embodiment, this magnification is defined as the geometric magnification β of the direction changing member 115. The geometric magnification of the whole drive mechanism 110 including the main body 111 and the direction changing member 115 is expressed as geometric magnification γ. The geometric magnification γ is the product (α × β) of the geometric magnifications of the main body 111 and the direction changing member 115.

In order to take out a large displacement from the small displacement dL of the piezo actuator 112, and to enlarge the drive range of the optical element 1, it is preferable to enlarge at least one of (alpha) and (beta). The geometric magnification α can be increased by reducing the shape parameter "a" of the displacement retrieving links 111a and 111b and increasing the shape parameter "b". And the geometric magnification (beta) can be enlarged by making angle (theta) small.

However, when the length b is enlarged, the diameter of the barrel 11 becomes large, and there is a design limitation. On the other hand, when the magnification is increased, the natural frequency of the driving mechanism 110 is lowered, and the performance on the pattern is deteriorated or the driving speed is reduced, for example, by vibration transmitted from the outside of the barrel 11 to the optical element 1. It may cause a fall, and care is needed. Considering the vibration, the geometrical magnification γ is preferably 0.7 or more and 2.0 or less. In consideration of the space in the Z-axis direction, the angle θ formed between the direction change links 115c and 115d and the X axis can be set within a range of 30 to 60 degrees. In this case, the geometric magnification β may be between about 0.57 and 1.72.

As described above, as the piezo actuator 112 extends, the lens frame driving link 115g is displaced in the Z-axis direction. The lens frame drive link 115g can be displaced only in the Z-axis direction without being displaced in the X- and Y-axis directions. Thus, an auxiliary link is provided.

Support links 115e and 115f connected to the left and right sides of the lens frame drive link 115g control the displacement in the X-axis direction of the lens frame drive link 115g. By the support links 115e and 115f, the lens frame drive link 115g can move in the Z-axis direction, but cannot move in the X-axis direction.

In addition, in order to control the displacement of the lens frame drive link 115g in the Y-axis direction, the support links 115s and 115t are provided. The support links 115s and 115t are connected to the horizontal links 115a and 115b through the elastic hinges H16 and H26 and also to the fixed links 115w through the elastic hinges H17 and H27. The support links 115s and 115t are disposed at the end portions near the center of the horizontal links 115a and 115b, and restrict the movement of the horizontal links 115a and 115b in the Y-axis direction while moving the horizontal links 115a and 115b in the X-axis direction.

Since the horizontal links 115a and 115b are restricted from moving in the Y-axis direction, the movement in the Y-axis direction of the direction change links 115c and 115d and the lens frame drive link 115g is regulated. With the above configuration, the area of the lens frame mounting screw hole 115j in the lens frame drive link 115g is displaced only in the Z-axis direction and not in the X-axis direction and the Y-axis direction. For this reason, the support frame 104 fastened to the lens frame drive link 115g can be driven correctly in a Z-axis direction.

The main body 111 is configured such that the displacement retrieving links 111a and 111b rotate about the elastic hinges H12 and H22, respectively. Therefore, the horizontal links 115a and 115b of the direction changing member 115 are easily slightly displaced in the Y-axis direction, and the lens frame drive link 115g is easy to displace in the Y-axis direction in accordance with the displacement of the horizontal links 115a and 115b. . Although this displacement is controlled by the auxiliary link, the control may not be sufficient depending on the required driving accuracy. Such displacements other than the Z-axis direction cause deformation of the support frame 104 and deformation of the lens, thereby deteriorating optical performance. Therefore, it is preferable to restrict the displacement of the lens frame drive link 115g in the Y-axis direction as small as possible.

As described above, the piezo actuator 112 drives the support frame 104 with respect to the barrel 11.

Next, the optical element control system 20 for controlling the optical element 1 will be described with reference to FIG. 6.

The optical element control system 20 includes a CPU (Central Processing Unit) 22 (or a control circuit) for a plurality of optical elements configured to control the plurality of optical elements. The CPU 22 for each optical element controls the driving of each optical element based on the output from the position sensor 102. Three piezo drivers 21 and three position sensors 102 are connected to the CPUs 22 for each optical element. The piezo actuator 112 is connected to each piezo driver 21. Each position sensor 102 includes two sensors as described above. One is for detecting displacement in the optical axis direction, and the other is for detecting radial displacement.

Further, each optical element CPU 22 configured to control the optical element is connected to an exposure apparatus CPU 23 configured to control the exposure apparatus. The exposure apparatus CPU 23 includes a vibration suppression mechanism control system 24, an illumination control system 25 for controlling the illumination mode and the amount of light of the illumination unit 4, a reticle stage control system 26, and a wafer stage control system 27. ) And the like.

Next, with reference to FIG. 7, the control sequence of the optical element using the optical element control system 20 in FIG. 6 is demonstrated.

In step S101, the optical element CPU 22 starts the optical element driving routine by communicating with the exposure apparatus CPU 23.

In step S103, the optical element CPU 22 accesses a lookup table containing information on the drive waveform of the optical element 1 via the exposure apparatus CPU 23 and retrieves data from the lookup table. . This lookup table corrects the drive correction amount of the optical element 1, the drive waveform for correcting various aberrations generated during scan driving in real time, the correction amount for correcting the optical characteristic change of the optical element 1, and the like in the illumination mode. Contains parameters. The change in the optical properties of the optical element 1 is caused, for example, by generating heat when the illumination light is absorbed by the optical element.

Next, in step S105, the optical element CPU 22 detects the air pressure around the optical element 1 by an air pressure sensor (not shown). Based on this air pressure, the optical element CPU 22 calculates a correction amount for correcting the position of the optical element 1. By correcting the position of the optical element 1 in this way, it is possible to reduce the influence of the refractive index fluctuation due to the air pressure.

Next, in step S107, the optical element CPU 22 in the drive waveform in the Z-axis direction of the optical element 1, the θx direction and the θy direction based on the information acquired in the steps S103 and S105. Generate a drive waveform.

In step S109, the optical element CPU 22 moves the axes of the waveforms in the three axis directions (Z, θx, θy) generated in step S107 in the Z-axis directions (Za, Zb, Zc) of the respective drive mechanisms 110. Convert to a drive waveform in.

In step S111, the optical element CPU 22 waits until it receives a drive start command from the exposure apparatus CPU 23. When the optical element CPU 22 does not receive a drive start command (NO in step S111), the CPU 22 waits in that state. When the optical element CPU 22 receives a drive start command (YES in step S111), the optical element CPU 22 starts driving the optical element 1 in step S113.

In step S113, the optical element CPU 22 drives the optical element 1 while monitoring the output from the position sensor 102 in accordance with the drive waveform generated in step S109.

After the process goes through steps S101 to S113, the one optical element driving routine ends. This routine is repeated when the process proceeds to step S115.

By performing the above process, the imaging performance of the optical element 1 can be improved. In addition, by performing similar drive control on the plurality of optical elements 1, the imaging performance of the entire projection optical system 7 can be optimized, and the pattern of the reticle 5 can be accurately projected onto the wafer 8.

(Second exemplary embodiment)

8A to 9B, an optical element holding apparatus in a second exemplary embodiment of the present invention will be described. The same reference numerals are given to components having the same functions as in the first exemplary embodiment, and for the parts not mentioned in the present exemplary embodiment, the same reference numerals are used as the first exemplary embodiment.

FIG. 8A is an internal plan view of the barrel 11 as seen from the optical axis direction of the inside of the barrel 11 shown in FIG. 1. FIG. 8B is a cross-sectional view of the 8B-8B line in FIG. 8A.

The holding device 200 includes a support frame (support member) 104. The support frame 104 contacts the plurality of peripheral portions of the optical element 1 to support the optical element 1. The holding device 200 also includes a position sensor 102 for detecting displacement of the optical element 1 or a target member mounted to the optical element 1 and an optical element based on an output from the position sensor 102. It is provided with a drive mechanism including an actuator for moving 1). The position sensor 102 is provided in several places.

The support frame 104 supports the optical element 1 in contact with the optical element 1 in the optical axis direction at the projection 106 (support) provided in the support frame 104. The optical element 1 is supported in the radial direction by an adhesive filled in a small gap between the optical element 1 and the support frame 104. The protrusions 106 are provided at angular intervals of approximately 120 ° around the optical axis at three places along the outer periphery of the optical element 1. That is, the support frame 104 supports the optical element 1 at three locations at equal intervals in the rotational direction around the optical axis.

Six notches are provided along the outer circumference of the support frame 104 for supporting the optical element 1. Each of the three notches of the six notches is fastened by a support frame mounting screw 105 to the output of the drive mechanism 110.

In addition, the remaining notches are provided at positions facing the position sensor 102. The holding device 200 can be miniaturized by arranging the to-be-detected part of the position sensor 102 inside the notch of the support frame 104. In the present exemplary embodiment, the notches may be made smaller than in the first exemplary embodiment, and the three notches may be omitted.

The drive mechanism 110 and the position sensor 102 are respectively arrange | positioned in three places by the angular interval of about 120 degrees around an optical axis. The drive mechanism 110 (or the piezo actuator 112) and the position sensor 102 are arrange | positioned at the position which mutually shifted 60 degrees. This structure improves the space efficiency and can reduce the holding device 200.

FIG. 9A is a diagram showing details of the position sensor 102 shown in FIG. 8A. This position sensor 102 is provided in the barrel 11 and includes the 1st sensor 124 which detects the relative displacement of the support frame 104 with respect to the barrel 11. In addition, the position sensor 102 is provided on the support frame 104, and is configured to detect the relative position of the optical element 1 with respect to the support frame 104 or the target member 131 mounted to the optical element 1. Two sensors 125. 9A illustrates an example in which the second sensor 125 detects the position of the target member 131.

The first sensor 124 includes a sensor bracket 126 attached to the barrel 11 and a sensor head screwed to the sensor bracket 126. The sensor head includes a Z-sensor head 127 and an R-sensor head 128. The Z-sensor head 127 detects relative displacement in the optical axis direction. The R-sensor head 128 detects the relative displacement in the radial direction orthogonal to the optical axis.

In addition, the detected frame detected by the Z-sensor head 127 and the R-sensor head 128 is provided in the support frame 104. In the present exemplary embodiment, a plane orthogonal to the optical axis of the support frame 104 and a plane orthogonal to the radial direction of the support frame 104 are set as the detected portion. However, the target member having the portion to be detected may be fixed to the support frame 104 by adhesion, welding, or screwing.

9B is an enlarged view of the second sensor 125. The second sensor 125 includes a sensor bracket 129 disposed on the support frame 104, and a sensor head fixed to the sensor bracket 129 with a screw. The sensor head includes a Z-sensor head 130 configured to detect relative displacement in the optical axis direction.

The optical member 1 is also equipped with a target member 131. This target member 131 is detected by the sensor head 130. The material of the target member 131 is the same as the material of the target member 123 described in the first exemplary embodiment.

In this exemplary embodiment, the displacement of the target member 123 mounted to the optical element 1 is detected. However, it is possible to detect the displacement of the optical element 1 itself. By detecting the displacement of the optical element 1 or the target member 123 mounted to the optical element 1, the deformation of the support frame 104 or the inclination of the support frame 104 with the optical element 1 The measurement error due to the difference can be reduced.

In addition, the optical element 1 deforms in the optical axis direction by gravity except for the portion supported by the protrusion 106. Furthermore, when the optical element 1 is rotated around the X or Y axis by the drive mechanism 110, the support frame 104 slightly deforms. According to the present exemplary embodiment, the contact portion where the protrusion 106 is in contact with the optical element 1 and the portion to be detected (target member 131) of the position sensor 125 are substantially in the rotational direction around the rotation axis. Are arranged in the same direction.

Here, the contact portion in which the protrusion 106 contacts the optical element 1 is located on the first plane substantially and passes through the center of the optical element 1 and has an axis perpendicular to the first plane as the rotation axis. The allowable range of difference between the contact where the protrusion 106 contacts the optical element 1 and the detected part of the position sensor 125 in this same direction is the optical sensitivity of the optical element 1, ie the allowed optical element. It depends on the error of (1). For example, if the difference is in the range of ± 5 degrees, this difference often does not affect the inclination angle detection error. Furthermore, even when the diameter of the optical element 1 is relatively small, the optical element 1 may be arranged so as not to interfere with the drive mechanism 110. Thereby, detection can be performed in the location where the deformation | transformation mentioned above is small. In other words, the measurement error due to deformation can be further reduced.

Instead of the axis of rotation passing through the center of the optical element 1, an axis passing through the center of the polygon formed by connecting a plurality of contact portions in a straight line and perpendicular to the first plane can be used as the axis of rotation. Of course, the rotation axis passing through the center of the optical element 1 and the rotation axis passing through the center of the polygon may coincide.

In the present exemplary embodiment, an example in which the optical axis of the optical element 1 coincides with the above-described rotation axis is shown. However, the present invention is applicable even when the optical axis does not coincide with the rotation axis. This is described in the third exemplary embodiment. In other words, it is also possible to replace the optical axis in the second exemplary embodiment with the above-described rotation axis.

In other words, when there are three or more contact parts and sensors as in the present exemplary embodiment, the vertex of the polygon formed by connecting a plurality of contact parts in a straight line and the detected part of the sensor in a straight line The directions of may substantially coincide.

The first sensor 124 may be installed in the protrusion 106. In addition, the first sensor 124 and the second sensor 125 may be disposed obliquely in the rotational direction around the optical axis from the viewpoint of saving the space.

The description of the drive mechanism 110 and the control system of the present exemplary embodiment is the same as described in the first exemplary embodiment and thus will not be repeated.

As described above, the position sensor 124 (first sensor) detects the relative displacement of the support frame 104 relative to the barrel 11, and the position sensor 125 (second sensor) is attached to the support frame 104. The relative displacement of the optical element 1 or the target member 131 relative to is detected.

In addition, according to the present exemplary embodiment, the second sensor 125 detects the inclination angle of the optical element 1 with respect to the support frame 104. The detected tilt angle is used for position control of the optical element 1. That is, the optical element 1 is controlled using a combination of the output of the first sensor 124 and the output of the second sensor 125. For this reason, even if the support frame 104 deforms when the optical element 1 is inclinedly driven, and there is a difference in the inclination between the optical element 1 and the support frame 104, the optical element 1 is in a desired position. You can control it to stay. In this way, even when the rigidity of the support frame 104 is insufficient, the adverse effect by the deformation | transformation of the support frame 104 can be reduced. That is, by forming a notch in the support frame 104 or making the thickness of the support frame 104 thin, the size and weight of the holding device can be reduced and the space efficiency can be improved.

In addition, the second sensor 125 detects the inclination angle of the optical element 1 only in the optical axis direction. However, the second sensor 125 may be detected to detect the inclination angle in the radial direction. For example, this configuration is effective in the case where the optical element 1 and the support frame 104 are displaced in the radial direction by the driving of the optical element 1, which greatly affects the optical performance.

(Third Exemplary Embodiment)

10A and 10B, an optical element holding apparatus in a third exemplary embodiment of the present invention will be described. FIG. 10A is a plan view of the inside of the barrel 11 in FIG. 1 seen from the optical axis direction. FIG. FIG. 10B is a cross-sectional view of the 10B-10B line in FIG. 10A. In addition, the same code | symbol is attached | subjected about the component same as a 1st exemplary embodiment, and it shall be the same as a 1st exemplary embodiment about the place which is not mentioned in this exemplary embodiment.

In the first and second exemplary embodiments, it is assumed that the lens is mainly used as the optical element 1, and the position sensor 102 and the protrusion 106 are disposed around the optical axis. In the case of a reflective optical system using a mirror as the optical element 1, the shape of the optical element 1 may not be circular in shape as shown in Fig. 10A. In this case, the protrusion 106 in which the optical element 1 and the support frame 104 contact each other may be disposed at an equal position with respect to the center CG of the optical element 1. This is because the weight of the optical element 1 applied to the protrusions 106 disposed at three places becomes uniform by disposing the protrusions 106 at the positions.

In this exemplary embodiment, the contact portion where the protrusion 106 contacts the optical element 1 and the detected portion of the position sensor 102 (target member 131) are substantially the same in the direction of rotation about the rotation axis. Is placed. Here, the contact portion in which the protrusion 106 contacts the optical element 1 is substantially on the first plane, and the axis of rotation passing through the center of the optical element 1 and perpendicular to the first plane is the axis of rotation. The allowable range of difference between the contact where the protrusion 106 contacts the optical element 1 and the detected part of the position sensor 125 in this same direction is the optical sensitivity of the optical element 1, ie the allowed optical element. It depends on the error of (1). However, if the difference is within the range of ± 5 degrees, the difference often does not affect the inclination angle detection error. Furthermore, even when the diameter of the optical element 1 is relatively small, the optical element 1 may be arranged so as not to interfere with the drive mechanism 110.

Instead of the axis of rotation passing through the center of the optical element 1, an axis perpendicular to the first plane passing through the center of the polygon formed by connecting a plurality of contact portions in a straight line can be used as the axis of rotation. The axis of rotation passing through the center of the optical element 1 and the axis of rotation passing through the center of the polygon may coincide.

The degree of this agreement depends on the optical sensitivity and weight of the optical element 1, but both axes are preferably within the range of 30 mm radius on the above-mentioned plane. In other words, as shown in the present exemplary embodiment, when there are three or more contact parts and sensors, a polygon formed by connecting a plurality of contact parts in a straight line and a direction of a vertex of the polygon formed in a straight line The direction of the vertices may be substantially coincident.

(Fourth Exemplary Embodiment)

An optical element holding apparatus in a fourth exemplary embodiment of the present invention will be described with reference to FIGS. 11A and 11B. In the first exemplary embodiment, the optical element 1 and the support frame 104 engage the protrusions 106 with adhesive in three places. In a fourth exemplary embodiment, the optical element 1 and the support frame 104 are mechanically clamped.

11A and 11B, three clamp mechanisms 140 are provided as support members for contacting at three peripheral portions of the optical element 1 to support the optical element 1. Although not shown, the sensor and the actuator are to be applied as in the first and second exemplary embodiments.

According to the present exemplary embodiment, the contact portion where the clamp mechanism 140 contacts the optical element 1 and the portion to be detected of the position sensor are disposed in substantially the same direction with respect to the rotational direction around the rotation axis. Here, the contact portion in which the clamp mechanism 140 contacts the optical element 1 is substantially on the first plane, passes through the center of the optical element 1, and makes an axis perpendicular to the first plane the rotation axis. The allowable range of difference between the contact portion where the clamp mechanism 140 contacts the optical element 1 and the detected portion of the position sensor in this same direction is the optical sensitivity of the optical element 1, that is, the allowed optical element 1 Depends on the error. For example, if this difference is within a range of ± 5 degrees, this difference often does not affect the inclination angle detection error. In addition, even when the diameter of the optical element 1 is relatively small, it is possible for the optical element 1 to be disposed without interfering with the driving mechanism 110.

Thereby, detection can be performed in the location where the deformation | transformation mentioned above is small. In other words, the measurement error due to deformation can be further reduced.

Instead of the axis of rotation passing through the center of the optical element 1, an axis passing through the center of the polygon formed by connecting a plurality of contact portions in a straight line and perpendicular to the first plane can be used as the axis of rotation. Of course, the axis of rotation passing through the center of the optical element 1 and the axis of rotation passing through the center of the polygon may coincide.

In the present exemplary embodiment, the optical axis of the optical element 1 coincides with the rotation axis described above. However, the present invention is applicable even when the optical axis does not coincide with the rotation axis.

In other words, when there are three or more contact parts and sensors as in the present exemplary embodiment, the vertex of the polygon formed by connecting a plurality of contact parts in a straight line and the detected part of the sensor in a straight line The direction of can substantially coincide. Note that the center of the area of the contact portion can also be considered as a representative point of the contact region.

Next, with reference to FIG. 12 and FIG. 13, the device manufacturing method using the above-mentioned exposure apparatus is demonstrated. FIG. 12 is a flowchart for explaining a manufacturing process of a semiconductor device (for example, an integrated circuit (IC), a large scale integration (LSI), a liquid crystal display, a charge-coupled device (CCD), etc.). In 12, a semiconductor chip is described as an example of a semiconductor device.

Step S1 is a circuit design process for designing a circuit of the semiconductor device. Step S2 is a mask fabrication process for fabricating a mask that can be called an original or a reticle based on the designed circuit pattern. Step S3 is a wafer manufacturing process for manufacturing a wafer which can be called a substrate using a material such as silicon. Step S3 may be a reticle manufacturing process. Step S4 is called "pre-process", and is a wafer process for forming the actual circuit on the wafer by the above-mentioned exposure apparatus according to the lithography technique by using the manufactured mask. Step S5 is called "post process" and is an assembly process of forming a semiconductor chip using the wafer produced in step S4. This post process includes an assembly process (for example, dicing and bonding), a packaging process (chip encapsulation), and the like. Step S6 is an inspection process for inspecting the semiconductor device produced in step S5. This inspection includes operation verification tests, durability tests, and the like. Step S7 is a shipping step for shipping the semiconductor device completed through these steps.

As shown in Fig. 13, the wafer process of step S4 described above includes an oxidation step S11 for oxidizing a wafer surface, a chemical vapor deposition step S12 (CVD) for forming an insulating film on the wafer surface, and an electrode on the wafer. The electrode formation step S13 which forms the vapor deposition by vapor deposition is included. In addition, the wafer process of step S4 exposes an ion implantation step S14 for injecting ions into the wafer, a resist processing step S15 for applying a photosensitive agent to the wafer, and a wafer subjected to resist processing with a mask having a circuit pattern using the exposure apparatus described above. Exposure step S16 to be included is included. The wafer process of step S4 includes the development step S17 for developing the wafer exposed in the exposure step S16, the etching step S18 for etching portions other than the resist image developed in the development step S17, and the unnecessary resist remaining after the etching step S18. The resist peeling step S19 to remove is included. By repeating these steps, a circuit pattern is formed multiplely on a wafer.

According to an exemplary embodiment of the present invention, it is possible to realize a holding device capable of measuring the position of an optical element while reducing measurement errors caused by the deformation of the support member supporting the optical element or the difference in inclination between the optical element and the support member. There is a number.

In addition, although the present invention has been described with reference to exemplary embodiments, the present invention is not limited to these exemplary embodiments. The following claims are capable of various modifications and variations without departing from the scope of the present invention.

1 is a schematic view of an exposure apparatus.

2A and 2B show a retainer according to a first exemplary embodiment of the present invention.

3A and 3B are detailed views of the position sensor of the holding device.

4A-4C show a drive mechanism.

5A and 5B show the operation of the link mechanism of the drive mechanism.

6 shows a control system for controlling an optical element.

7 is a flowchart showing control of an optical element.

8A and 8B show a retainer according to a second exemplary embodiment of the present invention.

9A and 9B are detailed views of a position sensor according to a second exemplary embodiment of the present invention.

10A and 10B show a retainer according to a third exemplary embodiment of the present invention.

11A and 11B show a retainer according to a fourth exemplary embodiment of the present invention.

12 is a flowchart for explaining a device manufacturing method using the exposure apparatus.

FIG. 13 is a flowchart showing details of the wafer process of step S4 of the flowchart shown in FIG. 10.

14 shows a conventional retainer.

15 shows another conventional retainer.

Claims (9)

A holding device for holding an optical element, A support member for supporting the optical element and including a plurality of protrusions in contact with the optical element; A cylindrical member for supporting the support member; A plurality of sensors for detecting positions of the optical element and the support member; A drive unit for driving the support member based on outputs from the plurality of sensors, And a direction of each vertex of the polygon formed by connecting the plurality of protrusions in a straight line substantially coincides with a direction of each vertex of the polygon formed by connecting the plurality of sensors in a straight line. A holding device for holding an optical element, A support member for supporting the optical element and including a plurality of protrusions in contact with the optical element; A cylindrical member for supporting the support member; A plurality of sensors for detecting positions of the optical element and the support member; A drive unit for driving the support member based on outputs from the plurality of sensors, The plurality of protrusions are substantially coplanar, When setting the axis perpendicular to the plane as the rotation axis passing through the center of the polygon formed by connecting the plurality of projections in a straight line, the plurality of projections are disposed substantially in the same direction as the plurality of sensors in the rotation direction around the rotation axis. Retainer characterized in that. A holding device for holding an optical element, A support member for supporting the optical element and including a plurality of protrusions in contact with the optical element; A cylindrical member for supporting the support member; A plurality of sensors for detecting positions of the optical element and the support member; A drive unit for driving the support member based on outputs from the plurality of sensors, The plurality of protrusions are on substantially the same plane, And when setting an axis passing through the center of the optical element and perpendicular to the plane as the axis of rotation, the plurality of protrusions are disposed substantially in the same direction as the plurality of sensors in the direction of rotation around the axis of rotation. . The method of claim 2, And the rotation axis coincides with the optical axis of the optical element. The method of claim 1, And the plurality of protrusions are arranged at three places at equal intervals around the optical axis of the optical element. A holding device for holding an optical element, A support member for supporting an optical element and including a plurality of protrusions in contact with the optical element; A plurality of sensors for detecting positions of the optical element and a target member mounted to the optical element; An actuator for driving the support member based on outputs from the plurality of sensors, And a direction of each vertex of the polygon formed by connecting the plurality of protrusions in a straight line substantially coincides with a direction of each vertex of the polygon formed by connecting the plurality of sensors in a straight line. A holding device for holding an optical element, A support member for supporting the optical element and including a plurality of protrusions in contact with the optical element; A plurality of sensors for detecting positions of the optical element and a target member mounted to the optical element; An actuator for driving the support member based on outputs from the plurality of sensors, The plurality of protrusions are substantially coplanar, When setting the axis perpendicular to the plane as the rotation axis passing through the center of the polygon formed by connecting the plurality of projections in a straight line, the plurality of projections are disposed substantially in the same direction as the plurality of sensors in the rotation direction around the rotation axis. Retainer characterized in that. A holding device for holding an optical element, A support member for supporting the optical element and including a plurality of protrusions in contact with the optical element; A plurality of sensors for detecting positions of the optical element and a target member mounted to the optical element; An actuator for driving the optical element based on outputs from the plurality of sensors, The plurality of protrusions are substantially coplanar, And when setting an axis passing through the center of the optical element and perpendicular to the plane as the axis of rotation, the plurality of protrusions are disposed substantially in the same direction as the plurality of sensors in the direction of rotation around the axis of rotation. . An exposure apparatus for projecting a pattern of an original onto a substrate through a projection optical system to expose the substrate, wherein at least one of the plurality of optical elements constituting the projection optical system is held by the holding device according to any one of claims 1 to 8. An exposure apparatus, characterized in that held.

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