KR100915695B1 - Apparatus for attaching display panel for stereoscopic image - Google Patents
Apparatus for attaching display panel for stereoscopic imageInfo
- Publication number
- KR100915695B1 KR100915695B1 KR1020070124546A KR20070124546A KR100915695B1 KR 100915695 B1 KR100915695 B1 KR 100915695B1 KR 1020070124546 A KR1020070124546 A KR 1020070124546A KR 20070124546 A KR20070124546 A KR 20070124546A KR 100915695 B1 KR100915695 B1 KR 100915695B1
- Authority
- KR
- South Korea
- Prior art keywords
- panel
- display panel
- stereoscopic
- chuck
- lens panel
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
Abstract
본 발명에 따른 입체영상용 디스플레이 패널 합착 장치는 상부챔버, 상기 상부챔버에 접하여 합착공간을 형성하는 하부챔버, 상기 상부챔버의 하방에 배치되며 입체렌즈 패널의 상면 모서리부에 각각 부착되는 상부척, 상기 하부챔버의 상방에 배치되며 디스플레이 패널이 부착되는 하부척 및 상기 상부챔버 내부에서 독립적으로 구동하여 상기 상부척을 수평이동시키는 스테이지를 포함한다.An apparatus for attaching a display panel for a stereoscopic image according to the present invention includes an upper chamber, a lower chamber contacting the upper chamber to form a bonding space, an upper chuck disposed under the upper chamber and attached to an upper edge portion of the stereoscopic lens panel, And a stage disposed above the lower chamber, the lower chuck to which a display panel is attached, and a stage for driving the upper chuck horizontally by driving independently in the upper chamber.
Description
본 발명은 입체영상용 디스플레이 패널 합착 장치에 관한 것으로, 보다 상세하게는 디스플레이 패널에 입체영상 구현을 위한 입체렌즈 패널을 합착시키는 입체영상용 디스플레이 패널 합착 장치에 관한 것이다.The present invention relates to a display panel bonding apparatus for stereoscopic images, and more particularly, to a display panel bonding apparatus for stereoscopic images for bonding a stereoscopic lens panel for realizing a stereoscopic image to the display panel.
최근들어, 디스플레이 장치의 대형화와 더불어, 디스플레이 장치의 2차원 영상표시에서 더 나아가 입체영상 표현에 관심이 집중되고 있다. 입체영상은 2차원의 영상에 비하여 자연스러울 뿐만 아니라 관찰자에게 새로운 물체에 대한 인식을 보다 용이하게 하기 때문이다. In recent years, with the increase of the size of the display device, attention has been focused on the representation of the stereoscopic image further from the two-dimensional image display of the display device. This is because a stereoscopic image is not only natural than a 2D image, but also makes it easier for an observer to recognize a new object.
이에 따라, 사람의 두 눈이 약 65mm 간격이 있으므로 사물을 바라볼 때 약간의 다른 상이 망막에 결상되고, 이 미세한 차를 뇌가 해석해서 입체감을 느끼게 하는 것에서 착안하여, 관찰자의 왼쪽 눈과 오른쪽 눈에 비치게 되는 2개의 2차원 화상을 하나의 2차원 스크린에 동시에 표시한 다음 일정한 방법에 의하여 그들을 분리하여 관찰자의 왼쪽 눈과 오른쪽 눈에 각각 입사시켜서 관찰자가 입체감을 느끼도록 하는 방법으로 안경식(stereoscope type) 장치와, 무안경식(auto-stereoscope type) 장치에 대한 연구가 활발히 진행 중에 있다.As a result, the two eyes of the human being are about 65 mm apart, so that when looking at an object, a slightly different image is formed on the retina, and the eye is interpreted by the brain to interpret the minute difference, so that the observer's left and right eyes are observed. The two-dimensional images displayed on the screen are simultaneously displayed on a single two-dimensional screen, and then separated by them by a predetermined method and incident on the left and right eyes of the observer, respectively, so that the observer feels a three-dimensional effect. type devices and auto-stereoscope type devices are being actively researched.
안경식 장치는 별도의 장비를 착용해야 하는 반면, 무안경식 장치는 다른 방법에 비하여 화면이 밝고, 직접 스크린을 주시하면 되므로 사용의 편의성이 탁월하여 그에 대한 연구가 집중되고 있는 실정이다. The spectacle device is required to wear a separate equipment, while the glasses-free device is brighter than other methods, and the screen is directly focused on the situation, because the ease of use is excellent and the research is concentrated.
무안경식 장치 중 렌티큘러(Lenticular) 렌즈를 이용한 장치는 엘씨디(LCD; Liquid Crystal Display)와 같은 디스플레이 패널 위에 원통형의 렌티큘러 렌즈가 배열되어 있는 입체렌즈 패널이 부착되어 있는 구조를 가진다. 이때, 하나의 렌티큘러 렌즈는 두개의 엘씨디 기본 소자 열을 포함하게 되고, 이들 두개의 엘씨디 기본소자에서 나온 빛을 분리하여 각각 관찰자의 왼쪽 눈과 오른쪽 눈에 입사시킴으로써 입체영상을 얻을 수 있도록 한다. A device using a lenticular lens among autostereoscopic devices has a structure in which a three-dimensional lens panel in which cylindrical lenticular lenses are arranged on a display panel such as a liquid crystal display (LCD) is attached. In this case, one lenticular lens includes two columns of the LCD element, and separates the light emitted from the two elements of the LCD element so that a stereoscopic image can be obtained by entering the left and right eyes of the observer, respectively.
본 발명의 목적은 디스플레이 패널과 입체렌즈 패널의 합착시, 디스플레이 패널과 입체렌즈 패널 간의 정밀한 정렬이 요구되는 입체영상용 디스플레이 패널 합착 장치을 제공하기 위한 것이다.An object of the present invention is to provide a display panel bonding apparatus for a stereoscopic image that requires precise alignment between the display panel and the three-dimensional lens panel when the display panel and the three-dimensional lens panel is bonded.
본 발명에 따른 입체영상용 디스플레이 패널 합착 장치는 상부챔버, 상기 상부챔버에 접하여 합착공간을 형성하는 하부챔버, 상기 상부챔버의 하방에 배치되며 입체렌즈 패널의 상면 모서리부에 각각 부착되는 상부척, 상기 하부챔버의 상방에 배치되며 디스플레이 패널이 부착되는 하부척 및 상기 상부챔버 내부에서 독립적으로 구동하여 상기 상부척을 수평이동시키는 스테이지를 포함한다.An apparatus for attaching a display panel for a stereoscopic image according to the present invention includes an upper chamber, a lower chamber contacting the upper chamber to form a bonding space, an upper chuck disposed under the upper chamber and attached to an upper edge portion of the stereoscopic lens panel, And a stage disposed above the lower chamber, the lower chuck to which a display panel is attached, and a stage for driving the upper chuck horizontally by driving independently in the upper chamber.
본 발명에 따른 입체영상용 디스플레이 패널 합착 장치는 디스플레이 패널과 입체렌즈 패널 간의 정밀한 정렬을 수행하므로, 높은 합착효율을 얻을 수 있는 효과가 있다.Since the display panel bonding apparatus for stereoscopic images according to the present invention performs precise alignment between the display panel and the stereoscopic lens panel, it is possible to obtain a high bonding efficiency.
또한, 본 발명에 따른 입체영상용 디스플레이 패널 합착 장치는 입체렌즈 패널의 상면에 부착된 상부척을 입체렌즈 패널의 상면 전체가 아닌 상면 모서리부에 각각 부착시키므로 합착 공정이 단순해질 뿐만 아니라 합착 공정의 비용도 절감하는 효과가 있다.In addition, the display panel bonding apparatus for stereoscopic images according to the present invention attaches the upper chuck attached to the upper surface of the stereoscopic lens panel to the upper edge of the upper surface of the stereoscopic lens panel instead of the entire upper surface of the stereoscopic lens panel. It also saves money.
도 1은 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치를 도시한 개략 단면도이다.1 is a schematic cross-sectional view showing a display panel bonding apparatus for a stereoscopic image according to an exemplary embodiment of the present invention.
도 2는 도 1의 "A"부분을 확대하여 나타낸 도면이다. FIG. 2 is an enlarged view of a portion “A” of FIG. 1.
도 3은 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치에서 입체렌즈 패널 및 스테이지를 나타낸 사시도이다. Figure 3 is a perspective view showing a three-dimensional lens panel and stage in the display panel bonding apparatus for a stereoscopic image according to an embodiment of the present invention.
도 4는 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치에서 입체렌즈 패널 및 스테이지를 나타낸 평면도이다.Figure 4 is a plan view showing a three-dimensional lens panel and stage in the display panel bonding apparatus for a stereoscopic image according to an embodiment of the present invention.
도 5는 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치의 작동을 나타낸 순서도이다.5 is a flow chart showing the operation of the display panel bonding device for a stereoscopic image according to an embodiment of the present invention.
**도면의 주요부분에 대한 부호 설명**** Description of the symbols for the main parts of the drawings **
100: 합착 장치100: bonding device
110: 상부챔버110: upper chamber
120: 하부챔버120: lower chamber
130: 상부척130: upper chuck
140: 스테이지140: stage
도 1은 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치를 도시한 개략 단면도이다.1 is a schematic cross-sectional view showing a display panel bonding apparatus for a stereoscopic image according to an exemplary embodiment of the present invention.
도 1을 참조하면, 합착 장치(100)는 상부챔버(110), 하부챔버(120), 상부척(130), 하부척(121) 및 스테이지(140)를 포함한다. Referring to FIG. 1, the bonding apparatus 100 includes an upper chamber 110, a lower chamber 120, an upper chuck 130, a lower chuck 121, and a stage 140.
상부챔버(110)는 디스플레이 패널(D)과 입체렌즈 패널(P)의 합착공간(111)을 형성한다. 상부챔버(110)는 하방에 상부척(130)이 마련되어, 입체렌즈 패널(P)이 부착되도록 구비된다. The upper chamber 110 forms a bonding space 111 of the display panel D and the three-dimensional lens panel P. The upper chamber 110 is provided with an upper chuck 130 below, to be attached to the three-dimensional lens panel (P).
하부챔버(120)는 상부챔버(110)에 접하여 디스플레이 패널(D)과 입체렌즈 패널(P)의 합착공간(111)을 형성한다. 하부척(121)은 하부챔버(120)의 상방에 배치되며, 디스플레이 패널(D)이 부착된다. The lower chamber 120 is in contact with the upper chamber 110 to form the bonding space 111 of the display panel (D) and the three-dimensional lens panel (P). The lower chuck 121 is disposed above the lower chamber 120, and the display panel D is attached.
하부챔버(120)는 상면 가장자리에 상부챔버(110)의 하면과 접촉되어 합착공간(111)의 기밀을 유지시키는 기밀부재(122)를 구비한다. The lower chamber 120 includes an airtight member 122 that contacts the bottom surface of the upper chamber 110 at the upper edge thereof to maintain the airtightness of the bonding space 111.
승강구동부는 도시하지 않았지만, 상부챔버(110)를 하부챔버(120)에 대해 승강시키도록 구비된다.Although not shown, the elevating driving part is provided to elevate the upper chamber 110 with respect to the lower chamber 120.
상부챔버(110)의 상면에는 디스플레이 패널(D)과 입체렌즈 패널(P)에 형성되는 정렬마크(미도시)를 촬영하기 위한 카메라부(112)가 설치되며, 하부챔버(120)의 하면에는 카메라부(112)가 정렬마크(미도시)를 촬영할 수 있도록 카메라부(112) 측으로 조명을 제공하는 조명장치(123)가 설치된다. 이때, 하부챔버(120)와 하부척(121)에는 서로 연통되는 조명홀(124)이 형성되며, 상부챔버(110)와 상부척(130)에는 서로 연통되는 촬영홀(113)이 형성된다.An upper surface of the upper chamber 110 is provided with a camera unit 112 for photographing the alignment mark (not shown) formed on the display panel (D) and the three-dimensional lens panel (P), the lower surface of the lower chamber (120) An illumination device 123 is provided to provide illumination to the camera unit 112 so that the camera unit 112 can photograph an alignment mark (not shown). At this time, the lower chamber 120 and the lower chuck 121 is formed with a light hole 124 in communication with each other, the upper chamber 110 and the upper chuck 130 is formed with a shooting hole 113 in communication with each other.
하부챔버(120)에는 배기관(125)과 공급관(126)이 설치된다. 배기관(125)은 합착공간(111)을 진공상태로 전환시키기 위한 진공펌프(미도시)에 연결된다. 공급관(126)은, 디스플레이 패널(D)에 입체렌즈 패널(P)이 접촉되면, 디스플레이 패널(D)과 입체렌즈 패널(P) 중 적어도 어느 하나를 가압하기 위한 공정가스를 합착공간(111)으로 제공하기 위해 가스공급원(미도시)과 연결된다. 이때, 공정가스는 대표적으로 질소(N2)가 사용될 수 있다.The exhaust chamber 125 and the supply pipe 126 are installed in the lower chamber 120. The exhaust pipe 125 is connected to a vacuum pump (not shown) for converting the bonding space 111 into a vacuum state. When the three-dimensional lens panel P is in contact with the display panel D, the supply pipe 126 may include a process gas for pressurizing at least one of the display panel D and the three-dimensional lens panel P. It is connected to a gas supply (not shown) to provide. At this time, the process gas may typically be used nitrogen (N 2 ).
그리고, 디스플레이 패널(D)과 입체렌즈 패널(P) 중 적어도 어느 하나에 디스플레이 패널(D)과 입체렌즈 패널(P)의 밀봉을 위한 밀봉제(S)가 도포될 수 있다. 이때, 밀봉제(S)는 디스플레이 패널(D)과 입체렌즈 패널(P) 중 적어도 어느 하나에 도포되어 합착공간(111)으로 반입될 수 있다. 또한, 합착공간(111)에 도포모듈이 설치되어, 합착공간(111)에 위치한 디스플레이 패널(D)과 입체렌즈 패널(P) 중 적어도 어느 하나에 도포되도록 할 수 있다. In addition, a sealant S for sealing the display panel D and the stereoscopic lens panel P may be applied to at least one of the display panel D and the stereoscopic lens panel P. In this case, the sealant S may be applied to at least one of the display panel D and the stereoscopic lens panel P, and may be carried into the bonding space 111. In addition, an application module may be installed in the adhesion space 111 to be applied to at least one of the display panel D and the stereoscopic lens panel P positioned in the adhesion space 111.
밀봉제(S)는 자외선 경화수지로써, 1액형 아크릴, 1액형 에폭시, 2액형 에폭시 중 어느 하나로 채택될 수 있다. 이에 따라, 상부챔버(110)의 상부에는 밀봉제(S)를 경화시키는 경화모듈(114)이 구비될 수 있다. 경화모듈(114)은 밀봉제(S)의 경화를 위해, 상부챔버(110)를 관통하여 하부척(121) 측으로 자외선을 조사할 수 있도록 구비된다. 경화모듈(114)은 합착 장치(100)와 별개로 설치될 수도 있다.Sealing agent (S) is an ultraviolet curable resin, it may be adopted any one of one-component acrylic, one-component epoxy, two-component epoxy. Accordingly, the upper portion of the upper chamber 110 may be provided with a curing module 114 for curing the sealant (S). The curing module 114 is provided so as to irradiate ultraviolet rays to the lower chuck 121 through the upper chamber 110 for curing the sealing agent (S). The curing module 114 may be installed separately from the bonding apparatus 100.
상부척(130)은 상부챔버(110)의 하방에 배치되며, 입체렌즈 패널(P)의 상면 모서리부에 각각 부착된다. 상부척(130)은 입체렌즈 패널(P)의 상면 전체가 아닌 상면 모서리부에 각각 부착됨으로써 합착 공정에 따른 비용 절감의 효과가 있을 뿐만 아니라, 합착 공정을 단순화시킬 수 있다. The upper chuck 130 is disposed below the upper chamber 110, and is attached to upper edge portions of the three-dimensional lens panel P, respectively. The upper chuck 130 is attached to the corners of the upper surface of the three-dimensional lens panel P, rather than the entire upper surface of the three-dimensional lens panel (P) can not only reduce the cost of the bonding process, but also simplify the bonding process.
상부척(130)은 정전력에 의해 입체렌즈 패널(P)을 부착하는 정전척(ESC; Electrostatic Chuck)으로 채용할 수 있다. 또한, 상부척(130)은 점착력에 의해 입체렌즈 패널(P)을 부착하는 점착척(SFC; Stick Film Chuck)으로도 채용할 수 있다. The upper chuck 130 may be employed as an electrostatic chuck (ESC) for attaching the three-dimensional lens panel P by electrostatic force. In addition, the upper chuck 130 may also be employed as an adhesive chuck (SFC; Stick Film Chuck) for attaching the three-dimensional lens panel (P) by the adhesive force.
상부척 승강구동부(115)는 상부척(130)을 하부척(121) 측으로 승강시키는 역할을 한다.The upper chuck elevating unit 115 serves to elevate the upper chuck 130 to the lower chuck 121 side.
스테이지(140)는 상부챔버(110)의 내부에 배치된다. 예들 들어, 도 1에서 보는 바와 같이, 상부챔버(110)와 상부척(130) 사이에 배치될 수 있다. 스테이지(140)는 독립적으로 구동하여 상부척(130)을 수평이동시킨다.The stage 140 is disposed inside the upper chamber 110. For example, as shown in FIG. 1, it may be disposed between the upper chamber 110 and the upper chuck 130. The stage 140 is driven independently to horizontally move the upper chuck 130.
디스플레이 패널(D)은 기판합착장치(미도시)에 의해서 어레이 기판과 컬러필터 기판이 합착된 TFT-LCD 기판을 말한다. 입체렌즈 패널(P)은 입체영상이 가능한 패널로서, 대표적으로 렌티큘러 렌즈(Lenticular Lens)일 수 있다.The display panel D refers to a TFT-LCD substrate in which an array substrate and a color filter substrate are bonded by a substrate bonding apparatus (not shown). The stereoscopic lens panel P is a panel capable of stereoscopic images, and may be typically a lenticular lens.
도 2는 도 1의 "A"부분을 확대하여 나타낸 도면이고, 도 3은 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치에서 입체렌즈 패널 및 스테이지를 나타낸 사시도이다. 도 4는 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치에서 입체렌즈 패널 및 스테이지를 나타낸 평면도이다.FIG. 2 is an enlarged view of a portion “A” of FIG. 1, and FIG. 3 is a perspective view illustrating a stereoscopic lens panel and a stage in the display panel bonding apparatus for stereoscopic images according to an exemplary embodiment of the present invention. Figure 4 is a plan view showing a three-dimensional lens panel and stage in the display panel bonding apparatus for a stereoscopic image according to an embodiment of the present invention.
도 2 내지 도 4를 참조하여 스테이지(140)를 설명한다. 스테이지(140)는 상부척(130)의 상방에 배치되며, 상부척(130)은 입체렌즈 패널(P)의 상면 모서리부에 각각 부착된다. 스테이지(140)는 독립적으로 구동하여 상부척(130)을 수평이동시킨다. 따라서, 스테이지(140)는 상부척(130)에 부착된 입체렌즈 패널(P)을 디스플레이 패널(D)에 대하여 수평이동시킨다. 여기서, 수평이동이라 함은 스트레칭(stretching)뿐만 아니라 좌우 정렬을 포함하는 개념이다. The stage 140 will be described with reference to FIGS. 2 to 4. The stage 140 is disposed above the upper chuck 130, and the upper chuck 130 is attached to the top edges of the three-dimensional lens panel P, respectively. The stage 140 is driven independently to horizontally move the upper chuck 130. Accordingly, the stage 140 horizontally moves the stereoscopic lens panel P attached to the upper chuck 130 with respect to the display panel D. FIG. Here, the horizontal movement is a concept including not only stretching but also left and right alignment.
상부척(130)은 입체렌즈 패널(P)의 상면 전체가 아닌 상면 모서리부에 각각 부착되기 때문에 입체렌즈 패널(P)은 중력에 의해 중심부 부근이 아래로 쳐질수 있다. 이때, 스테이지(140)는 상부척(130)에 부착된 입체렌즈 패널(P)의 중심부로부터 멀어지는 방향으로 입체렌즈 패널(P)을 스트레칭할 수 있다. 상기 스트레칭은 입체렌즈 패널(P)을 디스플레이 패널(D)에 대하여 정렬하기 전에 행할 수 있다. Since the upper chuck 130 is attached to the corners of the upper surface of the stereoscopic lens panel P instead of the entire upper surface of the stereoscopic lens panel P, the vicinity of the center portion of the stereoscopic lens panel P may be struck down by gravity. In this case, the stage 140 may stretch the stereoscopic lens panel P in a direction away from the center of the stereoscopic lens panel P attached to the upper chuck 130. The stretching may be performed before the stereoscopic lens panel P is aligned with the display panel D. FIG.
입체렌즈 패널(P)을 스트레칭한 후에, 스테이지(140)는 상부척(130)을 수평이동시킴으로써, 입체렌즈 패널(P)을 디스플레이 패널(D)에 대하여 정렬한다.After stretching the stereoscopic lens panel P, the stage 140 horizontally moves the upper chuck 130 to align the stereoscopic lens panel P with respect to the display panel D. FIG.
예를 들어, 스테이지(140)는 디스플레이 패널(D)에 대하여 입체렌즈 패널(P)을 상기 입체렌즈 패널(P)에 접하는 방향인 X축 방향과 Y축 방향으로 이동시킴과 동시에 θ 방향(회전 방향)으로 이동시킬 수 있다. 이때, 스테이지(140)는 구동축(141), X축 이송유닛(142) 및 Y축 이송유닛(143)을 포함할 수 있다.For example, the stage 140 moves the three-dimensional lens panel P in the X-axis direction and the Y-axis direction, which are directions in contact with the three-dimensional lens panel P, with respect to the display panel D, and at the same time, in the θ direction (rotation). Direction). In this case, the stage 140 may include a drive shaft 141, an X-axis transfer unit 142, and a Y-axis transfer unit 143.
구동축(141)은 스테이지(140)를 관통하여 상부척(130)과 연결되어 있으며, 상부척(130)을 X축 방향, Y축 방향 및 θ 방향으로 이동할 수 있도록 한다. X축 이송유닛(142)은 구동축(141)의 일측에 배치되며, 구동축(141)에 구동력을 전달함으로써 입체렌즈 패널(P)을 X축 방향으로 이동시킨다. 그리고, Y축 이송유닛(143)은 X축 이송유닛(142)과 직교된, 구동축(141)의 일측에 배치되며, 구동축(141)에 구동력을 전달함으로써 입체렌즈 패널(P)을 Y축 방향으로 이동시킨다. 또한, X축 이송유닛(142)과 Y축 이송유닛(143)의 복합적인 작동에 의해 입체렌즈 패널(P)의 θ 방향(회전 방향)으로의 이동이 조절된다. 여기서, X축 이송유닛(142)과 Y축 이송유닛(143)은 캠 구동방식이며, 이에 한정되지 않고 직진성을 부여하는 이송유닛으로의 다양한 변경 실시가 가능하다. The driving shaft 141 is connected to the upper chuck 130 through the stage 140 and allows the upper chuck 130 to move in the X-axis direction, the Y-axis direction, and the θ direction. The X-axis conveying unit 142 is disposed on one side of the drive shaft 141 and transfers the driving force to the drive shaft 141 to move the three-dimensional lens panel P in the X-axis direction. In addition, the Y-axis transfer unit 143 is disposed on one side of the drive shaft 141 orthogonal to the X-axis transfer unit 142, and transmits a driving force to the drive shaft 141 to move the three-dimensional lens panel P in the Y-axis direction. Move to. In addition, by the combined operation of the X-axis transfer unit 142 and the Y-axis transfer unit 143, the movement in the θ direction (rotation direction) of the three-dimensional lens panel P is adjusted. Here, the X-axis transfer unit 142 and the Y-axis transfer unit 143 is a cam driving method, various modifications to the transfer unit to give a straightness is not limited to this.
그리고, X축 이송유닛(142), Y축 이송유닛(143)은 각각 입체렌즈 패널(P)을 정렬시키는 방향에 따라 구분된 것이다. 또한, θ 방향이라 함은 X축 방향과 Y축 방향 사이의 각도를 나타내는 방향 즉, X축 방향과 Y축 방향 사이의 회전 방향을 말한다.The X-axis transfer unit 142 and the Y-axis transfer unit 143 are divided according to directions in which the three-dimensional lens panel P is aligned. Further, the θ direction refers to a direction indicating an angle between the X axis direction and the Y axis direction, that is, a rotation direction between the X axis direction and the Y axis direction.
예를 들어, 입체렌즈 패널(P)의 상면 모서리부에 각각 부착된 상부척(130)의 상방에 배치된 모든 X축 이송유닛(142)만이 같은 방향으로 이동하면, 상부척(130)에 부착된 입체렌즈 패널(P)은 X축 방향으로 이동한다. 또한, 모든 Y축 이송유닛(143)만이 같은 방향으로 이동하면, 상부척(130)에 부착된 입체렌즈 패널(P)은 Y축 방향으로 이동한다. 만약, X축 이송유닛(142)과 Y축 이송유닛(143)이 동시에 복합적으로 작동되면, 상부척(130)에 부착된 입체렌즈 패널(P)은 θ 방향으로 회전한다. 또한, X축 이송유닛(142)과 Y축 이송유닛(143)을 입체렌즈 패널(P)의 중심부로부터 멀어지는 방향으로 작동시키면, 입체렌즈 패널(P)은 스트레칭된다.For example, if only all the X-axis transfer units 142 disposed above the upper chucks 130 attached to the upper edges of the three-dimensional lens panel P move in the same direction, they are attached to the upper chucks 130. The stereoscopic lens panel P moves in the X-axis direction. In addition, when only all the Y-axis transfer unit 143 moves in the same direction, the three-dimensional lens panel P attached to the upper chuck 130 moves in the Y-axis direction. If the X-axis conveying unit 142 and the Y-axis conveying unit 143 are operated in combination at the same time, the stereoscopic lens panel P attached to the upper chuck 130 rotates in the θ direction. In addition, when the X-axis conveying unit 142 and the Y-axis conveying unit 143 are operated in a direction away from the center of the three-dimensional lens panel P, the three-dimensional lens panel P is stretched.
스테이지(140)는 상부척(130)과 하부척(121) 간의 수평도를 조절(정렬)함으로써, 디스플레이 패널(D)과 입체렌즈 패널(P)의 합착시에 디스플레이 패널(D)과 입체렌즈 패널(P) 간의 합착효율을 높일 수 있다. 또한, 스테이지(140)는 상부척(130)과 하부척(121) 간의 수평도를 조절(정렬)함으로써, 하부척(121)에 부착되는 합착 패널(D+P)에 대해 경화모듈(114)에 의한 경화효율을 높일 수 있게 한다.The stage 140 adjusts (aligns) the horizontality between the upper chuck 130 and the lower chuck 121, so that the display panel D and the three-dimensional lens when the display panel D and the three-dimensional lens panel P are attached to each other. The bonding efficiency between the panels P can be improved. In addition, the stage 140 adjusts (aligns) the horizontality between the upper chuck 130 and the lower chuck 121, thereby curing module 114 with respect to the bonding panel D + P attached to the lower chuck 121. It is possible to increase the curing efficiency by.
도 5는 본 발명의 실시예에 따른 입체영상용 디스플레이 패널 합착 장치의 작동을 나타낸 순서도이다.5 is a flow chart showing the operation of the display panel bonding device for a stereoscopic image according to an embodiment of the present invention.
도 5를 참조하면, 디스플레이 패널(D)과 입체렌즈 패널(P)은 챔버(110, 120) 외부에 마련된 이송장치(미도시)에 의해 챔버(110, 120) 내부로 반입된다. 챔버(110, 120) 내부로 이송된 디스플레이 패널(D)은 하부척(121)에 부착되며, 입체렌즈 패널(P)은 정전력 또는 점착력에 의해 상부척(130)에 부착된다. 이와 같이, 챔버(110, 120) 내부에서 디스플레이 패널(D)과 입체렌즈 패널(P)은 서로 대향되도록 위치한다(S110). 이때, 밀봉제(S)는 디스플레이 패널(D)과 입체렌즈 패널(P) 중 적어도 어느 하나에 도포되어 합착공간(111)으로 반입될 수 있다.Referring to FIG. 5, the display panel D and the stereoscopic lens panel P are brought into the chambers 110 and 120 by a transfer device (not shown) provided outside the chambers 110 and 120. The display panel D transferred into the chambers 110 and 120 is attached to the lower chuck 121, and the three-dimensional lens panel P is attached to the upper chuck 130 by electrostatic force or adhesive force. As such, the display panel D and the stereoscopic lens panel P are positioned to face each other in the chambers 110 and 120 (S110). In this case, the sealant S may be applied to at least one of the display panel D and the stereoscopic lens panel P, and may be carried into the bonding space 111.
디스플레이 패널(D)과 입체렌즈 패널(P)이 서로 대향되도록 위치하면, 승강구동부(미도시)는 디스플레이 패널(D)과 입체렌즈 패널(P)의 합착을 위해 상부챔버(110)를 하강시킨다. 그리고, 승강구동부(미도시)의 작동에 의해 상부챔버(110)와 하부챔버(120)는 접촉하고, 하부챔버(120)의 기밀부재(122)에 의해 합착공간(111)은 밀폐된다. 이후, 합착공간(111)의 배기가 수행되고, 합착공간(111)은 진공상태로 전환된다(S120). When the display panel D and the three-dimensional lens panel P are positioned to face each other, the lift driver (not shown) lowers the upper chamber 110 for bonding the display panel D and the three-dimensional lens panel P together. . The upper chamber 110 and the lower chamber 120 contact each other by the operation of the lifting driver (not shown), and the bonding space 111 is sealed by the airtight member 122 of the lower chamber 120. Thereafter, the exhaust of the bonding space 111 is performed, and the bonding space 111 is converted into a vacuum state (S120).
합착공간(111)이 진공상태로 전환되면, 카메라부(112)는 조명장치(123)로부터 조명을 제공받아 디스플레이 패널(D)과 입체렌즈 패널(P)에 형성된 정렬마크(미도시)를 촬영한다. 이때, 촬영결과에 따라 스테이지(140)를 이용하여 상부척(130)을 수평이동시켜 디스플레이 패널(D)에 대하여 입체렌즈 패널(P)의 정렬이 수행된다(S130). 디스플레이 패널(D)에 대하여 입체렌즈 패널(P)의 정렬을 수행하기 전에, 스테이지(140)를 이용하여 입체렌즈 패널(P)의 중심부 부근이 쳐져 있는 것을 스트레칭할 수 있다. When the bonding space 111 is switched to the vacuum state, the camera unit 112 receives the illumination from the lighting device 123 to photograph the alignment marks (not shown) formed on the display panel D and the stereoscopic lens panel P. FIG. do. At this time, according to the photographing result, the upper chuck 130 is horizontally moved using the stage 140 to align the stereoscopic lens panel P with respect to the display panel D (S130). Before performing alignment of the stereoscopic lens panel P with respect to the display panel D, the stage 140 may be used to stretch the vicinity of the center of the stereoscopic lens panel P.
디스플레이 패널(D)에 대하여 입체렌즈 패널(P)의 정렬이 수행되면, 상부척 승강구동부(115)는 상부척(130)을 하부척(121) 측으로 하강시킨다. 상부척(130)이 하강됨에 따라 입체렌즈 패널(P)은 디스플레이 패널(D)에 근접하며, 상부척(130)에 제공되는 정전력 또는 점착력은 차단된다. 상부척(130)의 정전력 또는 점착력이 차단되면, 입체렌즈 패널(P)은 밀봉제(S)가 도포된 디스플레이 패널(D)의 상부 표면에 접촉된다.When the stereoscopic lens panel P is aligned with respect to the display panel D, the upper chuck elevating driver 115 lowers the upper chuck 130 toward the lower chuck 121. As the upper chuck 130 is lowered, the stereoscopic lens panel P approaches the display panel D, and the electrostatic force or adhesive force provided to the upper chuck 130 is blocked. When the electrostatic force or adhesive force of the upper chuck 130 is blocked, the three-dimensional lens panel P is in contact with the upper surface of the display panel (D) to which the sealant (S) is applied.
입체렌즈 패널(P)이 디스플레이 패널(D)에 접촉되면, 합착공간(111)으로 공정가스가 주입된다. 합착공간(111)으로 공정가스가 주입됨에 따라 밀봉제(S)가 도포된 디스플레이 패널(D)과 입체렌즈 패널(P) 사이의 공간과, 나머지 합착공간(111)에 발생되는 압력차에 의해 입체렌즈 패널(P)이 디스플레이 패널(D) 측으로 가압되며, 밀봉제(S)에 의해 입체렌즈 패널(P)은 디스플레이 패널(D)과 합착된다. 합착되는 디스플레이 패널(D)과 입체렌즈 패널(P)은 합착 패널(D+P)로 제공된다(S140).When the three-dimensional lens panel P contacts the display panel D, process gas is injected into the bonding space 111. As the process gas is injected into the bonding space 111, the space between the display panel D and the three-dimensional lens panel P to which the sealing agent S is applied, and the pressure difference generated in the remaining bonding space 111. The stereoscopic lens panel P is pressed toward the display panel D, and the stereoscopic lens panel P is bonded to the display panel D by the sealing agent S. FIG. The display panel D and the stereoscopic lens panel P to be bonded are provided as the bonding panel D + P (S140).
합착 패널(D+P)은 하부척(121)에 머무르며, 경화모듈(114)은 자외선을 합착 패널(D+P) 측으로 조사시킨다. 따라서, 밀봉제(S)는 경화모듈(114)의 자외선 조사에 의해 경화된다(S150). 자외선 조사에 의해 밀봉제(S)가 경화되면, 승강 구동부(미도시)는 상부챔버(110)를 상승시켜, 합착공간(111)을 개방시킨다. 합착공간(111)이 개방되면, 합착 패널(D+P)은 이송장치(미도시)에 의해 합착 장치(100)의 외부로 반출된다.The bonding panel D + P stays at the lower chuck 121, and the curing module 114 irradiates ultraviolet rays toward the bonding panel D + P. Therefore, the sealing agent S is cured by ultraviolet irradiation of the curing module 114 (S150). When the sealing agent S is cured by ultraviolet irradiation, the lift driver (not shown) raises the upper chamber 110 to open the bonding space 111. When the bonding space 111 is opened, the bonding panel D + P is carried out to the outside of the bonding device 100 by a transfer device (not shown).
이상에서 살펴본 바와 같이 본 발명의 바람직한 실시예에 대해 상세히 기술되었지만, 본 발명이 속하는 기술분야에 있어서 통상의 지식을 가진 사람이라면, 첨부된 청구 범위에 정의된 본 발명의 정신 및 범위를 벗어나지 않으면서 본 발명을 여러 가지로 변형하여 실시할 수 있을 것이다. 따라서, 본 발명의 앞으로의 실시예들의 변경은 본 발명의 기술을 벗어날 수 없을 것이다.Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Accordingly, modifications to future embodiments of the present invention will not depart from the technology of the present invention.
예를 들어, 본 발명에 다른 부가적인 기능을 가진 구성요소를 추가하거나, 또는 다른 구성요소로 교체하여 실시할 수 있을 것이다. 그러나, 변형된 다른 실시예가 본 발명의 필수적 구성요소를 포함한다면 모두 본 발명의 기술적 범주에 포함된다고 보아야 한다.For example, the present invention may be implemented by adding a component having another additional function or replacing the component with another component. However, all other modified embodiments include essential components of the present invention should be considered to be included in the technical scope of the present invention.
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| KR20060023392A (en) * | 2004-09-09 | 2006-03-14 | 삼성전자주식회사 | Manufacturing method of three dimensional image display and assembling apparatus for the same |
| JP2006321575A (en) * | 2005-05-17 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Device and method for manufacturing display panel |
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| JP2001353682A (en) * | 2000-06-15 | 2001-12-25 | Ulvac Japan Ltd | Electrostatic attraction device, substrate conveyor and evacuation process device |
| KR20060023392A (en) * | 2004-09-09 | 2006-03-14 | 삼성전자주식회사 | Manufacturing method of three dimensional image display and assembling apparatus for the same |
| JP2006321575A (en) * | 2005-05-17 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Device and method for manufacturing display panel |
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