KR100909782B1 - Non-contact hot press device of liquid crystal display and method - Google Patents

Abstract

The present invention relates to a non-contact hot press device and a method thereof of a liquid crystal display device. A non-contact hot press apparatus for a liquid crystal display according to the present invention, comprising: a cassette containing a predetermined number of bonded substrates; A chamber configured to carry the cassette into a closed space; It is configured to include a predetermined number of gas inlet formed to enter the gas into the chamber.

Here, in particular, the predetermined number of bonded substrates inserted into the cassette is characterized in that it is stored spaced at a predetermined interval.

In the non-contact hot press apparatus and method of the liquid crystal display device according to the present invention, by providing pressure and temperature between substrates spaced at regular intervals in the chamber, the substrate can be cured so that glass defects do not occur.

Contactless, Pressurized, Hot Press, Cassette

Description

Non-contact hot press device and method for liquid crystal display device {APARRATUS AND THE METHODE FOR NONCONTACTING HOT PRESS OF LCD}

1A to 1D are diagrams illustrating the bonding bonding process of the upper plate and the lower plate.

2 is a view schematically showing the configuration of a hot press apparatus for curing a cemented substrate according to the prior art.

Figure 3 schematically shows the structure of a non-contact hot press device according to the present invention.

4 schematically shows the configuration of a cassette according to the present invention;

<Description of the symbols for the main parts of the drawings>

301 --- Chamber 302 --- Gas Inlet

303 --- cassette 304 --- support protrusion

305 --- Board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact hot press device and a method thereof of a liquid crystal display device. In particular, a liquid crystal capable of curing a substrate such that glass defects are prevented by providing pressure and temperature between substrates spaced at regular intervals in a chamber. A non-contact hot press device for a display device and a method thereof.

In general, a liquid crystal display (LCD) includes a process of manufacturing a panel top and a bottom plate accompanying a process of forming a liquid crystal cell forming a pixel unit, a process of forming and rubbing an alignment layer for liquid crystal alignment, and a top plate. And it is completed through a number of processes, such as the step of bonding the bottom plate and the step of injecting and encapsulating the liquid crystal between the bonded top and bottom plate.

The above-mentioned processes of manufacturing the panel by the upper and lower plates, the bonding process of the upper and lower plates, and the process of injecting and encapsulating the liquid crystal between the bonded upper and lower plates are performed at the exact positions preset by the robot. It is carried out repeatedly. (The upper and lower plates are referred to as substrates (glasses).)

First, the bonding process of the bonded substrate will be described before explaining the process of curing the bonded substrate by hot press.

1A to 1D are diagrams illustrating the bonding bonding process of the upper plate and the lower plate. As shown in FIG. 1A, in the bonding process, first, an upper plate and a lower plate are prepared to form necessary electrodes or active elements on each substrate, and coating alignment treatment of the alignment layer is performed.

Subsequently, as shown in FIG. 1B, a seal is formed on the upper plate. The seal is formed along the periphery of the top plate and forms an injection hole with some gaps left. Here, the seal includes a fiber spacer and a conductive spacer sandwiched between the outer seal and the inner seal.                         

The conductive spacer is for electrical conduction between the upper plate and the lower plate, and is disposed in a spot where necessary, and the fiber spacer is for maintaining the space between the upper plate and the lower plate at a predetermined interval during the bonding process.

Then, as shown in Figure 1c, the spacer is sprayed on the lower plate. The spacer is a spacer for maintaining a gap between the upper plate and the lower plate at a predetermined value in the display area.

Subsequently, as shown in FIG. 1D, the upper plate is turned over, moved onto the lower plate, and aligned to overlap.

That is, in the bonded substrate formed by the above process, the upper plate and the lower plate are disposed to face each other through a predetermined interval. Here, the spacer determines the distance between both substrates, and the space between the pair of substrates is determined at the periphery of the substrate by the thread sandwiching the fiber spacers with the sealing material.

On the other hand, the bonded substrate of the upper plate and the lower plate is cured by a hot press device.

2 is a view schematically showing a configuration of a hot press apparatus for curing a bonded substrate according to the related art. As shown here, the upper and lower plates 201 and 202 for curing the thermosetting resin while applying a predetermined pressure and temperature vertically; A buffer member 203 attached to a bottom surface of the upper surface plate 201; It comprises a jig plate 204 formed on the upper surface of the lower surface plate 202.

An operation of the liquid crystal display device configured as described above will be described.                         

First, the predetermined number of bonding substrates 206 are brought in to place on the jig plate 204 of the hot press apparatus.

More specifically, the bonded substrates are transferred to the jig plate 204 while the upper and lower plates 201 and 202 are separated from each other. Then, the slip sheet 205 is placed on the bonded substrate 206, and then the bonded substrate is placed. In this way, a predetermined number of bonded substrates are alternately inserted between the upper and lower plates 201 and 202.

Here, the substrate and the substrate do not adhere by being placed between the substrate and the substrate on which the interleaver is bonded.

The predetermined number of bonded substrates accommodated in the hot press apparatus are pressurized and heated while being placed between the top plate 201 and the bottom plate 202 of the hot press apparatus. In order to prevent damage to the substrate, at least one of the upper plate 201 and the lower plate 202 of the hot press device is provided with a buffer material 203.

The bonded substrate is heated and pressurized in the hot press apparatus and the hot press is continued until sufficient preliminary strength is generated. Here, it is preferably precured to a curing rate of 40 to 95%.

In addition, in the hardening process by the said hot press apparatus, heating temperature changes slightly by the thermosetting resin used. For example, when the epoxy resin is used as the thermosetting resin, the heating temperature is in the range of 80 ° C to 180 ° C, and when the acrylic resin is used as the thermosetting resin, the heating temperature range is 80 ° C to 150 ° C and the phenol noblock as the thermosetting resin. When the resin is used, the heating temperature is in the range of 80 ° C to 230 ° C.                         

In addition, the pressing force of the hot press device is in the range of 0.1kg / cm 2 ~ 3kg / cm 2.

That is, the hardening process by the said hot press apparatus is performed until sufficient bonding strength is obtained so that distortion and curvature of the position of the said bonding board | substrate may not arise by conveyance and heat fluctuation. Here, it is preferable to perform the hot press process for at least 2 minutes.

By the way, in the case of contact-curing a predetermined number of bonded substrates in the hot press apparatus as described above, if a substrate with foreign substances or glass chips is brought in between the substrate and the substrate, the process defect, the substrate (glass) warpage, The problem which causes a defect by jungle etc. arises.

SUMMARY OF THE INVENTION The present invention provides a non-contact hot press apparatus and method for a liquid crystal display device capable of curing a substrate such that glass defects are prevented by providing pressure and temperature between substrates spaced at regular intervals in the chamber. There is this.

In order to achieve the above object, the non-contact hot press device of the liquid crystal display device according to the present invention,

A cassette containing a predetermined number of bonded substrates;

A chamber configured to carry the cassette into a closed space;

It is characterized in that it comprises a predetermined number of gas inlets formed so that gas is introduced into the chamber.                     

Here, in particular, the predetermined number of bonded substrates of the cassette is characterized in that the spaced apart at a predetermined interval.

In addition, the non-contact hot press method of the liquid crystal display device according to the present invention in order to achieve the above object,

Importing a cassette containing the substrate bonded into the chamber;

It is characterized in that it comprises the step of introducing gas into the chamber into which the cassette is loaded.

In this case, in particular, in the step of introducing the gas into the chamber into which the cassette is introduced, it is characterized in that the gas having a predetermined pressure and temperature is introduced through the gas inlet.

According to the present invention as described above, the substrate can be cured so as not to cause glass defects by providing pressure and temperature between the substrates spaced at regular intervals in the chamber.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view schematically showing the structure of a non-contact hot press apparatus according to the present invention. As shown therein, a cassette 303 in which a predetermined number of bonded substrates is stored; A chamber 301 configured to carry the cassette 303 into a closed space; It is configured to include a predetermined number of gas inlet 302 is formed so that the gas flows into the chamber 301.

4 is a view schematically showing the configuration of a cassette according to the present invention. As shown therein, the upper plate 401 formed on the upper side; A plurality of side plates 402 mounted on both side edges of the top plate 401 to support the top plate 401 and to hold respective substrates (glasses) loaded; A lower plate 403 corresponding to the upper plate 401 and supporting the other one side of the plurality of side plates 402 supporting the upper plate 401 on both side edge surfaces thereof; It is configured to include a plurality of stoppers 404 to prevent the substrate (glass) loaded on each of the side plate 402 to fall back.

The lower plate 403 is a rectangular flat plate to form a plurality of grooves at predetermined intervals on both side surfaces. One end of the side plate 402 is mounted and coupled to grooves formed at both edges of the lower plate 403, respectively.

In addition, the upper plate 401 also has a rectangular flat plate having the same size as the lower plate 403 to form a plurality of grooves at predetermined intervals on both side edges. Here, the plurality of grooves formed on both side edge surfaces of the upper plate 401 are formed to correspond to the positions of the grooves formed on the lower plate 403.

Then, the other end of the side plate 402 is mounted and coupled to grooves formed on both side edge surfaces of the top plate 401, respectively.

Accordingly, the lower plate 403 and the upper plate 401 are coupled to both ends of the side plate 402 in grooves formed at both side edges thereof to form a structure facing each other. In this case, the side plates 402 coupled to both side edge surfaces of the upper plate 401 and the lower plate 403 are also at positions corresponding to each other.                     

Here, the above-mentioned shape is a hexahedral structure in which the lower plate 403 supports the side plate 402 and the upper plate 401.

On the other hand, a plurality of projections 304 are formed on the inner surface of the side plate 402 on both sides having a structure corresponding to each other at predetermined intervals. Here, the protrusions 304 of both side plates 402 are formed at predetermined intervals, and form the same positions of the protrusions corresponding to each other on both side surfaces.

Thus, each substrate (glass) can be loaded horizontally into each projection of the two side plate 402 when loaded.

In addition, the plurality of stoppers 404 are formed in the same length as the side plate 403 and are coupled to the grooves formed at predetermined intervals on the rear edge surfaces of the upper plate 401 and the lower plate 403.

In this case, the stopper 404 is for preventing the substrate (glass) from escaping to the rear side of the cassette.

The chamber 301 is a sealed structure formed so as not to be influenced by the outside, and a predetermined number of gas injection holes 302 are formed.

On the other hand, in the non-contact hot press method of the liquid crystal display according to the present invention, the substrates, which have been first bonded, are each accommodated in a cassette and brought into a chamber of a sealed structure that does not receive an external environment.

Then, N ₂ gas is introduced into the chamber into which the cassette is loaded through the gas inlet.

In more detail, the N ₂ gas flowing through the gas inlet 302 is introduced at a predetermined pressure and temperature. When the N ₂ gas having the predetermined pressure and temperature is introduced, the bonded substrates respectively accommodated in the cassette 303 are cured due to the air pressure and heat.

Therefore, when the substrates of the cassette 303 are subjected to pressure and temperature in the spaced state as described above, the light leakage defect may be reduced by preventing the bending of the substrate or the sliding of the substrate generated when the substrate and the substrate are laminated. .

In addition, even if a foreign material is introduced between the substrate and the substrate, a gap defect does not occur.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, the non-contact hot press apparatus and method of the liquid crystal display according to the present invention provide pressure and temperature between substrates spaced at regular intervals in the chamber, thereby curing the substrate so that glass defects do not occur. Can be.

Claims (6)

A cassette containing a predetermined number of bonded substrates; A chamber configured to carry the cassette into a closed space; A predetermined number of gas inlets formed so that gas is introduced into the chamber to apply a predetermined pressure; The cassette is An upper plate formed on the upper side; A plurality of side plates mounted on both side edges of the upper plate to support the upper plate and to hold the respective substrates loaded thereon; A lower plate that corresponds to the upper plate and supports the other one side of the plurality of side plates supporting the upper plate on both side edge surfaces thereof; And a plurality of stoppers for preventing the substrates respectively loaded on the side plates from falling out to the rear side. The method of claim 1, The non-contact hot press device of the liquid crystal display device, characterized in that a predetermined number of bonded substrates stored in the cassette are spaced apart at a predetermined interval. The method of claim 1, The inflow gas is N ₂ gas non-contact hot press device of the liquid crystal display device. Importing a cassette containing the substrate bonded into the chamber; Injecting a gas into the chamber into which the cassette is loaded and applying a predetermined pressure, The cassette is An upper plate formed on the upper side; A plurality of side plates mounted on both side edges of the upper plate to support the upper plate and to hold the respective substrates loaded thereon; A lower plate that corresponds to the upper plate and supports the other one side of the plurality of side plates supporting the upper plate on both side edge surfaces thereof; And a plurality of stoppers for preventing the substrates respectively loaded on the side plates from falling out to the rear side. The method of claim 4, wherein And a gas having a predetermined pressure and a temperature is introduced through the gas inlet in the gas flowing into the chamber into which the cassette is loaded. The method of claim 4, wherein Non-contact hot press method of the liquid crystal display device, characterized in that N ₂ gas in the step of applying a predetermined pressure by introducing a gas into the chamber into which the cassette is carried.

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