KR100908439B1 - Cleaning sheet for probe - Google Patents

Abstract

The present invention relates to a cleaning sheet for removing foreign substances of the probe used for semiconductor inspection, and more particularly, the polishing layer 10, the adhesive layer 20, the synthetic resin film layer 30, the adhesive layer 40 and the release paper After laminating (50) in order to form a cleaning sheet 100, the polishing layer 10 is coated with a release paper coated with a compound solution mixed with an abrasive in an amount of 5 to 70 parts by weight with respect to 100 parts by weight of polyurethane resin Since it is dried and cured, the foreign material of the probe can be efficiently removed and the durability of the polishing layer can be increased while suppressing wear and damage of the tip of the probe for semiconductor inspection, thereby providing excellent durability.

Semiconductor, inspection, probe, cleaning, sheet, lamination, polishing layer, polyurethane resin

Description

Cleaning sheet for probe {CLEANING SEAT FOR PROBE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning sheet for a probe for effectively removing foreign matter adhering to the tip of a semiconductor inspection probe used for an electrical characteristic test (inspection) of a semiconductor chip.

In general, in the semiconductor manufacturing process, probes are used to test electrical characteristics of each chip on a semiconductor wiper.

Since the probe transmits an electrical signal by contacting a tip of the semiconductor chip with a pad of the semiconductor chip, the probe inspects good or poor quality of the semiconductor.

Such a probe is an ultra-precision inspection apparatus, and foreign matters of the pad (generally formed of aluminum or aluminum and copper alloy, etc.) are attached to the probe tip during the probe tip contacting with the pad of the chip.

If foreign matters on the pad are attached to the tip of the probe as described above,

It is impossible to accurately measure the electrical characteristics of the semiconductor chip due to poor conduction between the pads or deteriorated electrical contact.

For this reason, the prop tip is required to be repeatedly cleaned during the inspection process of the semiconductor chip, and a cleaning means for this has been disclosed in a number of forms.

For example, the first is to use a ceramic plate that is the same type as the semiconductor wafer, which is cleaned by pressing the probe into the ceramic plate in the same manner as the probing of the semiconductor wafer.

However, in this method, since the tip of the probe is easily cut by the ceramic plate, the life of the probe is shortened, and the tip of the probe is deformed by repeated cleaning, thereby causing a problem in that the probe is deteriorated.

The second is to use a silicone rubber or urethane rubber, which is to remove the foreign material by sticking the tip of the probe to the silicone rubber or urethane rubber.

However, this method caused a problem that new foreign matter was attached to the tip of the probe due to debris such as silicone rubber or urethane rubber, or the tip of the probe was damaged when the probe was stuck.

In addition, during the cleaning process, foreign matter such as aluminum powder accumulates in silicon rubber or urethane rubber, and thus there is a problem that the cleaning ability is easily lowered.

In order to solve the problems of the conventional cleaning means, a cleaning sheet having a polishing layer containing a fine powder abrasive on its surface has been developed and marketed (Nihon Micro Coating Co., Ltd., trade name 'MIPOX').

The cleaning sheet is formed by laminating a polishing layer containing a fine powder abrasive, an impact absorbing elastic layer, a synthetic resin film layer, an adhesive layer, and a release paper in that order.

In this case, a form in which the polishing layer, the synthetic resin film layer, the adhesive layer, and the releasing layer of the sheet, in which the elastic layer of the sheet is excluded may be stacked in this order may also be used.

Such a cleaning sheet separates the release paper and adheres to a substrate such as a silicon wafer by an adhesive layer.

That is, by attaching the cleaning sheet to the substrate in the same shape and size as that of the semiconductor wafer, the foreign matter is removed by pressing the probe tip portion against the surface of the polishing layer of the cleaning sheet by the same operation as the probing of the semiconductor wafer.

The conventional cleaning sheet removes foreign substances while suppressing wear and breakage of the probe tip.

However, the above-mentioned conventional cleaning sheet has a problem such that the durability of the polishing layer is easily dropped due to the abrasive binding force of the polishing layer, and thus, the cleaning efficiency is lowered, thereby causing the wear and damage of the tip of the probe more seriously. .

In addition, since the above-mentioned conventional cleaning sheet uses silicone rubber or urethane rubber (polyurethane) as the elastic layer, the elasticity (cushionability) of the elastic layer is remarkably lowered in a low temperature environment.

Particularly, in a low temperature environment around -30 ° C, the cushioning property of the elastic layer made of silicone rubber or urethane rubber is weakened, and the amount of wear on the tip of the probe is increased during cleaning, and the life of the probe is rapidly decreased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and effectively removes foreign substances in the probe while suppressing wear and damage of the tip of the semiconductor inspection probe used in the electrical characteristic test (inspection) of the semiconductor chip. Of course, the purpose is to increase the service life of the abrasive layer to provide excellent durability.

This invention is

A polishing sheet, an adhesive layer, a synthetic resin film layer, an adhesive layer and a release paper are laminated to form a cleaning sheet,

The polishing layer is achieved by coating a release solution of a pound-melt solution mixed with an abrasive in an amount of 5 to 70 parts by weight with respect to 100 parts by weight of a polyurethane resin formed by reacting a polyester polyol and a polyisocyanate, followed by drying and curing. .

The polyurethane resin of the present invention is characterized by being formed by further reacting a polyisocyanate to a mixture of a polyester polyol and a polyether polyol.

The polyester polyol of the present invention is characterized by being formed by the reaction of adipic acid with ethanediol or 1,4-butanediol or a mixture thereof.

The abrasive of the present invention is characterized by being formed of zirconium oxide or silicon carbide having a particle diameter of 1.0 to 5.0 μm.

The compound solution in which the polyurethane resin and the abrasive of the present invention are mixed and melted is characterized by adding 1 to 30 parts by weight of a polyurethane toner to impart color.

The present invention effectively removes foreign substances in the probe while suppressing abrasion and breakage of the tip of the semiconductor inspection probe used for the electrical characteristic test (inspection) of the semiconductor chip by the abrasive layer formed by mixing the polyurethane resin and the abrasive. Since the binding strength of the polishing layer is excellent and its service life is increased, it has an effect of providing excellent durability.

As shown in FIG. 1, the cleaning sheet 100 of the present invention has a structure in which an abrasive layer 10, an adhesive layer 20, a synthetic resin film layer 30, an adhesive layer 40, and a release paper 50 are sequentially stacked. Is done.

The polishing layer 10 is obtained by coating a compound solution in which an abrasive is mixed in an amount of 5 to 70 parts by weight with respect to 100 parts by weight of a polyurethane resin on a release paper, and then drying and curing.

At this time, when the abrasive is mixed in an amount of less than 5 parts by weight, the polishing efficiency is significantly lowered. When the abrasive is mixed in an amount of more than 70 parts by weight, the amount of the polyurethane resin which aggregates the abrasive is too small and the binding property is poor, so that the abrasive is separated during use. It is preferable to mix in an amount of 5 to 70 parts by weight since it causes a problem of lowering durability.

The polyurethane resin is solution polymerized to binder the abrasive to strongly bind the abrasive and form a coating film. The raw material is a polyester polyol and a polyisocyanate, or a mixture of polyester polyol and polyether polyol. It is obtained by making a polyisocyanate react.

At this time, the polyester polyol is obtained by the reaction of adipic acid with ethanediol or 1,4-butanediol or a mixture thereof.

And the abrasive is to use a zirconium oxide or silicon carbide having a particle diameter of 1.0 ~ 5.0㎛.

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The abrasive may have a different particle size depending on the material of the tip of the probe, but since the particle diameter is formed to be 1.0 μm or more, foreign matter can be effectively removed from the tip of the probe, and formed to be 5.0 μm or less to minimize breakage and wear of the probe tip. It becomes possible.

Preferably, the polishing layer 10 has a thickness of 45 to 60 µm, but is formed to be 45 µm or more, thereby enabling repeated cleaning of the probe, and of course, to 60 µm or less. It can be minimized.

In addition, the compound solution in which the polyurethane resin and the abrasive are mixed may further include 1 to 30 parts by weight of a polyurethane-based toner, thereby providing color.

In this case, when the polyurethane-based toner is mixed in excess of 30 parts by weight, it is preferable to include 1 to 30 parts by weight because polishing efficiency is lowered.

The synthetic resin film layer 30 is, for example, preferably a polyimide resin film, a thermoplastic polyester vertical film, and the like, which is adhesively formed to be laminated on the polishing layer 10 by an adhesive forming an adhesive layer 20.

The synthetic resin film layer 30 is to effectively form the adhesive layer 40 for the adhesive use of the lower thickness is preferably 70 ~ 80㎛.

The adhesive layer 40 is used to bond the cleaning sheet 100 to a substrate, and the like, but may be variously used as a thermoplastic resin adhesive, a rubber adhesive, or a mixed adhesive thereof, and the synthetic resin film 30 may be firmly adhered to the substrate. It is desirable to choose what is there.

The thickness of the adhesive layer 40 is preferably formed to 20 ~ 30㎛, because the thickness of the adhesive layer is formed to 20㎛ or more can increase the adhesive strength, it is formed below 30㎛ can reduce the non-uniformity of the cleaning sheet Will be.

In addition, the release paper 50 is protected by covering the adhesive layer 40.

The present invention is a semiconductor using a semiconductor inspection probe after fixing the cleaning sheet 100 to the substrate (silicon wafer, ceramic plate, metal plate, etc.) by the adhesive layer 40 in the state that the release paper 50 is separated The foreign material is removed while pressing the probe tip portion to the polishing layer 10 of the upper layer of the sheet using a wafer inspection process.

Furthermore, since the polishing layer 10 provides an excellent binding force by the polyurethane resin, the polishing layer 10 is excellent in durability while being prevented from being released during use.

In addition, according to the present invention, the cleaning of the semiconductor chip in a low temperature environment of -30 ° C as well as high temperature is effectively provided.

Example 1

A polyester polyol (molecular weight 1,500) prepared by the reaction of ethylene glycol and adipic acid was reacted with 4,4'-diphenylmethane diisocyanate in a solvent of MEK and DMF to obtain a polyurethane viscous liquid (solid content 30%, viscosity 45,000 cps). )

Then, 35 parts by weight of zirconium oxide (3 μm in diameter) was added to 100 parts by weight of the polyurethane resin solution, and the compounded compound solution was coated on a release paper, followed by drying to obtain an abrasive layer (thickness of 50 μm).

In addition, coating a polyurethane resin (65% solids, viscosity 40,000 cps) for adhesion on a separate synthetic resin film layer (thickness 75㎛), dried at 70 ~ 80 ℃ 2 minutes and then laminated with the polishing layer, the synthetic resin film layer After the adhesive was attached to the bottom of the cover to release paper to protect the adhesive was completed the cleaning sheet.

After cleaning the adhesive sheet, the adhesive sheet was attached to the silicon wafer (diameter 296mm), and thus the tip of the probe was cleaned in a low temperature environment of -30 ° C. As a result, the cleaning layer was also provided with excellent durability. .

Comparative Example 1

1,4-butylene adipate (molecular weight 1,500) and 4,4'-diphenylmethane diisocyanate were reacted with a solvent of MEK and DMF in a polyurethane viscous liquid (solid content 30%, viscosity 40,000 cps) 30 weight part of particle diameters were added, and the compound compounded was coated on a release paper, and then dried to obtain an abrasive layer (thickness: 55 μm).

And laminating the polishing layer on the synthetic resin film layer (thickness 75㎛) coated with acrylic resin adhesive, and after bonding the adhesive on the bottom of the synthetic resin film layer to cover the release paper to protect the adhesive to complete the cleaning sheet.

The cleaning sheet removes the adhesive release paper, and then attaches the adhesive surface to the silicon wafer (296 mm in diameter) to clean the tip of the probe in a low temperature environment of -30 ° C. The problem was compromised.

1 is a cross-sectional view of the present invention cleaning sheet.

** Description of the symbols for the main parts of the drawings **

10: abrasive layer 20: adhesive layer

30: synthetic resin film layer 40: adhesive layer

50: release paper 100: cleaning sheet

Claims (5)

The synthetic resin film layer 30 bonded to the lower portion of the polishing layer 10 by the adhesive layer 20 is disposed, and the adhesive layer 40 and the adhesive layer 40 are protected under the synthetic resin film layer 30. In the cleaning sheet 100 which arranged the release paper 50 one by one, The polishing layer 10 is coated with a release paper coated with a pound solution of a molten abrasive in an amount of 5 to 70 parts by weight based on 100 parts by weight of a polyurethane resin formed by reacting a polyester polyol and a polyisocyanate, and then dried and cured. Cleaning sheet for probe, characterized in that. The method of claim 1, The polyurethane resin is a cleaning sheet for a probe, characterized in that formed by further reacting a polyisocyanate to a mixture of polyester polyol and polyether polyol. The method according to claim 1 or 2, The polyester polyol is a cleaning sheet for a probe, characterized in that formed by the reaction of ethanediol or 1,4-butanediol or a mixture thereof and adipic acid. The method of claim 1, The abrasive is a cleaning sheet for probes, characterized in that the zirconium oxide or silicon carbide having a particle diameter of 1.0 ~ 5.0㎛. The method of claim 1, A cleaning sheet for a probe, wherein the compound solution obtained by mixing and melting the polyurethane resin and the abrasive is formed by further comprising 1 to 30 parts by weight of a polyurethane-based toner.

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