KR100897852B1 - Apparatus for processing substrates - Google Patents

Abstract

The substrate processing apparatus includes a mounting portion, a first transfer portion, a second transfer portion, and a substrate processing portion. The stacker stacks cassettes containing a plurality of substrates in multiple layers. The first transfer unit transfers each of the cassettes loaded in the loading unit. The second conveying portion conveys each of the substrates accommodated in the cassette conveyed by the first conveying portion. The substrate treating portion processes the surface of each of the substrates conveyed by the second conveying portion. Therefore, the space for stacking the cassette can be reduced, and the transport distance between the cassette and the substrate can be shortened to improve productivity.

Description

Substrate Processing Unit {APPARATUS FOR PROCESSING SUBSTRATES}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for treating a surface of a substrate for manufacturing a semiconductor device.

Generally, semiconductor devices are fabricated from semiconductor substrates such as silicon based wafers. Specifically, the semiconductor device is manufactured including a deposition process, a polishing process, a photolithography process, an etching process, an ion implantation process, a cleaning process, an inspection process, and the like using the semiconductor substrate.

In order to proceed with the above processes, basically, a loading unit for loading the semiconductor substrate for carrying out the processes, a substrate processing unit for carrying out the processes substantially, and transferring the semiconductor substrate between the loading unit and the substrate processing unit. There is a need for a substrate processing apparatus including a transfer section.

In this case, in order to allow the semiconductor substrates to proceed at a time by a predetermined number, the semiconductor substrates are stacked in a single layer on the stacking unit by a cassette in which the predetermined number of semiconductor substrates are bundled.

Thus, in order to improve the efficiency of the processes, the substrate processing apparatus further includes a standby unit for waiting to receive the cassette from the loading unit and a separation unit for separating the semiconductor substrates from the cassette. That is, the transfer part includes a first transfer part for transferring the cassette from the loading part to the standby part, a second transfer part for transferring the cassette from the standby part to the separation part, and a third transfer part for transferring the semiconductor substrates from the separation part. It includes.

However, when the plurality of cassettes are stacked in the stacking unit in a single layer, the transfer unit includes the first, second and third transfer units, thereby increasing the overall installation area of the substrate processing apparatus and increasing the transfer distance of the transfer unit. It has a long problem.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of improving productivity by shortening the overall transfer distance while reducing the installation area by changing the cassette stacking method. .

In order to achieve the above object of the present invention, a substrate processing apparatus according to one feature includes a loading portion, a first transfer portion, a second transfer portion, and a substrate processing portion. The stacker stacks cassettes containing a plurality of substrates in multiple layers. The first transfer unit transfers each of the cassettes loaded in the loading unit. The second transfer unit transfers each of the substrates accommodated in the cassette transferred by the first transfer unit. The substrate processing unit processes a surface of each of the substrates transferred by the second transfer unit.

The stacking unit includes a frame and a space forming unit installed inside the frame and forming a space for stacking the cassettes in a plurality of layers.

The first transfer unit is a holder for holding the cassette, a transfer arm connected to the holder to transfer the holder in a horizontal direction and a lift connected to the transfer arm to lift the transfer arm and the holder in a vertical direction. Include.

Meanwhile, the substrate processing unit includes a plurality of processing tanks disposed along at least two first and second rows and accommodating chemicals for processing the substrates by dipping therein.

Accordingly, the substrate processing apparatus may further include a third transfer unit configured to transfer the substrates dipped in the processing tank of the first row to the processing tank of the second row. Thus, the substrate processing apparatus may further include an accommodation unit installed in a section in which the third transfer unit is transferred to accommodate chemicals falling from the substrates. Alternatively, the third transfer unit may transfer the processing tank of the first row directly to the processing tank of the second row while the substrates are dipped.

According to such a substrate processing apparatus, the mounting area for installing a substrate processing apparatus can be reduced by loading the cassette which makes a bundle several board | substrate into a loading part in multiple layers.

In addition, the transfer distance can be shortened by transferring the cassettes loaded in the stacking portion to the substrate processing portion only through the first and second transfer portions. That is, the overall productivity of the substrate processing apparatus can be improved.

Hereinafter, a substrate processing apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a view illustrating a stacking portion of the substrate processing apparatus shown in FIG. 1, and FIG. 3 is a side view of the stacking portion of FIG. 2. It is a figure which added the 1st conveyance part of the substrate processing apparatus shown in FIG. 1 to the shape seen.

1, 2, and 3, the substrate processing apparatus 1000 according to an exemplary embodiment of the present invention includes a loading unit 100, a first transfer unit 200, and a substrate processing unit 300.

In the stacking unit 100, a cassette 20 for accommodating a plurality of substrates 10 for manufacturing a semiconductor device as a bundle is loaded. For example, about 25 sheets or about 50 sheets of the substrates 10 may be loaded in the cassette 20.

The cassettes 20 are stacked in a plurality of layers in the stacking portion 100. To this end, the stacking unit 100 is a frame 110 that provides an outer frame and a space that is installed in a substantially matrix shape inside the frame 110 to form spaces for stacking the cassettes 20 in multiple layers. The forming unit 120 is included. That is, the cassette 20 is seated in the space forming part 120.

The space forming unit 120 has an open structure so that the surface facing the first transfer unit 200 may be smoothly loaded or taken out of the cassette 20. Since the cassette 20 generally has a block shape, the space forming unit 120 may form a block shape larger than the size of the cassette 20.

The stacking unit 100 includes a cassette loading region LA in which the cassettes 20 that bundle the substrate 10 to be processed from the substrate processing unit 300 are loaded, and from the substrate processing unit 300. The cassette unloading area ULA and the cassette loading area LA or the cassette unloading area ULA on which the cassettes 20 that bundle the processed substrate 10 are loaded cannot be loaded. It is divided into a storage area KA for loading the cassettes 20. The storage area KA may be formed between the cassette loading area LA and the cassette unloading area ULA for convenience of work.

Therefore, by stacking the cassette 20 in which the plurality of substrates 10 are bundled in the stacking unit 100 in multiple layers, the area for installing the stacking unit 100 can be reduced. That is, the overall installation area of the substrate processing apparatus 1000 including the loading part 100 may be reduced.

The first transfer part 200 transfers each of the cassettes 20 loaded on the loading part 100. The first conveying part 200 is formed along these to carry out the cassette 20 from the cassette loading area LA, the cassette unloading area ULA, and the storage area KA.

Accordingly, the first transfer unit 200 may transfer the cassette 20 loaded at any position of the loading unit 100 to another position of the loading unit 100 to be loaded. For example, the transfer of the first transfer part 200 may substantially progress from the cassette loading area LA and the cassette unloading area ULA to the storage area KA or from the storage area KA. It may proceed to the cassette loading area LA and the cassette unloading area ULA.

In addition, the first transfer part 200 is also configured to be able to transfer in the vertical direction in order to transfer all of the cassettes 20 stacked in a multi-layer on the stacking portion 100. That is, the first transfer part 200 includes a holder 210, a transfer arm 220, a lift 230, and a transfer body 240.

The holder 210 grips the cassette 20 from above. In this case, the holder 210 may be hooked with the cassette 20. Alternatively, the holder 210 may be coupled to the cassette 20 by a magnetic force applied from the outside. In this case, by using the electromagnetic force generated through the electricity applied from the outside as the magnetic force, it is possible to electrically and easily control the holding of the holder 210 the cassette (20). On the other hand, the holder 210 may have a blade structure that can be gripped while supporting the lower portion of the cassette (20).

The transfer arm 220 is connected to the holder 210 to transfer the holder 210 along the horizontal direction. The lift 230 is connected to the transfer arm 220 to elevate the transfer arm 220 and the holder 210 along a vertical direction.

The transfer body 240 is connected to the lift 230 to support the lift 230, the transfer arm 220, and the holder 210 connected thereto. In addition, the transfer body 240 applies a driving signal and a driving force for the movement of the transfer arm 220, the lift 230 and the holder 210. Thus, the first transfer part 200 to move along the cassette loading area LA, the cassette unloading area ULA, and the storage area KA under the transfer body 240. It may further include a rail 250 installed below.

Meanwhile, the substrate processing apparatus 1000 transfers the substrate 10 to the substrate processing unit 300 while separating the substrate 10 from the cassettes 20 transferred by the first transfer unit 200. It further comprises a second transfer unit 400 for.

The second transfer part 400 may allow the substrate 10 to easily surface-treat the substrate 10 in the substrate processor 300, or may surface-treat the substrate 10 in the substrate processor 300. The substrate 10 may be inverted to mirror the surface of the substrate 10 in order to properly load the cassette 20.

The substrate processing unit 300 substantially treats the surface of the substrate 10 transferred by the second transfer unit 400. In detail, the substrate processing unit 300 processes the surface of the substrate 10 through chemicals. The chemical may include, for example, sulfuric acid (H 2 SO 4), hydrochloric acid (HCl), hydrofluoric acid (HF), hydrogen peroxide solution (H 2 O 2), deionized water (H 2 O), and the like.

Therefore, since the operation of transferring from the mounting part 100 to the substrate processing part 300 is performed only through the first and second transfer parts 200 and 400, the transfer distance can be shortened. As a result, the overall productivity of the substrate processing apparatus 1000 can be improved.

The substrate processing unit 300 includes processing tanks 310 disposed along at least two first and second rows L1 and L2 and filled with the chemicals. The substrate 10 is substantially processed by dipping into the treatment tanks 310.

On the other hand, the substrate processing apparatus 1000 is installed between the first and second rows (L1, L2), the substrate 10 is dipped in the processing tank 310, each of the processing tank 310 It further comprises a third transfer unit 500 for transferring to. The third transfer part 500 transfers the substrate 10 in opposite directions in the first and second rows L1 and L2, respectively.

For example, the third transfer part 500 receives the substrate 10 from the second transfer part 400 in the first row L1 on the first side and moves to the second side opposite to the first side. Transfer. On the contrary, the third transfer part 500 receives the substrate 10 from the processing tank 310 disposed on the second side in the second row L2 and transfers the substrate 10 to the first side to transfer the second transfer part. Export to 400.

At this time, the substrate processing apparatus 1000 arranges the substrate 10 on the second side of the second row L2 from the processing tank 310 disposed on the second side of the first row L1. It further comprises a fourth transfer unit 600 for transferring to the processing tank 310. The fourth transfer part 600 substantially directly transfers the processing tank 310 disposed on the second side of the first row L1 to the second row L2 while the substrate 10 is dipped. Can be transferred to the second side of the.

In this case, when the fourth transfer part 600 transfers the substrate 10 from the first row L1 to the second row L2, the chemical filled in the processing tank 310 leaks. It can be prevented at the source. In addition, an operation of transferring the substrate 10 in each of the first and second columns L1 and L2, and transferring the substrate 10 from the first column L1 to the second column L2. By configuring the operation separately, the substrate processing unit 300 can proceed with the transfer of the substrate 10 more efficiently.

4 is a schematic diagram illustrating a substrate processing apparatus according to another embodiment of the present invention.

In the present embodiment, the same reference numerals are used since they may be the same as those shown in FIGS. 1, 2 and 3 except for the configuration of transferring the substrates from the first row to the second row of the substrate processing unit. Duplicate detailed descriptions will be omitted.

Referring to FIG. 4, the substrate processing apparatus 1100 according to another exemplary embodiment of the present disclosure may be integrated into one in order to transfer the substrates 10 in the first and second rows L1 and L2 of the substrate processing unit 700. The fifth transfer unit 800 is included.

That is, the fifth transfer part 800 is configured to have a “U” shape in the inner side along the first and second rows L1 and L2. The fifth transfer part 800 transfers the substrate 10 from the first side close to the second transfer part 400 to the second side along the first row L1, and immediately after the second row L2. Turn to the second side of and transfer to the first side again.

As such, by installing the fifth transfer part 800 inside the first and second rows L1 and L2 of the substrate processing part 700, an increase in the installation area due to the installation of the fifth transfer part 800 is achieved. Can be prevented.

In this case, the fifth transfer unit 800 may directly transfer the processing tank 710 of the substrate processing unit 700, but in this case, a separate space for transferring the processing tank 710 is required. Only the substrate 10 can be transferred.

In this case, since the chemical deposited from the dipping of the substrate 10 may fall in the section in which the fifth transfer part 800 transfers the first row L1 from the first row L1 to the second row L2, the substrate processing apparatus ( The 1100 may further include a receiving unit 900 for receiving a chemical that may be separated from the substrates 10 in the transfer section.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

The present invention described above has a stacking portion on which a plurality of substrates in a stack are stacked, while stacking the cassettes in multiple layers in a substrate processing apparatus for treating the surfaces of the substrates, thereby minimizing an installation area of the substrate processing apparatus. It can be used to

1 is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a mounting portion of the substrate processing apparatus shown in FIG. 1.

3 is a view in which the first transfer part of the substrate processing apparatus shown in FIG. 1 is added to the shape of the loading part of FIG.

4 is a schematic diagram illustrating a substrate processing apparatus according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10 substrate 20 cassette

100: loading part 200: first transfer part

300: substrate processing unit 400: second transfer unit

500: third transfer unit 600: fourth transfer unit

800: fifth transfer portion 900: receiving portion

1000: Substrate Processing Unit

Claims (7)

Stacking unit 100 for stacking the cassettes 20 for receiving a plurality of substrates 10 in a multi-layer A first transfer part 200 for transferring each of the cassettes 20 stacked on the stacking part 100; A second transfer part 400 for transferring each of the substrates 10 accommodated in the cassette 20 transferred by the first transfer part 200; The surface of each of the substrates 10 transferred by the second transfer part 400 is processed, and is disposed along at least two first and second rows L1 and L2 to move the substrates 10 therein. A substrate processing unit 300 having a plurality of processing tanks 310 in which chemicals for processing by dipping are accommodated; And And a third transfer part (600) for transferring the processing tank (310) of the first row (L1) directly to the second row (L2) in a state in which the substrates (10) are dipped. The method of claim 1, wherein the stacking portion 100 Frame 110; And And a space forming unit (120) installed inside the frame (110) and forming a space for stacking the cassettes (20) in a plurality of layers. The method of claim 1, wherein the first transfer unit 200 A holder 210 for holding the cassette 20; A transfer arm 220 connected with the holder 210 to transfer the holder 210 along a horizontal direction; And And a lift 230 connected to the transfer arm 220 for elevating the transfer arm 220 and the holder 210 along a vertical direction. delete delete delete delete

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