KR100875838B1 - Apparatus for controlling the temperature of test jig - Google Patents

Abstract

A test jig temperature control device is provided to cool or heat a test jig to a required temperature in a short time and control the temperature precisely. A test jig(30) has a securing part(32) for securing a semiconductor wafer thereon. A compression type cooling unit(20) has first and second connection pipes(26.28) connected to the test jig for cooling the test jig primarily. A heat exchange unit(40) is mounted in the test jig to contact a lower part of the securing part and connected t to the connection pipes. The heat exchange unit cools the securing part secondarily or heat the securing part. A control part(70) is connected to the compression type cooling unit and the heat exchange unit electrically for keeping the securing part at a required temperature.

Description

Apparatus for controlling the temperature of test jig}

The present invention relates to a temperature control apparatus in a semiconductor manufacturing process, and more particularly, to a test jig temperature control apparatus for rapidly cooling or heating a test jig for testing a temperature of an object in a semiconductor manufacturing process.

In general, in order to produce semiconductor devices or chips, various processes are repeatedly performed step by step. In the various semiconductor processes, the semiconductor devices or chips are tested whether they are normally operated under various temperature conditions. In order to perform the test, a test is performed by applying a temperature change while a wafer on which a semiconductor device or chips are formed is placed on a sealed test jig, and a representative process is an EDS process. A plurality of semiconductor chips are formed on the wafer through a deposition process, a photo process, an etching process, and an ion implantation process. When a plurality of semiconductor chips are formed on such a wafer, an EDS process is performed to select electrically operated semiconductor chips and defective semiconductor chips by performing electrical property inspection of each semiconductor chip. The EDS process repairs a defective semiconductor chip, and the non-repairable semiconductor chips are disposed of at an early stage, thereby reducing the time and cost for a later package process and package inspection. In addition, to analyze the initial failure of the semiconductor chip to stabilize the overall manufacturing process of the semiconductor device.

The wafer on which the semiconductor chip is formed is tested under a constant temperature condition in a probe chuck (test jig), wherein the chuck is subjected to a high temperature test at about 100 to 150 ° C., a room temperature test at about 25 to 35 ° C., Reliability is measured by performing a low temperature test at about 40 ° C.

Figure 1 illustrates an example of a conventional EDS thermostat device.

As shown in the probe chuck 10, an aluminum plate 12 is installed in which a wafer to be tested is placed on an upper portion thereof, and a heater 14 for supplying heat to the SUS plate 13 and the aluminum plate at a lower portion thereof. Is installed above the base 15. Meanwhile, a cooling passage 11 through which a refrigerant circulates is formed in the aluminum plate 12. Therefore, during the high temperature test, the heater 14 is operated to heat the aluminum plate 12. In the low temperature test, the low temperature cooler 1 is operated to supply the cooled refrigerant into the probe chuck 10, and the cooling is performed. The refrigerant passes through the cooling passage 11 to cool the aluminum plate 12.

Meanwhile, the low temperature cooler 1 includes a low temperature cooler 2, a low temperature liquid circulation device 3, and a water removing device 4. The low temperature cooling device 2 includes a compressor for compressing a gaseous refrigerant at high temperature and high pressure, a condenser for releasing heat from the gaseous refrigerant at high temperature and high pressure to liquefy it into a medium temperature high pressure refrigerant, and the liquid. In order to facilitate vaporization of the refrigerant, an expansion device for reducing the pressure while converting to a spray form and an evaporator for vaporizing the sprayed liquid refrigerant into gaseous refrigerant while absorbing ambient heat is average. The low temperature liquid circulation device 3 includes a reservoir for temporarily storing the cooled low temperature liquid (antifreeze), and a pump for supplying the low temperature liquid stored in the reservoir to the probe chuck 10. do.

On the other hand, when the industrial cooling temperature is required to achieve a very low temperature of less than -30 ℃, when the cooling system is configured using a general compression refrigeration cycle, the pressure range is also very wide due to the wide temperature range between the room temperature and the cooling temperature As a result, the pressure ratio to be performed by the compressor becomes very large, and thus, the performance of the cooling system becomes very low.

In order to solve this problem, it is common to use a cooling system that combines two or more refrigeration cycles operating continuously, and the refrigeration system implemented in this way is a multi-stage compressed refrigeration system, cascade refrigeration system, etc. There is this.

As shown in FIG. 2, the cascade refrigeration system has a heat exchanger installed between two refrigeration cycles, and the cascade condenser serves as an evaporator for an upper cycle on the right side and a condenser for a lower cycle on the left side. do. That is, the refrigerator is divided into a low temperature and a high temperature, and the condenser of the low temperature freezer is configured to serve as an evaporator of the high temperature freezer. The two cycles of refrigerants flow in the heat exchanger facing each other.

On the other hand, multi-stage compression refrigeration system as shown in FIG. 3 is to replace the heat exchanger installed between the chambers (Cascade condenser 1, 2) when the working fluids used in the cascade refrigeration system is the same fluid and only the gas flows into the upper cycle Gas-liquid separator is installed.

As described above, the cryogenic refrigeration apparatus using the multi-stage refrigeration cycle is required to rapidly change the temperature of the probe chuck from high temperature to low temperature or from low temperature to high temperature for production efficiency in the semiconductor manufacturing process, and to cool more quickly. This is because it is necessary to circulate a refrigerant (low temperature liquid) at a temperature lower than the temperature at which the temperature becomes.

The compression refrigeration cycle as described above has the advantage of high cooling efficiency, but it is necessary to install various devices such as a compressor, an evaporator, a heat exchanger, a condenser, and thus the installation space and the size of the device are large, the noise vibration is large, and the precise temperature is also high. Not only is it difficult to adjust, but there is a problem that costs a lot of maintenance and repair. In addition, there is a problem that the cooling flow path structure for cooling the aluminum plate inside the probe chuck, the heater structure for heating is not easy to maintain the surface temperature uniformity (uniformity) of the probe chuck, the cooling device and the heater is a separate control device Since it is controlled by, there was a difficulty in precise temperature control.

On the other hand, unlike a compression refrigeration cycle there is a cooling system using a thermoelectric module as a cooling system that does not use a refrigerant. The cooling system using the thermoelectric module refers to a solid heat pump using the cooling effect exhibited by the Peltier effect. A thermoelectric module having an n-type and p-type thermoelectric semiconductor connected between two ceramic insulator plates is used. The application of a current to a thermoelectric module takes advantage of the thermoelectric effect of temperature differences between the two sides of a thermoelectric module. That is, when current is applied to n-type and p-type thermoconductors, the endothermic phenomenon occurs as electrons absorbing thermal energy from the surroundings move to the inside of the thermoconductor at the negative contact, and at the positive contact, heat is generated by the release of the heat energy of the electron. The phenomenon occurs, so that the thermoelectric module can function as a cooling system or a heat pump.

Cooling system using the thermoelectric module as described above can be implemented in a small size, there is no noise and vibration, easy to fine temperature control and low maintenance costs, but the cooling system consisting of thermoelectric modules only multi-stage compression type cooling Compared to the system, the cooling efficiency is relatively low, and the temperature difference between the room temperature is very large, so it is difficult to implement the cryogenic temperature in a single configuration.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object thereof is to provide a test jig temperature control device having a simple structure and a small size in cooling or heating a test jig. It is another object of the present invention to provide a test jig thermostat for quickly and precisely controlling the cooling or heating of the test jig to the required temperature.

The test jig temperature control apparatus according to the present invention for achieving the above object, the test jig having a seating portion on which the semiconductor wafer is seated; A compression cooling device connected to the connection pipes for supplying and recovering the refrigerant to the test jig to cool the test jig firstly; It is installed inside the test jig to contact the lower part of the seating portion, and is connected to the connecting pipes to cool the seating portion of the test jig by using the refrigerant supplied from the compressed cooling device to secondary and also to seat the test jig. A heat exchanger for heating the unit; And a controller electrically connected to the compressed cooling device and the heat exchanger to maintain the seating portion of the probe at a required temperature.

The heat exchange device, the thermoelectric module unit is installed so that one side is in contact with the lower surface of the seating portion and includes a plurality of thermoelectric elements; And installed in contact with the other side of the thermoelectric module unit, connected by the compression cooling device, the first connection pipe, and the second connection pipe to exchange refrigerant, and the refrigerant supplied from the compression cooling device and the thermoelectric module. And a heat exchanger for directly exchanging heat.

The compression type cooling apparatus includes a compressor for compressing a gaseous refrigerant at a high temperature and high pressure; A condenser releasing heat from the high temperature and high pressure gas refrigerant compressed by the compressor to liquefy it into a medium temperature and high pressure liquid refrigerant; An expansion valve connected to the first connection pipe and configured to lower the pressure while converting it into a spray form to facilitate vaporization of the liquid refrigerant condensed by the condenser; And a liquid separator connected to the second connecting pipe and separating the gaseous liquid refrigerant from the heat exchanger so that only the gas refrigerant flows into the compressor.

The heat exchange unit may include a body having a closed structure having an inlet through which a first connector is connected to the refrigerant and an outlet through which the refrigerant is discharged by being connected with the second connector; And a plurality of aluminum thin plates in the form of a plate that are installed to be bonded to the inner surface of the body to maximize a heat exchange surface area with the refrigerant passing through the body, and through the expansion valve into the body through the first connection pipe. The introduced refrigerant is vaporized into a gas refrigerant while absorbing ambient heat inside the body, and the gas refrigerant is heat-exchanged by the aluminum thin plate and is transferred to the other side of the thermoelectric module part through an outer surface of the heat exchange part.

On the other hand, the seating unit and the heat exchanger are each provided with a temperature sensor electrically connected to the control unit, the control unit controls to apply an appropriate current to the thermoelectric element by using the temperature information received from the temperature sensor.

According to the present invention, in the semiconductor EDS process, by combining the compression type cooling device and the heat exchanger including the thermoelectric module to cool the secondary, there is an effect of rapidly realizing a cryogenic temperature of -40 ° C or lower. In addition, since only a small capacity compression device is used without using a low temperature liquid (antifreeze) circulator as compared to the existing cooling system, it is possible to reduce the maintenance cost while simplifying and miniaturizing the structure of the cooling system. And, by eliminating the heat exchange medium containing a conventional antifreeze to improve the reaction rate of cooling and heating, it has the advantage of reducing the amount of heat lost.

In addition, by installing the heat exchanger including the thermoelectric module in direct contact with the mounting portion to be cooled or heated to cool or heat, it is possible to maintain the temperature uniformity. In addition, since the thermoelectric module can be used as a heater and cooling and heating can be controlled by one control device, the control and reliability can be improved. In addition, fine temperature control is possible due to the characteristics of the thermoelectric module, and a temperature sensor is installed in the seating portion where the heat exchanger and the semiconductor wafer are seated, and thus, the temperature of the mounting portion can be accurately controlled.

The above objects, features and other advantages of the present invention will become more apparent by describing the preferred embodiments of the present invention in detail with reference to the accompanying drawings. Hereinafter, a test jig temperature control apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, an example of a test jig is an example of a probe chuck in a semiconductor EDS process, but the scope of the present invention is not necessarily limited thereto.

Referring to FIG. 4, the temperature control device includes a heat exchanger 40, a compression cooling device 20, and a controller 70 installed inside the probe chuck 30.

The probe chuck 30 is provided with a seating portion 32 in which the semiconductor wafer under test is seated thereon. As described above, during the EDS process, the semiconductor wafer is mounted on the seating portion 32 to perform high temperature, room temperature, and low temperature tests. The material and the shape of the seating part 32 preferably have a plate shape made of aluminum having good thermal conductivity. Therefore, in the present embodiment, the seating portion will be described with an example of an aluminum plate.

The compression type cooling device 20 is connected to the probe chuck 30 by the first connecting pipe 26 and the second connecting pipe 28 for supplying and recovering the refrigerant, and primarily inside the probe chuck 30. Cooling serves. As shown, the compression type cooling device 20 includes a compressor 21 for compressing a gaseous refrigerant at high temperature and high pressure, and releasing heat from the compressed high temperature and high pressure gas refrigerant to liquefy it into a medium temperature high pressure liquid refrigerant. Condenser 22 and expansion valve 23 for reducing the pressure while converting to a spray form to facilitate the vaporization of the condensed liquid refrigerant. The expansion valve 23 is connected to the first connecting pipe 26, and the refrigerant passing through the expansion valve 23 flows into the heat exchanger device 40 inside the probe chuck 30 through the first connecting pipe 26. do. Meanwhile, a liquid separator 24 connected to the second connection pipe 28 is installed in front of the compressor 21 to separate the gaseous refrigerant from the heat exchanger 40 so that only the gas refrigerant is transferred to the compressor 21. Let it in.

The heat exchanger 40 is installed inside the probe chuck to contact the lower portion of the aluminum plate 32. The heat exchanger 40 is connected by the compression cooling device 20, the first connection pipe 26, and the second connection pipe 28, by using the refrigerant supplied from the compression cooling device 20. It serves to cool the aluminum plate 32 of the chuck 30 secondly. In addition, the heat exchanger 40 not only cools the aluminum plate 32 but also serves as a heater for heating the aluminum plate 32. The heat exchanger 40 includes a thermoelectric module unit 60 installed at one side thereof in contact with a lower portion of the aluminum plate 32 and a heat exchanger unit 50 installed at the other side of the thermoelectric module unit 60.

The thermoelectric module unit 60 is provided with a plurality of thermoelectric elements to absorb or radiate heat through both sides by switching the polarity of the power supplied from the power supply unit 80 under the control of the controller 70. A thermoelectric module is an electronic component that can directly convert thermal energy into electrical energy or electrical energy into thermal energy. The thermoelectric module reverses the thermoelectric direction according to the control of the polarity of the supplied power, thereby allowing the functional conversion of the cooling or heating furnace to absorb heat. Can be moved from the surface to the heat dissipation surface. In addition, precise temperature control of 0.05 ℃ is possible by controlling the supplied voltage or current, and there is no vibration part because there is no driving part to operate the device, and it is used as the thermoelectric characteristics of the thermoelectric semiconductor. It is characterized by no pollution or pollution. In addition, the thermoelectric module has a characteristic of forming a significant temperature deviation between both sides according to the power supplied.

Referring to FIG. 5, the thermoelectric module unit 60 includes a plurality of thermoelectric elements 61 arranged in parallel and a pair of ceramics respectively provided through a plurality of conductors 62 at both ends of the thermoelectric elements 61. And substrates 63 and 64. Referring to the drawings, the principle of the thermoelectric module unit 60 will be described briefly. The thermoelectric module unit 60 has a structure in which a plurality of N-type thermoelectric elements 61a and P-type thermoelectric elements 61b are combined, and a power supply unit 80. When the DC power supplied by the P / C is applied, current flows through the conductor 62, and Peltier, which generates endothermic and exothermic phenomena, in the upper and lower ceramic substrates 63 and 64 according to the flow of the current. The effect will occur. Therefore, the upper ceramic substrate 64 absorbs heat from the aluminum plate 32 loaded thereon and transfers the heat to the lower ceramic substrate 63, thereby cooling the aluminum plate 32. The amount of heat transfer can control the cooling temperature of the aluminum plate 32 by adjusting the DC power applied. On the other hand, if the polarities of the DC power supply are reversed, the endothermic and heat generating directions are reversed.

As described above, the probe chuck temperature control device of the present invention rapidly cools by using the characteristics of the thermoelectric module unit 60 at the same time that the DC power is applied and the instantaneous temperature deviation occurs, and by the fine control by the supplied DC power. Not only this is possible but also precise control over the aluminum plate 32, which is the direct object to be cooled or heated.

The heat exchange part 50 is formed to be in contact with the thermoelectric module part 60 and is directly connected to the compressed cooling device 20 by the first connection pipe 26 and the second connection pipe 28. Referring to FIG. 6, the heat exchange part 50 is connected to the inlet port 55 through which the first connection pipe 26 is connected and the outlet port 56 through which the refrigerant flows out, connected to the second connection pipe 28. The branch includes a closed structure body 52 and an aluminum thin plate 54 installed in contact with the inner surface of the body 52.

The body 52 has a substantially hexahedral shape, and is assembled such that the lower ceramic substrate 63 of the thermoelectric module unit 60 is bonded to at least one of the outer surfaces of the body 52. Body 52 may be manufactured by adjusting the size according to the heat exchange capacity, it is preferable that the body 52 is made of an excellent aluminum alloy. Since the thermoelectric element 61 forms a moving path of heat through the contact surfaces with the ceramic substrates 63 and 64 which are assembly surfaces, when the thermoelectric elements are arranged, the ceramic substrates 63 and 64 are mechanically flat. If the flatness is poor, the heat exchange efficiency is lowered and the assembly load is concentrated on a part of the joint surface, so that the crack or shear stress of the thermoelectric element is concentrated and the ceramic substrates 63 and 64 are destroyed. do. Therefore, in order to bond with the flat ceramic substrates 63 and 64, the outer surface of the body 52 should also be formed as a flat surface, preferably, the surface roughness range is 25 μm or less.

Since the heat exchange part 50 is important to increase the heat transfer efficiency between the refrigerant flowing into the body 52 and the thermoelectric module part 60, the heat exchange rate per unit area should be fast. Therefore, the aluminum thin plate 54 is preferably densely formed in the body in a thin plate shape to maximize the heat exchange surface area with the refrigerant passing through the body 52. Referring to FIGS. 7A and 7B, the aluminum thin plate 54 has a corrugated plate shape in which valleys and floors are regularly formed, and the valleys and floors are brazed to an inner surface of the body 52. It joins by a process. Accordingly, the aluminum thin plate 54 can withstand the assembly pressure and the pressure of the internal circulation fluid (refrigerant), thereby maximizing heat exchange efficiency.

The operation of the heat exchanger 40 will be described in detail with reference to FIGS. 4 and 5 as follows.

First, when the low temperature test is performed after the semiconductor wafer is seated on the aluminum plate 32, the compression cooling apparatus 20 is driven. That is, the refrigerant compressed by the compressor 21 is condensed in the liquid state by the condenser 22, and the condensed refrigerant is converted into the sprayed state by the expansion valve 23. The refrigerant converted into the sprayed state is introduced into the heat exchange part 50 of the heat exchanger 40 through the first connection pipe 26. Since the heat exchanger 50 performs the function of an evaporator, the refrigerant introduced into the heat exchanger 50 is vaporized into a gaseous refrigerant while absorbing the heat around the inside of the body 52 to cool the inside of the body, and the aluminum thin plate 54 Heat transfer by the cooling) to cool the entire body heat exchanger 50 and the thermoelectric module 60 in contact with it. On the other hand, the thermoelectric module unit 60 is cooled because the upper ceramic substrate 64 in contact with the aluminum plate 32 has a heat absorbing function, and the aluminum plate 32 in contact with the aluminum plate 32 is cooled. As described above, the aluminum plate 32 can be rapidly maintained in a low temperature state by the compression cooling device 20 and the heat exchanger 40.

On the other hand, when performing a high temperature test, the compression type cooling device 20 is not driven. In this case, the thermoelectric module unit 60 is reversed in polarity as in the low temperature test so that one side of the thermoelectric module unit 60 is in contact with the aluminum plate 32 to generate heat, and the aluminum plate 32 in contact with the aluminum plate 32 is heated. do.

The control unit 70 is electrically connected to the heat exchanger 40 including the compression cooling device 20 and the thermoelectric module to control the aluminum plate 32 of the probe chuck 30 to the required temperature. That is, the controller 70 is electrically connected to and controls the compressed power supply unit 80 for supplying power to the compression type cooling device 20 and the heat exchanger device 40. In addition, the control unit 70 controls the endothermic or heat generating function by using the polarity switching of the thermoelectric module unit 60. The temperature control of the thermoelectric module unit 60 using the polarity switching of the control unit 70 is disclosed in Korean Patent No. 880419, filed and registered by the present applicant, and a detailed description thereof will be omitted. On the other hand, for accurate temperature control inside the probe chuck 30 is connected to each of the temperature sensors 34 and 57 installed in the aluminum plate 32 and the heat exchanger 50, the control unit 70 is a temperature sensor 34, By using the temperature information received at 57) to control the appropriate power to the thermoelectric module unit 60.

As described above, according to the present invention, since the cooling device and the probe chuck are directly connected without using the low temperature liquid circulation device (pump or reservoir) of the existing cooling system, the device can be simplified and downsized, and the cost reduction is very effective. There is. In addition, by installing a heat exchanger configured to include a thermoelectric module inside the probe chuck has its own cooling capacity, can significantly reduce the refrigeration capacity of the compression type cooling device, it is possible to use a smaller compressor than the conventional have.

In addition, since the heat exchanger performs a heater function, the control unit can control both cooling and heating. In addition, since a temperature sensor is attached to the heat exchanger and the aluminum plate of the heat exchanger, and precise temperature control is possible due to the characteristics of the thermoelectric module, there is an effect of improving reliability in low and high temperature tests.

<Example>

First, in order to maintain the aluminum plate 32 inside the probe chuck 30 at a low temperature (cryogenic temperature) state in order to test the reliability of the semiconductor wafer at a low temperature (cryogenic temperature) state, the controller 70 may use the compression cooling apparatus 20. The primary cooling is performed using the heat sink, and the secondary cooling is performed using the heat exchanger device 40 including the thermoelectric module unit 60. For example, when the aluminum plate 32 is desired to be made at about -50 ° C, the temperature of the heat exchange part 50 which is primarily cooled by the compression cooling device 20 is maintained at -20 ° C, and the thermoelectric module part 60 ), So that the cooling capacity of) is -50 ° C (2 ° C). (In this case, a certain amount of heat loss occurs in the connection pipe and the heat exchange part. As described above, temperature sensors are installed in the heat exchange part and the aluminum plate, respectively. Therefore, the aluminum plate 32 is cooled to about -50 ° C. by the heat exchange part 50 including the compression cooling device 20 and the thermoelectric module part 60. 8 is a graph showing the cooling effect of the temperature control device according to the present invention. As can be seen in the figure, the temperature first cooled by the compression type cooling device 20 is maintained at about -20 ° C, and the cooling capacity is secondarily by the thermoelectric module part 60 adjusted to about -50 ° C. In the cooled state, the temperature of the aluminum plate 32 is maintained at around -50 ° C. The cooling amount of the thermoelectric module unit 60 is adjusted to -50 ° C, but this may be set to a cooling amount less than or more by adjusting the amount of current applied to the thermoelectric module.

When stabilization of the set temperature is required, the controller 70 controls the current supplied to the thermoelectric module unit 60 while driving the compression cooling device 20 to implement temperature stabilization of the aluminum plate 32. To do that.

Meanwhile, when the aluminum plate 32 is to be converted to a room temperature state (25 to 35 ° C.) for a room temperature test, the control unit 70 stops the driving of the compression type cooling device 20, and the thermoelectric module unit 60. By controlling the power supplied to the aluminum plate 32 is finely adjusted to endothermic or heat dissipation.

On the other hand, when the aluminum plate 32 is converted from low temperature to high temperature (100 to 150 ° C.) or high temperature to high temperature for high temperature test, the control unit 70 stops the operation of the compression cooling apparatus 20 and The polarization of the thermoelectric module unit 60 is switched, that is, the side in contact with the aluminum plate 32 generates heat to control the aluminum plate 32.

On the contrary, when the aluminum plate 32 is switched from high temperature to low temperature, the control unit 70 drives the compression cooling device 20 and switches the polarity of the thermoelectric module unit 60, that is, the aluminum plate 32. The side in contact with the endotherm is controlled to cool the aluminum plate (32).

Although preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described specific embodiments. That is, those skilled in the art to which the present invention pertains can make many changes and modifications to the present invention without departing from the spirit and scope of the appended claims, and all such appropriate changes and modifications are possible. Equivalents should be considered to be within the scope of the present invention.

1 to 3 is a configuration diagram of examples of a conventional EDS thermostat,

4 is a configuration of a test jig (probe chuck) temperature control apparatus according to an embodiment of the present invention,

5 is a detailed view of the thermoelectric module unit of FIG. 4;

6 is a detailed view of the heat exchanger of FIG. 4;

7A is a perspective view of the aluminum sheet of FIG. 6,

7B is a schematic cross-sectional view of FIG. 6;

8 is a graph showing the cooling effect of the temperature control device according to the present embodiment.

<Description of Major Symbols in Drawing>

20. Compression chiller 30. Probe chuck (test jig)

32, seat (aluminum plate) 40. Heat exchanger

50. Heat exchanger 52. Body

54. Aluminum sheet 60. Thermoelectric module

70. Control part 34,57. temperature Senser

Claims (8)

A test jig having a mounting portion on which a semiconductor wafer is mounted; A compression cooling device connected to a first connection pipe and a second connection pipe for supplying and recovering refrigerant to the test jig to cool the test jig firstly; It is installed inside the test jig to contact the lower part of the seating part, and is connected to the connection pipes to cool the seating part of the test jig by using the refrigerant supplied from the compression cooling apparatus, or the test jig of the test jig. A heat exchanger for heating the seating portion; And, And a control unit electrically connected to the compressed cooling device and the heat exchanger to maintain the seating portion of the test jig at a required temperature. The heat exchange device may include a thermoelectric module unit including a plurality of thermoelectric elements installed at one side of the bottom surface of the seating part in contact with the bottom surface of the seating part; And a body having a closed structure in which the first connection pipe is connected to the inlet through which the refrigerant is introduced and the second connection pipe is connected to the outlet to allow the refrigerant to flow out, and the outer surface of one side is installed to contact the other side of the plurality of thermoelectric elements. And a heat exchanger having a plurality of aluminum thin plates installed to be bonded to the inner surface of the body, for directly exchanging heat exchange between the refrigerant supplied from the compression type cooling apparatus and the thermoelectric module unit. Thermostat. delete The method of claim 1, wherein the compression cooling device, A compressor for compressing the gaseous refrigerant at high temperature and high pressure; A condenser releasing heat from the high temperature and high pressure gas refrigerant compressed by the compressor to liquefy it into a medium temperature and high pressure liquid refrigerant; An expansion valve connected to the first connection pipe and configured to lower the pressure while converting it into a spray form to facilitate vaporization of the liquid refrigerant condensed by the condenser; And, And a liquid separator connected to the second connection pipe and separating a liquid refrigerant that is not vaporized in the heat exchanger to introduce only a gas refrigerant into the compressor. delete The method of claim 1, The outer surface of the body of the heat exchange part has a hexahedron shape including a first surface and a second surface, and at least one of the first surface and the second surface has a surface roughness range of 25 μm so that the thermoelectric module part can be assembled. Test jig temperature control device, characterized in that formed in the following flat surface. The method of claim 5, wherein The aluminum thin plate has a corrugated plate shape in which valleys and floors are regularly formed, and the valleys and floors are joined to a corresponding inner surface of the first and second surfaces by a brazing bonding process. Test jig thermostat. The method of claim 1, The seating unit and the heat exchange unit are each provided with a temperature sensor electrically connected to the control unit, And the control unit controls to apply an appropriate current to the thermoelectric element by using the temperature information received from the temperature sensor. The method according to any one of claims 1, 3 and 5 to 7, And the test jig is a probe chuck in a semiconductor EDS process.

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