KR100867777B1 - Molding apparatus for forming plural pairs of hollow moldings having thin film on inner surface - Google Patents

Abstract

The method of the present invention uses a stationary mold having a deposition recess having a deposition component therein, such as a target electrode, and a movable mold slidable. Primary molding is performed to form the body portion and the cover member and to have engaging portions around these openings. After tightly covered with the deposition recesses, the body portion remaining in the vertical slide mold is deposited. Next, the deposited body portion and the cover member remaining in the mold are mated, the mold is clamped, and the melted resin is injected to integrate the joining portions.

Hollow molding, semi-hollow body, cover member, joint, injection molding, moving mold, stationary mold

Description

MOLDING APPARATUS FOR FORMING PLURAL PAIRS OF HOLLOW MOLDINGS HAVING THIN FILM ON INNER SURFACE}

1A and 1B show a molding apparatus according to a first embodiment of the present invention, and also show schematic perspective views a and b of a stop mold and a moving mold, respectively, from a dividing line;

2a to 2j show a molding apparatus according to the first embodiment and schematically show a top view a to j of an individual molding step;

3a to 3d show examples of molds for explaining the working principle of the invention and also cross sections a to d of the individual molding steps.

4a to 4b show a molding apparatus according to a second embodiment of the present invention and show schematic perspective views a and b of the stationary mold and the moving mold respectively from the dividing line;

The present invention relates to a molding apparatus for forming an integrated hollow molding by combining the openings of a pair of semi-hollow bodies and also having a thin film deposited on the inner surface of the one or more semi-hollow bodies.

Molding, which partially has a thin film on the inner surface of the hollow body, on the order of tens of microns, is demonstrated by headlamps or taillights attached to a vehicle. The lamp consists of a recessed body portion having a bulb and a lens unit integrally attached to the opening of the body portion. The body portion is molded, for example, by injection molding, and is also suspended in a deposition-only vacuum tank by a dedicated hanger while blocking the unnecessary portion, such as the outer surface. Then, a thin film is formed on the body portion by a deposition method described later. The body part is again placed in a mold, mated with the individually molded lens parts, which are joined and integrated by an injection molding method.

Deposition methods for forming a thin film on the surface of a substrate such as a body portion are known in the art. Known techniques include: a sputtering method in which a thin film is formed by arranging a substrate and a target in an opposing manner, applying a negative voltage of several KV to the target in an argon gas atmosphere of several Pascals (PA) and discharging the targets; A vacuum deposition method in which a film is formed by housing an evaporation source in a vacuum container; An ion plating method in which vacuum deposition is performed by applying a negative voltage of several KV to a substrate in an argon gas having a pressure less than several Pascals (PA); And chemical vapor deposition.

JP-B-2-38377 describes a method for forming hollow moldings by injection molding. In particular, the hollow molding molding method includes a pair of primary semi-moldings formed by a pair of cavities formed of a stationary mold and a slide mold to open their openings. primary molding having a coupling portion around an opening; The slide mold also slides where the molds are opened so that one primary half-molding remains on the stationary mold, while the other primary half-molding remains on the sliding mold, and the mating portions of the pair of primary half-moldings are mated. And then the molds are clamped and the secondary molding is joined to the joining portions by injecting the dissolved resin into the joining portions. In addition, Japanese Patent No. 3,326,752 describes one of the molding methods of JP-B-2-38377, wherein in the primary molding, one primary semi-molding joint or abutting portion is used. The guide portion is integrally formed on the inner side of the second semi-molding border portion when the other semi-molding border portion is fitted to the border portion of the primary semi-molding portion. Guided for secondary molding by guides at the border of the molding. On the other hand, Japanese Patent No. 3,047,213 describes a predetermined molding method, in which the hollow molding is, as described above, by the border from the injection and filling point during secondary molding. It is shape | molded by injecting and filling resin so that the angle formed may be 90 degrees or less.

According to the molding methods described above, many problems arise because the substrate must be molded in advance by the injection molding method and also transferred to the vacuum tank for deposition. For example, the substrate is pre-molded and stored. Thus, the substrate may be contaminated by the surface by hand or contaminated with dust during storage, which may cause deposition failure. In order to avoid this, the handling of the substrate requires high surroundings, thereby raising the unit cost. In addition, the prefabricated substrate is stored once, so its storage causes management problems. In addition, the substrate must be extracted once from the mold before deposition and inserted back into the mold prior to bonding, thus reducing productivity.

On the other hand, the injection molding method described in JP-B-2-38377 has the advantage that it is possible to manufacture hollow moldings of complex shape as well as to mass produce hollow moldings by automating individual steps. On the other hand, according to Japanese Patent No. 3,326,752, without further or further deformation, the contact portions can achieve a fine contact (contact), thereby increasing the effect that the resin for secondary molding does not leak. In addition, the invention of Japanese Patent No. 3,047,213 is characterized in that its bonding strength is so high that the resin for secondary molding can be molded with fewer injection portions. Therefore, these inventions are still effectively implemented. However, the molding method of the related art cannot form a thin film of tens of microns on the inner surface of the hollow molding.

The present invention contemplates a molding method which solves the above-mentioned problems in the related art, and its object is that its quality is reduced by deposition failure, which does not require any particular storage management and can also be easily molded automatically. The present invention provides a method of forming a hollow molding body having a thin film on its inner surface having a predetermined deposited surface contaminant so as not to deteriorate, and a molding apparatus used to carry out the molding method.

In order to achieve the above-mentioned objects, according to the present invention, while the inner surface of the body part molded by the slidable movable mold and the stop mold remains in the groove of the movable mold, the body part is a target. The deposition is performed on the mold by being covered with a deposition chamber having a deposition component such as an electrode, a substrate electrode or a vacuum suction pipe.

In order to achieve the above object, according to the present invention, there is provided a method of forming a hollow molded body having a thin film on its inner surface, which comprises a pair of semi- A primary molding step comprising molding the hollow body; Driving the slidable moving mold to a defined position, leaving hollow bodies of molded pairs in a separate mold during primary molding, and forming a target electrode, a substrate electrode and a vacuum suction pipe therein; Depositing an inner surface of at least one of the paired semi-hollow bodies while covered with a deposition recess comprising a deposition component including a deposition recess; And driving at least one slideable movable mold to a position where the openings of the paired semi-hollow bodies are mated while the deposited pair of semi-hollow bodies remain in separate molds; The mold clamping step of clamping the secondary molding step, and the secondary molding step comprising the step of injecting a resin dissolved in the coupling portion of the semi-hollow bodies to integrate the paired semi-hollow bodies. According to a second aspect of the present invention, there is provided a method of simultaneously forming a plurality of hollow moldings, each having a thin film on its inner surface, which comprises a plurality of pairs of anti- A primary molding step comprising molding the hollow bodies; Driving the slidable moving mold, leaving the plurality of hollow bodies molded in a separate mold during primary molding, and forming a deposition component formed on the stationary mold and further comprising a target electrode, a substrate electrode and a vacuum suction pie. Depositing an inner surface of at least one of the paired semi-hollow bodies while covering with a deposition recess included therein; Driving the slidable moving mold to a position where the openings of the plural pair of semi-hollow bodies mate while the at least one deposited pair of semi-hollow bodies remain in a separate mold; And a secondary molding step including clamping and injecting a melt into the coupling portions of the semi-hollow bodies to integrate the plurality of pairs of semi-hollow bodies. According to a third aspect of the invention, the semi-hollow bodies which are mated during primary molding are individually molded from different resin materials.

According to a fourth aspect of the present invention, there is provided a molding apparatus for integrating a pair of semi-hollow bodies by joining around an opening and for forming a hollow molding body having a thin film on at least one inner surface of the semi-hollow bodies. The apparatus comprises: a first deposition recess and a core and recess for molding paired semi-hollow bodies, arranged at defined intervals, and comprising a target electrode, a substrate electrode and a vacuum suction pipe; A stop mold including two deposition recesses; And a slide mold having a horizontal slide mold co-operating with the recess of the stationary mold and a vertical slide mold having a first recess and a second recess co-operating with the core other than the stationary mold, wherein the first deposition recess and the second deposition recess are The size is large enough to cover the first groove and the second groove disposed in the vertical slide mold. According to a fifth aspect of the invention, a pair of semi-hollow bodies are integrated by joining around an opening and simultaneously forming multiple pairs of hollow body moldings having a thin film on the inner surface of at least one of the semi-hollow bodies. A molding device is provided, which comprises a plurality of cores and a plurality of grooves for molding a pair of semi-hollow bodies, arranged at defined intervals and further comprising a target electrode, a substrate electrode and a vacuum suction pipe. A stop mold including a first deposition recess and a second deposition recess including; A horizontal slide mold having a plurality of cores that cooperatively cooperate with a plurality of recesses of the stationary mold; And a movable mold including a vertical slide mold having a first groove and a second groove that cooperatively operate with the core of the stationary mold, wherein the first deposition groove and the second deposition groove are disposed on a vertical slide mold. It is large enough to cover the groove and the second groove.

Therefore, according to the present invention, a pair of semi-hollow bodies are molded using a stationary mold and a moving mold, and a slidable moving mold is formed in the stationary mold to deposit a component such as a target electrode, a substrate electrode or a vacuum suction pipe While covered with a deposition recess having a groove, the paired hollow bodies molded in the primary molding step are driven to a defined position, leaving their respective molds in contact with the inner surface of at least one of the paired semi-hollow bodies. Deposit. In short, the paired semi-hollow bodies are not withdrawn from the mold, but are deposited in the mold while covered with the deposition recess, so that the deposited surface is not contaminated with the hands or dust. Accordingly, it is possible to provide a hollow molding of excellent deposition quality having a thin film on its inner surface. In addition, the deposition is performed while the semi-hollow bodies remain in the mold, so that the semi-hollow bodies do not require storage management. Furthermore, according to the invention, the movable mold is driven and slidable to a position where the openings of the paired semi-hollow bodies conform to, while at least one paired semi-hollow bodies are left in a separate mold. By mold clamping the transfer mold, the paired semi-hollow bodies are integrated by injecting a melt into their joints. By using the mold, it is possible to easily and automatically form a hollow molding of a complicated shape having a thin film on its inner surface.

Meanwhile, according to another embodiment of the present invention, a plurality of pairs of semi-hollow bodies are molded in the primary molding step, and are deposited on the inner surface of at least one of the paired semi-hollow bodies in the deposition step, and the secondary molding step In the paired semi-hollow bodies are integrated. In addition to the effects described so far, a plurality of hollow moldings each having a thin film on the inner surface are simultaneously produced to improve molding efficiency.

Formed by injection molding a cup-shaped body portion and a flat plate-shaped cover member for sealing the opening of the body portion, forming a thin film on the inner surface of the body portion in the mold and sealing the opening of the body portion with the cover member, The molding example of the molding which has a thin film inside it is demonstrated. An embodiment of the molding apparatus of the present invention will be described first. 1 is a perspective view schematically showing a molding apparatus according to an embodiment of the present invention. FIG. 1A is a perspective view of the stationary mold 1 taken from the dividing line, and FIG. 1B is a perspective view of the moving mold 20 taken from the dividing line. In the illustrated embodiment, the stationary mold 1 has a split surface P which is formed in a cross shape with a first molding surface 2 extending vertically and a second molding surface 10 extending horizontally. . In the first divided surface 2, the first and second deposition recesses 3 and 4 forming the vacuum chamber are formed vertically at defined intervals. These deposition grooves 3 and 4 are large enough to cover the body molding grooves described below, and an O-ring 5 is provided around the grooves. When deposition is performed by the sputtering method, deposition components such as target electrodes or substrate electrodes are disposed in the deposition recesses 3 and 4, or vacuum suction pipes or argon gas supply pipes are opened in the deposition recesses 3 and 4. In addition, the openings of these electrodes or vacuum suction pipes are connected via hoses 6 and 7 to a vacuum device 8, an inert gas supply 9 or a power source device not shown.

The second molding surface 10 in the horizontal direction is provided with a body molding core for molding the cup-shaped body part in a position for mating with the first and second deposition recesses 3 and 4. Apart from the body molding core 11 at a predetermined interval, the second molding surface 10 is provided with a cover member molding recess 2 for molding the cover member. The body molding core 11 protrudes outward from the divided surface P. Thus, the body portion is formed in a cup shape. On the other hand, the cover member molding recess 12 is slightly recessed from the dividing surface P. FIG. Thus, the plate-shaped cover member is molded. Although not shown in FIG. 1, a bulge is formed around the core 11 for molding the coupling portion integrated with the body portion, which will be described in detail with reference to FIG. 3.

The movable mold 20 includes a horizontal slide mold 22 attached to the moving frame 21 to slide horizontally and a vertical slide mold 30 attached to the horizontal slide mold 22 to slide vertically. It is composed. These molds 22 and 30 have a split surface P formed in the common surface. Thus, in the embodiment shown in FIG. 1B, the horizontal slide mold 22 is divided horizontally so that the vertical slide mold 30 slides vertically between the divided portions. The vertical slide mold 22 thus formed is integrally perpendicular to the vertical slide mold 30 by an actuator 24 having an end portion attached to the support member 23 extending horizontally from the movable frame 21. Driven. On the other hand, the vertical slide mold 30 is vertically driven independently of the horizontal slide mold 22 by an actuator 32 having an end portion attached to the vertically extending gate-young support member 31.

The cover member molding core 25 for molding the cover member is formed on one side of the divided surface P of the horizontal slide mold 22 of the movable mold 20 formed to intersect the vertical slide mold 30, and Clearances 26 are formed on the other side to allow clearance to the body molding core 11 when clamping the mold. Although not shown in FIG. 1B, like the body molding core 11, a bulge is formed around the cover member molding core 25 to mold the coupling portion integrally with the cover member. On the divided surface P of the vertical slide mold 30, first and second body molding grooves 33 and 34 corresponding to the first and second deposition grooves 3 and 4 formed in the stationary mold 1 are formed. Is formed.

The stationary mold 1 and the moving mold 200 described so far can be used to form a cup-shaped body portion and a flat plate-shaped cover member as a primary molding operation, and the body portion and the cover member are integrated to form a secondary molding operation. The hollow molding can be molded. An example of a mold for explaining this molding principle is shown in FIG. 3. In particular, the mold consists of a stationary mold 40 and a slide mold 45, wherein a body molding groove 41 of a prescribed depth for molding the body has an upper portion at the divided surface P of the stationary mold 40. While formed in position, a cover member molding core 42 of relatively small height is formed in the lower position. Small cores 43 are formed at defined intervals around the core 42. The small core 43 forms a joining step around the opening of the cover member. On the other hand, on the divided surface P of the slide mold 45, a body molding core 46 to mate with the body molding groove 41 of the stop mold 40 is formed. In addition, small cores 47 are formed at defined intervals around the core 46. The small core 47 forms a joining step around the opening of the body. Under the body molding core 46, a narrow cover member molding recess 48 is formed, mating with the cover member molding core 42 of the stationary mold 40. Between the body molding core 46 and the cover member molding core 48, a primary molding in communication with the body molding groove 41 and the cover member molding groove 48 via a runner 51 and a gate 50. Molding sprues 50 are formed. The secondary molding spout 53 is formed below the primary molding spout 50. In Fig. 3, the actuator for driving the slide mold 45 for vertically sliding the mold clamping device, the ejecting device for ejecting the molding, the injection device and the like is omitted.

Hollow moldings can be formed using the molds 40 and 45 described above in the following manner. The molds 40 and 45 are mold clamped in the first position as shown in FIG. 3A. Then, a body molding cavity Kh is formed by the stationary mold 400 body molding recess 41 and the body molding core 46 of the slide mold 45. In addition, the cover member molding cavity ( Kf) is formed in the cover member molding core 42 of the stationary mold 41 and the cover member molding recess 48 of the slide mold 45. The molten resin is injected from the primary molding spout 50. As shown in Fig. 3B, the melt resin enters the body molding cavity Kh and the cover member molding cavity Kf through the runner 51 and the gate 52. By this primary molding operation, the body H And cover member F are molded to have a jointing half groove M 'around their opening, which is shown in Fig. 3C.

While waiting for the cooling condensation, the mold is opened while the body H remains in the stop mold 40 and the cover member F remains in the slide mold 45. Then, the slide mold 45 is slid to the secondary molding position where the openings of the body H and the cover member F are matched with each other. This registration position is shown in Figure 3c. Molds are mold clamped at the mating positions. Then, as shown in Fig. 3d, the coupling cavity M is formed by the half grooves M 'and M' at the outer periphery of the bonding position of the body H and the cover member F. The same or different resin as the body molding resin is injected from the secondary molding spout 53. Through this secondary molding, the body (H) and the cover member (F) are integrated to create a hollow molding.

As described so far, a primary molding operation is to mold the body portion and the cover member, and a thin film is formed on the inner surface of the body portion or on the inner surface of the body portion and the inner surface of the cover member, and the secondary molding operation By holding the cover members in contact with each other and integrating them by injecting the melted resin, a hollow molding having a thin film on its inner surface is obtained. In the embodiment shown in FIG. 1, the body molding core 11, the cover member molding core 25, the first and second body molding recesses 33 and 34, the cover member molding recess 12, etc. It is formed to have a shape as shown in Figure 3, or the coupling portion of the primary molding is made to have the same structure as described in Japanese Patent Nos. 3,326,752 and 3,047,213, but in Figure 1 the shape is simplified and schematic Is shown.

Referring to FIG. 2, an example of molding of a hollow molding having a thin film on the inner surface is described using the stationary mold 1 and the moving mold 20 of the embodiment shown in FIG. In FIG. 2, empty ellipses represent unfilled cavities, ellipses with circles represent semi-finished moldings obtained with filled cavities or primary moldings, solid ellipses represent deposited semi-complete moldings, and bold solid ellipses Denotes a hollow molding having a deposited inner surface. In addition, FIG. 2 shows only the slidable, driven moving mold 20, not the fixed stationary mold 1.

The moving mold 20 slides to the first molding position. In addition, the vertical slide mold 30 slides to the lower first molding position. Then, the first body molding recess 33 of the vertical slide mold 30 is mated with the body molding core 11 of the stationary mold 1 to form a cavity for molding the cup-shaped body portion. The molds are clamped and the melt injected for the primary molding operation. Thus, the first body portion is molded. This state is shown in FIG. 2A.

While waiting for the cooling condensation to some extent, as shown in FIG. 2B, the movable mold 20 is opened, and the vertical slide mold 30 is driven to the second molding position in the upper portion. Then, the cover member molding core 25 of the horizontal slide mold 22 is matched with the cover member molding recess 12 of the stationary mold 1. The second body molding recess 34 of the vertical slide mold 30 is also mated with the body molding core 11 of the stationary mold 1. This mating state is shown in Figure 2b. The molds are clamped. Then, the cavity for molding the cover member is formed by the cover member molding recess 12 of the stationary mold 1 and the cover member molding core 25 of the horizontal slide mold 22, and the second body molding cavity also It is formed by the body molding core 11 and the second body molding groove 34. The first molding melt is injected into these cavities. By these primary molding operations, the second body portion and the first cover member are simultaneously molded as shown in Fig. 2C.

As shown in FIG. 2D, while waiting for cooling condensation, the moving mold 20 is opened to drive the vertical slide mold 30 to the first deposition position below. Then, the first body molding groove 33 of the vertical slide mold 30 is to be joined to the first deposition groove 33 of the stop mold (1). In particular, the first body portion remaining in the first body molding recess 33 is matched with the first deposition recess 3 to enter therein. Next, the molds are mold clamped to the deposition area.

After this mold clamping, the O-ring 5 of the first deposition recess 3 is brought into close contact with the divided surface P of the vertical slide mold 30 and placed thereon. For example, a vacuum source or an inert gas supply source is driven to set the inside of the first deposition recess 3 in an argon gas atmosphere of several to several tens of Pascals (PA). Then, a negative voltage is applied to the target, a positive voltage of several Kv or more is applied to the body portion, and argon is discharged and deposited on the inner surface of the body portion. The deposition state is shown in Figure 2d. The vertical slide mold 30 is driven to the left secondary molding position as shown in FIG. 2E. Then, the first body portion remaining in the first body molding recess 33 after deposition is matched with the cover member remaining in the cover member molding recess 12 of the stationary mold 1. The molds are mold clamped and the melted resin for the second molding operation is injected. Thus, the body portion and the cover member are combined to integrate the opening. This state is shown in FIG. 2E. The moving member 20 is opened to take out the hollow molding having a thin film on the inner surface of the body portion. When the molding is taken out, the first body molding groove 33 of the vertical slide mold 30 is made hollow as shown in Fig. 2F.

The molding is taken out and the molds clamped. Then, the cavity for molding the third body part is formed by the body molding core 1 and the body molding recess 33, and the cavity for molding the cover member is formed by the cover member molding recess 12 of the stop mold 1. And the cover member molding core 25 of the horizontal slide mold 22. Melting resins for primary molding operations are injected into these cavities. Thus, the third body portion and the second cover members are primary molded simultaneously. The state with the final primary molding operation is shown in Fig. 2g.

The moving mold 20 is opened. The vertical slide mold 300 slides to the upper second deposition position. The molds are then mold clamped. Therefore, the O-ring 5 of the second deposition recess 4 is brought into intimate contact with the divided surface P of the vertical slide mold 30, so that preparation for deposition is made. As described above, the voltage and the gas are applied to the inside of the second deposition apparatus, and the deposition is performed on the inner periphery of the second body portion. The deposition is completed is shown in Figure 2h. The vertical column molding 30 is driven to the secondary molding position as shown in FIG. 2I. Therefore, the second body portion remaining in the second body molding recess 34 after deposition is matched with the cover member remaining in the cover member molding recess 12 of the primary mold 1. The molds are mold clamped and melted resin is injected for secondary molding. Thus, the body portion and the cover member are joined so that the opening is integrated. The moving mold 20 is opened to take out the hollow mold having a thin film on the inner surface. The ejected state is shown in Fig. 2J. Then, a hollow molding having a thin film on the inner surface of the body portion is likewise molded.

The invention can be practiced in various ways. For example, it is apparent that the inner surface of the cover member can be deposited by additionally forming a cover member deposition recess in the stop mold 1. In addition, if a molding apparatus such as that shown in FIG. 4 is used, two hollow moldings having a thin film on the inner surface thereof can be molded simultaneously. Although the description of this embodiment has not been made, the same components of the molding apparatus according to the first embodiment are shown as shown in Fig. 1, and the points are omitted by adding a common reference number or a common reference number indicating the same component. According to this embodiment, the stationary mold 1 'comprises two body molding cores 11 and 11' and two cover member molding recesses 12 and 12 '. In addition, the horizontal sliding mold 2 of the movable member 20 'has a large relief recess 26 for relieving the two cover member cores 25 and 25' and the body molding cores 11 and 11 '. '). The vertical slide mold 30 has two first body molding recesses 33 and 33 'and two second body molding recesses 34 and 34'. In addition, the first and second deposition recesses 3 'and 4' of the stationary mold 1 'are provided with two first body molding recesses 33 and 33' and two second bodies of the vertical slide mold 30, respectively. It is large enough to cover the molding grooves 34 and 34 'at the same time. By increasing the number of the body molding core and the cover member molding recess, it can be clearly seen that three or more hollow moldings having a thin film on the inner surface thereof can be produced. Further, the body molding resin material and the cover member molding resin material can be made different at the time of primary molding. For example, when a hollow molding having a thin film on its surface is a headlight or a taillight, the cover members may be molded with a transparent lens material.

Multiple pairs of semi-hollow bodies are molded in the primary molding step, deposited on the inner surface of at least one of the paired semi-hollow bodies in the deposition step, and the paired semi-hollow bodies are integrated in the secondary molding step. . In addition to the effects described so far, a plurality of hollow moldings each having a thin film on the inner surface are simultaneously produced to improve molding efficiency.

Claims (6)

delete delete delete delete delete A molding apparatus for integrating paired semi-hollow bodies by joining around an opening and simultaneously forming a plurality of pairs of hollow moldings having a thin film on at least one inner surface of the semi-hollow bodies, A first deposition recess comprising a plurality of cores and a plurality of grooves for molding the mated semi-hollow bodies, and a deposition component disposed at a predetermined interval and having a target electrode, a substrate electrode and a vacuum suction pipe; A stop mold including second deposition recesses; A movable slide comprising a horizontal slide mold having a plurality of cores cooperatively working with a plurality of recesses of the stationary mold, and a vertical slide mold having a first recess and a second recess cooperatively working with the core of the stationary mold. And a mold, wherein the first deposition groove and the second deposition groove are sized to cover the first groove and the second groove disposed on the vertical slide mold. Molding apparatus for molding the molded body at the same time.

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