KR100866881B1 - 발광 다이오드 패키지 - Google Patents
발광 다이오드 패키지 Download PDFInfo
- Publication number
- KR100866881B1 KR100866881B1 KR1020070024886A KR20070024886A KR100866881B1 KR 100866881 B1 KR100866881 B1 KR 100866881B1 KR 1020070024886 A KR1020070024886 A KR 1020070024886A KR 20070024886 A KR20070024886 A KR 20070024886A KR 100866881 B1 KR100866881 B1 KR 100866881B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- diode package
- heat sink
- electrode
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
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- Led Device Packages (AREA)
Abstract
Description
Claims (7)
- 삭제
- 방열판;상기 방열판 상에 구비되고, 복수의 도전 패턴 및 전극 단자를 구비한 기판;상기 기판의 전극 단자에 그라운드되어 연결된 발광 다이오드를 포함하여 이루어지고,여기서, 상기 발광 다이오드의 애노드 전극이 그라운드된 것을 특징으로 하는 발광 다이오드 패키지.
- 방열판;상기 방열판 상에 구비되고, 복수의 도전 패턴 및 전극 단자를 구비한 기판;상기 기판의 전극 단자에 그라운드되어 연결된 발광 다이오드를 포함하여 이루어지고,여기서, 상기 발광 다이오드의 애노드 전극이 그라운드 전극에 연결된 것을 특징으로 하는 발광 다이오드 패키지.
- 제 2 항 또는 제 3 항에 있어서, 상기 발광 다이오드는,네거티브(-) 구동인 것을 특징으로 하는 발광 다이오드 패키지.
- 제 4 항에 있어서, 상기 네거티브 구동 전압은,-5V인 것을 특징으로 하는 발광 다이오드 패키지.
- 제 4 항에 있어서, 상기 네거티브 구동은,벅 부스트 컨버터(buck boost converter) 회로를 이용하는 것을 특징으로 하는 발광 다이오드 패키지.
- 제 6 항에 있어서, 상기 벅 부스트 컨버터는,PWM(Pulse Width Modulation) 제어 신호에 의해 온/오프 되는 것을 특징으로 하는 발광 다이오드 패키지.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070024886A KR100866881B1 (ko) | 2007-03-14 | 2007-03-14 | 발광 다이오드 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070024886A KR100866881B1 (ko) | 2007-03-14 | 2007-03-14 | 발광 다이오드 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080083961A KR20080083961A (ko) | 2008-09-19 |
KR100866881B1 true KR100866881B1 (ko) | 2008-11-04 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070024886A KR100866881B1 (ko) | 2007-03-14 | 2007-03-14 | 발광 다이오드 패키지 |
Country Status (1)
Country | Link |
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KR (1) | KR100866881B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101018191B1 (ko) * | 2008-11-27 | 2011-02-28 | 삼성엘이디 주식회사 | 세라믹 패키지 및 이를 구비하는 헤드램프 모듈 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950021816A (ko) * | 1993-12-14 | 1995-07-26 | 이헌조 | 전계발광(el)소자 제조방법 |
KR20060115055A (ko) * | 2005-05-04 | 2006-11-08 | (주)대신엘이디 | 조명용 led모듈 |
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2007
- 2007-03-14 KR KR1020070024886A patent/KR100866881B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950021816A (ko) * | 1993-12-14 | 1995-07-26 | 이헌조 | 전계발광(el)소자 제조방법 |
KR20060115055A (ko) * | 2005-05-04 | 2006-11-08 | (주)대신엘이디 | 조명용 led모듈 |
Also Published As
Publication number | Publication date |
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KR20080083961A (ko) | 2008-09-19 |
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