KR100863697B1 - Spray coating powder, method of forming the same and method of forming a spray coating - Google Patents

Abstract

A powder for spray coating and a method of manufacture thereof are provided to seal with spraying a ceramic powder, moreover a method for manufacturing the spraying coating film is provided to do sealing process by including an organic powder for the sealing when spraying a ceramic powder. A powder(10) for spray coating is comprises a ceramic powder(20) for the spray coating; a sealing film(30) surrounding the exterior of the ceramic powder and being obtained by heat-treating in the state that surrounds exterior the organic powder. The particle diameter ratio of the ceramic powder and organic powder is 1:0.1~0.3 and processing a sealing the powder for spray coating by simultaneously including an organic powder when spraying the ceramic powder.

Description

SPRAY COATING POWDER, METHOD OF FORMING THE SAME AND METHOD OF FORMING A SPRAY COATING}

The present invention relates to a spray coating powder, a method for manufacturing the same, and a method for manufacturing the spray coating film, and more particularly, a coating powder for use in forming a spray coating film on a base material, a method for manufacturing the same, and a method for manufacturing the spray coating film. It is about.

In general, as a method of forming a sprayed coating film, first, the powder of a ceramic material such as yttria is prepared. Subsequently, the powder is melted using plasma and thermally sprayed onto the base material to temporarily form the thermal spray coating film. Next, a sealing solution is applied to the temporarily formed thermal spray coating film. The reason for sealing the thermal spray coating through the sealing solution is to increase the service life of the thermal spray coating by preventing the thermal spray coating from absorbing moisture in the air.

In this case, as a method of applying the sealing solution to the spray coating film formed temporarily, for example, the sealing solution may be directly applied to the thermal spray coating film, or may be applied to the thermal spray coating film using a sol-gel method. Subsequently, the thermal spray coating film and the sealing solution formed temporarily are heat treated at high temperature and high pressure to complete the thermal spray coating film.

However, when the thermal spray coating film is completed by the above method, the sealing solution does not sufficiently penetrate to the lower end of the thermal spray coating film, or the sealing solution is required a lot and in some cases a constant sealing treatment for a large area is not There is a problem.

In addition, since the sealing solution contains a solvent in a liquid state, the thermal spray coating may be damaged, and as the above-described high temperature and high pressure heat treatment process is required, a lot of time and space and separate equipment are used. It is not economical, and there is another problem that cracks are generated on the surface of the thermal spray coating layer during the heat treatment.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a spray coating powder that can seal and spray ceramic powder at the same time.

In addition, another object of the present invention is to provide a method for producing the above spray coating powder.

In addition, another object of the present invention is to provide a method of manufacturing a spray coating film which can be sealed by using the spray coating powder described above, or simultaneously including a sealing organic powder when spraying the ceramic powder.

In order to achieve the above object of the present invention, the spray coating powder according to one feature comprises a ceramic powder and a sealing film. The sealing film surrounds the outer surface of the ceramic powder and is obtained by heat-treating the organic powder for sealing in the state surrounding the outer surface.

A particle diameter ratio of the ceramic powder and the organic powder may be 1: 0.1 to 0.3. In addition, the content ratio of the ceramic powder and the organic powder may be 1: 0.2 to 0.5.

In order to achieve the above object of the present invention, a method for producing a spray coating powder according to one aspect is disclosed. Prepare a ceramic powder for thermal spray coating. Then, the organic powder for sealing is applied to the outer surface of the ceramic powder. Next, the organic material powder applied to the outer surface of the ceramic powder is heat-treated. Subsequently, the heat treated organic powder is cooled to form a sealing film on the outer surface of the ceramic powder.

Here, the particle diameter ratio of the ceramic powder and the organic material powder may be 1: 0.1 to 0.3. The content ratio of the ceramic powder and the organic powder may be 1: 0.2 to 0.5.

The heat treatment temperature of the organic powder may be 50 ℃ to 200 ℃. In addition, the sealing film may quench the heat-treated organic material powder to room temperature for 0.01 seconds to 2 seconds to instantly strengthen the hardness.

In order to achieve another object of the present invention described above, a method for producing a spray coating film according to one aspect is disclosed. A powder for thermal spray coating including a sealing film obtained by heat-treating the ceramic powder used for the thermal spray coating and the outer surface of the ceramic powder and surrounding the outer surface of the organic powder for sealing is prepared. Subsequently, the thermal spray coating powder is sprayed on a base material to form a thermal spray coating film. Here, the temperature for heat treating the organic material powder is 50 ℃ to 200 ℃.

In addition, a method of manufacturing a thermal spray coating film according to another feature is disclosed. Prepare a ceramic powder and a sealing organic powder used for spray coating. Subsequently, the ceramic powder and the organic powder are sprayed on a base material to form a spray coating film in which the ceramic powder and the organic powder are mixed.

Here, the mixing ratio of the ceramic powder and the organic powder may be 1: 0.15 to 0.5.

Here, the forming of the thermal spray coating film in which the ceramic powder and the organic powder are mixed may include forming the mixed powder by mixing the ceramic powder and the organic powder and spraying the mixed powder on the base material to form the thermal spray coating film. It may include the step. Here, the particle diameter ratio of the ceramic powder and the organic powder may be 1: 0.15 to 0.5.

Alternatively, in the forming of the thermal spray coating film in which the ceramic powder and the organic powder are mixed, the thermal spray coating film may be formed by simultaneously spraying the ceramic powder and the organic powder on the base material separately. Here, the particle diameter ratio of the ceramic powder and the organic material powder may be 1: 0.3 to 0.8.

The forming of the sprayed coating film in which the ceramic powder and the organic powder are mixed may include spraying the ceramic powder on the base material and spraying the organic powder on the ceramic powder sprayed on the base material to directly in front of the base material. It may include the step of forming the thermal spray coating film by mixing the ceramic powder and the organic powder. Here, the particle diameter ratio of the ceramic powder and the organic material powder may be 1: 0.3 to 0.8.

According to such a spray coating powder, a manufacturing method thereof and a manufacturing method of the spray coating film, when spraying the ceramic powder on the base material, by coating the organic material for sealing in advance, or by including when spraying the ceramic powder, the thermal sprayed The need to separately seal the thermal spray coating film formed through the ceramic powder can be excluded.

As a result, the manufacturing process of the thermal spray coating layer using the ceramic powder may be simplified to shorten the process time.

In addition, by using the sealing organic material in a solid state, such as a film or powder, it is possible to exclude the need to separately heat treatment after forming the thermal spray coating film on the base material. That is, as in the background art, cracks may be prevented in advance due to the heat treatment process. Thereby, the quality of the sprayed coating film can be prevented from being lowered, and the life of the sprayed coating film can be extended.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the spray coating powder, a manufacturing method thereof and a manufacturing method of the spray coating film according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Spray Coating Powder

1 is a view showing a spray coating powder according to an embodiment of the present invention.

1, the spray coating powder 10 according to an embodiment of the present invention includes a ceramic powder 20 and the sealing film 30.

The ceramic powder 20 is obtained from a slurry composition comprising a ceramic material such as yttria. Alternatively, the ceramic powder 20 may be obtained from a slurry composition comprising a ceramic material such as silicon carbide.

The sealing film 30 is formed to surround the outer surface of the ceramic powder 20. The sealing film 30 is obtained by heat-treating the organic material for sealing 40 having its own sealing effect in the state surrounding the outer surface of the ceramic powder 20.

Here, the organic powder 40 may be formed of, for example, a monomer, a co-polymer, a polymer, or the like. In particular, when the organic powder 40 is made of a polymer, amideimide, benzimidazole, ethyleneimine, oxymethylene, formaldehyde, phenylene sulfide, tetrapolyethylene, methyl methacrylate, vinyl, fluorine resin, silicone Or the like, or a mixture of two or more thereof.

On the other hand, when the particle diameter ratio of the organic powder 40 compared to the ceramic powder 20 is less than about 1: 0.1, the thickness of the sealing film 30 becomes too thin and thus does not have a sealing effect. If the particle size ratio of the organic material powder 40 is greater than about 1: 0.3, the organic material powder 40 may not be properly melted during heat treatment, and thus the sealing film may not be uniformly formed. Therefore, the particle diameter ratio of the organic powder 40 to the ceramic powder 20 is preferably about 1: 0.1 to 0.3. In addition, the particle diameter ratio of the organic powder 40 to the ceramic powder 20 is more preferably about 1: 0.15 to 0.2.

For example, when the ceramic powder 20 has a particle size of about 30 μm, the organic material powder 40 may have a particle size of about 3 μm to 10 μm, and more preferably about 4.5 μm to 6 μm. It may have a particle size of. Thus, in this embodiment, the particle diameter of the organic material powder 40 may be about 5㎛.

Manufacturing method of spray coating powder

2A and 2B are schematic views illustrating a method of manufacturing the spray coating powder shown in FIG. 1.

Referring to FIG. 2A, first, a ceramic powder 20 including a ceramic such as yttria is prepared. Here, the particle diameter of the ceramic powder 20 may be about 30㎛.

Subsequently, a sealing organic powder 40 is coated on the outer surface of the ceramic powder 20 so as to surround the outer surface. At this time, the particle diameter of the organic powder 40 is in the range of about 1: 0.1 to 0.3 compared to the ceramic powder 20, as described in reference to Figure 1, the ceramic powder 20 is about 30㎛ as described above In the case, it may be preferably about 5㎛.

2B, the organic material powder 40 applied to the outer surface of the ceramic powder 20 is subsequently heat treated.

In this case, when the temperature for heat treating the organic powder 40 is less than about 50 ° C., the organic material powder 40 is not preferable because the organic material powder 40 is not melted. When the temperature for heat treatment is more than about 200 ° C., the organic powder It is not preferable because all 40 are melted and the shape is disturbed. Therefore, the temperature for heat treating the organic material powder 40 is preferably about 50 ℃ to 200 ℃. In addition, the temperature of the organic material powder 40 is more preferably about 50 ℃ to 150 ℃. Thus, in this embodiment, the temperature for heat treatment of the organic material powder 40 includes about 100 ℃. The organic powder 40 heat-treated at such a temperature is present in a slightly molten state on the outer surface of the ceramic powder 20.

That is, the organic powder 40 is connected to each other through a heat treatment process, thereby forming a sealing film 30 in a molten state on the outer surface of the ceramic powder 20.

Subsequently, the organic powder 40 that has been heat treated is cooled. That is, the sealing film 30 in a slightly molten state formed by heat treatment of the organic material is cooled and completely solidified in a stable state.

At this time, since the sealing film 30 in a slightly molten state is in an unstable state in which its shape may be disturbed, the sealing film 30 is quenched to room temperature to temporarily strengthen its hardness.

Therefore, when the time for quenching the sealing film 30 is less than about 0.01 seconds, the time is too short, which is not preferable because the sealing film 30 may be damaged, and the time for quenching may exceed about 2 seconds. In this case, since the shape of the sealing film 30 is disturbed, it is not preferable. Therefore, the time for rapidly cooling the sealing film 30 is preferably performed in about 0.01 seconds to 2 seconds. Here, liquid oxygen, liquid nitrogen, liquid carbon dioxide, or the like may be used for the quenching.

Accordingly, the sealing film 30 is formed on the outer surface of the ceramic powder 20 by subjecting the organic powder 40 for sealing to the outer surface of the ceramic powder 20 to undergo a heat treatment and cooling process.

Spray coating film manufacturing method 1

FIG. 3 is a schematic diagram illustrating an example of forming a spray coating layer using the spray coating powder of FIG. 1, and FIG. 4 is a schematic flowchart for explaining a method of forming the spray coating layer of FIG. 3.

Referring to FIG. 3, as a film forming apparatus 100 to be applied to the manufacturing method 1, the film forming apparatus 100 includes a powder supply unit 110 and a powder spraying unit 120.

The powder supply unit 110 provides a spray coating powder 10 including a ceramic powder 20 and a sealing film 30 formed surrounding the outer surface of the ceramic powder 20.

The powder spraying unit 120 is connected through the powder supply unit 110 and the supply line 130 to receive the spray coating powder 10 from the powder supply unit 110. The powder spraying part 120 sprays the sprayed coating powder 10 on the base material M to form a substantially spray coating film CL on the base material M.

In this case, a high frequency voltage for plasma generation from the outside may be applied to the powder spraying part 120 to spray the spray coating powder 10.

On the other hand, when the content of the organic powder 40 for forming the sealing film 30 in the thermal spray coating powder 10 compared to the ceramic powder 20 is less than about 1: 0.2 (CL) spray coating film (CL ) Is not preferable because the ratio of the sealing film 30 is so low that the sealing effect is not properly achieved, and when the content of the organic powder 40 exceeds about 1: 0.5, the thermal spray coating film CL In the sealing film 30 is too high because it does not relatively perform the original function of the thermal spray coating film (CL) is not preferable. Therefore, the content of the organic powder 40 compared to the ceramic powder 20 in the thermal spray coating powder 10 is preferably about 1: 0.2 to 0.5. Thus, in the present embodiment, the content of the organic powder 40 compared to the ceramic powder 20 may be about 1: 0.3.

In addition, the film forming apparatus 100 further includes a moving part (not shown) for moving the base material M along one direction. That is, the powder spraying part 120 may form the thermal spray coating film CL on the base material M as a whole while moving the base material M through the moving part.

Hereinafter, a process of completing the spray coating film CL will be described in detail with reference to FIG. 4.

Referring to FIG. 4, first, a spray coating powder 10 is prepared (S10). Here, the thermal spray coating powder 10 is composed of the ceramic powder 20 and the sealing film 30 as described above.

Subsequently, the thermal spray coating powder 10 is sprayed on the base material M to form a thermal spray coating film CL (S20). In this case, the spray coating film CL may be formed while moving the base material M by using a moving part.

As such, by spraying the thermal spray coating powder 10 applied on the outer surface of the sealing film 30 to the base material M, the need to separately seal the thermal spray coating film CL formed therethrough is eliminated. Can be. As a result, the process time of the spray coating film CL may be simplified.

In addition, since the sealing film 30 is substantially in a solid state such as powder, it may be possible to eliminate the need to separately heat-treat the thermal spray coating film CL as described in the background art. That is, as in the background art, cracks may be prevented in advance due to the heat treatment process. As a result, the quality of the thermal spray coating layer CL may be prevented from being lowered, and the life of the thermal spray coating layer CL may be extended.

Warrior Coating film  Manufacturing method 2

Figure 5 is a schematic diagram showing another embodiment of forming a thermal spray coating film of the present invention.

In the present embodiment, except for the configuration of supplying the powder for the thermal spray coating, it may be the same as the embodiment of Figure 3, the overlapping detailed description thereof will be omitted.

Referring to FIG. 5, as the film forming apparatus 200 to be applied to the manufacturing method 2, the powder supply unit 210 of the film forming apparatus 200 mixes the ceramic powder 22 and the sealing organic powder 42. It is supplied to the powder spraying part 220 in one state. In this case, the powder supply unit 210 is connected through the powder spraying unit 220 and the supply line 230.

Accordingly, referring to the process of forming the thermal spray coating film CL on the base material M using the film forming apparatus 220, first, to form the thermal spray coating film CL on the powder supply part 210. The ceramic powder 22 and the organic powder 42 are prepared. Specifically, the mixed powder 50 in which the ceramic powder 22 and the organic powder 42 are mixed is prepared.

In this case, when the mixing ratio of the ceramic powder 22 and the organic powder 42 mixed in the mixed powder 50 is less than about 1: 0.2, the content of the organic powder 42 is too small to seal properly. It is not preferable because it is not supported, and when the mixing ratio is greater than about 1: 0.5, it is not preferable because the content of the organic powder 42 is too high to properly perform the original function of the thermal spray coating film CL. . Therefore, the mixing ratio of the ceramic powder 22 and the organic powder 42 mixed in the mixed powder 50 is preferably about 1: 0.2 to 0.5. Thus, in the present embodiment, the mixing ratio may be about 1: 0.3.

In addition, when the particle size ratio of the ceramic powder 22 and the organic powder 42 mixed in the mixed powder 50 is less than about 1: 0.15, the size of the organic molecule 42 is too small to allow the ceramic powder ( When supplying to the powder spraying part 220 in the state of the mixed powder 50 mixed with 22), since the supply is not performed smoothly, when the particle size ratio exceeds about 1: 0.5, The organic matter powder 42 is not preferable because the mixing ratio is not adjusted as above. Therefore, the particle diameter ratio of the ceramic powder 22 and the organic powder 42 mixed in the mixed powder 50 is preferably about 1: 0.15 to 0.5. In addition, the particle size ratio is more preferably about 1: 0.15 to 0.3.

For example, when the particle diameter of the ceramic powder 22 is about 30 μm, the particle size of the organic powder 42 may be about 4.5 μm to 15 μm. More specifically, the particle size of the organic material powder 42 may be about 5㎛ to 10㎛.

Subsequently, the mixed powder 50 is sprayed onto the base material M through the powder spraying unit 220 to form the thermal spray coating layer CL.

Thus, by spraying on the base material (M) in the mixed powder 50 state in which the ceramic powder 22 and the organic material powder 42 for sealing is mixed, the sealing coating step (CL) is formed, Can be excluded.

In addition, since the organic powder 42 for sealing the thermal spray coating film CL is in a solid state, the thermal spray coating film CL may be formed on the base material M, and thus, the need for a separate heat treatment process may be excluded. have.

Warrior Of coating film  Manufacturing Method 3

Figure 6 is a schematic diagram showing another embodiment of forming a thermal spray coating film of the present invention.

In the present embodiment, except for the configuration of supplying the powder for the thermal spray coating, it may be the same as the embodiments of Figures 3 and 5, the overlapping detailed description thereof will be omitted.

Referring to FIG. 6, as a film forming apparatus 300 to be applied to the manufacturing method 3, the powder supply unit 310 of the film forming apparatus 300 is divided into first and second powder supply units 312 and 314. .

The first powder supply part 312 supplies the ceramic powder 24 to the powder spraying part 320, and the second powder supply part 314 supplies the sealing organic material 44 to the powder spraying part 320. To feed.

The first and second powder supply parts 312 and 314 are connected to the powder spraying part 320 through first and second supply lines 330 and 340. In addition, the powder spraying unit 320 has a partition wall 350 formed therein to distinguish the ceramic powder 24 and the organic powder 44 supplied from the first and second powder supply units 312 and 314. Can be installed.

Accordingly, referring to the process of forming the thermal spray coating film CL on the base material M using the film forming apparatus 300, first, the thermal spray coating film is formed on each of the first and second powder supply parts 312 and 314. The ceramic powder 24 for forming CL and the organic powder 44 for sealing are prepared.

Subsequently, the ceramic powder 24 and the organic powder 44 are discharged from the first and second powder supply parts 312 and 314 through the first and second supply lines 330 and 340. 320).

Here, when the particle diameter ratio of the ceramic powder 24 and the organic powder 44 is less than about 1: 0.3, the organic powder 44 is supplied from the second powder supply part 314 to the powder spraying part 320. () Is not preferable because it is not economical due to the increase of the amount of the organic powder (44) is used, and if the particle size ratio exceeds about 1: 0.8 it is difficult to penetrate between the ceramic powder (24) Not. Therefore, the particle diameter ratio of the ceramic powder 24 and the organic powder 44 is preferably about 1: 0.3 to 0.8.

For example, when the particle diameter of the ceramic powder 24 is about 30 μm, the particle size of the organic powder 44 may be about 9 μm to 24 μm. More specifically, the particle size of the organic powder 44 may be about 10㎛ to 15㎛.

Subsequently, the ceramic powder 24 is sprayed on the base material M from the powder spraying part 320, and the organic powder 44 is sprayed on the base material M to form the spray coating film CL. . Here, the ceramic powder 24 and the organic powder 44 are sprayed and sprayed at the same position of the base material (M).

In addition, the content ratio of the ceramic powder 24 and the organic powder 44 sprayed and sprayed on the thermal spray coating film CL may be about 1: 0.2 to 0.5 as in the embodiments of FIGS. 3 and 5, More preferably about 1: 0.3.

As such, by spraying and spraying the ceramic powder 24 and the organic powder 44 for sealing on the base material M simultaneously to form the spray coating film CL, the sealing treatment process can be eliminated. .

Warrior Of coating film  Manufacturing method 4

7 is a schematic view showing another embodiment of forming a thermal spray coating film of the present invention.

In the present embodiment, except for the configuration of supplying the powder for the thermal spray coating, it may be the same as the embodiments of Figures 3, 5 and 7, the duplicated detailed description will be omitted.

Referring to FIG. 7, as a film forming apparatus 400 to be applied to the manufacturing method 4, the powder supply unit 410 of the film forming apparatus 400 is divided into first and second powder supply units 412 and 414. Lose.

The first powder supply unit 412 supplies the ceramic powder 26 to the powder spraying unit 420, and the second powder supply unit 414 supplies the sealing organic powder 46 from the powder spraying unit 420. It sprays with the said ceramic powder 26 sprayed. In this case, the first powder supply part 412 is connected to the powder spraying part 420 through a supply line 430. In addition, the second powder supply part 414 extends through the spray line 440 to the ceramic powder 26 sprayed from the powder spraying part 420.

Accordingly, referring to the process of forming the thermal spray coating film CL on the base material M using the film forming apparatus 400, first, the thermal spray coating film on each of the first and second powder supply parts 412 and 414. The ceramic powder 26 for forming CL and the organic powder 46 for sealing are prepared.

Subsequently, the ceramic powder 26 is supplied from the first powder supply part 412 to the powder spraying part 420 through the supply line 430. Subsequently, the ceramic powder 26 is sprayed on the base material M from the powder spraying part 420 to form the thermal spray coating film CL.

At this time, the organic powder 46 is injected from the second powder supply unit 414 to the ceramic powder 26 sprayed through the spray line 440. As a result, the ceramic powder 26 and the organic powder 46 sprayed in front of the base material M are mixed. That is, the thermal spray coating layer CL is formed in a state in which the organic powder 46 is mixed with the ceramic powder 26.

Here, the particle diameter ratio of the ceramic powder 26 and the organic powder 46 may be about 1: 0.3 to 0.8 as in the embodiment of FIG. In addition, the content ratio of the ceramic powder 26 and the organic powder 46 may also be about 1: 0.2 to 0.5.

As such, when the ceramic powder 26 is sprayed from the powder spraying portion 420, the organic powder 46 for sealing is sprayed onto the sprayed ceramic powder 26 to form the thermal spray coating layer CL. By doing so, the sealing treatment step can be eliminated.

Warrior Of coating film  Evaluation of the surface

8 is a photograph showing the surface of the thermal spray coating film obtained by the method of FIG.

Referring to Figure 8, among the embodiments of the present invention as a thermal spray coating film obtained by performing the manufacturing process according to the method of Figure 6, the thermal spray coating film is obtained by thermal spray coating on the base material powder mixed ceramic powder and organic powder It was.

Thus, as a result of confirming the surface of the thermal spray coating film, it can be seen that the surface of the thermal spray coating film was first treated through the surface texture of the thermal spray coating film.

Warrior Of coating film  Evaluation of the cut plane

9 is a photograph showing a cut surface of the thermal spray coating film obtained by the method of FIG.

Referring to Figure 9, among the embodiments of the present invention as a thermal spray coating film obtained by performing the manufacturing process according to the method of Figure 6, it was obtained through the same process as the thermal spray coating film in FIG.

Thereafter, the obtained thermal spray coating film was exposed to the red ink for about 1 hour. Thus, as a result of confirming the cut surface of the sprayed coating film, it was confirmed that the sprayed coating film was completely sealed through the cut surface of the sprayed coating film appeared white instead of red.

Evaluation of permittivity

Table 1 below shows the measured data of the dielectric constant of the thermal spray coating film prepared according to the method of FIG. 6. More specifically, the dielectric constants of the case where the organic powder is added and the organic powder is not added as in the present invention are shown as the frequency of the voltage increases.

Referring to Table 1, when the organic powder is not added, the dielectric constant decreases as the frequency of the voltage increases, whereas the frequency of the voltage increases when the organic powder is added using the method of FIG. 6. Nevertheless, it was confirmed that the dielectric constant was kept constant.

As a result, the thermal spray coating of the present invention did not leak to the outside even with a voltage having a high frequency band, it can be seen that the sealing was well performed through the organic powder.

Leakage Current Evaluation

Table 2 below shows data obtained by measuring the leakage current of the thermal spray coating film prepared according to the method of FIG. 6 and photographed in FIGS. 8A and 8B. More specifically, leakage currents in the case of adding the organic material powder and in the case of not adding the organic material powder as shown in the present invention are shown as the voltage increases.

Referring to Table 2, when the organic powder is not added, more leakage current is generated as the voltage increases, whereas the voltage increases when the organic powder is added using the method of FIG. 6. It was confirmed that no leakage current was generated.

As a result, the thermal spray coating film of the present invention did not generate a leakage current even as the voltage was increased, and thus, the sealing coating was well performed through the organic powder.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

When the ceramic powder is sprayed on the base metal, the present invention described above can be used to exclude the sealing treatment process by applying the sealing organic powder in advance or by spraying the same with the ceramic powder.

1 is a view showing a spray coating powder according to an embodiment of the present invention.

2A and 2B are schematic views illustrating a method of manufacturing the spray coating powder shown in FIG. 1.

Figure 3 is a schematic diagram showing an embodiment of forming a thermal spray coating film using the spray coating powder of Figure 1;

FIG. 4 is a schematic flowchart illustrating a method of forming the thermal spray coating layer of FIG. 3.

Figure 5 is a schematic diagram showing another embodiment of forming a thermal spray coating film of the present invention.

Figure 6 is a schematic diagram showing another embodiment of forming a thermal spray coating film of the present invention.

7 is a schematic view showing another embodiment of forming a thermal spray coating film of the present invention.

8 is a photograph showing the surface of the thermal spray coating film obtained by the method of FIG.

9 is a photograph showing a cut surface of the thermal spray coating film obtained by the method of FIG.

<Explanation of symbols for the main parts of the drawings>

CL: thermal sprayed coating M: base material

10: spray coating powder 20: ceramic powder

30: sealing film 40: organic matter powder

100 film forming apparatus 110 powder supply unit

120: powder spraying unit

Claims (18)

Ceramic powders for thermal spray coatings; And Surrounding the outer surface of the ceramic powder and including a sealing film obtained by heat-treating the organic powder for sealing in the state surrounding the outer surface, The particle size ratio of the ceramic powder and the organic material powder is 1: 0.1 to 0.3 spray coating powder, characterized in that. delete The powder coating for thermal spraying of claim 1, wherein the content ratio of the ceramic powder and the organic powder is 1: 0.2 to 0.5. Preparing a ceramic powder for thermal spray coating; Coating a sealing organic material powder having a particle diameter ratio of 1: 0.1 to 0.3 on the outer surface of the ceramic powder; Heat-treating the organic powder applied to the outer surface of the ceramic powder; And Quenching the heat-treated organic material powder at room temperature for 0.01 to 2 seconds to form a sealing film on the outer surface of the ceramic powder, the hardness of which is momentarily strengthened, the spray coating powder. delete The method of claim 4, wherein the content ratio of the organic powder and the ceramic powder is 1: 0.2 to 0.5. 5. The method of claim 4, wherein the heat treatment temperature of the organic powder is 50 ° C. to 200 ° C. 6. delete  A thermal spray coating comprising a ceramic powder for thermal spray coating and a sealing film obtained by heat-treating the organic powder for sealing having a particle size ratio of 1: 0.1 to 0.3 with the ceramic powder surrounding the outer surface of the ceramic powder and surrounding the outer surface Preparing a powder for use; And Spraying the spray coating powder on the base material to form a spray coating film comprising the step of forming a spray coating film.  10. The method of claim 9, wherein the temperature of heat treatment of the organic powder is 50 ℃ to 200 ℃ manufacturing method of the spray coating film, characterized in that. Preparing a ceramic powder for spray coating and a sealing organic material powder having a mixing ratio of 1: 0.2 to 0.5; And Spraying the ceramic powder and the organic powder on a base material to form a spray coating film in which the ceramic powder and the organic powder are mixed. delete The method of claim 11, wherein the forming of the thermal spray coating film in which the ceramic powder and the organic powder are mixed comprises: Mixing the ceramic powder and the organic powder to form a mixed powder; And And spraying the mixed powder on the base material to form the thermal spray coating layer. The method of claim 13, wherein the particle diameter ratio of the ceramic powder and the organic powder is 1: 0.15 to 0.5. 12. The method of claim 11, wherein in the step of forming a thermal spray coating film of the ceramic powder and the organic powder is mixed, the thermal spray coating film sprays the ceramic powder on the base material and at the same time the organic material powder on the thermal sprayed base material Method of producing a spray coating film, characterized in that formed by spraying. 16. The method of claim 15, wherein a particle diameter ratio of the ceramic powder and the organic powder is 1: 0.3 to 0.8. The method of claim 11, wherein the forming of the thermal spray coating film in which the ceramic powder and the organic powder are mixed comprises: Spraying the ceramic powder on the base material; And Manufacturing the thermal spray coating film by spraying the organic powder onto the ceramic powder sprayed on the base material to mix the ceramic powder and the organic powder sprayed in front of the base material to form the thermal spray coating film. Way. 18. The method of claim 17, wherein a particle diameter ratio of the ceramic powder and the organic powder is 1: 0.3 to 0.8.

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