KR100862081B1 - A flexible printed circuits board of having the power supply apparatus - Google Patents

A flexible printed circuits board of having the power supply apparatus Download PDF

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Publication number
KR100862081B1
KR100862081B1 KR1020070000284A KR20070000284A KR100862081B1 KR 100862081 B1 KR100862081 B1 KR 100862081B1 KR 1020070000284 A KR1020070000284 A KR 1020070000284A KR 20070000284 A KR20070000284 A KR 20070000284A KR 100862081 B1 KR100862081 B1 KR 100862081B1
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South Korea
Prior art keywords
flexible printed
printed circuit
circuit board
power supply
stacked
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KR1020070000284A
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Korean (ko)
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KR20080063639A (en
Inventor
안효준
김기원
남태현
안주현
신휘범
조권구
조규봉
류호석
신원철
김종선
김동주
김동연
김익표
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경상대학교산학협력단
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Abstract

본 발명은 연성인쇄회로기판에 관한 것으로서, 연성인쇄회로기판(A)의 이면에 집전체(10), 상기 집전체(10) 위에 적층되는 양극(20), 상기 양극(20) 위에 적층되는 전해질층(30), 상기 전해질층(30) 위에 적층되는 음극(20'), 상기 음극(20') 위에 적층되는 집전체(10')가 순차적으로 적층되어 연성인쇄회로기판(A)의 이면에 전원장치(B)가 실장되고, 전원장치(B)가 실장된 연성인쇄회로기판(A) 전체가 고분자 보호층(C)으로 포장 도포되고, 상기 전원장치(B)를 구성하는 각 층이 아르곤 분위기의 글로브 박스(glove box) 내에서 스퍼터링법 또는 증착법 중 하나의 방법을 수행하는 진공박막형성 프로세서에 의해 증착 형성된 것임을 특징으로 하며, 연성인쇄회로기판 자체에 공급 전원을 구비할 수 있도록 연성인쇄회로기판의 뒷면에 유연성 전원장치를 실장하여 연성인쇄회로기판의 효율이 증가되고, 연성인쇄회로기판의 뒷면에 실장하는 전원장치를 가볍고 유연성을 갖도록 하여 그 제조공정이 간단하면서도 연성인쇄회로기판에 용이하게 채용할 수 있어 제품의 가격을 저렴하게 할 수 있는 각별한 장점이 있는 유용한 발명이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board, and includes a current collector 10, a positive electrode 20 stacked on the current collector 10, and an electrolyte stacked on the positive electrode 20 on a rear surface of the flexible printed circuit board A. FIG. The layer 30, the cathode 20 ′ stacked on the electrolyte layer 30, and the current collector 10 ′ stacked on the cathode 20 ′ are sequentially stacked on the rear surface of the flexible printed circuit board A. FIG. The power supply device B is mounted, the entire flexible printed circuit board A on which the power supply device B is mounted is packaged and coated with a polymer protective layer C, and each layer constituting the power supply device B is argon. And formed by a vacuum thin film forming processor which performs one of sputtering and vapor deposition in a glove box of an atmosphere, and the flexible printed circuit can be provided with a power supply to the flexible printed circuit board itself. Flexible printing by mounting a flexible power supply on the back of the board The efficiency of the furnace board is increased, and the power supply device mounted on the back of the flexible printed circuit board is light and flexible, so that the manufacturing process is simple and can be easily adopted for the flexible printed circuit board, thereby reducing the price of the product. It is a useful invention with particular advantages.

연성인쇄회로기판, 전원장치, 폴리이미드, 집전체. Flexible printed circuit boards, power supplies, polyimides, current collectors.

Description

전원장치를 구비한 연성인쇄회로기판{A flexible printed circuits board of having the power supply apparatus}A flexible printed circuits board of having the power supply apparatus

도 1은 본 발명 전원장치를 구비한 연성인쇄회로기판의 단면도,1 is a cross-sectional view of a flexible printed circuit board having a power supply of the present invention;

도 2는 본 발명 전원장치를 구비한 연성인쇄회로기판의 평면도,2 is a plan view of a flexible printed circuit board having a power supply of the present invention;

도 3은 본 발명에 따른 다수의 전원장치가 실장된 연성인쇄회로기판의 평면도,3 is a plan view of a flexible printed circuit board mounted with a plurality of power supplies according to the present invention;

도 4는 본 발명 전원장치를 구비한 연성인쇄회로기판의 일실시예를 나타낸 단면도,4 is a cross-sectional view showing an embodiment of a flexible printed circuit board having a power supply of the present invention;

도 5는 도 4에 나타낸 본 발명 전원장치를 구비한 연성인쇄회로기판의 평면도,FIG. 5 is a plan view of a flexible printed circuit board having the power supply device of the present invention shown in FIG.

도 6은 본 발명의 일실시예에 따른 전원장치의 충ㆍ방전 그래프이다.6 is a graph of charge and discharge of a power supply apparatus according to an embodiment of the present invention.

〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>

1 : 커버층 2 : Cu층1: cover layer 2: Cu layer

3 : 폴리이미드층 10, 10' : 집전체3: polyimide layer 10, 10 ': current collector

20 : 양극 20' : 음극20: anode 20 ': cathode

30 : 전해질층 A : 연성인쇄회로기판30: electrolyte layer A: flexible printed circuit board

B : 전원장치 C : 고분자 보호층B: power supply device C: polymer protective layer

본 발명은 전원장치를 구비한 연성인쇄회로기판(FPCB; flexible printed circuits board)에 관한 것으로서, 더욱 상세하게는 연성인쇄회로기판(FPCB; flexible printed circuits board)의 뒷면에 2차 전지로서 유연성의 전원장치를 스퍼터링 혹은 증착법을 통해 실장하고 연성인쇄회로기판 자체의 전력원으로 사용할 수 있도록 하며 전체를 고분자보호층으로 포장 도포하여 이루어진 전원장치를 구비한 연성인쇄회로기판에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (FPCB) having a power supply, and more particularly, to a flexible power supply as a secondary battery on the back of a flexible printed circuit board (FPCB). The present invention relates to a flexible printed circuit board having a power supply device which is mounted by sputtering or evaporation, which can be used as a power source of the flexible printed circuit board itself, and is packaged and coated with a polymer protective layer.

최근 전자제품들이 소형화, 경량화, 고기능화되는 추세에 따라 인쇄회로기판의 사용이 증가하고 있는데, 그 중에서도 연성인쇄회로기판은 재질이 유연하고 얇아서 좁은 공간에 효율적으로 회로를 구성할 수 있는 전자부품으로서의 작업성이 매우 뛰어나기 때문에 그 수요가 급증하고 있다.In recent years, the use of printed circuit boards is increasing due to the miniaturization, light weight, and high performance of electronic products. Among them, flexible printed circuit boards are flexible and thin, and thus, work as electronic parts that can efficiently construct circuits in narrow spaces. Because of the excellent sex, the demand is increasing.

또한 일반적으로 연성인쇄회로기판의 재질로는 동박과 방향족 폴리이미드 필름을 적층한 것을 사용함으로써 내열성, 내약품성, 기계적 강도 및 전기적 특성이 우수할 뿐만 아니라 치수 변경이 적어 여러 전자제품의 중요한 부품으로 많이 사용되며, 특히 디지털카메라, DVD플레이어, 핸드폰, 캠코드, 개인용 단말기, LCD 등 현재 부가가치가 높은 제품의 핵심부품으로서 주로 많이 사용된다.In general, the flexible printed circuit board is made of a laminate of copper foil and an aromatic polyimide film, which not only has excellent heat resistance, chemical resistance, mechanical strength and electrical properties, but also changes in dimensions, making it an important component of many electronic products. Especially, it is mainly used as a core part of high value-added products such as digital camera, DVD player, mobile phone, cam code, personal terminal, LCD and so on.

이와 같이 연성인쇄회로기판을 사용하는 각종 전자부품 들을 동작시키기 위한 전원은 지금까지 외부의 전지나, 외부의 AC전원을 통해서만 공급되었고, 연성인쇄회로기판 자체에는 전원공급원이 없으므로 메모리나 비메모리 전원, 백업(back) 전원, 대기전원으로 사용할 수 있는 자체 전원장치를 구비한 연성인쇄회로기판의 개발이 요구되는 실정이다.As such, power for operating various electronic components using the flexible printed circuit board has been supplied only through an external battery or an external AC power, and since the flexible printed circuit board itself has no power supply, memory, non-memory power, and backup There is a need for development of a flexible printed circuit board having its own power supply device that can be used as a back power source or a standby power source.

본 발명은 상기한 실정을 감안하여 발명한 것으로서, 본 발명의 목적은 연성인쇄회로기판 자체에 공급 전원을 구비할 수 있도록 연성인쇄회로기판의 뒷면에 유연성 전원장치를 스퍼터링 혹은 증착법을 통해 실장하고 연성인쇄회로기판 자체의 전력원으로 사용할 수 있도록 하며 전체를 고분자보호층으로 포장 도포하여 연성인쇄회로기판의 효율을 증가시킨 전원장치를 구비한 연성인쇄회로기판을 제공하는 데 있다.The present invention has been invented in view of the above-described circumstances, and an object of the present invention is to mount a flexible power supply device on the back of the flexible printed circuit board by sputtering or vapor deposition to provide a power supply to the flexible printed circuit board itself, and to provide flexibility. The present invention provides a flexible printed circuit board having a power supply device that can be used as a power source of the printed circuit board itself, and is packaged and coated with a polymer protective layer to increase the efficiency of the flexible printed circuit board.

본 발명의 다른 목적은 연성인쇄회로기판의 뒷면에 실장하는 전원장치를 가볍고 유연성을 갖도록 하여 그 제조공정이 간단하면서도 연성인쇄회로기판에 용이하게 채용할 수 있어 제품의 가격을 저렴하게 할 수 있는 전원장치를 구비한 연성인쇄회로기판을 제공하는 데 있다.Another object of the present invention is to provide a power supply device mounted on the back of the flexible printed circuit board to be light and flexible, so that the manufacturing process is simple and can be easily employed in the flexible printed circuit board to reduce the price of the product There is provided a flexible printed circuit board having a device.

상기한 목적을 달성하기 위한 본 발명 전원장치를 구비한 연성인쇄회로기판은 연성인쇄회로기판의 이면에 집전체, 상기 집전체 위에 적층되는 양극, 상기 양극 위에 적층되는 전해질층, 상기 전해질층 위에 적층되는 음극, 상기 음극 위에 적층되는 집전체가 순차적으로 적층되어 연성인쇄회로기판의 이면에 전원장치가 실장되고, 전원장치가 실장된 연성인쇄회로기판 전체가 고분자 보호층으로 포장 도포되어 이루어지고, 상기 전원장치를 구성하는 각 층이 아르곤 분위기의 글로브 박스내에서 스퍼터링법 또는 증착법 중 하나의 방법을 수행하는 진공박막형성 프로세서에 의해 증착 형성된 것임을 특징으로 한다.A flexible printed circuit board having a power supply device of the present invention for achieving the above object is a current collector on the rear surface of the flexible printed circuit board, a positive electrode stacked on the current collector, an electrolyte layer stacked on the positive electrode, laminated on the electrolyte layer The negative electrode, and the current collectors stacked on the negative electrode are sequentially stacked so that a power supply device is mounted on the rear surface of the flexible printed circuit board, and the entire flexible printed circuit board on which the power supply device is mounted is coated and coated with a polymer protective layer. Each layer constituting the power supply device is deposited by a vacuum thin film forming processor which performs one of sputtering and vapor deposition in an argon atmosphere glove box.

이하, 첨부된 도면 및 바람직한 실시예를 참조하여 본 발명 전원장치를 구비한 연성인쇄회로기판을 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings and preferred embodiments will be described in detail a flexible printed circuit board having a power supply of the present invention.

도 1은 본 발명 전원장치를 구비한 연성인쇄회로기판의 단면도, 도 2는 본 발명 전원장치를 구비한 연성인쇄회로기판의 평면도, 도 3은 본 발명에 따른 다수의 전원장치가 실장된 연성인쇄회로기판의 평면도, 도 4는 본 발명 전원장치를 구비한 연성인쇄회로기판의 일실시예를 나타낸 단면도, 도 5는 도 4에 나타낸 본 발명 전원장치를 구비한 연성인쇄회로기판의 평면도, 도 6은 본 발명의 일실시예에 따른 전원장치의 전압에 대한 용량 그래프로서, 본 발명 전원장치를 구비한 연성인쇄회로기판은 연성인쇄회로기판(A)의 이면에 집전체(10), 상기 집전체(10) 위에 적층되는 양극(20), 상기 양극(20) 위에 적층되는 전해질층(30), 상기 전해질층(30) 위에 적층되는 음극(20'), 상기 음극(20') 위에 적층되는 집전체(10')가 순차적으로 적층되어 연성인쇄회로기판(A)의 이면에 전원장치(B)가 실장되고, 전원장치(B)가 실장된 연성인쇄회로기판(A) 전체가 고분자 보호층(C)으로 포장 도포된 구성으로 이루어져 있다.1 is a cross-sectional view of a flexible printed circuit board having a power supply of the present invention, FIG. 2 is a plan view of a flexible printed circuit board having a power supply of the present invention, and FIG. 3 is a flexible printed circuit having a plurality of power supply devices mounted thereon according to the present invention. 4 is a sectional view showing an embodiment of the flexible printed circuit board including the power supply of the present invention, and FIG. 5 is a plan view of the flexible printed circuit board with the power supply of the present invention shown in FIG. Is a capacitance graph of the voltage of a power supply device according to an embodiment of the present invention, the flexible printed circuit board having a power supply device of the present invention is the current collector 10, the current collector on the back of the flexible printed circuit board (A) An anode 20 stacked on the anode 10, an electrolyte layer 30 stacked on the anode 20, a cathode 20 ′ stacked on the electrolyte layer 30, and a house stacked on the cathode 20 ′. The entire 10 'is stacked in sequence so that the flexible printed circuit board A A power supply (B) is mounted to the surface, the entire flexible printed circuit the power supply (B) a mounting substrate (A) consists of a coating consisting of a wrapping of a polymer protective layer (C).

미설명부호 1은 커버층, 2는 Cu층, 3은 폴리이미드층이고, 커버층(1)과 Cu층(2) 및 폴리이미드층(3)은 연성인쇄회로기판(A)의 이면 구성요소이다.Reference numeral 1 is a cover layer, 2 is a Cu layer, 3 is a polyimide layer, and the cover layer 1 and the Cu layer 2 and the polyimide layer 3 are backside components of the flexible printed circuit board A. to be.

본 발명은 연성인쇄회로기판(A)의 이면에 전원장치(B)를 실장한 것으로서, 상기 전원장치(B)의 전해질층(30)으로는 액체 전해액이나 고체 전해질을 모두 사용할 수 있으나, 전해액의 누설을 방지하기 위해 고분자의 고체 전해질을 사용하는 것이 바람직하다.According to the present invention, the power supply device B is mounted on the rear surface of the flexible printed circuit board A. The electrolyte layer 30 of the power supply device B may use either a liquid electrolyte or a solid electrolyte. It is preferable to use a polymer solid electrolyte to prevent leakage.

상기 전원장치(B)를 구성하는 각 층은 아르곤 분위기의 글로브 박스(glove box) 내에서 스퍼터링법, 이온도금법, 증착법 등의 진공박박형성 프로세서에 의해 층착되며, 전극(20, 20')은 각각 양극과 음극으로서 그 순서가 바뀌어도 된다.Each layer constituting the power supply device B is deposited by a vacuum thin film forming processor such as sputtering, ion plating, or vapor deposition in a glove box in an argon atmosphere, and the electrodes 20 and 20 'are respectively deposited. The order may be changed as the positive electrode and the negative electrode.

또한 상기 고분자 보호층(C)은 연성인쇄회로기판(A)과 유연성을 갖는 전원장치(B)를 보호하기 위해 사용되는 것으로서, 전원장치(B)가 실장된 연성인쇄회로기판(A) 전체를 포장 도포하여 외부로부터의 이물질의 접촉을 최소화하게 된다.In addition, the polymer protective layer (C) is used to protect the flexible printed circuit board (A) and the flexible power supply (B), the entire flexible printed circuit board (A) on which the power supply (B) is mounted. Packaging is applied to minimize the contact of foreign matter from the outside.

도 3은 본 발명에 따른 다수의 전원장치가 실장된 연성인쇄회로기판의 평면도로서, 도 3에 도시한 바와 같이 하나의 연성인쇄회로기판(A)의 이면에 다수의 전원장치(B)를 형성함으로써 필요에 따라 연성인쇄회로기판(A)의 용도와 기능에 맞게 다양하게 잘라서 사용할 수 있게 된다.FIG. 3 is a plan view of a flexible printed circuit board on which a plurality of power supply devices are mounted according to the present invention. As illustrated in FIG. 3, a plurality of power supply devices B are formed on a rear surface of one flexible printed circuit board A. FIG. By doing so, it is possible to cut and use variously according to the use and function of the flexible printed circuit board (A) as necessary.

도 4는 본 발명 전원장치를 구비한 연성인쇄회로기판의 일실시예를 나타낸 단면도, 도 5는 도 4에 나타낸 본 발명 전원장치를 구비한 연성인쇄회로기판의 평면도로서, 도 4 및 도 5에 도시한 본 발명 전원장치를 구비한 연성인쇄회로기판은 상기 전원장치(B)를 구성하는 각 층의 형성시에 양극(20)과 음극(20')의 적층 면적이 전해질층(30)의 적층 면적보다 작도록하고, 전해질층(30)을 사이에 두고 양극(20)과 음극(20')을 서로 엇갈리게 형성하여 양극(20)의 집전체(10)와 음극(20')의 집전체(10')를 서로 분리하여 형성하고, 전원장치(B)가 실장된 연성인쇄회로기판(A) 전체를 고분자 보호층(C)으로 도포 포장한 것이다.4 is a cross-sectional view showing an embodiment of a flexible printed circuit board having the power supply of the present invention, and FIG. 5 is a plan view of the flexible printed circuit board having the power supply of the present invention shown in FIG. In the flexible printed circuit board having the power supply device of the present invention, the stacking area of the anode 20 and the cathode 20 'is formed by stacking the electrolyte layer 30 when the respective layers constituting the power supply device B are formed. The current collector 10 of the positive electrode 20 and the current collector of the negative electrode 20 'are formed to be smaller than the area, and the positive electrode 20 and the negative electrode 20' are alternately formed with the electrolyte layer 30 therebetween. 10 ') are formed separately from each other, and the entire flexible printed circuit board A on which the power supply device B is mounted is coated and packaged with the polymer protective layer C.

다음으로 아래와 같이 본 발명 전원장치를 구비한 연성인쇄회로기판을 제조하고 전원장치의 충ㆍ방전전압에 대한 용량을 측정하여 도 6의 그래프로 나타냈다.Next, a flexible printed circuit board having the power supply device of the present invention was manufactured as shown below, and the capacity of the power supply device was measured and shown in the graph of FIG. 6.

연성인쇄회로기판 이면에 전원장치를 부착하기 위하여 먼저 연성인쇄회로기판으로 사용되는 Cu층(2)이 코팅된 폴리이미드층(3) 이면에 Cu 집전체(10)를 코팅 하고 DC 마그네트론 스퍼트링(magnetron sputtering)으로 전극(20)으로 실리콘을 1시간 동안 증착하였다. 실리컨 박막 전극의 특성을 보기 위하여 실리콘(20)/전해질(30)/리튬(20')으로 전지를 구성하엿다. 모든 공정은 아르곤 분위기의 글로브 박스(glove box) 내에서 실시하고, 제조된 전지의 충ㆍ방전 특성을 측정하여 그 결과를 도 6에 그래프로 나타냈다.In order to attach the power supply to the backside of the flexible printed circuit board, first, the Cu current collector 10 is coated on the backside of the polyimide layer 3 coated with the Cu layer (2), which is used as the flexible printed circuit board, and the DC magnetron sputtering ( Silicon was deposited on the electrode 20 by magnetron sputtering for 1 hour. In order to see the characteristics of the silicon thin film electrode, a battery was constructed of silicon (20) / electrolyte (30) / lithium (20 '). All processes were performed in the glove box of argon atmosphere, the charge / discharge characteristic of the manufactured battery was measured, and the result was shown graphically in FIG.

도 6으로부터 제조된 전지는 연성인쇄회로기판 자체 전원장치로서, 메모리나 비메모리 전원, 백업(back)전원, 대기전원으로 사용하기에 충분함을 알 수 있다.The battery manufactured from FIG. 6 is a flexible printed circuit board self power supply, and is sufficient to be used as a memory, a non-memory power supply, a backup power supply, and a standby power supply.

지금까지 본 발명을 바람직한 실시예로서 설명하였지만, 본 발명은 이에 한정되지 않으며, 발명의 요지를 이탈하지 않는 범위 내에서 다양하게 변형하여 실시할 수 있음은 물론이다.Although the present invention has been described as a preferred embodiment, the present invention is not limited thereto, and various modifications can be made without departing from the spirit of the invention.

상기한 바와 같이 본 발명은 연성인쇄회로기판 자체에 공급 전원을 구비할 수 있도록 연성인쇄회로기판의 뒷면에 유연성 전원장치를 스퍼터링 혹은 증착법을 통해 실장하고 연성인쇄회로기판 자체의 전력원으로 사용할 수 있도록 하며 전체를 고분자보호층으로 포장 도포하여 연성인쇄회로기판의 효율을 증가시키는 효과가 있고, 연성인쇄회로기판의 뒷면에 실장하는 전원장치를 가볍고 유연성을 갖도록 하여 그 제조공정이 간단하면서도 연성인쇄회로기판에 용이하게 채용할 수 있어 제품의 가격을 저렴하게 할 수 있는 각별한 장점이 있다.As described above, the present invention mounts a flexible power supply on the back side of the flexible printed circuit board by sputtering or vapor deposition so that the flexible printed circuit board may have a power supply, and may be used as a power source of the flexible printed circuit board itself. It is packaged and coated with a polymer protective layer to increase the efficiency of the flexible printed circuit board, and the power supply device mounted on the back of the flexible printed circuit board is light and flexible, so that the manufacturing process is simple and flexible printed circuit board. There is a special advantage that can be easily adopted to lower the price of the product.

Claims (4)

연성인쇄회로기판(A)의 이면에 집전체(10), 상기 집전체(10) 위에 적층되는 양극(20), 상기 양극(20) 위에 적층되는 전해질층(30), 상기 전해질층(30) 위에 적층되는 음극(20'), 상기 음극(20') 위에 적층되는 집전체(10')가 순차적으로 적층되어 연성인쇄회로기판(A)의 이면에 전원장치(B)가 실장되고, 전원장치(B)가 실장된 연성인쇄회로기판(A) 전체가 고분자 보호층(C)으로 포장 도포되어 이루어지고, 상기 전원장치(B)를 구성하는 각 층이 아르곤 분위기의 글로브 박스(glove box) 내에서 스퍼터링법 또는 증착법 중 하나의 방법을 수행하는 진공박막형성 프로세서에 의해 증착 형성된 것임을 특징으로 하는 전원장치를 구비한 연성인쇄회로기판.On the rear surface of the flexible printed circuit board A, a current collector 10, an anode 20 stacked on the current collector 10, an electrolyte layer 30 stacked on the anode 20, and the electrolyte layer 30. The negative electrode 20 'stacked above and the current collector 10' stacked on the negative electrode 20 'are sequentially stacked so that the power supply B is mounted on the rear surface of the flexible printed circuit board A. The entire flexible printed circuit board (A) mounted with (B) is packaged and coated with a polymer protective layer (C), and each layer constituting the power supply device (B) is in a glove box having an argon atmosphere. A flexible printed circuit board having a power supply, characterized in that formed by a vacuum thin film forming processor for performing one of the sputtering method or the deposition method. 제 1항에 있어서, 상기 전해질층(30)이 고분자의 고체 전해질인 것을 특징으로 하는 전원장치를 구비한 연성인쇄회로기판.The flexible printed circuit board as claimed in claim 1, wherein the electrolyte layer (30) is a polymer solid electrolyte. 삭제delete 제 1항에 있어서, 상기 전원장치(B)를 구성하는 각 층의 형성시에 양극(20)과 음극(20')의 적층 면적이 전해질층(30)의 적층 면적보다 작도록 하고, 전해질층(30)을 사이에 두고 양극(20)과 음극(20')을 서로 엇갈리게 형성하여 양극(20)의 집전체(10)와 음극(20')의 집전체(10')가 서로 분리되어 있는 것을 특징으로 하는 전원장치를 구비한 연성인쇄회로기판.The electrolyte layer according to claim 1, wherein the formation area of the anode 20 and the cathode 20 'is smaller than that of the electrolyte layer 30 at the time of forming each layer constituting the power supply device B. The positive electrode 20 and the negative electrode 20 'are alternately formed with the 30 interposed therebetween so that the current collector 10 of the positive electrode 20 and the current collector 10' of the negative electrode 20 'are separated from each other. A flexible printed circuit board having a power supply, characterized in that.
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JPH09260803A (en) * 1996-03-26 1997-10-03 Toshiba Battery Co Ltd Wiring board with cell
JP2004171964A (en) * 2002-11-20 2004-06-17 Sony Corp Circuit board, connection method of battery, and power supply device
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JPH09260803A (en) * 1996-03-26 1997-10-03 Toshiba Battery Co Ltd Wiring board with cell
JP2004171964A (en) * 2002-11-20 2004-06-17 Sony Corp Circuit board, connection method of battery, and power supply device
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