KR100841344B1 - Substrate spin apparatus - Google Patents

Abstract

A substrate spinning apparatus is provided to clean a substrate support pin after a substrate treating process by forming a spray hole toward the substrate support pin and arranging a tube along a hollow axis. A substrate spinning apparatus includes a carrier(110), a pin chuck(140), a substrate support pin(150), a back nozzle cap(130), and a flow path(170). The carrier supports a substrate and is rotated around a hollow axis. The spin chuck is arranged to be close to an edge of the carrier and supports an edge of the substrate. The substrate support pin is arranged to be close to a center of the carrier and supports a rear surface of the substrate. The back nozzle cap is arranged at the center of the carrier. A back nozzle, which sprays a treatment solution toward the rear surface of the substrate, is fixed on the back nozzle cap. The flow path is implemented inside the back nozzle cap and includes a spray hole for spraying a cleaning liquid toward the substrate support pin.

Description

Substrate Spin Device {SUBSTRATE SPIN APPARATUS}

1 is a cross-sectional view showing a substrate spin apparatus according to the prior art.

2 is a cross-sectional view illustrating a substrate spin device in accordance with an embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100; Substrate spin device 110; carrier

120; Hollow shaft 130; Bag nozzle cap

130a; Cap center 130b; Cap periphery

140; Spin chuck 140a; Spin Chuck Support

150; Substrate support pins 160; Bag nozzle

162; Bag nozzle piping 170; Euro

170a; Flow path nozzle 172; Euro piping

200; Substrate 200a; Front of the board

200b; Backside 200c of the substrate; The edge of the substrate

The present invention relates to a substrate spin apparatus, and more particularly, to a substrate spin apparatus for supporting and rotating a substrate.

In order to manufacture a semiconductor device, a multi-layered thin film is formed on a substrate such as a semiconductor wafer. In general, a substrate processing process such as an etching or a cleaning process is essentially adopted for forming a thin film. In the substrate treatment process using the treatment liquid, the thin film deposited on the back of the substrate acts as a foreign matter in a subsequent process, and thus the treatment liquid is also processed on the back of the substrate for the purpose of removing foreign matters such as unnecessary thin films.

It is common to use a substrate spin field as shown in FIG. 1 to treat the treatment liquid on the substrate back side. The substrate spin apparatus shown in FIG. 1 is employed in a substrate processing apparatus, such as a substrate cleaning processing apparatus, and is used to support and rotate a substrate.

Referring to FIG. 1, a conventional substrate spin apparatus 10 includes a rotatable carrier 11 that supports a substrate 20. The carrier 11 is rotated about the hollow shaft 12 by receiving the driving force of the spin motor and other driving units. On the carrier 11, a spin chuck 14 and a substrate support pin 15 for actually supporting the substrate 20 are provided. The substrate 20 is supported on the carrier 11 with the front side 20a facing up and the back side 20b facing downward. The substrate support pin 15 supports the rear surface 20b of the substrate 20 and the spin chuck 14 supports the edge 20c of the substrate 20.

In the hollow shaft 12, a back nozzle 16 for providing a processing liquid to the back surface 20b of the substrate 20 is provided. The bag nozzle 16 is fixed by the bag nozzle cap 13. When the substrate 20 is mounted on the carrier 11, the carrier 11 rotates and thus the processing liquid (eg, cleaning liquid) is sprayed from the back nozzle 16 toward the rear surface 20b of the rotating substrate 20. And (for example, washing).

In the conventional substrate spin apparatus 10, when the substrate support pin 15 is contaminated, there is a problem of recontaminating the substrate 20. Accordingly, there has been a conventional problem such as disassembling the substrate spin device 10 in order to clean the substrate support pin 15. As such, there is no conventional method for easily cleaning the substrate support pin 15 when the substrate support pin 15 is contaminated. Thus, a loss occurs in equipment maintenance and operation, and there is a problem in increasing the substrate throughput.

The present invention has been made to solve the above-mentioned problems in the prior art, an object of the present invention to provide a substrate spin apparatus that can easily clean the substrate support pin.

The substrate spin apparatus according to the present invention for achieving the above object is characterized in that the back nozzle cap has a cleaning flow path capable of injecting a cleaning liquid or a cleaning gas to the substrate support pin.

Substrate spin apparatus according to an embodiment of the present invention that can implement the above features, the carrier for supporting the substrate rotates about the hollow shaft; A spin chuck disposed proximate an edge of the carrier to support an edge of the substrate; A substrate support pin disposed proximate to a center of the carrier and supporting a rear surface of the substrate; A back nozzle cap disposed at the center of the carrier and having a back nozzle fixed to spray the processing liquid toward the rear surface of the substrate; And a flow path installed in the back nozzle cap and having a spray hole for spraying a cleaning fluid toward the substrate support pin.

In the present exemplary embodiment, the back nozzle cap includes a cap center part at which the back nozzle is located, and a cap peripheral part extending from the cap center part to be close to the substrate support pin and at which the injection hole is located.

In this embodiment, the spin chuck and the substrate support pin are each disposed in plural. The plurality of flow paths are arranged in the same number as the number of the plurality of substrate support pins so as to correspond to each of the plurality of substrate support pins. The injection port is opened toward the substrate support pin.

In the present embodiment, a back nozzle pipe connected to the back nozzle to provide the treatment liquid to the back nozzle and a flow path pipe connected to the flow path to provide the cleaning fluid to the flow path are installed in the hollow shaft. It is.

In the present embodiment, the cleaning fluid may include a cleaning gas including any one selected from nitrogen, air, inert gas, and a combination thereof; Contains any one of the washing | cleaning liquid containing ultrapure water

According to this invention, the flow path which injects a cleaning gas or a cleaning liquid in the direction of a board | substrate support pin is arrange | positioned in a back nozzle cap. Accordingly, the substrate support pin may be cleaned after the substrate treatment process is completed.

Hereinafter, a substrate spin apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, the present invention is well pointed out and claimed in the claims. However, the present invention may be best understood by reference to the following detailed description in conjunction with the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

(Example)

2 is a cross-sectional view showing a substrate spin apparatus according to an embodiment of the present invention. The substrate spin apparatus shown in FIG. 2 is adopted in a substrate processing apparatus capable of, for example, providing a processing liquid on the back side of the substrate to process the processing liquid on the back side of the substrate, for example, cleaning the back side of the substrate, and supporting the substrate. It can be used to rotate.

2, a substrate spin apparatus 100 according to an embodiment of the present invention includes a rotatable carrier 110 that supports a substrate 200, such as a silicon wafer, that can be used to fabricate a semiconductor memory device. . The carrier 110 may be designed to have a circular shape on a plane, for example. The carrier 110 is connected to the hollow shaft 120, the hollow shaft 120 transmits the driving force of the spin motor and other drive to the carrier 120 to rotate the carrier 120 about the hollow shaft 120 Let's do it.

The carrier 110 is provided with a spin chuck 140 and a substrate support pin 150 for actually supporting the substrate 200. The spin chuck 140 is disposed to be biased toward the edge of the carrier 110, and the substrate support pin 150 is disposed to be biased toward the center of the carrier 110 as compared to the spin chuck 140. A plurality of spin chucks 140 and substrate support pins 150 are preferably provided to stably support the substrate 200.

Each of the plurality of spin chucks 140 has a support thereon that is in actual contact with the edge 200c of the substrate 200. As the spin chuck 140 rotates, the support portion contacts the edge 200c of the substrate 200 so that the substrate 200 is supported by the spin chuck 140. The substrate support pin 150 supports the back surface 200b of the substrate 200. When the substrate 200 is transferred to the substrate spin apparatus 100, the spin chuck 140 supports the edge 200c of the substrate 200, and the substrate support pin 150 supports the rear surface 200b of the substrate 200. I support it. Accordingly, the substrate 200 is mounted on the carrier 110 such that the front surface 200a faces upward and the rear surface 200b faces downward.

In the hollow shaft 120, a back nozzle 160 is provided to provide a treatment liquid to the rear surface 200b of the substrate 200. The bag nozzle 160 receives a treatment liquid from the bag nozzle pipe 162 provided in the hollow shaft 120. The bag nozzle 160 is fixed by a bag nozzle cap 130 disposed on the carrier 110. The bag nozzle cap 130 is located at the center of the carrier 110. When the substrate 200 is mounted on the carrier 110, the carrier 110 rotates and thus the treatment liquid is injected from the back nozzle 160 toward the center of the rear surface 200b of the substrate 200 that rotates. Back surface 200b) is processed. In one example, the process may be a cleaning process for the back surface 200b of the substrate 200. The cleaning treatment liquid sprayed from the bag nozzle 160 may be, for example, ultrapure water (DIW).

The bag nozzle cap 130 may be designed to have a circular shape in plan. The back nozzle cap 130 may be divided into a cap center part 130a in which the back nozzle 160 is located, and a cap peripheral part 130b extending from the cap center part 130a toward the substrate support pin 150. The cap periphery 130b of the back nozzle cap 130 extends close to the substrate support pin 150. That is, the back nozzle cap 130 may be designed to have a larger diameter than in the related art. The back nozzle cap 130 extends from the cap center portion 130a toward the cap peripheral portion 130b to spray the cleaning fluid, that is, the cleaning liquid or the cleaning gas toward each of the plurality of substrate support pins 140, to form the substrate support pins 150. A plurality of flow paths 170 for cleaning are formed. The flow path 170 receives a cleaning liquid or a cleaning gas from the flow path pipe 172 provided in the hollow shaft 120. The number of flow paths 170 may be the same as the number of substrate support pins 150. It is preferable that the injection hole 170a of the flow path 170 is directed toward the substrate support pin 150 so that the cleaning liquid or the cleaning gas is easily injected to the substrate support pin 150. The cleaning liquid injected from the flow path 170 may be, for example, ultrapure water (DIW), and the cleaning gas may be any one selected from, for example, air, nitrogen (N ₂ ), and an inert gas, or a combination thereof.

The substrate spin device configured as described above operates as follows.

Referring back to FIG. 2, the substrate 200 is supported by the spin chuck 140 and the substrate support pin 150 on the carrier 110. At this time, the substrate 200 is supported such that its rear surface 200b faces downward and the front surface 200a faces upward. When the carrier 110 rotates and the substrate 200 rotates, a cleaning liquid such as ultrapure water is injected from the back nozzle 160 toward the rear surface 200b so that the rear surface 200b of the substrate 200 is cleaned. do. When the processing on the back surface 200b of the substrate 200 is completed, the rotation of the carrier 110 is stopped and the substrate 200 is detached from the carrier 110.

If the process for the substrate 200 is repeated several times, the substrate support pin 150 may be contaminated. When the substrate support pin 150 is contaminated, the cleaning liquid or the cleaning gas supplied through the flow path pipe 172 is injected through the injection port 170a to be provided to the substrate support pin 150. As a result, the substrate support pin 150 is cleaned. The cleaning process for the substrate support pin 150 may be performed every time the substrate 200 processing is completed, or may be performed when the processing of a plurality of substrates of a predetermined amount is completed, or the cleaning process may be performed every cycle. Can be.

The foregoing detailed description is not intended to limit the invention to the disclosed embodiments, and may be used in various other combinations, modifications, and environments without departing from the spirit of the invention. The appended claims should be construed to include other embodiments.

As described in detail above, according to the present invention, the substrate after the substrate processing process is completed by making a large diameter of the back nozzle cap to make a nozzle for injecting cleaning gas or cleaning liquid in the direction of the substrate support pin and constructing a pipe through the hollow shaft. The cleaning of the support pin may proceed. Accordingly, the contamination of the substrate support pins can be eliminated or prevented, so that recontamination to the substrate can be suppressed.

Claims (7)

A carrier supporting the substrate and rotating about a hollow axis; A spin chuck disposed proximate an edge of the carrier to support an edge of the substrate; A substrate support pin disposed proximate to a center of the carrier and supporting a rear surface of the substrate; A back nozzle cap disposed at the center of the carrier and having a back nozzle fixed therein for spraying the processing liquid toward the rear surface of the substrate; And A flow path installed in the back nozzle cap and having a spray hole for injecting a cleaning fluid toward the substrate support pin; Substrate spin device comprising a. The method of claim 1, And the back nozzle cap includes a cap center part at which the back nozzle is located and a cap peripheral part extending from the cap center part to be close to the substrate support pin and at which the injection hole is located. The method of claim 1, And a plurality of spin chucks and substrate support pins, respectively. The method of claim 3, And a plurality of flow paths are arranged to correspond to each of the plurality of substrate support pins, the plurality of passages being equal to the number of the substrate support pins. The method of claim 1, And the injection hole is opened toward the substrate support pin. The method of claim 1, A back nozzle pipe connected to the back nozzle to provide the treatment liquid to the back nozzle, and a flow path pipe connected to the flow path to provide the cleaning fluid to the flow path, in the hollow shaft. Device. The method of claim 6, The cleaning fluid may include a cleaning gas including any one selected from nitrogen, air, an inert gas, and a combination thereof; A substrate spin apparatus comprising any one of a cleaning liquid containing ultrapure water.

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