KR100839644B1 - 조명등 케이스의 금속코팅방법 - Google Patents
조명등 케이스의 금속코팅방법 Download PDFInfo
- Publication number
- KR100839644B1 KR100839644B1 KR1020060083647A KR20060083647A KR100839644B1 KR 100839644 B1 KR100839644 B1 KR 100839644B1 KR 1020060083647 A KR1020060083647 A KR 1020060083647A KR 20060083647 A KR20060083647 A KR 20060083647A KR 100839644 B1 KR100839644 B1 KR 100839644B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal
- lamp
- coating
- synthetic resin
- case
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (5)
- 삭제
- 삭제
- 삭제
- 하나의 챔버 내에서 스퍼터링과 진공증착 수단을 동시에 수행할 수 있는 증착법을 이용하여 합성수지상에 금속물질을 코팅하는 방법에 있어서,조명등 케이스 표면상에 이물질을 제거하기 위해 용제, 알카리, 에멀션, 및 전해약에 의해 깨끗하게 세척하는 단계, 상기 세척 후 건조시키는 단계, 상기 건조 후 조명등 케이스에 밀착성이 좋게 하기 위해 합성수지를 프라이머 처리하는 단계, 상기 처리 후 5 내지 20℃의 저온으로 2차 건조시키는 단계, 상기 건조 후 W, Mo, 스테인레스강 중에서 하나 이상 선택하여 금속물질을 조명등 케이스에 5 내지 30마이크로미터의 두께로 증착하는 단계, 상기 금속피막을 증착한 후 3차 건조시키는 단계로 이루어지는 것을 특징으로 하는 조명등 케이스의 금속코팅방법.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060083647A KR100839644B1 (ko) | 2006-08-31 | 2006-08-31 | 조명등 케이스의 금속코팅방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060083647A KR100839644B1 (ko) | 2006-08-31 | 2006-08-31 | 조명등 케이스의 금속코팅방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080020310A KR20080020310A (ko) | 2008-03-05 |
KR100839644B1 true KR100839644B1 (ko) | 2008-06-19 |
Family
ID=39395352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060083647A KR100839644B1 (ko) | 2006-08-31 | 2006-08-31 | 조명등 케이스의 금속코팅방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100839644B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190113049A (ko) | 2018-03-27 | 2019-10-08 | 하명순 | 멀티마스킹 지그장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000006904A (ko) * | 1999-11-11 | 2000-02-07 | 유흥상 | 진공증착 코팅장치와 그의 코팅방법 및 코팅 적층체 |
KR20000006965A (ko) * | 1999-11-16 | 2000-02-07 | 이경희 | 박막 제조 방법 및 제조 장치 |
KR20000059109A (ko) * | 2000-07-14 | 2000-10-05 | 문태호 | 전자파 차폐용 금속박막의 코팅장치 |
KR20040082254A (ko) * | 2003-03-18 | 2004-09-24 | (주)이오스테크놀로지 | 스파터와 진공 증착을 동시에 사용하여 플라스틱사출물에서의 전자기파 차폐를 위한 금속박막 및 증착방법 |
KR20050081485A (ko) * | 2004-02-13 | 2005-08-19 | 주식회사 이산바이오텍 | 전자파 차폐용 다층피막형성장치 |
-
2006
- 2006-08-31 KR KR1020060083647A patent/KR100839644B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000006904A (ko) * | 1999-11-11 | 2000-02-07 | 유흥상 | 진공증착 코팅장치와 그의 코팅방법 및 코팅 적층체 |
KR20000006965A (ko) * | 1999-11-16 | 2000-02-07 | 이경희 | 박막 제조 방법 및 제조 장치 |
KR20000059109A (ko) * | 2000-07-14 | 2000-10-05 | 문태호 | 전자파 차폐용 금속박막의 코팅장치 |
KR20040082254A (ko) * | 2003-03-18 | 2004-09-24 | (주)이오스테크놀로지 | 스파터와 진공 증착을 동시에 사용하여 플라스틱사출물에서의 전자기파 차폐를 위한 금속박막 및 증착방법 |
KR20050081485A (ko) * | 2004-02-13 | 2005-08-19 | 주식회사 이산바이오텍 | 전자파 차폐용 다층피막형성장치 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190113049A (ko) | 2018-03-27 | 2019-10-08 | 하명순 | 멀티마스킹 지그장치 |
Also Published As
Publication number | Publication date |
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KR20080020310A (ko) | 2008-03-05 |
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