KR100837217B1 - Isolator - Google Patents

Abstract

An isolator is provided to increase a heat transition by forming a heat transition unit on a body having a resistor or a resistor-mounted part having a ground resistor which by-passing a reverse current of a carrier wave. An isolator includes a main body(30), and a heat transition unit(100a,100b,100c). The main body has an insertion element unit composed of elements which implement transmission and modulation circuit of a carrier wave and a reverse-carrier wave. The heat transition unit is mounted on a resistor-mounted part of the main body having a resistor unit. The resistor unit is electrically coupled to the insertion element unit and removes the carrier wave. The heat transition unit is composed of at least one of a vertical closed hole, a horizontal closed hole and a closing/opening hole, or a combination of them. The vertical closed hole, the horizontal closed hole and the closing/opening hole are formed on a resistor-mounted body of an isolation element or the main body.

Description

Irreversible Circuitry {ISOLATOR}

1 shows a horizontally coupled split type irreversible circuit device according to the present invention,

(a) is a perspective view showing the assembled state

(b) is an exploded view showing the device structure

(c) is a structural diagram showing the assembled state

(d) is equivalent circuit diagram

FIG. 2 illustrates heat transfer means of a resistor mounted body in which a resistor is mounted in the separate irreversible circuit device of FIG. 1.

(a) is a configuration diagram showing a vertical closing hole as an example of the heat transfer means

(b) is a block diagram showing the opening and closing hole as another example of the heat transfer means

(c) is a block diagram showing a combined configuration of Figures 2a and 2b

(d) is a block diagram showing a horizontal closure hole as another example of the vertical closure hole and the heat transfer means of Figure 2a

3 illustrates another example of a vertically coupled split type irreversible circuit device according to the present invention.

(a) is a perspective view showing the assembled state

(b) is an exploded view of a main portion showing a resistance mounting body having a heat transfer means of the type shown in FIGS. 2a and 2d;

4A and 4B are exploded views showing the integrated irreversible circuit element according to the present invention, in which the heat transfer means is provided at the resistance mounting portion of the main body.

FIG. 5 is a diagram illustrating a non-reciprocal circuit device of the present invention having a conventional heat transfer means.

(a) is an essential part showing an integrated irreversible circuit element without a conventional heat transfer means

(b) is an essential part of an integrated irreversible circuit element of the present invention having a heat transfer means.

6 is a perspective view showing a form in which the heat transfer means of the present invention is provided in the main body in which the insertion element is mounted;

FIG. 7 shows a double isolator according to the present invention.

(a) is a perspective view of a horizontal fastening type separation type irreversible circuit element as shown in FIG.

(b) is a perspective view showing an integrated irreversible circuit element as shown in FIG.

Explanation of symbols on the main parts of the drawings

1,1 ', 1 ", 1a, 1" a .... Irreversible Circuitry

10 .... Insert element 30 .... Main body

40 .... Resistance mounted body

42 .... Resistance mounting area of main body or resistance mounting body

50 ... resistance measures

100a, 100b, 100c .... Heat transfer means (vertical closing hole, horizontal closing hole, opening and closing hole)

The present invention relates to an irreversible circuit isolator for stabilizing a wireless communication system by preventing a backflow of a transmission wave while being located in a wireless transmitter, and more particularly, to quickly realize heat dissipation of ground resistance, The shortening of the line of the grounding resistance leads to stabilization of the characteristics of the resistor, and the excess of the irreversible circuit element which improves the body solderability of the resistor.

The irreversible isolators known so far are located in a wireless transmission unit and are used in a system such as a mobile communication device such as a mobile phone or a base station equipment for wireless communication, and the output of the transmitting end by the circuit of the system and the reverse carrier. Electronic component to protect the system.

For example, a carrier is inevitably generated due to an error in circuit matching (impedance matching) while a transmission wave passes through each device connected in a system. If the part is designed to be irreversible circuit, and functionally likened to a kind of ammeter, it can be said to have a unidirectional characteristic of a diode.

Such irreversible circuit elements are used in a variety of wireless communication devices such as mobile phones such as cell phones, such as mobile phones from high-power systems (equipment) such as base station transmission apparatus, satellite broadcasting equipment.

That is, the irreversible circuit element is mounted between a transmission circuit component of a wireless communication device (equipment) or between a power amplifier module (PAM) and an antenna (antenna module) and grounded while bypassing a carrier wave (carrier signal source) carried by the antenna module. By removing it through the resistor, it protects the power amplifier module, which is a key component of the device.

Therefore, the grounding resistor mounted on the irreversible circuit device component for the reflection of the half wave is transferred to the device body of the thermal energy generated in the process of bypassing the carrier power and the resistance mounting portion. Ensuring the path of heat dissipation in the resistive ground plane has a significant impact on the product's electromagnetic characteristics.

However, the irreversible circuit device may be classified into an integrated nonreversible circuit device (one body type) (see FIG. 4) and a separate non-reversible circuit device (heat sink type) (see FIG. 1A).

For example, since an integrated irreversible circuit device uses one body, it is easy to manufacture and the production cost is low, but it is difficult to realize the electromagnetic characteristics of high output or low loss.

For example, in the case of an integrated irreversible circuit element, an iron-based (Fe) or an iron-based alloy (Ni) to facilitate the magnetic flux flow of a magnet (Sr-ferrte. Or metal) having a static magnetic field function inserted into the part. -Fe, etc.), the electrical resistance at the ground resistance is relatively high, and in this case, the amount of heat generated at the ground resistance at carrier removal tends to increase.

On the other hand, the separate irreversible circuit device is an element that improves the heat generation and the increase and decrease of the ground resistance value, the stabilization of the electromagnetic characteristics and the realization of the high output low loss characteristics.

For example, wireless communication technology (industrial) is rapidly developing and the frequency (fo) band of the radio wave used is extended to tens to hundreds of GHz. For the protection of the system, it is necessary to use a separate non-reciprocal circuit element having a high thermal resistance of the ground resistor mount (heat radiating ground body).

However, in the case of such a separate irreversible circuit element, when the main body of the separated resistor mounting body (body) on which the grounding resistor is mounted is subjected to fine twisting, the grounding resistance, for example, 50 Ω termination grounding resistor is mounted (mounting) The separation between the bottom surface of the resistive mounting body and the contact surface of the system body (main earth surface) on which the device is mounted causes the electromagnetic effect to be halved, resulting in deterioration of the thermal emission function and the electromagnetic characteristics of the product. In particular, there is a problem in that the manufacturing cost is higher than that of an integrated irreversible circuit element.

For example, instead of the separate irreversible circuit device having a high manufacturing cost, an integrated irreversible circuit device having a low manufacturing cost is used, and the heat generated at the ground resistance or the resistance mounting part when removing the carrier, which is the biggest problem in the integrated irreversible circuit device, is used. There is a need for a technology for an irreversible circuit device having an improved heat dissipation or heat transfer structure.

More preferably, there has been a demand for a technique capable of applying a heat transfer means to a separate irreversible circuit element.

 In addition, there has been a need for a technique that can be applied to a double isolator in which a body is extended and a plurality of insertion element portions and a plurality of resistors are mounted.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to minimize the heat transfer characteristics of the resistance generated by the ground resistance to the system body or the atmosphere (movement path) to improve the heat radiation characteristics of the resistance. In addition, it is possible to shorten the line of the grounding resistance, thereby to stabilize the characteristics of the grounding resistance, and to provide a non-reciprocal circuit element that improves the solderability of the resistance mounting portion of the grounding resistance by realizing the soldering surface portion of the grounding resistance. There is.

The present invention as a technical aspect for achieving the above object, as an irreversible circuit element for stabilizing a wireless communication system by preventing the reverse flow of the transmission wave, the element for implementing the transmission and carrier circuit of the carrier wave and the reverse flow of the transmission wave The main body is mounted to the insertion element portion consisting of; And,

Heat transfer means provided on at least a resistance mounting portion of the main body in which resistance means for removing carrier waves is electrically connected to the insertion element portion;

It provides a non-reversible circuit device configured integrally, including.

In addition, another technical aspect of the present invention provides an irreversible circuit element for stabilizing a wireless communication system by preventing a reverse flow of a transmission wave, wherein an insertion element including an element for implementing a transmission and a carrier circuit of a carrier reversed with a transmission wave is included. Main body mounted; And,

A heat transfer means provided at least in the resistance mounting portion of the resistance mounting body electrically coupled with the insertion element portion to remove the carrier wave and detachably coupled to the main body;

It provides a non-reciprocal circuit device configured to be separated, including.

Preferably, the heat transfer means is at least one of a vertical closing hole, a horizontal closing hole and an opening and closing hole formed in the main body of the integrated element or the resistance mounting body of the detachable element, or a combination thereof.

More preferably, at least one of the vertical closure hole, the horizontal closure hole, and the opening / closing hole of the heat transfer means is further provided with a non-ferrous metal or a high molecular material which enhances heat transfer resistance or resistance conductivity.

More preferably, the vertical closing hole, the horizontal closing hole and the opening and closing hole of the heat transfer means are configured to communicate toward the system body or the atmosphere in which the element is mounted.

At this time, the vertical closing hole and the horizontal closing hole of the heat transfer means may be configured to communicate at least inside the main body or the resistance mounting body.

In addition, a heat transfer means may be further provided in the main body in which the insertion element is mounted, and the heat transfer means of the main body may be provided as a vertical closing hole provided in the bottom of the element mounting part of the main body.

Herein, the main body of the integrated device or the main body of the detachable device and the separate resistor mounting body are extended so that a plurality of insertion element parts and resistance means are mounted, and the heat transfer means includes a resistance mounting part or a resistance mounting part of the body and its surroundings. It is also possible to be provided on the body of the.

In addition, the insertion element portion, a ferromagnetic material for applying a magnetic field to the ferrite, a pole piece for magnetic concentration and ferrite dielectric ground, and a specific capacitor through the inner conductor through the inside to implement the transmission wave by the magnetic field spin and It consists of a garnet ferrite element that implements a carrier wave and a carrier circuit, and an inner conductor having input, output, and ground terminals, and the insertion element part is covered with a cover.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

First, Fig. 1 and Fig. 2 show a separate irreversible circuit element 1 according to the present invention.

For example, the separate irreversible circuit element 1 of the present invention of FIGS. 1 and 2 is provided in a wireless transmission unit to prevent reverse flow of the transmission wave, thereby protecting the power amplifier module to stabilize the wireless communication system as a whole, while The grounding resistor 50 for removal is a horizontally coupled detachable irreversible circuit element mounted (mounted) on the resistor mounting body 40 that is separated from the main body 30 and coupled in a horizontal direction.

As described above, the split type irreversible circuit element 1 according to the present invention includes a main body 30 constituting the main body of the element and an insertion element portion 10 mounted thereon, as shown in FIGS. 1A to 1C. The ground resistor 50 is mounted on the main body 30 while being detachably coupled to the main body 10 and integrally mounted on the system body B (FIG. 1C) while the function of the ground plane generated from the ground resistance It can be divided into a resistor mounting body 40 having a heat dissipation function as a main function.

On the other hand, the insertion element unit 10 of the irreversible circuit element 1 of the present invention will be described.

That is, as shown in FIGS. 1B and 1C, the insertion element unit 10 is stacked to implement a transmission and carrier circuit of a normally transmitted transmission wave inputted and output in a wireless communication system and a carrier of reverse flow thereof. It consists of several devices.

First, a ferromagnetic material (magnetic element) (Magnet) 12, in which a pair is stacked on the upper and lower sides of the inner conductor 18, is a garnet ferrite element (or a ferrite and dielectric coupled element) (garnet ferrite) 16. It provides a function of applying a static magnetic field to the pair, the pair of pole pieces (14) arranged on the lower and upper side of the ferromagnetic material 12 (magnet) collects the magnetic force of the ferromagnetic material (112) By providing a function of smoothly transferring magnetic force to the garnet ferrite element 16, and at the same time, by providing a ground plane (G1 of FIG. 1D) for implementing a specific capacitor between the inner conductor and the garnet ferrite element. Ensure that the flow is implemented smoothly.

In addition, the garnet ferrite element 16 stacked above and below the inner conductor 18 inside the pole piece 14 is a garnet ferrite or a device in which a dielectric is bonded to the garnet ferrite. The L element and the C value of the capacitor are respectively formed between the conductors to implement the insertion element unit 10 with an LC filter structure to enable reversible transmission and irreversible transmission of radio waves, which are signal sources. The device is usually of ceramic material.

Next, the inner conductor 18 provides a function of a transmission source that enables radio wave transmission of a signal source, i.e., a transmission wave and a carrier wave, and such an inner conductor 18 includes an input terminal 18a to which an input signal is applied. An output terminal 18b for outputting a signal, and a ground terminal 18c electrically connected to the ground resistor 50 mounted on the resistor mounting body 40 to enable the removal of carrier waves.

Each of these terminals protrudes outside the main body through the terminal through grooves 31a, 31b, 31c cut in three directions of the main body 30, and is connected to the system and the ground resistance.

In addition, the thermal compensation plate 20 disposed on the upper ferromagnetic material 12 forms a magnetic path for implementing electrical characteristic values between the inner conductor 18 and upper and lower garnet ferrite elements 18. While performing the heat dissipation function to cool the heat generated in the element mounting portion 32 of the main body (30).

Finally, the cover 22 which is fastened to the screw portion 32a (FIG. 8) formed on the inner circumferential surface of the main body element mounting portion 32 is covered on the upper side of the thermal compensation plate 20.

Meanwhile, FIG. 1D illustrates an equivalent circuit for understanding the electrical characteristics of the insertion element unit 10.

That is, as illustrated in FIGS. 1B to 1D, a high frequency transmission signal is input to the input terminal 18a of the inner conductor 18, and at this time, the input terminal 18a and the ground G1 (pole piece) 14 are provided. An input capacitor C1 is implemented therebetween, and the output terminal 18b of the inner conductor is connected to an antenna module (not shown) so that the input high frequency signal is finally transmitted through the antenna, and at this time, the output terminal 18b and the ground The output capacitor C2 is implemented between the (pole pieces) 14.

In addition, the ground terminal 18c of the inner conductor 18 is electrically connected to the ground resistor 50 mounted on the resistor mounting body 40, and at this time, the ground terminal 18c and the pole piece 14 of the inner conductor. Ground capacitor C3 is implemented between G1 and G1.

Accordingly, the capacitor values implemented between the respective terminals 18a, 18b, 18c of the inner conductor 18 and the ground G1 implement a transmission or carrier circuit of radio waves transmitted through the inner conductor 18. Thus, transmission of the transmission wave and the carrier wave is performed so that the transmission wave is transmitted, and the carrier wave is absorbed and removed to be transmitted to the ground resistor 50 to prevent the reverse flow thereof.

As a result, the heat generated when the carrier is removed from the ground resistance 50 is preferably radiated from the resistor mounting body 40, which is a thermal effect of the insertion element 10 mounted on the main body 30. Most preferably, the thermal energy is transferred to the system body (B of FIG. 1C) or to the atmosphere when the system is mounted on the irreversible circuit element 1.

Next, FIG. 2 illustrates the improvement of the structure of the separate resistor mounted body 40 in the horizontally coupled split type irreversible circuit device 1 according to the present invention. Specifically, heat is applied to the resistor mounted body 40. It is to have a transition means (100a to 100c).

However, in the heat transfer means described below, the closed hole means that the resistance is mounted through the main body and the resistance mounting body and is closed when the irreversible circuit element is mounted on the system body (B). It means to include a space open to the side.

In addition, the separate irreversible circuit elements are divided into horizontally coupled and vertically coupled irreversible circuit elements 1 and 1 'as shown in FIGS. 2 and 3.

First, as shown in FIG. 2A, in the horizontally coupled irreversible circuit element 1 of the present invention, the heat transfer means is vertically penetrated at the resistance mounting portion (mounting surface) 42 of the resistance mounting body 40. It may be a vertical closing hole (100a).

In this case, as shown in FIG. 2A, the vertical closure hole 100a is a first thermal transition path through which heat generated from the ground resistance 50 is directly transferred to the system body B through the vertical closure hole 100a. Implement (B ').

Therefore, the first heat transition path B 'implemented as the heat transfer means of the vertical closing hole 100a provides the following advantages.

First, a plurality of vertical closing holes 100a are formed in the mounting portion 42 of the separate resistor mounting body 40 on which the ground resistor 50 is mounted, so that the heat generated from the ground resistor 50 is directly the system body ( B) In other words, since the system body made of metal or nonmetal is moved in the shortest path of movement, the shortest path of thermal path is realized, which allows rapid dissipation of ground resistance.

In addition, the line of the ground resistance with the system body (B) can be shortened, so that the characteristics of the ground resistance can be stabilized.

For example, the current generated in the resistance is moved by a surface effect moving along the surface of the resistance mounting body 40 and then along the inner surface of the hole in the vertical closing hole 100a, which is the heat transfer means. By being transferred directly to the system body, the line of resistance is shortened.

In addition, the vertical closing hole 100a of the present invention has a grounding resistance by multiplying the solder surface portion of the resistance mounting portion 42 of the resistance mounting body 40 on which the actual grounding resistor 50 is mounted (mounted). It can improve the solderability of

As described above, since the shortest path is directly connected to the system body, the transition path of the heat generated from the ground resistance is minimized, thereby minimizing the soldering time of the ground resistance, thereby reducing the thermal shock of the ground resistance.

Next, as shown in Figure 2b, in the horizontally coupled separate type irreversible circuit device 1 of the present invention, the heat transfer means may be an opening and closing hole (100b) provided in the resistance mounting body (40).

In this case, the opening and closing hole 100b simultaneously implements the first thermal transition path B 'leading to the system body and the second thermal transition path A' in the atmospheric direction.

Therefore, in this case, rather than the heat transfer means of the vertical closing hole (100a) of Figure 2a it will be possible to diversify the heat transfer path in the air direction to facilitate the heat dissipation.

Next, as shown in Figure 2c, it will be possible to include both the heat transfer means of the vertical closing hole (100a) and the opening and closing hole (100b) of Figures 2a and 2b.

Alternatively, as shown in FIG. 2D, it may be implemented by heat transfer means combining multiple closed holes, for example, a vertical closed hole 100a and a horizontal closed hole 100c.

In this case, the horizontal closing hole 100c may be preferable because the horizontal closing hole 100c communicates with the vertical closing hole 100a in the resistance mounting body to implement the second thermal transition path A 'in the atmospheric direction.

Next, FIG. 3 shows another form of the split type irreversible circuit element according to the present invention, for example, a vertically coupled split type irreversible circuit element 1 '.

As described above, in the vertically coupled split type irreversible circuit element 1 ′ of the present invention, as shown in FIGS. 3A and 3B, the resistance mounting body 40 is vertically connected to the connection body 60 extending from the main body 30. Combined structure.

However, the insertion element portion 10 is the same as that of FIG. 2, and the insertion element portion 10 is mounted on the element mounting portion 32 provided in the main body 30 of FIG. 3B.

Here, the specific configuration and function of the insertion element unit 10 is replaced with the description of FIG.

As shown in FIGS. 3A and 3B, the vertically coupled split type irreversible circuit device 1 ′ according to the present invention has a grounding resistor 50 connected to the main body 30 on which the insertion element part 10 is mounted. When the mounted resistance mounting body 40 mounts the irreversible circuit element 1 on the system body B, the resistance mounting body 40 is vertically coupled to the connection body 60 of the main body 30. Since the main body squeezes the resistor mounting body while the system element of the circuit element is mounted, the resistance mounting body 40 is tightly grounded to the system body (B), thereby improving the system body grounding property of the detachable and resistance mounting body. Let it be

Therefore, as shown in FIG. 3B, the vertically coupled split type irreversible circuit element 1 ′ according to the present invention also has the heat transfer means described above, that is, the vertical closing hole 100a and the opening and closing hole 100b and the horizontal closing. The ball 100c may be provided in the resistor mounting body 40.

Of course, it can be configured by combining the vertical and horizontal closing and opening and closing holes of the heat transfer means, which is shown in detail in Figure 3b, the function of which is replaced by the description of FIG.

That is, the vertical and horizontal closing holes and the opening and closing holes of the heat transfer means may be provided with a combination arrangement of one or two or more in the resistance mounting body.

3A and 3B, the resistor mounting body 40 includes heat generated by the heat transfer means, that is, vertical and horizontal closing holes 100a and 100c and opening and closing holes 100b. A first thermal transition path B 'which leads directly to the body B and a second thermal transition path A' which leads to heat transfer to the atmosphere are implemented.

Next, Fig. 4 shows an integrated irreversible circuit element 1 "according to the present invention. Only two types of integrated irreversible circuit elements 1" are shown in Figs. 4A and 4B. The characteristic configuration is the same.

That is, as shown in FIGS. 4A and 4B, the insertion element part 10 is mounted on the main body 30 to be sealed by the cover 22, and the terminal passage groove 31c is formed on one side of the main body 30. ), The resistor mounting portion 42 is integrally formed on the main body, and the ground resistor 50 is mounted.

Meanwhile, the main sea 30 of the integrated irreversible circuit element 1 ″ of FIG. 4 is an element mounting portion 30b that protrudes integrally so that the insertion portion 10 is disposed inside the body plate 30a and the center thereof. When the insertion element portion 10 is mounted therein, the cover 22 is structured to be assembled and fixed by the finishing blow of the upper edge of the element mounting body 30b.

At this time, as shown in FIG. 4, even in the case of the integrated irreversible circuit element 1 "of the present invention, the above-described heat transfer means, for example, the vertical closing hole 100a and the horizontal closing hole (not shown in FIG. 4). 2) and the opening and closing hole 100b are provided at the resistance mounting portion 42 of the body plate 30a of the main body 30, and the first heat transition path B 'facing the system body B and the atmosphere. The second thermal transition path A 'in the direction is implemented.

Therefore, the heat conduction path generated by the resistance is shortened and diversified, so that the heat transfer property is improved, and the heat dissipation is improved. To shorten the path.

On the other hand, in the integrated irreversible circuit element 1 ", the insertion element portion 10 is as described in Fig. 1B, and the detailed description thereof will be omitted. Only the temperature compensation plate 20 will be different from Fig. 1B. It is only.

Next, FIGS. 5A and 5B show the conventional integrated irreversible circuit element 1 "of the present invention described in FIG. 4 having a vertically closed hole 100a serving as a heat transfer means. Doing.

5A and 5B, a straight arrow indicates a heat release path to the atmosphere, a dashed-dotted arrow indicates a heat transfer path to the system body, and a 2-dot dashed arrow indicates Indicates a ground resistance conducting path.

Thus, in the conventional case of FIG. 5A, when the heat generated from the ground resistor 50 is provided in the integrated main body 30 with the resistance ground plane 42, the system body ( Heat is easily induced to B), but in the case of the present invention of FIG. 5B, a vertical closing hole 100a, which is a heat transfer means, is provided through the resistance ground portion 42 of the body 30, so that heat is transferred to the system body ( The transition is induced directly to B), so that the path of heat transfer is minimized so that the heat dissipation of the resistor is realized quickly.

In addition, in the case of the present invention of Figure 5b the direction of the resistive path is directly led to the system body (B) by the vertical closing hole (100a).

That is, the current generated in the ground resistance line, for example, the resistance is transmitted along the main body surface in the conventional case, but in the present invention through the vertical closing hole 100a of the heat transfer means (actually the surface of the inner surface of the vertical closing hole) Directly transferred to the system body (B) can be implemented to stabilize the characteristics of the ground resistance than conventional.

In addition, the soldering part becomes multifaceted at the time of resistance soldering by the vertical closing hole 100a, so that the solderability is also excellent.

As a result, since the heat transfer from the integral non-reciprocal circuit element having a lower manufacturing cost than the separate type to the main body on which the element is mounted is blocked in the present invention, it is to provide an integrated non-reciprocal circuit element having low cost and excellent device characteristics.

Meanwhile, the vertical and horizontal closing holes 100a and 100c and the opening and closing hole of the heat transfer means are provided in the separated or integrated irreversible circuit elements 1, 1 ', 1 "of the present invention described with reference to FIGS. The material 100b includes a non-ferrous metal such as copper (Cu) and aluminum (Al), and a polymer such as fluororesin having excellent thermal properties such as heat transfer induction and resistance conductivity. Filling or inserting the material is desirable to increase the heat transfer or resistance conductivity.

In this case, the resistance mounting body 40 of the separate type irreversible circuit element 1 (1 ') of FIGS. 2 and 3 or the resistance mounting portion 42 of the integrated irreversible circuit element 1 "of FIGS. Since there is no space in the main body 30 provided, the fabrication cost will be increased, but the structural rigidity will be improved, and the thermal transfer resistance and the resistance conductivity will also be improved.

Next, as shown in Figure 6, it is also possible to penetrate through the vertical closing hole (100a) of the heat transfer means through the bottom of the element mounting portion of the main body 30 in the irreversible circuit element of the present invention.

In this case, heat dissipation is effectively performed when heat is generated by magnetoresistance in the main body element mounting portion by the vertical closing hole 100a formed at the bottom of the element mounting portion 32 of the main body 30, and the insertion element portion 10 It will also improve the grounding of several devices.

6 illustrates only the horizontally fastening split type irreversible circuit device, but it is also applicable to the vertically fastening split type irreversible circuit device or the integrated irreversible circuit device described above.

Next, the resistive mounting body 40 coupled to the main body 30 in the separate irreversible circuit elements 1 and 1 ′ of FIGS. 2 and 3 has excellent thermal transition and does not generate corrosion even on its own. It is preferable to fabricate one of (Al), copper (Cu), copper-zinc (Cu-Zn) alloy iron, and iron-nickel (Fe-Ni) alloy.

Alternatively, the resistive mounting body 40 that is separated and coupled in the separate irreversible circuit element may be formed of the same material as the main body, for example, iron-based (Fe) material, which is not easily heat-transferred, but has a low grounding resistance on its surface. It will also be preferable to plate with silver (Ag), copper (Cu), and the like.

In addition, the resistance mounting body 40 of the present invention may be composed of a molded product manufactured by integrating iron (Fe) or iron-nickel (Fe-Ni) alloy powder and a polymer resin, and in this case, resistance While facilitating the fabrication of the mounting body 40, it will also stabilize the electromagnetic properties as well as the thermal transition.

Of course, the material is not necessarily limited thereto.

Next, as shown in FIGS. 7A and 7B, the discrete or integrated irreversible circuit elements of the present invention may have a pair of irreversible circuit elements in which a plurality of element insertion portions 10 are mounted and correspondingly, a plurality of resistors 50 are mounted. Of course, it is applicable to (1a) (1 "a) (double isolator).

In this case, although only the horizontal fastening type is shown as a separate type, the vertical fastening type separate circuit element is also possible.

On the other hand, referring to Figure 7b, the heat transfer means of the present invention, that is, the vertical, horizontal closing hole (100a) (100c) or opening or closing hole (100b) is not only the resistance mounting portion 42, but also the body, that is the body plate ( 30a) may be provided around the resistance mounting portion.

In this case, heat transfer or resistance line shortening will be more smoothly implemented.

Therefore, in a pair irreversible circuit element, when the main body 30 of the integrated element, that is, the body plate 30a or the main body 30 of the detachable element and the detachable resistor mounting body 40 is expanded, at least two or more insertion elements are provided. The unit 10 and the resistor 50 can be mounted.

At this time, at least one of the vertical closing hole (100a), the horizontal closing hole (100c) and the opening and closing hole (100b) or a combination thereof as the heat transfer means of the present invention, the resistance mounting portion 42 of the body as well as the expansion around the It can be provided in the extended portion of the body (30a) 40.

In this case, reference numeral 18d in FIG. 7 denotes a connection terminal of an internal conductor in a pair irreversible circuit element in which two insertion element units 10 are mounted, and one side and the other output and input terminals 18a and 18b are disposed at the center portion. It is connected.

According to such an irreversible circuit element of the present invention, the following excellent effects can be obtained.

First, heat transfer means can be smoothly implemented by forming heat transfer means at a resistance mounting portion or a separate resistance mounting body on which a ground resistor for bypassing the reverse flow of carrier waves is removed. Applicable to

That is, heat dissipation of the ground resistance is quickly and smoothly realized by shortening the movement path of the heat generated from the ground resistance.

In addition, the line of the ground resistance can be shortened, thereby enabling the stabilization of the characteristics of the ground resistance.

Next, the soldering surface of the grounding resistor is multifaceted by holes which are heat transfer means to improve the solder resistance mounting portion of the grounding resistance.

In particular, since the heat transfer from the integral non-reciprocal circuit element having a lower manufacturing cost than the separate type to the main body on which the element is mounted is blocked in the present invention, it is to provide a non-reciprocal circuit element having low cost and excellent device characteristics.

Therefore, the present invention can be applied to existing products without complicated structure, thereby providing a very practical irreversible circuit element, and excellent resistance grounding property and heat dissipation property in the resistance mounting part, thereby stabilizing the electromagnetic characteristics of the irreversible circuit element. This will also stabilize the operation of wireless communication systems.

While the invention has been shown and described in connection with specific embodiments so far, it will be appreciated that the invention can be varied and modified without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

Claims (10)

An irreversible circuit element for stabilizing a wireless communication system by preventing reverse flow of a transmission wave, A main body 30 on which an inserting element unit 10 composed of elements for implementing a transmission and carrier circuit of a carrier wave flowing backward with a transmission wave is mounted; And, Heat transfer means provided at least in the resistance mounting portion 42 of the main body in which the resistance means 50 is electrically connected to the insertion element portion to remove the carrier; An irreversible circuit element configured integrally, including. An irreversible circuit element for stabilizing a wireless communication system by preventing reverse flow of a transmission wave, A main body 30 on which an inserting element unit 10 composed of elements for implementing a transmission and carrier circuit of a carrier wave flowing backward with a transmission wave is mounted; And Heat transfer means provided at least in the resistance mounting portion 42 of the resistance mounting body 40 which is electrically connected to the insertion element portion and is equipped with a resistance means 50 for removing a carrier wave and detachably coupled to the main body. ; Irreversible circuit device configured as a separate type including. The vertically closed hole 100a or the horizontally closed hole 100c according to claim 1 or 2, wherein the heat transfer means is formed in the main body 30 of the integrated element or the resistance mounting body 40 of the separate element. And at least one of the opening and closing holes 100b or a combination thereof. The non-reciprocal circuit device according to claim 3, wherein at least one of the vertical closing hole, the horizontal closing hole, and the opening / closing hole of the heat transfer means is further provided with a non-ferrous metal or a polymer material to increase the heat transfer property or the resistance conductivity. . 4. The irreversible circuit element according to claim 3, wherein the vertical closing hole, the horizontal closing hole and the opening and closing hole of the heat transfer means are configured to communicate with the system body (B) on which the element is mounted or toward the atmosphere. 4. The irreversible circuit element according to claim 3, wherein the vertical closing holes (100a) and the horizontal closing holes (100C) of the heat transfer means are configured to communicate with each other at least inside the main body or the resistance mounting body. 3. The irreversible circuit element according to claim 1 or 2, wherein a heat transfer means is further provided on the main body on which the insertion element portion is mounted. 8. The irreversible circuit element according to claim 7, wherein the heat transfer means comprises a vertical closing hole (100a) provided at the bottom of the element mounting portion of the main body. The main body of the integrated device or the main body of the detachable device and the separate resistor mounting body are extended so that a plurality of insertion element portions and resistance means are mounted, and the heat transfer means includes resistance mounting of the body. Non-reciprocal circuit element, characterized in that provided on the portion 42 or the resistance mounting portion and the body around it. 3. The capacitor of claim 1, wherein the insertion element comprises a ferromagnetic material for applying a magnetic field to a ferrite, a pole piece for magnetic concentration and a dielectric ground of the ferrite, and a specific capacitor through an inner conductor therein. And a garnet ferrite element for implementing the transmission and carrier circuit of the transmission wave and the carrier by the magnetic field spin, and an inner conductor having input, output, and ground terminals, wherein the insertion element part is covered with a cover. device.

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