KR100813578B1 - Support bar for probe card - Google Patents

Abstract

A support bar for a probe card is provided to minimize thermal deformation of a support bar by forming slots on one surface of the support bar. A support bar(40) for a probe card(10) supports a plurality of probes(50) that come in contact with a pad of an object to be tested to transfer an electrical signal. A plurality of slots(48) are lengthwise formed on one surface of the body(42) of the support bar so that thermal deformation can separately occur in each section of the support bar. The slots can be formed in the lower surface of the body where the probes are installed.

Description

Support bar for probe card {SUPPORT BAR FOR PROBE CARD}

1 is a perspective view showing an example of a probe card to which the support bar according to the present invention is applied;

2 is a cross-sectional view partially showing a probe card to which a support bar according to the present invention is applied;

3 is a perspective view showing the configuration of a support bar and a probe according to the present invention;

Figure 4 is a front view showing the configuration of the support bar and the probe according to the present invention,

5 is a front view illustrating the thermal deformation of the support bar according to the present invention;

6 is a front view illustrating the thermal deformation of the support bar of the comparative example compared with the support bar according to the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

10: probe card 20: printed circuit board

22: pad 30: support ring

40: support bar 42: body

48: slot 50: probe

60: insulating resin

The present invention relates to a support bar for a probe card, and more particularly, to a support bar for a probe card for supporting probes for testing electrical characteristics of an object under test, such as a semiconductor device and a flat panel display.

Semiconductor devices are manufactured through many processes, such as manufacturing a wafer, testing a wafer, and packaging a die. The test of the wafer is a so-called electrical die sorting test for testing the electrical properties of semiconductor devices. In the electrical die sorting test, semiconductor devices are classified into good and bad by contacting the pads of the semiconductor device with the probes of the probe card to input and output an electrical signal.

In addition to testing semiconductor devices, the probe card can be used for data / gate in flat display cell processes such as thin film transistor-liquid drystal (TFT-LCD), plasma display panel (PDP), and organic electroluminescence (OEL). It is used for testing the line (Data / Gate Line).

Probe cards in many documents, such as US Pat. Nos. 7,150,095 and 7,138,812, disclose a technique in which needle type probes are connected to a printed circuit board. The probe card of these patent documents is equipped with a support for supporting the probes on a printed circuit board. The probes are fixed to the supporter by molding of insulating resin, for example, epoxy resin, and connected to the printed circuit board by soldering.

On the other hand, needle-type probes are made of tungsten with a diameter of 80 ~ 100㎛ in consideration of electrical conductivity and rigidity. The probes are supported along one side of the long support bar along the length direction, and the support bar is made of ceramic material for insulation. Due to the trend toward higher densities of semiconductor devices, the pitch of pads is reduced to 70-80 μm and manufactured, and the trend of miniaturization of patterns is rapidly progressing. Therefore, in order to test pads having a pitch of 70-80 μm by needle-type probes, probe cards are manufactured by arranging the probes in a stack structure of 2-3 stages.

However, in the prior art probe card including the probe card of the above patent documents, in order to stack and arrange the probes on one surface of the support bar, the epoxy resin should be fired at least twice according to the number of layers of the probes at a high temperature of about 30 ° C. In addition, when the epoxy resin is fired, heat deformation of the support bar is generated, which causes a problem in that the flatness and reliability of the probe card are greatly reduced.

In addition, the alignment of the probes after stacking the probes takes a lot of time, there is a problem that the productivity is reduced. In particular, since the burn-in test of the semiconductor device is performed at a high temperature of about 125 ° C., there is a problem that a poor connection between the probes and the pads occurs due to thermal deformation of the support bar during the burn-in test.

The present invention has been made to solve various problems of the prior art as described above, an object of the present invention is to minimize the thermal deformation of the support bar support for the probe card that can improve the productivity and flatness of the probe card In providing a bar.

Another object of the present invention is to provide a support bar for a probe card that can prevent a poor connection between pads and probes of an object to be improved in test reliability.

A feature of the present invention for achieving the above object is, in the support bar for a probe card for supporting a plurality of probes that are in contact with the pad of the test object to transfer the electrical signal, so that the thermal deformation is generated on each side of the body by section There is a support bar for a probe card in which a plurality of slots are formed along the longitudinal direction.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments associated with the accompanying drawings.

Hereinafter, preferred embodiments of the support bar for a probe card according to the present invention will be described in detail with reference to the accompanying drawings.

First, referring to FIGS. 1 and 2, the probe card 10 may include a printed circuit board 20, a support ring 30, a plurality of support bars 40, and a plurality of needle-type probes 50. Consists of The printed circuit board 20 is connected to the test head of the tester by a known Pogo Block and a Performance Board Unit. A plurality of pads 22 are formed on the bottom surface of the printed circuit board 20. The support ring 30 is mounted at the center of the lower surface of the printed circuit board 20, and a quadrangle for connecting the pads 22 and the probes 50 of the printed circuit board 20 to the center of the support ring 30. Hole 32 is formed.

1 to 4, the body 42 of the support bars 40 is formed to be thin and long so as to be arranged at equal intervals on the lower surface of the support ring 30. The support bars 40 may be made of an insulating material, for example, ceramic. A pair of through holes 44 are formed at both ends of the support bars 40. The pair of screws 46 are fastened to the support ring 30 through the through holes 44. The support bars 40 are firmly fixed to the lower surface of the support ring 30 by fastening the screws 46. The width and length of the support bars 40 may be appropriately changed as necessary.

A plurality of slots 48 are formed on the lower surface of the body 42 of the support bar 40 so as to face the width direction of the support bar 40 at intervals along the length direction. By the formation of the slots 48, the thermal deformation of the support bars 40 is generated for each section between the slots 48, thereby minimizing the thermal deformation of the support bar 40. 1 to 5, the slots 48 are formed on the bottom surface of the body 42 to which the probes 50 are mounted, but the slots 48 may be formed on the top and both sides of the body 42. have.

2 and 3, a plurality of probes 50 are arranged along a length direction on the bottom surface of each of the support bars 40. Each of the probes 50 has a horizontal fixing portion 52 disposed on the lower surface of the support bars 40, a connection terminal portion 54 bent upward at one end of the horizontal fixing portion 52, and horizontally. It is comprised by the contact terminal part 56 bent downward at the other end of the fixed part 52. As shown in FIG. The horizontal fixing part 52 is fixed to the lower surface of each of the support bars 40 by molding of the insulating resin 60, for example, epoxy resin. The end of the connection terminal portion 54 is connected to each of the pads 22 of the printed circuit board 20 by soldering. The end of the contact terminal portion 56 is in contact with the pads 4 of the inspected object 2, such as a wafer and a flat panel display, to input and output electrical signals.

A known space transformer and an interposer may be provided between the printed circuit board 20 and the probes 50. The space transformer is configured to arrange a plurality of probes at a fine pitch, and the space transformer may be configured of a multi-layer printed circuit board. The interposer is configured to transfer electrical signals between the printed circuit board and the space transformer and maintain flatness of the probe card.

On the other hand, in order to determine the amount of heat deformation due to heat deformation during the firing and burn-in test of the epoxy resin, the test bar of the Example and the support bar of the Comparative Example was tested under the same conditions. 5 and 6, the support bar 40 of the embodiment and the support bar 40 ′ of the comparative example differ only in whether the slots 48 are formed, and the rest of the configuration is manufactured in the same manner.

The support bar 40 of the example and the support bar 40 'of the comparative example are made of zirconia (Zrconia, ZrO ₂ ), which is a ceramic. The support bars (40, 40 ') made of zirconia have mechanical properties and volume resistivity 0.8 ㅧ 10 ¹² Ω㎝, dielectric constant 6.5 with flexural strength of 1,100 MPa, compressive strength of 3,000 MPa, modulus of elasticity of 210 GPa, hardness of 13 GPa, Poisson's ratio of 0.32. Has electrical properties. The thermal characteristics of the support bars 40 and 40 'are maximum operating temperature of 1,600 ℃, coefficient of thermal expansion of 9.5 ㅧ 10 ⁶ (200 ℃), thermal conductivity of 3W / mK, specific heat of 0.5 (J / gK, 20 ℃).

The heat deflection of the support bar 40 of the embodiment and the support bar 40 'of the comparative example was measured by the displacement (d, d') in the thickness direction when the heating was started at 20 ° C and reached 95 ° C. Indicated. 5 and 6 show the shape after thermal deformation for each of the support bar 40 of the embodiment and the support bar 40 'of the comparative example with a dashed-dotted line. In FIG. 5, four slots 48 are formed in the body 42 of the support bar 40. However, the number, depth, and spacing of the slots 48 may be minimized. May be changed as appropriate.

division Example Comparative example Displacement in the thickness direction (mm) 0.0951 0.11 d ′-d (mm) 0.0149

Referring to Table 1, the displacement d of the support bar 40 of the embodiment is 0.0951 mm, the displacement d 'of the support bar 40' of the comparative example is 0.11 mm, and the displacement d and the displacement d '. It can be seen that the difference of) is 0.0149mm ((14.9㎛). As a result, it can be seen that the support bar 40 of the embodiment is reduced by about 15.6% of the heat deformation compared to the support bar 40 'of the comparative example.

Thus, since the heat deformation of the support bar 40 is generated for each section by the formation of the slots 48, and the total heat deformation is minimized, the time required for the alignment of the probes 50 after mounting the probes 50 is greatly shortened. This improves the productivity and flatness of the probe card 10. In addition, poor connection between the pads 4 and the probes 50 of the inspected object 2 is prevented, thereby improving the reliability of the test.

The embodiments described above are merely illustrative of the preferred embodiments of the present invention, the scope of the present invention is not limited to the described embodiments, those skilled in the art within the spirit and claims of the present invention It will be understood that various changes, modifications, or substitutions may be made thereto, and such embodiments are to be understood as being within the scope of the present invention.

As described above, according to the support bar for a probe card according to the present invention, by forming slots on one surface of the support bar, thermal deformation of the support bar is minimized, thereby improving productivity and flatness of the probe card. In addition, the connection between the pads and the probe of the test object is prevented, thereby improving the reliability of the test.

Claims (2)

A support bar for a probe card for supporting a plurality of probes in contact with a pad of an object to transmit an electrical signal, A support bar for a probe card, in which a plurality of slots are formed along a longitudinal direction so that thermal deformation is generated for each section on one surface of the body. The support bar of claim 1, wherein the slots are formed on a bottom surface of the body on which the probes are mounted.

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