KR100810893B1 - Plane coating apparatus for cmp equipment - Google Patents

Abstract

CMP equipment flat coating apparatus of the present invention is to prevent the lifting of the pad from the platen, thereby preventing equipment accidents and wafer damage, the clamp portion provided on one side of the platen, the upper portion of the clamp portion A mounting portion configured to be adjustable in the horizontal direction in the first position, a coating position adjustable in the vertical direction at the tip of the mounting portion and configured to supply the coating, and disposed in front of the coating supply portion and perpendicular to the coating supply portion. It is comprised by the flat part comprised so that position adjustment is possible in the direction.

Lip, platen, coating, rip

Description

Flat coating equipment for CMP equipment {PLANE COATING APPARATUS FOR CMP EQUIPMENT}

1 is an overall configuration diagram of a flat coating device for CMP equipment according to the present invention,

2 is a perspective view of the clamp portion,

3 is a perspective view of a mounting portion for mounting the flat portion and the coating supply portion to the clamp portion,

4 is a perspective view of the coating supply unit,

5 is a perspective view of the flat portion,

6 is a perspective view of the coating remover.

The present invention relates to a flat coating device for CMP equipment, and more particularly, to a flat coating device for CMP equipment to remove the corroded portion of the outer surface of the platen and to coat the coating again.

In general, in the manufacturing process of a semiconductor device, the surface of the wafer having a multi-stage metal layer is planarized by a mechanical chemical reaction is called a chemical mechanical polishing (CMP) process.                         

The CMP equipment for this CMP process consists of three platens and four heads are mounted on the cross body in the center part. Therefore, the head loads the wafer and rotates from side to side to perform the polishing process on each platen.

The platen has a pad attached to its upper surface, and the wafer is mechanically and chemically polished by spraying an abrasive called slurry. The head is configured to load and unload wafers in Head Cup Loading Unloading (HCLU).

The head loaded with the wafer from the HCLU is rotated to one side to first polish the wafer on the first platen, and then further rotated in the same direction to secondly polish the second platen. After the secondary polishing is finished, the head is further rotated in the same direction to polish the wafer at the buffing pad of the third platen. After tertiary polishing, the head rotates to the opposite side and moves to HCLU to unload the wafer. The wafer enters the cleaner by the robot and is cleaned.

The surface of the platen is coated in a circle. Since the pad is attached to this coated surface, the pad is hardly separated from the platen surface by the strong adhesive force.

However, due to the weak acidity of the slurry, for a long time of use, the surface portion of the coated platen is corroded, causing the slurry to flow between the surface of the platen and the pad, which causes staining.

As a result, a rip phenomenon occurs at the edge of the platen, in which the pad is lifted.

If this lip phenomenon is severe, the head crosses and hits the pad, causing equipment accidents and wafer breakage.

The present invention is to solve the above problems, an object of the present invention is to provide a flat coating device for CMP equipment to prevent the lifting of the pad from the platen, thereby preventing equipment accident and wafer breakage have.

Flat coating apparatus for CMP equipment according to the present invention,

Clamp part installed on one side of the platen,

A mounting part configured to be adjustable in a horizontal direction from above the clamp part;

A coating supplier configured to supply a coating and position adjustable in a vertical direction at the tip of the mounting unit;

And a flat part disposed in front of the coating supply part and configured to be adjustable in a vertical direction in the coating supply part.

The mounting portion is a vertical member installed vertically on the clamp portion,

An inclined member installed inclined on the side clamp portion of the vertical member,

First and second horizontal guides provided horizontally on top of the vertical member and the inclined member, and                     

It is comprised by the horizontal member which is moved in the said 1st, 2nd horizontal guide inside, and is fixed by the fixing screw provided in the 1st, 2nd horizontal guide.

The coating supply part is moved in the horizontal direction to the mounting portion is fixed by the fixing screw, the horizontal / vertical guide is formed to be mounted in the vertical direction, and

It consists of a tank jig provided with a coating tank which is moved in a vertical direction to the horizontal / vertical guide and fixedly installed by a fixing screw, and which supplies a coating material therein.

The flat portion is clamped to a fixed position in the vertical direction to the coating supply,

A housing mounted to the front end of the clamp to be adjustable in a horizontal direction;

The housing includes a flat member installed in the vertical direction by having an elastic member embedded in the vertical direction and having a control screw for adjusting the position in the vertical direction at the upper end thereof.

In addition, the planar coating device for the CMP equipment further includes a coating removal unit which is installed in a controlled position toward the side of the platen from the side of the clamp portion.

The coating removal unit is a clamp fixed to a position adjusted in the vertical direction in the clamp portion, and

It includes a removal member mounted to the front end of the clamp to be adjustable in the lateral direction.                     

Advantages and advantages of the present invention will be more apparent from the following detailed description based on the accompanying drawings.

1 is an overall configuration diagram of a flat coating device for CMP equipment according to the present invention, the surface of the platen is oxidized by prolonged use, the adhesive strength with the pad is weakened, due to this weakening phenomenon the head crosses the platen It is configured to solve all the problems caused when the outer edge of the surface hit the excited pad.

The planar coating device for the CMP equipment is largely composed of a configuration including a clamp portion (A), a mounting portion (B), a coating supply portion (C), a flat portion (D) and a coating removal portion (E), platen The outer surface of (1) is scraped off of the oxidized slurry and the coating can be newly coated.

The clamp portion A constitutes the basis of the present flat coating apparatus and is provided on one side of the platen 1. This clamp portion (A) is fixed to the pillar (3) provided on one side of the platen (1).

This clamp portion A has a jaw 5 for fixing the device to the column 3 as shown in FIG. 2, and a handle 7 of a screw structure for adjusting the distance of the jaw 5. have. That is, as the handle 7 is operated clockwise and counterclockwise, the jaw 5 is installed or released on the pillar 3.

The attachment part B is provided above the clamp part A comprised in this way. The mounting portion (B) is adjustable in the horizontal direction from above the clamp portion (A), and the coating portion (C), the flat portion (D) and the coating removing portion (E) described above on the clamp portion (A). ) Is configured to install.

This mounting part B is comprised from the vertical member 9, the inclined member 11, the 1st, 2nd horizontal guides 13 and 15, and the horizontal member 17, as shown in FIG.

The vertical member 9 is vertically provided on the clamp part A, and the inclined member 11 is provided inclined on the clamp part A which is a side of the vertical member 9. The vertical member 9 and the inclined member 11 are one embodiment of a structure capable of stably supporting the horizontal member 17.

In addition, the 1st, 2nd horizontal guides 13 and 15 are integrally provided in the horizontal state at the upper end of the vertical member 9 and the inclination member 11, respectively. The horizontal members 17 are provided in the first and second horizontal guides 13 and 15.

The horizontal member 17 is horizontally moved and positioned inside the first and second horizontal guides 13 and 15, and is fixed by the fixing screw 19 provided in the first and second horizontal guides 13 and 15. It is fixed at the set position.

The coating material supply part C is provided in the front-end | tip of the mounting part B comprised in this way. This coating supply part (C) is comprised so that the outer part of the platen 1 may supply the coating to be newly coat | covered in this state in the state which removed the oxidized slurry.

This coating supply part (C) is composed of a horizontal / vertical guide 21 and the tank jig 23, as shown in Figure 4 to supply the coating is positioned in the vertical direction at the front end of the mounting portion (B) have.                     

The horizontal / vertical guide 21 is moved in the horizontal direction to the horizontal member 17 of the mounting portion B, is fixedly installed by the fixing screw 25, and is formed to be mountable in the vertical direction.

The tank jig 23 mounted on the horizontal / vertical guide 21 is configured to be moved in a vertical direction from the horizontal / vertical guide 21 and fixedly installed at a position moved by the fixing screw 25. .

The tank jig 23 is provided with a coating tank 27. This coating tank 27 is configured to be able to supply a coating for coating the platen (1).

The flat part D is provided in front of the coating supply part C comprised in this way. This flat portion (D) is configured to be able to adjust the position in the vertical direction in the coating supply (C).

This flat portion D is composed of a clamp 29, a housing 31, and a flat member 33, as shown in Figure 5 to supply the outer surface of the upper surface of the platen 1 in the coating supply (C) The resulting coating is evenly distributed.

The clamp 29 is configured to be positioned in a direction perpendicular to the tank jig 23 of the coating supply part C and fixed at a position adjusted by the fixing screw 35.

The housing 31 is configured to be pivoted in the horizontal direction at the tip of the clamp 29 so that it can be fixed in a position adjusted by the fixing screw 35.

The flat member 33 is configured to widely distribute the coating supplied to the portion while elastically contacting the platen 1 toward the outer surface of the upper surface of the platen 1 from the lower side of the housing 31.

That is, the flat member 33 is elastically supported in the vertical direction by the elastic member 37 embedded in the housing 31, and the elastic force of the elastic member 41 by the adjustment screw 39 provided at the upper end thereof. Overcoming, the vertical position is adjusted.

On the other hand, the flat coating apparatus of the present invention further includes the above-described coating removing unit (E). This coating removal portion (E) is provided on the side of the clamp portion (A) and positioned toward the side of the platen (1), and is supplied from the coating supply (C) to the outside of the upper surface of the platen (1) It is configured to remove the coating that has been coated and flowed down to the side of the platen 1.

As shown in FIG. 6, the coating removal unit E is composed of a clamp 43 and a removal member 45. The coating remover E composed of the clamp 43 and the removing member 45 has a structure similar to the flat part D described above.

The clamp 43 is fixedly fixed to the platen 1 side of the clamp portion A by means of a fixing screw 47 so that the clamp portion A can be positioned in the vertical direction.

The removal member 45 is attached to the distal end of the clamp 43 by a fixing screw 47 so as to be positioned in the lateral direction of the platen 1 at the distal end of the clamp 43. The removing member 45 may be configured to interpose the housing 31, the elastic member 41, and the adjusting screw 39 like the flat member 33.

The process of coating the coating on the outer surface of the platen 1 with the flat coating device for CMP equipment configured as described above is as follows.

First, the corroded slurry on the outer surface of the upper surface of the platen 1 is removed.

The flat coating apparatus of this embodiment is installed on the side of the platen 1 using the clamp portion A. FIG.

The adjusting member 39 of the mounting portion B, the coating supply portion C, and the flat portion D is adjusted to lower the flat member 33 on the outer upper surface of the platen 1.

At the same time, by removing the coating (E) to remove the removal member 45 is located on the side of the platen (1).

In this state, when the platen 1 rotates to supply the coating, the coating is widely coated on the outer surface of the upper surface of the platen 1. At this time, the rotational speed of the platen 1 is suitably about 5rpm in which the coating can be properly spread without being scattered by centrifugal force.

After coating, the platen 1 is idled to dry the coating.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

As described above, the planar coating device for CMP equipment of the present invention removes the corroded slurry on the outer surface of the platen in advance and coats the coating on the portion, thereby weakening the adhesive force of the pad due to oxidation of the coating portion, thereby causing the pad to lift. It can prevent the lip phenomenon, and also reduce equipment accidents and wafer breakage, such as the head hitting the excited pad, and improve the equipment operation rate and yield.

Claims (6)

Clamp part installed on one side of the platen, A mounting part configured to be adjustable in a horizontal direction from above the clamp part; A coating supplier configured to supply a coating and position adjustable in a vertical direction at the tip of the mounting unit; Flat coating apparatus for CMP equipment is disposed in front of the coating supply and comprises a flat portion configured to be adjustable in the vertical direction in the coating supply. The method according to claim 1, The mounting portion is a vertical member installed vertically on the clamp portion, An inclined member installed inclined on the side clamp portion of the vertical member, First and second horizontal guides provided horizontally on top of the vertical member and the inclined member, and Planar coating apparatus for CMP equipment comprising a horizontal member which is moved inside the first and second horizontal guides and is fixed by a fixing screw provided in the first and second horizontal guides. The method according to claim 1, The coating supply part is moved in the horizontal direction to the mounting portion is fixed by the fixing screw, the horizontal / vertical guide is formed to be mounted in the vertical direction, and And a tank jig having a coating tank configured to move in a vertical direction to the horizontal / vertical guide to be fixed by a fixing screw and to provide a coating material therein. The method according to claim 1, The flat portion is clamped to a fixed position in the vertical direction to the coating supply, A housing mounted to the front end of the clamp to be adjustable in a horizontal direction; Built-in elastic member in the vertical direction in the housing and a flat coating device for CMP equipment comprising a flat member installed in the vertical direction with a control screw for adjusting the position of the vertical direction on the top. The flat coating apparatus of claim 1, further comprising a coating remover installed at an adjusted position toward the side of the platen at the side of the clamp unit. The method according to claim 5, The coating remover is a clamp fixed to a position adjusted in the vertical direction in the clamp portion, and Flat coating device for CMP equipment comprising a removal member mounted to the front end of the clamp in a lateral direction.

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