KR100786296B1 - Donor substrate for laser induced thermal imaging, and method of fabricating thereof, and method of fabricating oled using the same - Google Patents

Abstract

A donor substrate for laser induced thermal imaging, a manufacturing method thereof, and a manufacturing method of OLED using the same are provided to enhance imaging efficiency by forming a self-assembled monolayer on a buffer layer. A donor substrate for laser induced thermal imaging includes a base layer(100), a photothermal conversion layer(110), a buffer layer(120), a self-assembled monolayer(130), and an imaging layer(150). The photothermal layer is placed on the base layer. The buffer layer is made of hydric silicon, and is placed on the photothermal conversion layer. The self-assembled monolayer is placed on the buffer layer. The imaging layer is placed on the buffer layer and the self-assembled monolayer.

Description

Donor substrate for laser transfer, method of manufacturing the same, and method for manufacturing an organic light emitting device using the same

1 is a schematic diagram for explaining a mechanism for forming an organic film layer by a conventional laser thermal transfer method.

2A and 2B are cross-sectional views of a laser thermal transfer donor substrate according to Embodiment 1 of the present invention.

2C and 2D are schematic views for explaining a method of manufacturing a laser thermal transfer donor substrate according to a first embodiment of the present invention.

3 is a cross-sectional view of an organic light emitting display device according to a second exemplary embodiment of the present invention.

<Brief Description of Drawings>

100: base material layer 110: photothermal conversion layer

120: buffer layer 130: self-assembled monolayer

150: transfer layer 200: substrate

210: pixel definition layer

The present invention relates to a laser thermal transfer donor substrate, a method of manufacturing the same, and an organic light emitting display device using the same. More specifically, a self-assembled monomolecular film is formed in a predetermined region on a buffer layer of a donor substrate, whereby a transfer layer of the donor substrate is transferred. By having a pattern corresponding to a substrate to be formed, the present invention relates to a laser thermal transfer donor substrate having improved transfer efficiency, a method of manufacturing the same, and a method of manufacturing an organic light emitting display device using the same.

Flat panel display devices are being used as display devices replacing cathode ray-ray tube display devices due to their light weight and thinness. Representative examples of such a flat panel display include a liquid crystal display (LCD) and an organic light emitting diode (OLED). Among these, the organic light emitting display device has superior luminance and viewing angle characteristics as compared to the liquid crystal display device and does not require a back light.

Such an organic light emitting display device combines electrons and holes injected through a cathode and an anode to an organic thin film to recombine to form excitons, and a specific wavelength is determined by energy from the excitons formed. The display device using the phenomenon that light is generated. The organic thin film may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

In the organic light emitting display device, in order to implement a full color organic light emitting display device, the organic thin film should be patterned. As a method for patterning the organic thin film, a method using a fine pattern mask and ink-jet printing (Ink-Jet Printing) and Laser Induced Thermal Imaging (LITI). Among them, the laser thermal transfer method may finely pattern the organic thin film and has an advantage of being a dry process.

1 is a schematic diagram for explaining a mechanism for forming an organic film layer by a conventional laser thermal transfer method.

Referring to FIG. 1, a donor substrate including a base layer S1a, a photothermal conversion layer S1b, and a transfer layer S2 is transferred onto a substrate S3a including a lower electrode. It arranges toward S3a). A pixel definition layer S3b including an opening defining an emission area may be formed on the substrate S3a.

Subsequently, when a laser is irradiated to a predetermined region of the donor substrate, the laser beam passing through the substrate layer S1a is converted into heat in the photothermal conversion layer S1b, and the heat is converted into the photothermal conversion layer S1b and the transfer layer ( The first adhesive force W12 between S2 is weakened to transfer the transfer layer S2 onto the substrate S3a.

The transfer characteristics of the transfer layer S2 during the transfer of the laser thermal transfer method may include a first adhesive force W12 between the photothermal conversion layer S1b and the transfer layer S2, and an adhesive force inside the transfer layer S2. W22) and the second adhesive force W23 between the transfer layer S2 and the substrate S3a. When the first adhesive force W12 is small, the transfer layer S2 is easily separated from the photothermal conversion layer S1b of the donor substrate, and the transfer layer S2 is transferred even in a region where the laser is not transferred. This happens.

In addition, since there is a step due to the pixel defining layer S3b in the emission area of the organic light emitting display device, when the organic film layer is formed by the laser thermal transfer method, the organic film layer is cut off at the stepped portion, and thus, the organic film layer is not transferred. have. This is called edge open failure (or non-transfer failure; E), which occurs because the thickness of the portion to be transferred is thickened and the bending radius of curvature increases.

The failure of the edge open and the transfer of the transfer layer in the region that should not be transferred result in deterioration of efficiency, lifespan, and luminance of the organic light emitting display device.

Accordingly, the present invention is to solve the above problems of the prior art, by forming a self-assembled monomolecular film in a predetermined region on the buffer layer of the donor substrate, so that the transfer layer of the donor substrate has a pattern corresponding to the substrate to be transferred Accordingly, an object of the present invention is to provide a laser thermal transfer donor substrate having improved transfer efficiency, a method of manufacturing the same, and a method of manufacturing an organic light emitting display device using the same.

The object of the present invention is a base layer; A photothermal conversion layer on the base layer; A buffer layer made of hydrogenated silicon positioned on the photothermal conversion layer; A self-assembled monomolecular film positioned in a predetermined region on the buffer layer; And a transfer layer positioned on the buffer layer and the self-assembled monolayer.

In addition, the object of the present invention is to provide a substrate layer, to form a photothermal conversion layer on the substrate layer, to form a buffer layer of hydrogenated silicon on the photothermal conversion layer, using a white light in a predetermined region on the buffer layer Thereby forming a self-assembled monomolecular film, and forming a transfer layer on the buffer layer and the self-assembled monomolecular film.

In addition, the object of the present invention is to provide a substrate, forming a lower electrode on the substrate, using a donor substrate comprising a substrate layer, a photothermal conversion layer, a buffer layer, a self-assembled monolayer and a transfer layer on the lower electrode Forming an organic layer pattern by a laser thermal transfer method, wherein the self-assembled monolayer is formed on the buffer layer, and the organic field includes forming the transfer layer to have a pattern corresponding to the pattern formed on the substrate. It is achieved by a method of manufacturing a light emitting display device.

Details of the above objects and technical configurations and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention. In addition, in the drawings, the length, thickness, etc. of layers and regions may be exaggerated for convenience. Like numbers refer to like elements throughout.

Example 1

2A to 2D are cross-sectional views and schematic views for explaining a method of manufacturing a laser thermal transfer donor substrate according to a first embodiment of the present invention.

Referring to FIG. 2A, a substrate layer 100 is provided, and a photothermal conversion layer 110 is formed on the substrate layer 100. The substrate layer 100 should have transparency in order to transmit light to the photothermal conversion layer 110, and may be made of a material having a constant optical property and sufficient mechanical stability as a supporting substrate. The base layer 100 may be made of glass or at least one polymer material selected from the group consisting of polyester such as polyethylene terephthalate (PET), polyacryl, polyepoxy, polyethylene, and polystyrene. More preferably, the base layer 100 may be polyethylene terephthalate.

The photothermal conversion layer 110 absorbs light in the infrared-visible light region and converts a part of the light into heat. The photothermal conversion layer 110 should have a constant optical density and include a light absorbing material. The photothermal conversion layer 110 may be a metal film including aluminum oxide or aluminum sulfide as the light absorbing material, and a polymer organic film including carbon black, graphite, or infrared dye as the light absorbing material. In this case, the metal film may be vacuum deposition, electron beam deposition, or sputtering, and the organic film may be a conventional film coating method, such as gravure, extrusion, spin, and knife. ) Can be formed by one of the coating method.

A buffer layer 120 is formed on the photothermal conversion layer 110 by hydrogenated silicon such as silane and silicon oil. The buffer layer 120 may form hydrogenated silicon on the photothermal conversion layer 110 by vacuum deposition, electron beam deposition, or sputtering. Alternatively, after the silicon is deposited on the photothermal conversion layer 110, the surface-treated with fluorine or the like on the silicon may be used as the buffer layer 120 the hydrogenated silicon on which the Si-H bond is formed on the surface. . The hydrogenated silicon is intended to form a self-assembled monolayer 130 on the buffer layer in a subsequent process.

Subsequently, white light is irradiated to a predetermined region on the buffer layer 120 using a mask pattern 140, thereby forming a self-assembled monolayer 130 on a predetermined region on the buffer layer 120, as shown in FIG. 2B. do. The self-assembled monolayer 130 is to improve the adhesion between the buffer layer 120 and the transfer layer 150 formed in a subsequent process, preferably an organic molecular film regularly aligned on the surface of the buffer layer 120. .

As shown in FIG. 2C, the self-assembled monomolecular film 130 has a function of a molecular membrane and a long alkane chain in the body portion that enables regular molecular film formation with a reactor of the head that couples with the buffer layer 120. Consists of functional groups of the tail portion. That is, the self-assembled monolayer 130 is located at the end of the long alkane chain which is a body part and the alkane chain, and molecules having functional groups that can covalently bond with the surface of the transfer layer 150 are the head part. The phosphorus reactor is adsorbed and bonded to the surface of the buffer layer 120. The molecules adsorbed and bonded to the surface of the buffer layer 120 are aligned on the surface of the substrate using a self-assembly phenomenon in which molecules are aligned two-dimensionally on the surface of the buffer layer 120 to form a self-assembled monolayer 130. ).

In the case of manufacturing the self-assembled monolayer 130 by the above method, the film forming process can be controlled at the molecular level, and the functional groups of the molecules forming the self-assembled monolayer 130 may be selectively changed in various ways. In addition, the adjustment is also possible, and the bond with the surface of the buffer layer 120 is also strong, excellent stability of the film, it can be easily removed if desired.

The material for forming the self-assembled monolayer 130 is a surfactant molecule such as fatty acid, an organosilicon molecule such as alkyltrihalosilanes or alkyl alkoxides, an organosulfur molecule such as alkylthiols, or an organic phosphate molecule such as alkyl phosphate. And ethylene-based hydrocarbons represented by general formula C _n H _2n (n is an integer) or acetylene type represented by general formula C _n H _{2n -2} (where n> 2 and n are integers). Materials containing hydrocarbons can be used. More preferably, in the general formula, a material including the ethylene-based hydrocarbon or the acetylene-based hydrocarbon where n is an integer of 20 or less may be used. In the general formula, when n is an integer greater than 20, it is difficult to form a film due to structural isomers, and the intermolecular van der Waals forces due to the increase of the surface area between the chains increases, which is a problem in the alignment between the molecules. This can happen.

The ethylene hydrocarbon may be represented by alkene, and the acetylene hydrocarbon may be represented by alkyne.

Forming the self-assembled monolayer 130 on a predetermined region of the buffer layer 120 uses a hydrosilylation reaction.

Figure 2d is a schematic diagram showing the hydrogen silicification reaction of the hydrogenated silicon and the material containing alken (Alkene).

Referring to FIG. 2D, when white hydrogen is irradiated onto the hydrogenated silicon, excitons are generated due to the low energy of the white light, and electrons and holes are emitted from the excitons. The holes are transferred to adjacent alkenes, and electrons are transferred to the hydrogenated silicon, which breaks the Si—H bond of the hydrogenated silicon while simultaneously bonding the silicon and alkenes to form an Si—C bond. Through the above process, the alkene-containing material is bonded to the silicon surface. In addition, although the material containing alkenes is exemplified in FIG. 2C, the material containing alkyne may be combined with the hydrogenated silicon through the above process.

As described above, the self-assembled monolayer 130 may be formed in a predetermined region on the buffer layer 120 by irradiating white light to a predetermined region on the buffer layer 120 exposed to the material of forming the self-assembled monolayer 130.

Subsequently, the transfer layer 150 is formed on the base layer 100 including the self-assembled monolayer 130. The transfer layer 150 may be formed of one single layer film or one or more multilayer films selected from the group consisting of organic films, such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, the hole injection layer The organic films, such as a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, can be used if it is a material normally used.

Preferably, the hole injection layer may be composed of an aryl amine compound, a starburst type amine, and the like. More specifically, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamino (m-MTDATA), 1,3,5-tris [4- (3-methylphenylphenylamino) phenyl] benzene ( m-MTDATB) and phthalocyanine copper (CuPc).

The hole transport layer may include an arylene diamine derivative, a starburst compound, a biphenyldiamine derivative having a spiro group, a ladder compound, and the like. More specifically N, N-diphenyl-N, N'-bis (4-methylphenyl) -1,1'-biphenyl-4,4'-diamine (TPD) or 4,4'-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (NPB).

As the light emitting layer, a low molecular material such as Alq3 (host) / DCJTB (fluorescent dopant), Alq3 (host) / DCM (fluorescent dopant) or CBP (host) / PtOEP (phosphorescent organometallic complex), which is a red light emitting material, and a PFO polymer High molecular weight materials such as Alq3, Alq3 (host) / C545t (dopant), CBP (host) / IrPPY (phosphorescent organic complex) which are green light emitting materials, and PFO polymer, PPV Polymeric materials, such as system type polymers, can be used. In addition, low molecular weight materials such as DPVBi, Spiro-DPVBi, Spiro-6P, Distylbenzene (DSB) and Distriarylene (DSA), which are blue light emitting materials, and polymer materials such as PFO-based polymers and PPV-based polymers may be used. .

The electron transport layer is formed of a metal compound that is stacked on the organic light emitting layer and can be easily accommodated by electrons, and has an excellent 8-hydroquinoline aluminum salt (Alq3) having excellent properties for transporting electrons supplied from the cathode electrode stably. Can be done.

The electron injection layer may be made of one or more materials selected from the group consisting of 1,3,4-oxydiazole derivatives, 1,2,4-triazole derivatives, and LiF.

The transfer layer 150 may be formed by extrusion, spin, knife coating, vacuum deposition, or CVD.

Example 2

3 is a cross-sectional view of an organic light emitting display device according to a second exemplary embodiment of the present invention.

Referring to FIG. 3, a lower electrode (not shown) is formed on a substrate 200 formed of glass, synthetic resin, stainless steel, or the like, and a pixel definition layer 210 including an opening is formed on the lower electrode. do. A thin film transistor (not shown), an insulating film (not shown), and a capacitor (not shown) may be formed between the substrate and the lower electrode by a conventional method.

Next, a laser thermal transfer donor substrate is disposed so that the transfer layer 150 of the donor substrate faces the substrate 100.

 The laser thermal transfer donor substrate includes a base layer 100, a photothermal conversion layer 110, a buffer layer 120, a self-assembled monolayer 130, and a transfer layer 150, as in the first embodiment described above. The buffer layer 120 is formed of hydrogenated silicon, and the hydrogenated silicon is used to form a subsequent self-assembled monolayer 130, and may be silicon that is surface-treated and hydrogenated silicon after lamination of silicon.

The self-assembled monolayer 130 is formed using hydrogen siliconization reaction through white light. The self-assembled monolayer 130 controls the adhesion between the buffer layer 120 and the transfer layer 150 formed in a subsequent process. In addition, the self-assembled monolayer 150 is formed in a pattern corresponding to the pattern of the substrate 100 to which the transfer layer 150 is transferred in order to prevent edge open defects during the transfer layer 150 transfer. Since the region on which the transfer layer 150 is to be transferred on the substrate 200 is a concave region, the donor substrate forms a self-assembled monolayer 130 under the region to which the transfer layer 150 is to be transferred. The transfer layer 150 is formed in a convex pattern in which a region to be transferred is protruded. When the transfer layer 150 is formed in a convex pattern, it corresponds to the concave pattern of the substrate 200. Therefore, the transfer efficiency of the transfer layer 150 is improved, and the edge generated by the concave pattern of the substrate 200. Open failure can be prevented.

The transfer layer 150 is formed on the base layer 100 including the self-assembled monolayer 130. The transfer layer 150 may be formed of one single layer film or one or more multilayer films selected from the group consisting of organic films, such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, the hole injection layer The organic films such as the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer may be used as long as they are materials commonly used as described above.

Subsequently, a laser is irradiated to a predetermined region of the laser thermal transfer donor substrate to transfer the transfer layer 150 and the self-assembled monolayer 130 to form an organic layer pattern on the substrate 200.

The donor substrate and the organic light emitting display using the same according to the embodiment of the present invention form a self-assembled monomolecular film between the buffer layer and the transfer layer of the donor substrate, thereby improving the transfer efficiency of the transfer layer. In addition, the self-assembled monomolecular film is formed only in a predetermined region on the buffer layer, thereby forming a step corresponding to the substrate on which the transfer layer is to be transferred, thereby preventing edge open defects generated when the transfer layer is transferred.

Therefore, in the laser thermal transfer donor substrate according to the present invention, the self-assembled monomolecular film is formed in a predetermined region on the buffer layer, thereby improving the transfer efficiency of the transfer layer.

Claims (14)

Base layer; A photothermal conversion layer on the base layer; A buffer layer made of hydrogenated silicon positioned on the photothermal conversion layer; A self-assembled monolayer on the buffer layer; And And a transfer layer on the buffer layer and the self-assembled monolayer. The method of claim 1, The self-assembled monolayer film is a laser thermal transfer donor substrate, characterized in that consisting of ethylene-based hydrocarbon represented by the general formula C _n H _2n (n is an integer). The method of claim 1, The self-assembled monomolecular film is a laser thermal transfer donor substrate, characterized in that made of acetylene hydrocarbon represented by the general formula C _n H _{2n -2} (where n> 2, n is an integer). The method of claim 2 or 3, The self-assembled monomolecular film is a laser thermal transfer donor substrate, characterized in that n is an ethylene-based hydrocarbon or an acetylene-based hydrocarbon in which n is an integer of 20 or less. The method of claim 1, The donor substrate of claim 1, wherein the self-assembled monolayer is positioned on a predetermined region of the buffer layer, and the donor substrate has a convex pattern protruding from a region where the self-assembled monolayer is located. Providing a base layer, Forming a photothermal conversion layer on the substrate layer, Forming a buffer layer of hydrogenated silicon on the photothermal conversion layer; Forming a self-assembled monomolecular film using white light on the buffer layer, And forming a transfer layer on the buffer layer and the self-assembled monolayer. The method of claim 6, The self-assembled monomolecular film is a method of manufacturing a laser thermal transfer donor substrate, characterized in that formed from ethylene hydrocarbon represented by the general formula C _n H _2n (n is an integer). The method of claim 6, Wherein said self-assembled monomolecular film is formed of an acetylene hydrocarbon represented by the general formula C _n H _{2n -2} (where n> 2 and n is an integer). The method according to claim 7 or 8, The self-assembled monomolecular film is a method for manufacturing a laser thermal transfer donor substrate, wherein n is an ethylene hydrocarbon or an acetylene hydrocarbon, wherein n is an integer of 20 or less. The method of claim 6, And forming the donor substrate in a convex pattern protruding from the region in which the self-assembled monomolecular film is formed by forming the self-assembled monomolecular film in a predetermined region on the buffer layer. Providing a substrate, Forming a lower electrode on the substrate, Forming an organic layer pattern on the lower electrode by laser thermal transfer using a donor substrate including a substrate layer, a photothermal conversion layer, a buffer layer, a self-assembled monolayer and a transfer layer, The self-assembled monomolecular film is formed on the buffer layer, wherein the transfer layer is formed to have a pattern corresponding to the pattern formed on the substrate. The method of claim 11, The organic layer pattern may be a single layer film or at least one multilayer film selected from the group consisting of an organic layer of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer, manufacturing an organic light emitting display device. Way. The method of claim 11, The buffer layer is a method of manufacturing an organic light emitting display device, characterized in that to form a self-assembled monolayer using white light. The method of claim 11, The donor substrate may have the self-assembled monomolecular film formed under the region where the transfer layer is to be transferred on the substrate to form a convex pattern protruding from the region to be transferred of the transfer layer. Manufacturing method.

Images