KR100782022B1 - Heat radiating device for electronic equipment component - Google Patents

Abstract

A heat radiating device for an electronic device is provided to transfer heat generated from a heated element to a heat sink quickly, and maximize a cooling effect of a cooling fan, a radiating plate, and a heat pipe by installing a floating guide for supporting the cooling fan opposite to the cooling fan on the radiating plate. A clip is installed to an upper part of the heated part, forms a central hole, and has a female screw(23) for joining both ends of an extended part(22) of the central hole with a wing nut. A spacer is installed to the heated part by combining with the clip, and comprises a lower and upper connector(11,13). The heat pipe(33) overlaps both end parts to a pipe curve of the spacer and has an arc shape facing the spacer. The radiating plate(30) forms a fan shape by inserting each joining groove(32) into an arc shape of the heat pipe. The floating guide is installed to the inside corresponding to the radiating plate, is joined with a fan supporter(4) at an upper side of the upper connector, forms a U-shaped guide plate(2) perpendicular to the fan supporter, and forms a mounter(3) including a fixing groove(5) combined with the heat pipe to both sides of the guide plate.

Description

Heat Radiating Device For Electronic Equipment Component

1 is a perspective view showing the structure of a clip according to the present invention,

2 is a perspective view showing the structure of a spacer according to the present invention;

3 is a perspective view showing a flow guide coupled to the cooling fan according to the present invention,

4 is a perspective view showing a heat sink according to the present invention;

5 is an exploded perspective view of a clip and a spacer according to the present invention;

Figure 6 is a perspective view of the flow guide coupled to Figure 5,

7 is a view schematically showing a state in which a radiator for an electronic device component according to the present invention is applied to a heating element.

<Description of the symbols for the main parts of the drawings>

1: flow guide 10: spacer

11: lower binder 12: coupling protrusion

13: upper binder 14: binding hole

15: pipe goal 20: clip

21: center hole 30: heat sink

33: heat pipe

The present invention relates to a radiator for electronic device parts, and more particularly, the heat absorbing portion of the heat pipe can be easily attached to and detached from the heat generating parts by an upper coupling member, a lower coupling member, a clip, or the like, and can be securely fixed to the heating element. By moving all the heat, the heat absorbing part has the effect of cooling as quickly as possible. Also, the U-shaped flow guide is formed to face the cooling fan without using another cooling fan, and only the heat sink having a fan shape is installed. The present invention relates to a radiator for electronic component parts configured to increase the overall heat dissipation efficiency of a device by discharging hot air outside with a minimum size and space.

Generally, electronic devices include computers, refrigerators, monitors, TVs, VCRs, TV projectors, power units, projectors, sliders, overhead projectors, facsimiles, and batteries for automobiles. As such electronic devices are used, heat is generated from components installed therein. For example, a CPU of a computer, a thermoelectric module of a refrigerator, a lamp of a projector, and the like. In order to cool the heat of such a component, a heat radiator is installed in the electronic device. In addition, electronic components such as central processing units (CPUs), thermoelectric elements, chipsets in video graphic array (VGA) cards, and power transistors generate more heat during operation. These types may cause malfunction in operation or severe damage if the temperature of the electronic components exceeds the proper temperature, so heat must be installed in the heat generating area to release heat generated outside.

The chipset heatsink of a computer CPU installs a fan on top of the chipset to blow cooling air directly to the chipset or attach a heat sink to the chipset so that the heat sink radiates heat from the chipset. There was a problem that the noise occurs due to the rotation of the card. However, if a large number of different cards were installed according to the installation option, it was not easy to install the fan because the spacing between the cards was narrow.

Even in the heat sink, if the size of the heat sink is large, the heat dissipation efficiency is high, but there is no problem. However, since the spacing between the cards is basically small, it is practically difficult to install a heat sink of sufficient capacity between the cards.

The heat dissipation part discharges heat received from the heat absorbing part to the outside through heat exchange with the external cold air, and is composed of various types of heat dissipation fins. The heat dissipation fins have a large contact area with external air as their surface areas are larger. Increase the performance of the heatsink.

In addition to increasing the surface area of the heat dissipation fin to increase the performance of the heat sink, cooling of the heat absorbing portion faster by moving the heat of the heat absorbing portion to the outside of the heat absorbing portion is also one of the techniques for improving the performance of the heat sink. However, in recent years, it has been difficult to keep the surface area of the heat dissipation fin wide in a situation in which the size of the heat sink should gradually decrease according to the trend of integration of electronic components or devices. In addition, even if heat sink fins are made of aluminum, copper, silver, or gold, which have high thermal conductivity, in order to dissipate heat from the heat absorbing part to the outside of the heat absorbing part more quickly, there is a certain limit to cooling the heat absorbing part due to the properties of the metal. Due to its material and structural limitations, it was difficult to meet the desire to dissipate more heat more quickly.

In addition, components included in the computer case include heat generating components that generate heat during operation. Such heating units typically include a central processing unit, a graphics card, and a power supply. In the case of these heating components, when the temperature of the components increases due to the generated heat, the performance of the components decreases, and in severe cases, the operation of the components is stopped. May be In addition, since the heat generated by the heat generating parts has increased in recent years due to the rapid development of computer performance, cooling of the heat generating parts is one of the most important problems to be solved in the computer industry.

At present, a method of cooling the heat generating parts included in the case of a computer is mainly to contact each of the heat generating parts with a heat sink that absorbs heat, and then pass the wind of the cooling fan to the heat sink. I use it. In order to absorb and dissipate heat more efficiently from heat-generating components, various researches, such as change of heat sink material or shape change, have been attempted. By the way, the cooling system of the computer up to now has a common feature that, after the cooling of each heating element is made by a cooling fan attached to each heating element inside the case, the heated air inside the case is provided in the case again. Another cooling fan is used to discharge to the outside. This common point causes many problems.

That is, in order to cool the heat generating parts embedded in the case, since a large number of cooling fans that rotate at high speed must be installed, the following problems are caused. First, a lot of noise occurs when the computer is operating. In fact, most of the noise generated by computers is the mechanical noise of these cooling fans. These noises can be a source of deterioration in the work efficiency of computer workers and sensitive workers who want a quiet work environment. Secondly, when the computer is operating, a large amount of external air is continuously introduced into the case and the internal air is circulated, so that the external fine dust adheres to many components embedded in the computer case. This phenomenon is caused more severely by the static electricity generated in the components embedded in the case, and these dusts may cause malfunction or failure of the sensitive components.

In addition, there is a problem that the cooling of the heat generating parts is not efficient because it occurs inside the case. In other words, the temperature inside the case having a limited volume is higher than the outside temperature when the computer is operated and a little time passes, and it is impossible to cool the heating parts with the already warm air.

In addition, even when looking at the existing heat pipe used as a heat radiator, it is impossible to use it in a vertical or inclined position due to its operation characteristics. Especially, in the construction of ondol, it is difficult to maintain the inclination only by the pipeline radiator itself, and the area of the heat pipe distribution pipe that touches the heat source alone. Due to its small size, heat transfer is inefficient, and it is difficult to maintain the overall position and connect several pieces.

 On the other hand, due to the high integration of communication equipment, the unit heat density of each element, component, equipment, etc. is increasing. The heat density causes an increase in temperature. This must be taken.

Since heat pipes have been developed for the aerospace industry, miniature heat pipes have recently been produced and used to cool electronic devices. For example, notebook computers use small heatpipes to transfer heat from the chip to the case to dissipate heat generated from the Pentium chip through the case.

Explaining the general principle of the operation of a heat pipe, a heat pipe is a sealed working fluid in a vacuum pipe. In the evaporator with a heat source, the working fluid evaporates and vapor diffuses inside the pipe, passing through the conveying part and passing through the condenser. It releases heat and becomes liquid again and rides on the wall to the evaporator. The heat is evaporated again. In the same principle as above, the heat pipe is a device for efficiently transferring heat with no power even at a small temperature difference by using latent heat of evaporation of a working fluid.

In other words, the printed circuit board may be directly in contact with the heat sink, or the surface market part may be directly attached to the heat sink, but the heat supply using the heat pipe may easily dissipate heat in the power supply circuit or electronic circuits that generate a lot of heat. As technology development is progressing, electronic components will become smaller and lighter in the future, and new and various cooling methods are required to lower the temperature of the component bottom, which causes a decrease in reliability.

The present invention has been created to solve the above problems, the heat radiated by the heat-generating parts to allow the cooling fan, heat sink, heat pipe to immediately move the heat generated from the heat-generating parts and to dissipate, U-shaped The flow guide which is formed to support the cooling fan is installed on the part facing the cooling fan instead of the lower end or the upper end of the heat sink, thereby inducing the heat of the heat-generating part to the heat sink, so that the heat conduction to the heat generating part is faster and the heat dissipation efficiency is improved. It is high and provides a radiator for electronic parts that can maximize the effect of the cooling fan, heat sink, heat pipe.

In addition, the heat absorbing part of the heat pipe can be easily attached to or detached from the heat generating part by a base, a coupling shaft, a clip, or the like, and can be securely fixed to the heat generating element so that all heat can be transferred to the heat pipe heat absorbing part so that the heat absorbing part is not required to be wide and large. It is to provide the effect of rapid cooling.

That is, it provides heat radiator for electronic parts configured to increase the overall heat dissipation efficiency of the device by discharging the hot air that escapes to another place without processing all the heat at one time without using another cooling fan. There is a purpose.

The present invention for solving the above problems is a cooling device that performs a predetermined function in the electronic device, installed indirectly or directly attached to the heat generating parts, is installed on the heat generating parts upper end, the central hole in the center A clip having male threads formed so that both ends of the extension portions formed at both sides of the central hole are fastened with a butterfly nut; It is coupled to the clip is installed on the heat generating parts, the pipe bone in the center is spaced apart and penetrated, the lower coupling body formed a plurality of coupling projections on both sides of the pipe bone, and the pipe bone corresponding to the pipe bone is formed Spacer is assembled and coupled to the upper coupling formed a coupling hole corresponding to the coupling protrusion; A heat pipe coupled at both ends to the pipe valley of the spacer in an overlapping manner, the portion of the spacer being opposed to the spacer in an arc shape; A heat sink having a plurality of heat sinks having fastening grooves formed in the center thereof, the fastening grooves being inserted into the arc-shaped portions of the heat pipes and fastened to form a fan shape; It is installed inward to correspond to the heat sink, the pan support is coupled to the top surface of the upper assembly, the U-shaped guide plate is formed at right angles to one side of the fan support, fixed to the heat pipes at both ends of the guide plate A flow guide in which a groove is formed and a fixing fixing part is formed; Characterized in that comprises a.

The present invention having such a feature will be more clearly described through the preferred embodiment accordingly. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the structure of the clip according to the invention, Figure 2 is a perspective view showing the structure of the spacer according to the invention, Figure 3 is a perspective view showing a flow guide coupled to the cooling fan according to the present invention, Figure 4 is a perspective view illustrating a heat sink according to the present invention, FIG. 5 is an exploded perspective view of a clip and a spacer according to the present invention, FIG. 6 is a perspective view showing a flow guide coupled to FIG. 5, and FIG. 7 is according to the present invention. FIG. Is a diagram schematically illustrating a state in which a radiator for an electronic device component is applied to a heating element.

As shown, the radiator for electronic device components according to the present invention is a device for performing a predetermined function in the electronic device, indirectly or directly attached to the heat generating component that generates heat, to increase the overall heat dissipation efficiency, clip ( 20), the spacer 10, the flow guide 1, the heat pipe 33, and the heat sink (30).

The clip 20 is a part attached to and fixed to a heat generating part, and a lower end of the clip 20 is coupled to a rear part of the heat generating part, and is perpendicular to both rear ends of both ends of the central hole 21 of the clip 20. The formed male screw 23 penetrates the heat generating part to be fixed to the bottom surface of the heat generating part with a butterfly nut, and has an extension part 22 at both ends thereof, and a central hole in which the spacer 10 is coupled to the top and bottom ends thereof. 21) is formed.

The spacer 10 is composed of the upper coupling 13 and the lower coupling 11, the lower coupling 11 is a portion which is in contact with the substrate is located at the bottom of the central hole 21 of the clip 20 It comes in contact with the heat generating part. The lower coupling member 11 is spaced apart at regular intervals in the center and the heat generating portion of the heat pipe 33 is superimposed on both ends of the pipe valley 15 formed in parallel in two lines, overlapping portion of the pipe valley 15 The center has a plurality of coupling protrusions 12 are formed on both ends. The upper assembly 13 is a portion that is assembled to correspond to the lower assembly 11, the coupling hole is located on the top of the clip 20, the coupling hole 12 corresponding to the coupling protrusion 12 of the lower assembly 11 ( 14 are formed in a plurality, and the heat generating portion of the heat pipe 33 is coupled to correspond to the lower assembly 11, the same as the lower assembly 11 overlapping and spaced at a predetermined interval of two parallel pipe valleys And (15).

The heat pipe 33 is coupled to the pipe valley 15 formed at the center of the spacer 10, which is a coupling of the upper coupling 13 and the lower coupling 11, the both ends of the linear coupling overlapping in a straight line, overlapping The part opposing both ends becomes an arc shape.

The heat dissipation plate 30 is coupled to an upper end of an arc-shaped portion of the heat pipe 33 opposite to a portion where the heat pipe 33 overlaps, and is fastened to a central surface coupled to the heat pipe 33. A plurality of central holes 21, 31 having grooves 32 have a fan-shaped structure on the center of the arc-shaped portion.

The flow guide 1 is located at a portion opposite to the heat dissipation plate 30, and is coupled to the upper end of the coupling member of the spacer 10 that couples the heat generating part including the clip 20. A pan support (4) positioned and a guide plate (2) formed in a U shape at a right angle with a bottom surface of the pan support (4), and at both ends of the guide plate (2), the guide plate (2). Mounting fixing parts (3) at both ends are formed at right angles with respect to the coupling position of the heat dissipation plate (30) composed of the heat dissipation fins (31), and the fixing groove (4) coupled to the heat pipe (33) at both ends. It is composed.

Hereinafter will be described the operation and principle of the preferred embodiment of the present invention having the configuration and structure as described above.

The radiator for electronic device parts according to the present invention is installed in a heat generating part that generates heat, and male threads 23 are provided at both ends of the extension part 22 formed with the central hole 21 at the center of the clip 20. The clip 20 is coupled to the heat generating part of the heat generating part through a butterfly nut. It is easy to attach and detach from the heat generating parts can be easily applied elsewhere. In addition, the spacer 10 composed of the upper coupling member 13 and the lower coupling member 11 coupled to the central hole 21 formed at the center of the clip 20 may also be directly coupled to the heat generating component. Due to the coupling protrusion 12 of the coupling protrusion 11 and the corresponding coupling groove 12, the heat generating part of the heat pipe 33 is fixed to the central hole 21 formed in the center of the clip 20 to directly receive heat from the heat dissipation part. By concentrating the heat generated from the heat generating parts to both ends of the heat pipe 33 there is a fast cooling effect according to the fast heat transfer. The flow guide (1) coupled to the upper end and the upper end of the upper assembly (13) is a cooling fan that is not installed on the top or bottom surface of the heat sink (30), as other conventional radiators use the heat sink ( 30 is coupled to the upper assembly (13) so that it can be installed facing the fan support (4) to put the cooling fan, the U-shaped guide plate at a right angle to the bottom surface of the fan support ( 2), the guide plate (2) is provided to face the fan-shaped guide plate (2). The guide plate 2 serves to send heat only in the direction of the heat dissipation plate 30 composed of the heat dissipation fins 31 without spreading heat generated in the heat generating parts in all directions. This role eliminates the problem of one of the problems of the existing radiator, which is to solve the problem of hot air flowing out due to the installation of another cooling fan. By acting to reduce the hot air to induce heat from the heat generating parts to the heat sink (30) to play a role that does not need any more radiators. The heat induced in the guide plate 2 is arc-shaped of the heat pipe 33 which is opposed to the guide plate 2 by a cooling fan which is located at the fan support 4 formed at the center of the guide plate 2. It is directed to the heat sink 30 is installed in the portion, the heat sink 30 is composed of a plurality of heat radiation fins 31, the center hole 21, 32 to be coupled to the upper end of the arc-shaped portion of the heat pipe 33 It is composed of a heat radiation fin 31 having an overall shape of a fan. This is because the flow guide (1) to collect heat to one place, such as a circular shape or a cylindrical shape, without increasing the size of the heat sink 30, it is possible to serve as an efficient radiator with a minimum fan shape.

As described above, the present invention allows the heat absorbing portion of the heat pipe to be easily attached to and detached from the heat generating parts by the upper coupling body, the lower coupling body, the clip, and the like. Not only does the heat absorbing part cool down so rapidly, but also the U-shaped flow guide is formed to face the cooling fan without the use of another cooling fan, and at the same time with only a minimum size and space for installing only a fan-shaped heat sink. It is possible to realize that the heat dissipation efficiency of the device is high by allowing the outside air to be discharged to the outside because it cannot handle all the heat.

Claims (1)

In the cooling device that is attached to the heating element indirectly or directly to the heating element that performs a predetermined function in the electronic device, The clip is installed in the upper end of the heat generating part, the central hole 21 is formed in the center, the clip having a male screw 23 shape so that both ends of the extension part 22 formed on both sides of the central hole 21 are fastened with a butterfly nut. 20; Is coupled to the clip 20 is installed on the heat generating parts, a plurality of pipe valleys 15 in the center are spaced apart from each other at regular intervals, a plurality of coupling projections 12 on both sides of the pipe valleys 15 The upper coupling member 13 formed with the lower coupling member 11 and the pipe valley 15 corresponding to the pipe valley 15 is formed, and the coupling hole 14 corresponding to the coupling protrusion 12 is formed. A spacer 10 composed of; A heat pipe 33 having both ends coupled to the pipe valley 15 of the spacer 10 in an overlapping manner, and a portion of the spacer 10 facing the spacer 10 having an arc shape; A heat dissipation plate 30 having a plurality of heat dissipation plates 30 having a fastening groove 32 formed in the center thereof, the fastening grooves 32 being inserted into the arc-shaped portions of the heat pipe 33 to be fastened to form a fan shape; Corresponding to the heat dissipation plate 30 is installed inward, the fan support 4 is coupled to the upper end surface of the upper assembly 13, the U-shaped guide plate (2) at right angles to one side of the fan support (4) A flow guide (1) having a mounting fixing portion (3) having a fixing groove (4) formed at both ends of the guide plate (2) and fastened to the heat pipe (33); Radiator for electronic device components, characterized in that comprising a.

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