KR100781195B1 - Planar type heat transferring devices using tubes and manufacturing method thereof - Google Patents

Abstract

The present invention can maintain the flatness of the product by press working using a pipe material, even if there is no joining site, even if bent or bent to a desired shape, there is no problem such as distortion at the joining site, and problems such as damage to the sealing state and leakage of refrigerant are caused. An object of the present invention is to provide a plate-shaped heat transfer device and a method of manufacturing the same.

The plate heat transfer apparatus of the present invention is press-processed from a tube of a predetermined length, has two seamless opposing sides, an upper surface and a bottom surface are defined between the two sides, and surrounds an inner space sealed from outside air, A case in which a refrigerant is injected into at least a portion of the internal space to cause phase change by heat; One or more plate-shaped wick structures in contact with at least a portion of an inner surface of the case and providing a micro-path for allowing the refrigerant to move; And one or more support structures for supporting the one or more wick structures to be in close contact with at least a portion of the inner surface of the case, the one or more supporting structures having a plurality of through openings for providing a passage of the refrigerant and the vapor. It fills at least a portion of the internal space, moves along the wick structure by capillary force generated in the micropath inside the wick structure, is vaporized and moved by the heat source, and then condenses and circulates in the space. It is characterized by performing heat transfer.

Heat transfer device, chiller, heat exchanger, refrigerant, CPU, PC, electronic parts, condensation, vaporization

Description

Plate type heat transfer device using pipe material and manufacturing method thereof {PLANAR TYPE HEAT TRANSFERRING DEVICES USING TUBES AND MANUFACTURING METHOD THEREOF}

1A-1B show the configuration of a flexible heat pipe of the prior art.

2 shows a configuration of another flat plate heat transfer apparatus of the prior art.

3 shows the structure of the inventor's prior patent application No. 10-2004-91617.

4 shows the structure of the inventor's prior patent application No. 10-2005-1028.

5A and 5B show the case where the plate heat transfer apparatus of the prior art and the plate heat transfer apparatus of the present invention are bent to conform to the curved shape of the heat source surface, respectively.

Figure 6 shows the flow of the first embodiment of the plate heat transfer device manufacturing method of the present invention.

Figure 7 shows the flow of a second embodiment of the plate heat transfer device manufacturing method of the present invention.

8A and 8B are views for explaining the structure of various modified embodiments of the plate heat transfer apparatus of the present invention, respectively.

9A and 9B show the flow of the first and second embodiments of the plate heat transfer device manufacturing method of the present invention, respectively.

<Explanation of symbols for the main parts of the drawings>

500: Extruded / drawn tube 505: Tube after primary press working

507: cases 510 and 610: support structure

520, 620: Wick structure 550: Case after secondary press

605: extruded / drawn tube 607: case

650, 750, 850: case after press working

The present invention relates to a plate heat transfer apparatus using a pipe member and a method for manufacturing the same, and more particularly, plate heat transfer for cooling the heat source such as semiconductor chips by transferring heat generated from the heat source surface such as semiconductor chips to the low temperature portion. Relates to a device.

In recent years, as the integration of semiconductor chips such as memory, central processing unit (CPU), and embedded chips has increased, the smooth cooling of chips is becoming more important, and the ultra-light weight and slimness of electronic products such as notebooks, PDAs, mobile phones, etc. As the development of optical displays is increasing interest in the cooling of LCDs and LED panels, in order to cool semiconductor chips embedded in such electronic products, existing package technologies and cooling fan technologies may be used. The method is facing structural and functional limitations in order to achieve smooth cooling.

In order to overcome this limitation, recently, a microstructure called a heat pipe has been attracting attention as a new heat transfer device capable of performing a cooling function of a semiconductor chip.

1 shows the configuration of a flexible heat pipe disclosed in prior art 1 (US Pat. No. 6,446,706). The disclosed flexible heat pipe comprises a polypropylene layer 28, a first metal foil layer 32 and a second adhesive layer 34 bonded to the polypropylene layer 28 by a first adhesive layer 30. A wick layer 24 made of a flexible porous material sealed by an outer wall 26 including a second metal foil layer 12 bonded to the metal foil layer 32 has a flat laminated structure. . In addition, there is an isolation layer 18 that supports the wick layer 24 to allow the gas to move in various directions while maintaining close contact with the outer wall 26, such as polypropylene. A mesh screen of the same material was used. Also, here the wick layer 24 is made of a copper felt material.

2 shows the configuration of a flat plate heat transfer apparatus disclosed in the prior art 2 (Patent Publication 10-2004-18107). The illustrated device is composed of an assembly of the upper plate 200 and the lower plate 100 in which the heat source is in contact with the bottom surface corresponding to the evaporator P1 to form a void therebetween, and the surface tension of the liquid refrigerant. A wick plate (110) in close contact with the lower plate by the spacer plate 120 for maintaining a constant interval between the lower plate 100 and the wick plate (110).

The liquid refrigerant circulates between the evaporator P1 and the condenser P2 and is continuously supplied from the condenser to the evaporator by capillary forces generated between the lower plate and the steam generated by the heat source of the evaporator is moved to the condenser. Is converted back into the liquid refrigerant. In this case, the spacer plate 120 is to maintain a constant gap between both the lower plate 100 and the wick plate 110 within a range where surface tension occurs.

However, the above-described heat pipe of the prior art 1 has a problem that the internal structure is complicated and not easy to manufacture, and the degree of contact with the inside of the outer wall by using a copper felt layer or the like as the wick layer 24. Depends on the position of the wick layer 24, and the micropaths formed in the wick layer 24 themselves to generate capillary force become non-uniform, resulting in poor reproducibility in the degree of heat transfer. In addition, since the felt layer is difficult to manufacture in a thin thickness has a problem that the thickness of the entire heat pipe is thickened because the thickness of the wick layer itself is thick, the heat pipe disclosed by this problem is used for the cooling of ultra-thin semiconductor devices It becomes impossible.

In addition, the heat pipe of the prior art 1 is not uniform in the micropath generating the capillary force is very large flow resistance, it is not structurally easy to obtain a high capillary force, the evaporation near the heat source will be active There is also a concern that the flow of the liquid refrigerant is cut off.

In the case of the plate type heat transfer device disclosed in the prior art 2, the manufacturing of the plate heat transfer device is very difficult, and a structure having a very complicated shape must be inserted between the upper plate and the lower plate, thus requiring extremely precise processing. It is almost impossible to produce, and as mentioned in the specification of the prior art 2, there is a structural limitation that it can only be manufactured to a thickness of several mm or more.

In addition, in the prior art 2, the flow of the liquid refrigerant is designed to occur through the gap between the planar wicks and the gap between the wick plate 120 and the lower plate provided in the wick plate 120, accordingly In order to maintain a constant gap between the wick plate 120 and the lower plate and the planar wicks, complex structures such as bridges connecting the planar wicks and protrusions provided on the lower and upper plates are provided. However, it is very difficult to precisely process such fine internal structures so that they can be mounted in a flat plate heat transfer device having a thickness of several mm or less, and considering the machining error, such a structure becomes a very difficult structure for mass production. The effect of the gap unevenness leads to the blocking of the liquid refrigerant supply to the evaporator, which can cause a fatal defect.

As described above, the structure is complicated, dry out easily occurs, and cooling performance may be degraded. In addition, the prior art heat transfer apparatus has a structure in which upper and lower upper and lower plates are joined to an inner structure. The bonding process is necessarily required, and even though the bonding process is not performed, the sealing state with the outside air is not perfect at the bonding portion, so that it is difficult to maintain the internal vacuum state or the refrigerant is leaked, so that defects often occur.

In addition, as shown in FIG. 5A, in the case of a plate heat transfer device having a structure in which an upper plate and a lower plate are joined, distortion due to misalignment during progress of a welding process for joining two plates (decreased flatness) When the heat dissipation side of the heat source is curved or several heat sources that are not coplanar are to be cooled together by one plate heat transfer device, the device needs to be bent or bent to the desired shape. But there is a problem of distortion at the junction.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and is to provide a plate type heat transfer device which is more reliable while reducing the production cost due to its simple structure and manufacturing process.

In addition, the present invention can maintain the flatness of the product by press working using a pipe material, even if there is no joint portion, even if bent or bent in the desired shape, such as crushing at the joint portion does not occur, such as damage to the sealing state and refrigerant leakage, etc. It is an object of the present invention to provide a plate heat transfer apparatus and a method of manufacturing the same.

In addition, the present invention is to provide a plate-type heat transfer device and a method of manufacturing the same that can be manufactured at a low cost while having a high cooling performance by efficient heat transfer.

In order to achieve the above object, the plate heat transfer apparatus according to the first aspect of the present invention is press-processed from a tube member having a predetermined length, and has two seamlessly opposed sides, and an upper surface and a bottom surface between the two sides. A case in which a defined and enclosed interior space sealed from outside air is injected with at least a portion of the interior space in which a phase change is induced by heat; One or more plate-shaped wick structures in contact with at least a portion of an inner surface of the case and providing a fine passage through which the refrigerant is movable; And one or more support structures for supporting the one or more wick structures to be in close contact with at least a portion of the inner surface of the case, the one or more supporting structures having a plurality of through openings for providing a passage of the refrigerant and the vapor. It fills at least a portion of the internal space, moves along the wick structure by capillary force generated in the micropath inside the wick structure, is vaporized and moved by the heat source, and then condenses and circulates in the space. It is characterized by performing heat transfer.

Here, if necessary, the plate-shaped wick structure is produced by aggregating a plurality of unit fibers, the unit fibers are themselves a structure that can absorb the refrigerant, the direction parallel to the inner surface of the case of the refrigerant Plate hydrophilic wick structures can be used that provide a passage to the furnace.

In addition, the plate-shaped wick structure may be used one or more thin plates formed with a plurality of parallel patterns penetrated up and down.

The support structure may be a porous structure having through openings in a vertical direction and a horizontal direction for moving the vapor up and down and moving the liquid refrigerant in a horizontal direction.

In particular, a screen mesh may be used as the support structure.

If necessary, in order to use both sides as a heat source contacting surface without any difference, the one or more plate-shaped wick structures may be at least two or more, and each of the one or more plates may be disposed on each side with the supporting structure interposed therebetween. have.

In addition, the case may be such that the thickness after the press working is not uniform depending on the position.

In particular, the case has a cross-sectional shape that is press-processed such that the thickness at the two opposite sides of the seamless is larger than the thickness at the center portion, and is in the shape of a dumbbell, further promoting circulation of steam using the left and right passages. It may be to increase the heat transfer efficiency.

Furthermore, the case has a cross-sectional shape, the lower surface of which is straight, and the upper surface of the case has a shape where peaks and valleys have a predetermined pitch, and may have an increase in the heat exchange area between the steam circulation and the outside air.

According to a second aspect of the present invention, there is provided a method of manufacturing a plate-shaped heat transfer device, the method comprising: (a) preparing a pipe member having a predetermined length; (b) inserting into the conduit one or more support structure having at least one plate-shaped wick structure for providing a micro passage so that the refrigerant is movable and a plurality of through openings for providing a passage for movement of the refrigerant and vapor; And (c) pressing the tubular material such that the wick structure is in contact with at least a portion of the inner surface of the tube and the support structure is in close contact with the wick structure in at least a portion of the inner surface of the tube.

Preferably, in the step (a), a pipe made by extrusion or drawing is prepared. In addition, in the step (a), it can be used an annealing tube material.

Further, the step (a), (a-1) preparing a circular pipe member and (a-2) the primary press working to a predetermined thickness with a margin to insert the plate-shaped wick structure and the support structure It may include a step.

Preferably, in the step (a), it is characterized in that the pipe member extruded into a substantially rectangular or track-shaped cross-sectional shape of a predetermined thickness with a margin for inserting the plate-shaped wick structure and the support structure. .

In the step (c), if necessary, the press working may be performed so that the thickness after the press working is not uniform depending on the position.

In particular, the step (c) may be press-processed such that the thicknesses at the two opposite sides are larger than the thickness at the center portion, and the press-processing may be performed so that the cross-sectional shape becomes a dumbbell shape, or (c) In the step, the press work may be performed such that the cross-sectional shape is straight and the upper surface is in the shape of peaks and valleys having a predetermined pitch.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present inventors have filed a patent application 10-2004-91617 and a patent application 10-2005-1028 separately from the present application, the configuration of the plate-shaped heat transfer device proposed in each is as shown in Figs.

3 shows the structure of the plate-shaped heat transfer apparatus of patent application 10-2004-91617 by this inventor. The illustrated plate heat transfer device has a structure in which a support structure 310 and one or more thin plates 320 and 322 are inserted between the upper plate 300 and the lower plate 350 made of metal. On the thin plate, a plurality of vertically penetrating parallel patterns formed by precision machining such as etching or punching are formed. As the pressure supporting structure 310, a mesh screen or the like having a vertical through opening having a sufficient density on the surface of the upper and lower through openings for allowing vapor generated by the vaporization of the refrigerant by the heat source in contact with the bottom surface of the lower plate 350 to move in the vertical direction. Porous material is used.

The pressing support structure 310 is pressed at least a part of the parallel pattern forming region, in particular, on the thin plates 320 and 322 during assembly, and the parallel pattern on the thin plates 320 and 322 by the pressing action of the pressing supporting structure 310. The silver may be in close contact with the upper surface of the lower plate 350, and a fine gap having a narrower width than the width of the pattern formed on the thin plate before assembly may be obtained, thereby forming an extremely fine pattern on the plate. It is possible to overcome the process limitations during etching or machining, and this process has the advantage that even a fine refrigerant passage having a diameter of several um, which is very difficult to implement in practice, can be realized.

4 shows the configuration of a plate heat transfer apparatus of Patent Application No. 10-2005-1028 by the inventor. The illustrated structure is a structure in which one or more hydrophilic wick structures 420 and a supporting structure 410 such as a screen mesh are inserted into the case consisting of the upper plate 400 and the lower plate 450. Here, the hydrophilic wick structure 420 refers to a structure having the property that the material itself can absorb and retain a refrigerant such as water therein, and is composed of a collection of fine fibers, where the fine fibers themselves are absorbed and repaired. It means something with the ability to possess.

The fiber constituting the hydrophilic wick structure has a hydrophilic group, -OH, -COOH, = 0, -NH2, -NH-, = N-, etc. on the surface thereof, so that it can be combined with water well. The hole (H) is present in the cross section of the fiber, and the capillary force through the hole allows the absorption of water into the fiber and the repair of the fiber itself, or the cross section is not a simple circular structure, but can be repaired because it is made of various shapes. It has a structure. In addition, when the groove is formed on the surface of the fiber or fine grooves (groove) is formed has a greater absorption and repair ability, and furthermore, the carbon nano tube (carbon nano tube) that has recently expanded its application range In this case, the surface area is extremely large, light weight, and a sufficient volume of hollows are formed therein, so that the water retention rate is very high and sufficient to be used as a material for the hydrophilic wick.

The present invention provides a structure and a manufacturing method of a novel plate-shaped heat transfer device further improving the structure proposed in the above-described applicant of the present invention. 6 shows one embodiment of the plate heat transfer device manufacturing method of the present invention. In the illustrated embodiment, first, prepare a cylindrical tube 500 having a predetermined length (S10). Here, the pipe member 500 may be one manufactured by a known method such as extrusion or drawing. The drawing process is difficult in the rolling, extrusion processing, etc., which is commonly used for processing semi-finished products such as rods, wires, pipes, etc., so that it is difficult to manufacture an accurate one having a very small cross-sectional area and a small dimensional tolerance. It refers to the process of reducing the product and extracting the product.

In this case, it is also possible to use an annealing pipe member 500 in order to be easy to use by bending or bending to fit the shape of various heat sources after the completion of processing.

Subsequently, a pipe member 505 having a substantially rectangular or cylindrical cross-sectional shape is formed through primary pressing (S20). At this time, the width of the pipe member 505 is approximately approximate to the width of the plate heat transfer apparatus to be finally formed, and the upper and lower surfaces are formed, and even if the width of the upper and lower surfaces is relatively large due to the characteristics of the press working, the flatness is highly flat. You can get it.

Next, the wick structure 520 and the support structure 510 is inserted into the pipe member 505 (S30). Insertion may be made from one inlet of the pipe member 505. In the above-mentioned primary press working, the press working is performed with a thickness to allow the wick structure 520 and the supporting structure 510 to be easily inserted.

In the state in which the wick structure 520 and the support structure 510 are inserted, the second press process is performed (S40). At this time, the wick structure 520 and the support structure 510 are in close contact with the upper and lower inner walls of the case 550, respectively, to obtain a basic structure of the plate heat transfer device.

The plate-shaped support structure 510 obtained by the above-described method is press-processed from the tube material so that the joining process such as welding is not necessary on the left and right sides, and the joint is not present. Therefore, not only the flatness problem and the bending of the side as shown in Fig. 5a does not occur (see Fig. 5b), but also has the advantage that the manufacturing cost is very simple to reduce the manufacturing cost.

When the refrigerant is injected, depressurized and sealed using the basic structure of the plate heat transfer device obtained by press working, the plate heat transfer device is completed. In this case, welding, soldering, or an adhesive may be used to seal the left and right inlets of the pipe, but a good vacuum may be maintained by applying a press working using a knife edge. After press working, it may be necessary to reinforce the sealed state through soldering or the like.

For example, if a knife edge is formed on one of the upper and lower surfaces of the tube after the secondary press working formed in FIG. 6 and press processing is performed near the entrance in that state, the knife edge is dug into a flat surface on the other side and the sealing state is reduced. Can be formed. Alternatively, a gasket or the like having a knife edge is inserted between the upper and lower surfaces, and pressed in such a state so that the knife edges can be indented on both the upper and lower sides, thereby obtaining a sealed state.

If the above sealing process is performed in a vacuum state, the internal low pressure state can be easily obtained, or after performing the sealing process except the exhaust port at normal pressure, exhaust and refrigerant injection through the exhaust port, and finally sealing the exhaust port The method may also be used.

As the wick structure 520 and the support structure 510, any proposed in the foregoing patent applications of the present inventors may be used, and any other proposed in the prior art may be used. In particular, the 'hydrophilic wick' and the like proposed in the prior patent application of the present invention is suitable to be used as a wick structure, the screen mesh is suitable as a support structure.

7 shows another embodiment of the plate heat transfer device manufacturing method of the present invention. Here, a cylindrical tube member is not used, but initially, a tube member 605 having a substantially rectangular cross-sectional shape or a track shape is obtained by an extrusion or drawing process (S120). At this time, the tube 605 is preferably annealing.

After the process is the same as in the embodiment shown in Figure 6, after inserting the wick structure 620 and the support structure 610 (S130), the wick structure 620 and the support structure 610 through the press working To each of the upper and lower inner surfaces of the case 650 to obtain the basic structure of the plate-shaped support structure (S140).

9A and 9B show a process flow of the embodiments of the plate heat transfer device manufacturing method of the present invention described above.

8A and 8B are views for explaining the case structure of various modified embodiments of the plate heat transfer apparatus of the present invention, respectively. The illustrated modified embodiments illustrate cases where the cross-sectional thickness is not constant depending on the position during press working, where FIG. 8A shows an example of a case 750 press-processed such that the cross section has a dumbbell shape. Through the cylindrical passages 760 on the left and right sides of the case 750, the steam V generated by the vaporization of the refrigerant near the heat source H can quickly move to the other region, and thus the other region of low temperature. It can be quickly condensed at Thus, the effect that the circulation and heat transfer of the refrigerant can be further promoted is obtained.

In FIG. 8B, the case 850 is press-formed so that the cross-sectional shape of the upper surface is a shape having peaks and valleys periodically. In this case, similarly, the vapor generated by the vaporization of the refrigerant near the heat source H is rapidly moved to the low temperature region through the passage 860 and condensed, thereby facilitating the circulation of the refrigerant. In addition, it is also possible to obtain the advantage that the heat exchange area is widened by the shape of the top and the top of the valley, so that the cooling efficiency can be increased. The periodic acid and valley shape of the upper part can be modified in various forms, and can serve to promote heat exchange as a fin in a heat exchanger.

The plate heat transfer device and its manufacturing method according to the present invention can be modified and applied in various forms within the scope of the technical idea of the present invention and are not limited to the above preferred embodiment. In addition, the embodiments and drawings are merely for the purpose of describing the contents of the invention in detail, and are not intended to limit the scope of the technical idea of the invention, the present invention described above is common knowledge in the technical field to which the present invention belongs As those skilled in the art can have various substitutions, modifications, and changes without departing from the spirit and scope of the present invention, it is not limited to the embodiments and the accompanying drawings. And should be judged to include equality.

According to the present invention, a simple structure and a manufacturing process can reduce the production cost and can implement a more reliable plate heat transfer device.

In addition, by using the present invention, by pressing the tube material can be used to maintain the flatness of the product, even if there is no bonding site, even if bent or bent in the desired shape, such as crushing at the bonding site without damaging the sealed state and the refrigerant It is possible to obtain a plate heat transfer device and a method of manufacturing the same, in which problems such as leakage do not occur.

Furthermore, according to the present invention, it is possible to obtain a plate-shaped heat transfer apparatus and a method of manufacturing the same, which can be manufactured at low cost while having high cooling performance by efficient heat transfer.

Claims (17)

Pressed from a tube of a predetermined length, having two opposite sides that are seamless, an upper surface and a bottom surface are formed between the two sides, surrounding an inner space sealed from the outside air, and in at least a portion of the inner space. A case in which a refrigerant into which a phase change is caused by heat is injected; At least one plate-shaped wick structure in contact with at least a portion of an inner surface of the case and providing a fine passage through which the refrigerant is movable; And Pressurizing at least a portion of the wick structure to further adhere the micropath of the wick structure to at least a portion of the bottom surface of the case, and at least one support structure having a plurality of through openings for providing a passage of the refrigerant and the vapor; Including; The refrigerant fills at least a portion of the inner space of the case, moves along the wick structure by capillary force generated in a micropath inside the wick structure, is vaporized and moved by the heat, and then condensed. A plate-shaped heat transfer apparatus characterized by performing heat transfer by circulating in a space. The method of claim 1, The plate-shaped wick structure includes a unit fiber including a hydrophilic group, a unit fiber having a hole in a cross section of the fiber, a unit fiber having a groove or a fine groove on the fiber surface, and a unit fiber having a hollow therein. A plate-type heat transfer device comprising: a plate-type hydrophilic wick structure manufactured by aggregating a plurality of unit fibers of at least one type of unit fibers, and having a moving passage for moving the refrigerant in a direction parallel to the inner surface of the case. The method of claim 1, The plate-shaped wick structure is a plate-shaped heat transfer device, characterized in that at least one thin plate formed with a plurality of parallel patterns penetrated up and down. The method of claim 1, The support structure is a plate-shaped heat transfer device having a porous structure having through-holes in the vertical direction and the horizontal direction for moving the vapor up and down and the liquid refrigerant in the horizontal direction. The method of claim 1, The support structure is a plate heat transfer device, characterized in that the screen mesh (screen mesh). The method of claim 1, The one or more plate-shaped wick structures, the number of the at least two, the plate-shaped heat transfer device, characterized in that disposed on each side with the support structure therebetween. The method of claim 1, The case is a plate heat transfer apparatus, characterized in that the thickness after the press working is not uniform depending on the position. The method of claim 7, wherein The case is a plate-shaped heat transfer apparatus, characterized in that the cross-sectional shape is press-processed such that the thickness at the two opposite sides that are seamless is greater than the thickness at the center portion. The method of claim 7, wherein The case has a plate-shaped heat transfer device, characterized in that the cross-sectional shape, the lower surface is a straight shape, the upper surface is a shape having a peak and a valley of a predetermined pitch. (a) preparing a tube of a predetermined length; (b) inserting into the conduit at least one support structure having at least one plate-shaped wick structure for providing a fine passage so that the refrigerant is movable and a plurality of through openings for providing the passage of the refrigerant and vapor; And (c) the wick structure is in contact with at least a portion of the inner surface of the tube, and the support structure presses the wick structure such that a portion of the wick structure is in close contact with at least a portion of the inner surface of the tube to obtain a fine gap. And pressing the tubular material so that the thickness of the tubular material is not uniform according to the position. The method of claim 10, In the step (a), A method for producing a plate heat transfer device, characterized in that for preparing a pipe made by extrusion or drawing. The method of claim 10, In the step (a), A method of manufacturing a plate heat transfer apparatus, comprising preparing an annealing pipe member. The method of claim 10, In step (a), (a-1) preparing a circular tube and (a-2) A method of manufacturing a plate heat transfer apparatus, comprising the step of primary pressing to a predetermined thickness with a margin to insert the plate wick structure and the support structure. The method of claim 10, In the step (a), A method of manufacturing a plate heat transfer apparatus, comprising: preparing an extruded tube material having a substantially rectangular or track cross-sectional shape having a predetermined thickness with a space for inserting the plate wick structure and the support structure. delete The method of claim 10, In the step (c), the plate-shaped heat transfer device manufacturing method is characterized in that the cross-sectional shape is pressed so that the thickness at the two opposite sides is larger than the thickness at the center portion. The method of claim 10, In the step (c), the cross-sectional shape is such that the lower surface is straight and the upper surface is a shape having peaks and valleys having a predetermined pitch.

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