KR100780454B1 - Probe card and production method thereof - Google Patents

Abstract

A probe card and a manufacturing method of the same are provided to fix a plurality of probes by using a fixing substrate and to bond the probes with bumps by using wires. A plurality of bumps(150) are protruded from a printed circuit board(100). The bumps are electrically connected to an internal wiring part of the printed circuit board. A fixing substrate(200) is attached on an upper part of the printed circuit board. The fixing substrate includes an open region including all regions of the bumps and a plurality of penetrating holes(210) formed at positions corresponding to the bumps. A plurality of probes(300) include one or more leg parts. The probe is inserted into the penetrating hole corresponding to the leg part in order to be fixed to a position corresponding to the bump. The probe is electrically connected to the bump by using wires(400).

Description

Probe card and production method thereof

1 is a partial cutaway view schematically showing a configuration of a probe card in which a conventional probe is formed.

2 is a partial perspective view schematically illustrating a configuration of a probe card manufactured by connecting a probe formed on a conventional substrate by wire bonding.

3 is a perspective view schematically showing the configuration of a probe card according to an embodiment of the present invention.

4 to 8 show each step of the method of manufacturing a probe card according to an embodiment of the present invention.

9 is a cross-sectional view schematically illustrating the configuration of the probe card assembly of FIG. 8.

* Brief description of the main parts of the drawing *

100: circuit board, 150: bump

200: fixed substrate, 210: through hole

220: open area, 300: probe

The present invention relates to a probe card and a method of manufacturing the same. In particular, the present invention relates to a probe card having an improved structure and a method of manufacturing the same so that the probe can be quickly and easily connected to a circuit board.

The probe card is mounted to a wafer probing apparatus and used to electrically test each individual semiconductor element formed on the wafer.

In this case, the probe provided in the probe card contacts the non-contact metal pad of each individual semiconductor device so that the test can be performed. Such a probe card generally forms a plurality of probes at once on a space transformer, which is a type of circuit board contacting a printed circuit board by using a semiconductor etching technology, or a substrate on which a plurality of probes are formed by using a semiconductor etching technology. And a method of connecting by wire bonding.

First, according to the method of manufacturing a probe card in which a probe is formed on a space transformer using a semiconductor etching technique, the probe card has an upper portion of the wiring part 11 that transmits an electrical signal from the space transformer 10, as shown in FIG. 1. After the bumps 20 are formed at a predetermined height, the probe bodies 30 formed to have the probe tips 40 are attached to the bumps 20 through the joints 50.

However, the conventional method of manufacturing a probe card using the semiconductor etching technique must use a semiconductor etching technique of a complicated process using a photoresist layer or the like to form the bump 20 in the space transformer 10 to a constant height, Probably a cumbersome process such as having to attach the probe body 30 formed in a separate process to the top of each bump 20, respectively.

Meanwhile, according to a method of connecting a substrate on which a plurality of probes are formed by using a semiconductor etching technique to a wire bonding method with a printed circuit board, the probe card may use the semiconductor etching technique on the substrate 70 as shown in FIG. 2. After the plurality of probes 60 are formed using the plurality of probes 60, the substrate 70 is attached to the auxiliary printed circuit board 80, and then wiring portions of the probe 60 and the auxiliary printed circuit board 80 are formed. 81 is bonded using the wire 71, the auxiliary printed circuit board 80 is placed on the main printed circuit board 90, and the wiring portion 81 of the auxiliary printed circuit board 80 is It is manufactured by connecting the wiring portion 91 of the printed circuit board 90 to the metal wire 85.

The conventional method of manufacturing a probe card has a disadvantage in that the manufacturing method is complicated, such as an auxiliary printed circuit board 80, an intermediate connecting board such as a metal wire 85, and the like, used between the probe 60 and the main printed circuit board 90. There is this.

In addition, the conventional method of manufacturing a probe card has to form the probe 60 on the substrate 70 through a semiconductor etching process, and thus, the manufacturing process is difficult, and thus, a fine pitch between the probes is difficult to be implemented. . Therefore, this conventional probe card manufacturing method has a disadvantage in that it is difficult to manufacture a probe card corresponding to a wafer having a fine pitch between semiconductor chips.

In addition, in the conventional method of manufacturing a probe card, a multilayer such as a substrate 70, an auxiliary printed circuit board 80, and a main printed circuit board 90 is used, and each layer is bent by heat generated during the manufacturing process. It may be deformed, and thus the flatness of the entire probes 60 may be changed.

Meanwhile, according to the conventional methods of manufacturing a probe card, a probe, particularly a probe tip, is manufactured through a complicated semiconductor etching process such as forming and removing a photo photoresist layer several times, and thus a contact pressure for each probe and The length of the scrub may appear differently, and thus, the alignment of the probes may be disturbed, and the impedance may be different for each probe, thereby degrading the overall electrical characteristics of the probe card.

In order to solve the above technical problem, the present invention is to provide a probe card of a novel structure that can quickly and easily connect the probe to the circuit board.

In addition, the present invention provides a method for manufacturing a probe card of a novel structure that can be quickly and easily connected to the probe to the circuit board.

Probe card according to an aspect of the present invention for solving the above technical problem is a circuit board protruding a plurality of bumps electrically connected to the wiring portion therein; A fixed substrate attached to an upper portion of the circuit board and having an open area having a size that includes all of the areas where the plurality of bumps are formed, and a plurality of through holes formed at positions corresponding to the plurality of bumps; And a plurality of probes having one or more legs. The probe is inserted into the corresponding through hole corresponding to the leg, and is fixed at a position corresponding to the bump, and the probe and the bump are electrically connected through a wire.

The probe may have one or more leg portions, and the fixed substrate may be formed to have one or more through holes for one probe so as to correspond to one or more leg portions of the probe, respectively.

The leg portion of the probe may be formed to have a locking portion having an uneven shape.

An empty space may be formed inside the uneven shape of the locking portion.

The through hole of the fixing substrate may be formed to have a fixing portion having an uneven shape corresponding to the uneven shape of the locking portion.

The fixed substrate is made of a nonconductive material.

According to still another aspect of the present invention, there is provided a method of manufacturing a probe card, the method including: manufacturing a circuit board by forming a plurality of bumps electrically connected to an internal wiring part; Manufacturing a fixed substrate to have an open area having a size including all of the areas in which the plurality of bumps are formed and a plurality of through holes at positions corresponding to the plurality of bumps, respectively; Disposing the fixed substrate on the circuit board such that the plurality of through holes of the fixed substrate correspond to the plurality of bumps of the circuit board; And inserting and fixing a plurality of probes into corresponding plurality of through holes, respectively.

The probe card manufacturing method of the present invention may further include electrically connecting the plurality of bumps corresponding to the plurality of probes with wires, respectively.

The method of manufacturing a probe card of the present invention may further include attaching the circuit board and the fixed substrate to a bonded bonder.

According to another aspect of the present invention, a probe includes a circuit board having a plurality of bumps electrically connected to an internal wiring part, an open area exposing the plurality of bumps, and positions corresponding to the plurality of bumps, respectively. The locking portion is inserted into and fixed to the through hole of the probe card base formed by attaching a fixing substrate having a plurality of through holes, and the locking portion is provided to have a concave-convex shape corresponding to the concave-convex fixing portion formed inside the through hole of the fixing substrate. And formed leg portions.

An empty space may be provided inside the uneven shape of the locking portion.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

First, a probe card according to an exemplary embodiment of the present invention will be described in detail with reference to FIG. 3.

As can be seen in Figure 3, the probe card according to an embodiment of the present invention is composed of a circuit board 100, a fixed substrate 200, and a probe 300.

Here, the circuit board 100 may include a wiring unit (not shown) therein, and may be used without particular limitation as long as it has a plurality of bumps 150 electrically connected to the wiring unit and protruded outward. have. The circuit board 100 may be manufactured by forming a bump 150 that is electrically connected to the wiring portion by a general patterning process on a commercially available printed circuit board or a space transformer.

The fixed substrate 200 is attached to the upper portion of the circuit board 100 to fix the plurality of probes 300 to positions corresponding to the plurality of bumps 150 formed on the circuit board 100, respectively.

As shown in FIG. 3, the fixed substrate 200 is formed with an open area 220 having a size including all of the areas in which the plurality of bumps 150 are formed, and the plurality of probes ( A plurality of through holes 210 are formed to be inserted and fixed at positions corresponding to the plurality of bumps 150. On the other hand, when the probe 300 has two or more legs, the fixed substrate 200 has two or more through holes for one probe 300 to correspond to two or more legs of the probe 300, respectively. 210). In this case, the number of the through-holes 210 of the fixed substrate 200 is more than twice the number of the bumps 150 of the circuit board 100 corresponding to the probe 100 in one-to-one correspondence.

The fixed substrate 200 may be used without particular limitation as long as it is formed of a non-conductive material. As the non-conductive material, a material having high resistance such as silicon or glass is preferably used.

The fixed substrate 200 may be manufactured by selectively screening the plurality of through holes 210 and the open area 220 through a mask on a raw material substrate.

In one embodiment of the present invention, the circuit board 100 and the fixed board 200 are precisely arranged by an align key (not shown), and may be bonded to each other by a bonding bonder. Here, the bonding bond used is not particularly limited as long as it is a non-conductive bond, but preferably epoxy, argon alpha, and UV bond. In addition, a non-conductive bonder bonded through light or heat such as ultraviolet rays can also be used as the bonding bonder.

The probe 300 is not particularly limited in shape as long as it includes the probe tip 310 and one or more legs (not shown). The probe 300 may have two or more legs so that the probe 300 is not rotated after being inserted into and fixed to the through hole 210 of the fixed substrate 200.

3 is an example of a possible shape of the probe 300. The probe 300 is fixed to the fixed substrate 200 only by inserting the leg portion into the through hole 210 of the fixed substrate 200. To this end, at least one of the legs of the probe 300 is formed to have at least one locking portion 330 of the uneven shape so as not to be easily separated from the through hole 210 of the fixed substrate 200 as shown in FIG. It is desirable to be. It is more preferable that an empty space is formed in the interior of the locking portion 330, so that the locking portion 300 has an elastic force in the empty space direction. Therefore, when the leg of the probe 300 having the locking portion 330 is inserted into the through hole 210 of the fixed substrate 200, the probe 300 is not easily separated due to the elastic force of the locking portion 300. .

 The probe 300 may be preferably formed through a general etching process using a mask and a photo photoresist layer corresponding to the shape of the probe 300.

As such, the probe 300 fixed at the position corresponding to the bump 150 on the circuit board 100 may be connected to the bump 150 through the wire 400 as shown in FIG. 3. Connected.

As such, the probe card according to an embodiment of the present invention can directly connect the bumps 150 formed in the wide range on the circuit board 100 to the respective probes 300, so that the entire area of the circuit board as in the prior art. There is no need to combine several transverse arrangements to form a probe for.

Therefore, the flatness of the probe card according to an embodiment of the present invention can be easily adjusted compared to the probe card formed by combining a plurality of horizontal arrangement structures as in the related art, and the flatness is excellent.

Hereinafter, a method of manufacturing a probe card according to an embodiment of the present invention will be described in detail with reference to FIGS. 4 to 9.

First, a circuit board 100 as shown in FIG. 4 is first manufactured.

The circuit board 100 is manufactured by forming a plurality of bumps 150 at a portion electrically connected to an internal wiring part.

Hereinafter, a method of manufacturing the circuit board 100 will be described in detail with reference to FIG. 5.

First, as shown in FIG. 5A, a circuit board 100 having a wiring part 120 formed therein is prepared. In the present invention, a case in which a space transformer is used as the circuit board 100 will be described as an example.

Next, a seed layer 110 is formed by sputtering and attaching a metal such as titanium or copper on the circuit board 100.

Next, as shown in FIG. 5B, a photoresist layer 130 is formed on the seed layer 110.

Thereafter, portions corresponding to the exposed portions of the wiring portion 120 on the upper portion of the circuit board 100 using masks having holes at positions corresponding to the exposed portions of the wiring portion 120 on the upper portion of the circuit board 100. The photoresist layer 130 is selectively exposed and denatured by irradiating light with light, and a portion of the photoresist layer 130 denatured with an etching solution is selectively etched and removed, as shown in FIG. 5C. The through hole 131 is formed on the 130.

Next, a metal 150 is filled in the through hole 131 by the electroplating method to form the bump 150 as illustrated in FIG. 5D. There is no restriction | limiting in particular as a metal used at this time, Nickel is used preferably.

Next, the plurality of protruding bumps 150 are polished by chemical mechanical polishing or the like to planarize the plurality of bumps 150.

Thereafter, the photoresist layer 130 and the seed layer 110 are etched away to manufacture the circuit board 100 of FIG. 4.

Meanwhile, as shown in FIG. 6, the fixed substrate 200 includes an open area 220 and a plurality of probes 300 having a size including all of the areas in which the plurality of bumps 150 are formed on the circuit board 100. ) Is formed of a non-conductive material to have a plurality of through holes 210 that can be inserted and fixed. The method of manufacturing the fixed substrate 200 may be easily manufactured using conventional techniques such as screening and removing the through-hole 210 and the open area 220 through a mask on the non-conductive raw material substrate. Detailed description will be omitted in the specification of the present invention.

Next, the fixed substrate 200 is connected to the plurality of bumps 150 of the manufactured circuit board 100 so that the plurality of through holes 210 of the fixed substrate 200 correspond to the circuit board 100. ) And attached to each other to form a probe card base as shown in FIG. In this case, an alignment key (not shown) that simultaneously passes through the circuit board 100 and the fixed substrate 200 may be used for accurate placement of the circuit board 100 and the fixed substrate 200. In this case, the arrangement of the circuit board 100 and the fixed board 200 can be easily achieved by disposing an alignment key on the circuit board 100 and arranging the fixed board 200 according to the alignment key. have. In this case, the circuit board 100 and the fixed substrate 200 may be firmly bonded to each other by a bonding bonder. Here, the bonding bond used is not particularly limited as a non-conductive bond, but preferably epoxy, argon alpha, and UV bond can be used. In addition, a non-conductive bonder bonded through light or heat such as ultraviolet rays can be used as the bonding bonder.

As such, when the fixed substrate 200 is bonded to the circuit board 100, as shown in FIG. 7, the plurality of bumps 150 formed on the circuit board 100 may open the fixed substrate 200. Exposed by the region 220.

Next, the probes 300 manufactured by the MEMS process are separately inserted into and fixed to the plurality of through holes 210 provided on the fixing substrate 200 of the probe card base thus formed, as shown in FIG. 8. Form a probe card structure.

The probe 300 is preferably provided with two or more legs so as not to rotate after being inserted and fixed in the through-hole 210 of the fixed substrate 200. In addition, at least one of the legs of the probe 300 is formed to have at least one locking portion 330 of the concave-convex shape so as not to be easily separated from the through hole 210 of the fixed substrate 200 as shown in FIG. do. It is more preferable that an empty space is formed in the interior of the locking portion 330, so that the locking portion 300 has an elastic force in the empty space direction. Therefore, when the leg of the probe 300 having the locking portion 330 is inserted into the through hole 210 of the fixing substrate 200, the probe 300 is fixed due to the elastic force of the locking portion 300. It is not easily separated from the substrate 200. Meanwhile, the through hole 210 of the fixing substrate 200 may include an uneven shape fixing part 211 corresponding to the uneven shape of the locking part 330 of the probe 300. In this case, the probe 300 inserted into the through-hole 210 of the fixed substrate 200 has the engaging portion 330 unevenly coupled with the fixed portion 211 of the fixed substrate 200, so that the probe 300 It is possible to fix more firmly.

As described above, when the plurality of probes 300 are inserted into and fixed to the through holes 210 adjacent to the corresponding bumps 150 as shown in FIG. 8, the weld 340 of the plurality of probes 300 and the corresponding probes ( A plurality of bumps 150 corresponding to 300 may be collectively welded and bonded with a plurality of wires 400 to manufacture the probe card of the present invention as shown in FIG. 3.

As described above, the probe card of the present invention may be simply manufactured by forming a bump on a circuit board, fixing a plurality of probes through a fixed substrate, and wire bonding the probe and the bump.

Specifically, the probe card of the present invention is directly connected to a plurality of probes fixed to a fixed substrate by a wire directly to the bump formed on the circuit board, bar connection in the conventional probe card is made of a plurality of probes Intermediate connecting substrates such as < RTI ID = 0.0 > Accordingly, the manufacturing method of the probe card of the present invention has a shorter manufacturing process compared to the prior art, shorten the manufacturing process time, and does not use intermediate connecting substrates, thereby making it easy to adjust the flatness of the probe card and thus productivity. This can be greatly improved.

In addition, in the probe card of the present invention, the probe may be inserted into the through-hole of the fixing substrate to fix the probe. In addition, the probe card according to an embodiment of the present invention is manufactured by adhering a separately prepared fixed substrate to a separately manufactured circuit board, so that the thermal deformation is different from the prior art in which a plurality of layers are formed on one substrate. Does not occur, and thus the flatness of the entire probe card is excellent.

On the other hand, the probe card manufactured by the method of manufacturing the probe card of the present invention is exposed to the bumps on the circuit board by the open area of the fixed substrate, the wire bonding operation between the probe and the bumps is facilitated, Repair work is also easy.

On the other hand, the probe card of the present invention is manufactured by inserting a precisely manufactured probe through a MEMS process into a fixed substrate, and thus, the probe can be more precisely arranged and designed compared to the prior art of forming the probe on a circuit board. It is possible to implement a fine pitch.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the technical idea of the present invention, and it is obvious that the present invention belongs to the appended claims. Do.

Claims (12)

A circuit board on which a plurality of bumps electrically connected to an internal wiring part protrude; A fixed substrate attached to an upper portion of the circuit board and having an open area having a size that includes all of the areas where the plurality of bumps are formed, and a plurality of through holes formed at positions corresponding to the plurality of bumps; And A plurality of probes having one or more legs; Including but not limited to: And the probe is inserted into the through hole corresponding to the leg part and fixed at a position corresponding to the bump, and the probe and the bump are electrically connected through a wire. The method of claim 1, The probe has two or more legs, And the fixing substrate has two or more through holes for one probe so as to correspond to two or more leg portions of the probe, respectively. The method of claim 1, The probe card, characterized in that the leg portion of the probe has a locking portion having an uneven shape. The method of claim 3, The probe card, characterized in that an empty space is formed inside the concave-convex shape of the engaging portion. The method of claim 3, The probe card according to claim 1, wherein the through hole of the fixed substrate has a concave-convex fixing portion corresponding to the concave-convex shape of the engaging portion. The method according to any one of claims 1 to 5, And the fixed substrate is made of a non-conductive material. Manufacturing a circuit board by forming a plurality of bumps electrically connected to an internal wiring part; Manufacturing a fixed substrate to have an open area having a size including all of the areas in which the plurality of bumps are formed and a plurality of through holes at positions corresponding to the plurality of bumps, respectively; Disposing the fixed substrate on the circuit board such that the plurality of through holes of the fixed substrate correspond to the plurality of bumps of the circuit board; And Inserting and fixing a plurality of probes into corresponding plurality of through holes, respectively; Probe card manufacturing method comprising a. The method of claim 7, wherein Electrically connecting the plurality of bumps corresponding to the plurality of probes with wires, respectively. The method of claim 7, wherein And attaching the circuit board and the fixed substrate with a bond bonder. The method of claim 7, wherein And the number of through holes of the fixed substrate is greater than twice the number of bumps. A circuit board having a plurality of bumps electrically connected to an internal wiring part, an open area exposing the plurality of bumps, and a fixed substrate having a plurality of through holes at positions corresponding to the plurality of bumps, respectively. A probe fixed to the through hole of a probe card base formed by attachment, And a leg portion having a locking portion provided in a concave-convex shape corresponding to the concave-convex fixing portion formed in the through hole of the fixed substrate. The method of claim 11, Said probe, characterized in that the empty space is provided inside the concave-convex shape of the engaging portion.

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