KR100776482B1 - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

An organic light emitting display device and a manufacturing method thereof are provided to maintain a stable light emitting characteristic and improve an electric characteristic of an element by preventing the change of voltage. An organic light emitting display device includes an insulation substrate, a first electrode, a first wiring, a second electrode, a second wiring, a sub electrode, a driving unit, an insulation film(60), and an organic thin film layer. The first electrode is formed in one direction on the insulation substrate. The first wiring is connected to the first electrode. The second electrode is formed in the direction which crosses the first electrode. The second wiring is connected to the second electrode. The sub electrode is formed at the first wiring and the second wiring. The driving unit is connected with the first wiring and the second wiring. The insulation film is formed between the first electrode and the second electrode, and has an opening at a part where the first electrode and the second electrode cross each other, and an opening at a part where the driving unit, the first wiring, and the second wiring are connected. The organic thin film layer is formed at the opening where the first electrode and the second electrode cross each other.

Description

Organic light emitting display device and method of manufacturing the same {Organic light emitting display device and method of manufacturing the same}

1 is a plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

2A to 2G are plan views illustrating a method of manufacturing an organic light emitting display device according to the present invention.

3A to 3G are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10: pixel region 12: anode electrode

14 cathode electrode 22 data line

24: scanning lines 26a and 26b: auxiliary electrodes

28a and 28b: protective film 30: non-pixel region

40: bonding pad portion 42: drive portion

46: bump 50: input / output pad portion

60: insulating films 62a, 62b and 62c: openings

70: partition 80: organic thin film layer

100: substrate 110: anisotropic conductive film

112: challenge ball

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more particularly, to an organic light emitting display device having an auxiliary electrode and a manufacturing method thereof.

Organic light emitting devices are next-generation display devices with self-luminous characteristics.They are organic light emitting devices that have a viewing angle, contrast, response speed, and power consumption compared to liquid crystal display devices (LCDs). Has excellent properties.

The organic light emitting device is composed of an anode electrode, an organic thin film layer and a cathode electrode, and when a predetermined voltage is applied to the anode electrode and the cathode electrode, holes injected through the anode electrode and electrons injected through the cathode electrode are recombined in the light emitting layer. In this process, light is emitted by the energy difference generated by this process.

Such an organic light emitting display device has a passive matrix method in which a pixel is connected between a scan line and a signal line to form a pixel, and a thin film transistor in which an operation of each pixel serves as a switch. It is configured in an active matrix manner controlled by a film transistor (TFT).

An organic light emitting display device having a passive matrix type includes: an organic light emitting display including an anode formed in one direction, a cathode formed to intersect the anode, and an organic thin film layer formed between the anode and the cathode; The driving unit is configured to process a signal input from the outside and transmit the signal to the organic light emitting diode through the data line and the scan line.

In the organic light emitting display device configured as described above, the data line and the scan line are formed of a transparent electrode material such as indium tin oxide (ITO). ITO has good permeability but high resistance. Therefore, in the current driving type organic light emitting display device, an increase in resistance values of the data line and the scan line causes a sudden voltage change. Recently, the auxiliary electrode is formed of a material having a low resistance to reduce the resistance of the data line and the scan line, and the sidewall of the auxiliary electrode is exposed during the etching process for patterning the data line and the scan line. The increase is a problem.

An object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same that can prevent sidewall loss of the auxiliary electrode.

An organic light emitting display device according to an aspect of the present invention for achieving the above object is an insulating substrate, a first electrode formed in one direction on the insulating substrate, a first wiring connected to the first electrode, the first electrode A second electrode formed in a direction intersecting with the second electrode, a second wiring connected to the second electrode, an auxiliary electrode formed on the first wiring and the second wiring, a driver connected to the first wiring and the second wiring, and the first electrode An insulating layer formed between a second electrode and an opening formed in a portion at which the first electrode and the second electrode intersect, a portion at which the driving unit is connected to the first wiring and the second wiring, the first electrode and the second electrode An organic thin film layer formed in the opening of the intersection portion, a protective film formed on at least one surface of the upper surface and the lower surface of the auxiliary electrode, and formed on the insulating film and intersecting the first electrode. And partition walls arranged in a direction.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device, including: a first electrode arranged in one direction on a substrate; a first wiring and a second wire extending from the first electrode; Forming a second wiring to be connected to an electrode, forming an auxiliary electrode on the first wiring and the second wiring, forming an insulating film on the entire upper surface, and then forming the auxiliary electrode on the first wiring and the second wiring And forming an opening to expose a portion of the first electrode, forming a partition on the insulating film in a direction crossing the first electrode, and forming an organic thin film layer on the first electrode exposed through the opening. And forming a second electrode crossing the first electrode and connected to the auxiliary electrode formed on the second wiring.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided to those skilled in the art to fully understand the present invention, and may be modified in various forms, and the scope of the present invention is limited to the embodiments described below. no.

1 is a plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

The substrate 100 made of an insulator is divided into a pixel region 10 and a non-pixel region 30. The substrate 100 uses a substrate made of a transparent material, such as an opaque material in the case of the top light emitting structure and glass in the case of the bottom light emitting structure. The non-pixel area 30 may be a peripheral area of the pixel area 10 and may mean an area surrounding the pixel area 10.

In the substrate 100 of the pixel region 10, a plurality of organic electroluminescent elements connected in a matrix manner are formed between the anode electrode 12 and the cathode electrode 14, and in the substrate 100 of the non-pixel region 30. Data lines 22 and scan lines 24 extending from the anode electrode 12 and the cathode electrode 14 of the pixel region 10, a power supply line (not shown) for the operation of the organic light emitting diode, and an input / output pad unit ( A driver 42 for processing a signal supplied from the outside through the 50 and supplying the signal to the data line 22 and the scan line 24 is formed.

The organic electroluminescent element is composed of an anode electrode 12 and a cathode electrode 14 formed to cross each other, and an organic thin film layer formed between the anode electrode 12 and the cathode electrode 14. The organic thin film layer has a structure in which a hole transport layer, an organic light emitting layer, and an electron transport layer are stacked, and may further include a hole injection layer and an electron injection layer.

The driver 42 is formed on the substrate 100 of the non-pixel region 30 in the manufacturing process of the organic light emitting device, or is manufactured as a separate integrated circuit semiconductor chip and then chip on glass Alternatively, the substrate 100 may be attached to the substrate 100 to be connected to the data line 22 and the scan line 24 by a wire bonding method or the like.

An encapsulation substrate (not shown) is disposed on the substrate 100 for encapsulation of the organic light emitting device, and the substrate 100 and the encapsulation substrate are sealed by a sealant such as epoxy or frit. Are bonded.

Next, a method of manufacturing the organic light emitting display device according to the exemplary embodiment of the present invention configured as described above will be described with reference to FIGS. 2A to 2G and 3A to 3G. For convenience of description, FIGS. 2A to 2G and 3A to 3G schematically illustrate a part of the bonding pad portion 40 on which the pixel region 10, the non-pixel region 30, and the driver 42 of FIG. 1 are mounted. As shown.

2A and 3A, a conductive layer is formed of a transparent electrode material on the substrate 100, and the conductive layer is patterned to form anode electrodes 12 arranged in one direction in the pixel region 10. In the non-pixel region 30, a data line 22 extending from the anode electrode 12 and a scan line 24 to be connected to the cathode electrode 14 are formed. At this time, a part of the data line 22 and the scan line 24 are formed up to the bonding pad portion 40. The transparent electrode material may be formed of one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO).

2B and 3B, auxiliary electrodes 26a and 26b are formed on the data line 22 and the scan line 24. ITO is a conductive material doped with indium oxide (In ₂ S ₃ ) doped with tin oxide (SnO ₂ ), and has a disadvantage in that the transmittance is good but the resistance is high. Thus, in order to reduce the resistance of the data line 22 and the scan line 24 made of ITO or the like, materials having low resistance, for example, aluminum (Al), silver (Ag), molybdium (Mo), and copper ( The auxiliary electrodes 26a and 26b are formed of Cu, chromium (Cr), or the like. However, since the materials may be easily lost when exposed to an etchant during an etching process for patterning ITO, the protective films 28a and 28b only on and under or above the auxiliary electrodes 26a and 26b, as shown in FIG. 2C. Can be formed. The passivation layers 28a and 28b are formed of a material that does not cause loss of the auxiliary electrodes 26a and 26b during an etching process for patterning ITO.

2D, 3C, and 3D, after the insulating film 60 is formed of an organic material or an inorganic material on the entire upper surface, a protective film formed on the data line 22 and the scan line 24 of the bonding pad part 40. Openings 62a, 62b, and 62c are formed to expose portions 28a and 28b, a protective film 28b formed on the scan line 24 adjacent to the pixel region 10, and a part of the anode electrode 12 in the light emitting region. At this time, the thickness of the insulating film 60 formed on the data line 22 and the scan line 24 is adjusted to be thinner than the diameter of the conductive ball, and the edges of the data line 22, the scan line 24, and the anode electrode 12 are adjusted. The sizes of the openings 62a, 62b and 62c are adjusted to be covered by the additional insulating layer 60. 3C is a cross-sectional view taken along the A1-A2 portion of FIG. 2A, and FIG. 3D is a cross-sectional view taken along the B1-B2 portion of FIG. 2A.

Referring to FIG. 2E, the partition wall 70 is formed on the insulating layer 60 of the pixel region 10 in a direction crossing the anode electrode 12. The partition wall 70 is for separation between the organic thin film layer to be formed on the insulating film 60 and the cathode electrode, it is preferable to form an overhang structure having a wider width than the lower portion.

2F and 3E, after forming the organic thin film layer 80 on the entire upper surface, the organic thin film layer 80 of the non-pixel region 30 is removed. At this time, the organic thin film layer 80 is filled in the opening 62c of the light emitting region, and the organic thin film layer 80 is separated from each other by the partition wall 70.

2G and 3F, the metal layer is formed on the entire upper surface and then patterned to form the cathode electrode 14 to cross the anode electrode 12 of the emission region. At this time, a portion of the cathode electrode 14 is in contact with the passivation layer 28b exposed through the opening 62b so that the cathode electrode 14 and the scan line 24 are electrically connected through the auxiliary electrode 26b.

The present invention forms an insulating film 60 in the pixel region 10 and the non-pixel region 30, as shown in Figure 2d, and on the data line 22 and the scanning line 24 of the bonding pad portion 40 The formed protective films 28a and 28b and the protective film 28b formed on the scanning line 24 adjacent to the pixel region 10 are exposed through the openings 62a and 62b as shown in FIG. 3D. Therefore, the sidewalls and edges of the data line 22, the scan line 24, and the auxiliary electrodes 26a and 26b are protected by the insulating layer 60, so that the etching agent penetrates or corrodes the metal layer to form the cathode electrode 14. Loss due to

2G and 3G, an anisotropic conductive film (ACF) 110 is disposed such that the conductive balls 112 are positioned on the passivation layers 28a and 28b exposed through the openings 62a and 62b of the bonding pad portion 40. After the formation of the bumps 46, the driving unit 42 is mounted so that the bumps 46 are positioned in the openings 62a and 62b, respectively. Then, the bumps 46 are compressed by a process such as thermocompression bonding so that the bumps 46 come into contact with the protective films 28a and 28b through the conductive balls 112. The conductive balls 112 are broken by thermocompression so that the bumps 46 come into contact with the passivation layers 28a and 28b so that the driving unit 42 passes through the auxiliary electrodes 26a and 26b and the data line 22 and the scan line 24. Is electrically connected to the

In this embodiment, the insulating film 60 is formed on the entire surface of the non-pixel region 30 and is formed on the data line 22 and the scan line 24 through the openings 62a and 62b formed in the bonding pad portion 40. Although the structure in which the formed protective films 28a and 28b are exposed is described, the present invention is not limited thereto, and an effect of the present invention can be obtained even when the insulating film 60 is embedded only between the data line 22 and the scan line 24. have.

As described above, the preferred embodiment of the present invention has been disclosed through the detailed description and the drawings. The terms are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, in the present invention, the sidewalls and edges of the data line, the scan line, and the auxiliary electrode are protected by the insulating layer, thereby preventing the loss of the auxiliary electrode due to infiltration or corrosion of the etchant during the etching process. Therefore, since the voltage fluctuation is prevented due to the decrease in the resistance values of the data line and the scan line, stable light emission characteristics can be maintained and the electrical characteristics of the device can be improved.

Claims (11)

Insulation board, A first electrode formed in one direction on the insulating substrate, A first wiring connected to the first electrode, A second electrode formed in a direction crossing the first electrode, A second wiring connected to the second electrode, Auxiliary electrodes formed on the first wiring and the second wiring; A driving unit connected to the first wiring and the second wiring; An insulating film formed between the first electrode and the second electrode and having an opening formed at a portion at which the first electrode and the second electrode cross each other, at a portion at which the driving part is connected to the first wiring and the second wiring, An organic light emitting display device comprising an organic thin film layer formed in the opening at a portion where the first electrode and the second electrode intersect. The organic light emitting display device of claim 1, wherein the first electrode, the first wiring, and the second wiring are made of a transparent electrode material. The organic light emitting display device according to claim 1, wherein the auxiliary electrode is one selected from the group consisting of aluminum (Al), silver (Ag), molybdium (Mo), copper (Cu), and chromium (Cr). . The organic light emitting display device of claim 1, wherein the driving unit is connected to the first wiring line and the second wiring line through conductive balls. The organic light emitting display device of claim 1, further comprising a passivation layer formed on at least one of an upper surface and a lower surface of the auxiliary electrode. The organic light emitting display device of claim 1, further comprising a partition wall formed on the insulating layer and arranged in a direction crossing the first electrode. Forming a first electrode arranged in one direction on the substrate, a first wiring extending from the first electrode, and a second wiring to be connected to the second electrode; Forming an auxiliary electrode on the first wiring and the second wiring; Forming an opening so that an auxiliary electrode formed on the first wiring and the second wiring and a portion of the first electrode are exposed after forming an insulating film on the entire upper surface; Forming a partition on the insulating film in a direction crossing the first electrode; Forming an organic thin film layer on the first electrode exposed through the opening; And forming a second electrode crossing the first electrode and connected to the auxiliary electrode formed on the second wiring. The method of claim 7, wherein the first electrode, the first wiring, and the second wiring are formed of a transparent electrode material. The organic light emitting display device of claim 7, wherein the auxiliary electrode is formed of one selected from the group consisting of aluminum (Al), silver (Ag), molybdium (Mo), copper (Cu), and chromium (Cr). Method of preparation. The method of claim 7, wherein a thickness of the insulating layer formed on the first wiring and the second wiring is adjusted to be smaller than a diameter of the conductive ball. The method of claim 7, wherein the size of the opening is adjusted to cover the edges of the first wiring, the second wiring, and the first electrode with the insulating film.

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