KR100773413B1 - Method for producting rod type resistor - Google Patents

Abstract

The present invention relates to a cylindrical resistor manufacturing method, a process for producing a first mask film having a resistor pattern, a process for producing a second mask film having a pad pattern, and a thick film printing method using the first mask film Forming a resistor on the outer circumferential surface of the ceramic rod, and forming a pad in contact with the resistor formed on the outer circumferential surface of the ceramic rod by a thick film printing method using a second mask film; When pads are formed on the outer circumferential surface of the ceramic rod, the process of assembling leads to the pads, and when the lead is bonded to the pads, assembling the cover formed with the through grooves through both ends of the ceramic rods so that the lead penetrates. When the cover is assembled, it consists of trimming the lead to have a predetermined resistance value.It removes the inductive component to secure the reliability of the circuit when used in precision circuits, realizes high resistance value, and reaches the target temperature quickly when used as a heating element. It is in such a way.

Resistors, Cylindrical, Thick Film, Ceramic

Description

Method for manufacturing cylindrical resistors {Method for producting rod type resistor}

1 is a perspective view of a cylindrical resistor of the present invention,

2A to 2J are views illustrating a method of manufacturing the cylindrical resistor shown in FIG. 1;

3a and 3b is a view showing an assembly method of a cylindrical resistor according to the present invention,

4 is an exploded perspective view showing an embodiment of an assembly method of a cylindrical resistor according to the present invention.

<Code Description of Main Parts of Drawing>

11: first mask film 12: second mask film

15: third mask film 22a: resistor

23a: pad 24a: protective layer

31: ceramic rod 32: lead

33: cover 41: hollow ceramic rod

42: insertion rod 43: circular clamp lead

44: insulation ring 45: L-shaped clamp

46: nut

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a cylindrical resistor, and more particularly, to a method for manufacturing a cylindrical resistor in which a resistor pattern is formed by using a thick film printing manufacturing method such that an inductive component generated in the resistor is removed.

Resistors used in high voltage or precision circuits include wirewound resistors. The winding resistor is largely composed of a ceramic bobbin, a metal wire, and a ceramic case. In the method of manufacturing a winding resistor composed of a ceramic bobbin, a metal wire and a ceramic case, first, a metal wire formed of a nickel-chromium (Ni-Cr) alloy or a copper-nickel (Cu-Ni) alloy is wound on the ceramic bobbin with a coil like a coil. . When the metal wire is wound around the ceramic bobbin in the form of a screw, the ceramic bobbin wound around the metal wire is assembled inside the ceramic case.

When the assembly of the ceramic bobbin wound with a metal wire inside the ceramic case is completed, a lead terminal is assembled to the metal wire, and then the winding resistor is manufactured by filling a ceramic case with a material such as cement in the ceramic case. Here, since the resistor generates heat in proportion to the resistance value, the winding resistor is assembled by installing an aluminum (Al) plate having good thermal conductivity inside the ceramic case to release the generated heat to the outside.

Conventional winding resistors used in high voltage or precision circuits are manufactured by winding a metal wire in a bobbin-like shape to a bobbin, thereby having a large inductive component. In the case where a large inductive component is present in the winding resistor, the resistance value is changed due to the inductive component. When the resistance value of the winding resistor is changed due to the inductive component, there is a problem of causing a fatal error in the peripheral circuit to which the winding resistor is applied.

The high inductance causes fatal errors in the circuits to which the wirewound resistors are applied, and metal wires formed of nickel-chromium (Ni-Cr) alloys or copper-nickel (Cu-Ni) alloys have very low resistivity values. If the resistivity of the metal wire is very low, the length of the metal wire is increased to produce a winding resistor having a high resistance value of 500 KΩ or more. If the length of the metal wire is increased, the volume of the winding resistor as a whole increases the manufacturing cost and the economical efficiency is lowered, when manufacturing a winding resistor having a resistance value of 1MΩ or more, there is a problem that it is difficult to manufacture the volume.

Due to the low resistance of the metal wire wound on the ceramic bobbin, it is difficult to manufacture a winding resistor having a high resistance value, and when used as a heating element, the time to reach the target temperature is very slow due to the use of a good conductive metal wire. There is this.

An object of the present invention is to provide a method of manufacturing a cylindrical resistor to form a resistor pattern by using a thick film printing manufacturing method to remove the inductive components generated in the inside of the resistor.

Another object of the present invention is to provide a method of manufacturing a cylindrical resistor that can implement a high resistance value at a low resistance value according to a pattern of a resistor formed on the outer circumferential surface of the cylindrical ceramic case.

 Another object of the present invention is to provide a method of manufacturing a cylindrical resistor that can be quickly reached to the target heat generation temperature uniformly when used as a heating element by printing a resistor on the outer peripheral surface of the cylindrical ceramic case.

The method of manufacturing a cylindrical resistor of the present invention comprises the steps of preparing a first mask film having a resistor pattern; Manufacturing a second mask film having a pad pattern; Forming a resistor on the outer circumferential surface of the ceramic rod by a thick film printing method using the first mask film; Forming a pad in contact with a resistor formed on an outer circumferential surface of the ceramic rod by a thick film printing method using the second mask film; When a pad is formed on an outer circumferential surface of the ceramic rod, bonding the lead to the pad to assemble it; Assembling a cover having a through hole formed at both ends of the ceramic rod when the lead is attached to the pad so as to penetrate the lead; And trimming the lead to have a predetermined resistance value when the cover is assembled at both ends of the ceramic rod, and the resistor patterns formed on the first mask film in the process of manufacturing the first mask film having the resistor pattern include a plurality of U. A U-shaped pattern formed so as to continuously connect the self, a first linear pattern spaced apart at a predetermined interval and connected to the upper side of the U-shaped pattern, and a second straight line spaced at a predetermined interval and connected to the lower side of the U-shaped pattern It is characterized by being formed in a pattern.

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The resistance value of the resistor formed in the process of forming the resistor on the outer circumferential surface of the ceramic rod by the thick film printing method using the first mask film is adjusted to the length of the width of the U-shaped pattern, the first straight pattern and the second straight pattern. In the process of forming the pad so as to contact the resistor formed on the outer circumferential surface of the ceramic rod by the thick film printing method using the two-mask film, the pad is formed of a high resistance material when used at high voltage, it is characterized by being formed of a low resistance material when used at low voltage.

The resistor is formed on the outer circumferential surface in the process of forming a resistor on the outer circumferential surface of the ceramic rod by the thick film printing method using the first mask film and the pad is formed in contact with the resistor formed on the outer circumferential surface of the ceramic bar by the thick film printing method using the second mask film. The ceramic rod with the pad formed sequentially is characterized in that the hollow hollow ceramic rod is used.

The hollow ceramic rod is a process of inserting a screw rod formed at both ends inside the hollow ceramic rod, and when the insertion rod is inserted into the hollow ceramic rod, assembling circular clamp leads at both ends of the hollow ceramic rod, and at both ends of the hollow ceramic rod. When the clamp leads are assembled, the process of installing insulation rings on both sides of the hollow ceramic rod, and when the insulation rings are installed on both sides of the hollow ceramic rod, install L-shaped clamps on the insulation rings, and then tighten the nuts on the screws formed at both ends of the rod. It is characterized by.

The outer circumferential surface of the ceramic rod in the process of forming a resistor on the outer circumferential surface of the ceramic rod by the thick film printing method using the first mask film and in the process of forming a pad in contact with the resistor formed on the outer circumferential surface of the ceramic rod by the thick film printing method using the second mask film. A third mask film having a protective layer pattern formed thereon is added to protect the resistors and pads formed thereon, and a protective layer is formed on the resistors and the pads using the third mask film, and the protective layer is formed of non-combustible silicone, epoxy, It is characterized in that any one of phenol and EMC is selected and formed.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 is a perspective view of a cylindrical resistor of the present invention, Figures 2a to 2j is a view showing a manufacturing method of the cylindrical resistor shown in FIG. As shown in the drawing, a process of manufacturing the first mask film 11 having the resistor patterns 11b, 11c, and 11d, a process of manufacturing the second mask film 12 having the pad pattern 12b, and The process of forming the resistor 22a on the outer circumferential surface of the ceramic rod 31 by the thick film printing method using the first mask film 11 and the ceramic rod 31 by the thick film printing method using the second mask film 12. Forming the pads 23a so as to contact the resistors 22a formed on the outer circumferential surface of the ceramic rod 31, and when the pads 23a are formed on the outer circumferential surface of the ceramic rod 31, the leads 32 are adhered to the pads 23a to be assembled. A process of assembling the lid 33 having the through groove 33a formed at both ends of the ceramic rod 31 so that the lead 32 penetrates when the lead 32 is adhered to the pad 23a. When the cover 33 is assembled at both ends of the rod 31, the lid 32 is trimmed to have a predetermined resistance value.

Referring to the configuration and operation of the present invention in more detail as follows.

In order to manufacture the inductive cylindrical resistor from which the inductive component is removed by the thick film printing method, first, a mask film for forming the resistor 22a and the pad 23a is formed. The mask film for forming the resistor 22a is shown in FIG. 2A. As shown in FIG. 2A, a process of manufacturing the first mask film 11 having the resistor patterns 11b, 11c, and 11d on the film 11a is performed. When the first mask film 11 is manufactured, a process of manufacturing the second mask film 12 having the pad pattern 12b formed on the film 12a as shown in FIG. 2E is performed.

The resistor patterns 11b, 11c, and 11d formed on the first mask film 11 are formed through the film 11, and the U-shaped pattern 11b, the first straight pattern 11c, and the second straight pattern ( 11d). Resistor patterns 11b, 11c, and 11d composed of the U-shaped pattern 11b, the first linear pattern 11c, and the second linear pattern 11d are formed on the film 11a, and the U-shaped pattern 11b is formed in large numbers. U is formed to be continuous. The first linear patterns 11c are spaced apart at predetermined intervals and connected to the upper side of the U-shaped pattern 11b formed so that a plurality of U characters are continuously connected, and the second linear patterns 11d are spaced at predetermined intervals below. And electrically connected to each other.

Embodiments of the resistor patterns 11b, 11c, and 11d are shown in Figs. 2b, 2c and 2d. In FIG. 2B, a mask film 13 having a first linear pattern 13c and a second linear pattern 13d superimposed on the U-shaped pattern 13b formed on the film 13a is used, or as shown in FIG. 2C. The mask film 14 in which the curved pattern 14b was formed in the film 14a is used to form the threaded shape on the outer circumferential surface of the ceramic rod 31 at 22a. Another embodiment of the mask film 14 uses a mask film 15 formed of one square pattern 15b on the film 15a, as shown in FIG. 2D, but has a plurality of square patterns 15b. Can be formed.                     

First mask film 11 and second mask film 12 having resistor patterns 11b, 11c, and 11d composed of U-shaped pattern 11b, first straight pattern 11c, and second straight pattern 11d. After the manufacturing process, the resistor 22a is formed on the outer circumferential surface of the ceramic rod 31 by the thick film printing method using the first mask film 11 as shown in FIGS. 2F and 2G using the first mask film 11. The process is carried out. In the thick film printing method, as shown in FIG. 2F, first, the resist material 22 is loaded on the first mask film 11, and then the first mask film 11 is pulled in the direction of arrow A. FIG.

When the first mask film 11 is pulled, the ceramic rod 31 in pressure contact with the first mask film 11 rotates in the direction indicated by the arrow B. FIG. When the first mask film 11 is pulled in the direction of arrow A and the ceramic rod 31 is rotated in the direction of arrow B and the resistance material 22 is pressed, the resistance material 22 is the outer circumferential surface of the ceramic bar 31. Is formed. That is, when the resistive material 22 is compressed and discharged through the resistive patterns 11b, 11c, and 11d formed on the first mask film 11, the resistive material is formed on the outer circumferential surface of the ceramic rod 31 by the discharged resistive material 22. Patterns 11b, 11c, and 11d are formed. When the resistor patterns 11b, 11c, and 11d are formed on the outer circumferential surface of the ceramic rod 31, the first mask film 11 is removed from the outer circumferential surface of the ceramic rod 31 and then fired at 500 to 850 ° C.

The resistance value of the resistor 22a formed on the ceramic rod 31 is the length of the width W of the U-shaped pattern 11b, the first straight pattern 11c and the second straight pattern 11d shown in FIG. 2A. Adjusted. When the resistors 22a are formed by setting the widths W of the U-shaped pattern 11b, the first straight line pattern 11c, and the second straight line pattern 11d to be wide, the conductivity of the resistor 22a becomes high. When the resistor 22a is formed by narrowing the width W of each of the U-shaped pattern 11b, the first straight line pattern 11c, and the second straight line pattern 11d, the resistor 22a is formed. ), The conductivity is low, it is possible to implement a high resistance value.

According to the width W of each of the U-shaped pattern 11b, the first straight line pattern 11c, and the second straight line pattern 11d, resistance values ranging from 0.1 to tera grade can be realized. It can be applied to the circuit to be used. In addition to being used in a high voltage circuit, the resistor patterns 11b, 11c, and 11d are formed in a U-shaped pattern 11b, a first straight line pattern 11c, and a second straight line pattern 11d as shown in FIG. As a result, generation of inductive components can be eliminated, and thus high reliability can be ensured when used in a high precision circuit or an RF (radio frequency) circuit.

When the resistor 22a is formed on the outer circumferential surface of the ceramic rod 31 using the first mask film 11, the ceramic rod 31 may be formed by a thick film printing method using the second mask film 12 as shown in FIG. 2H. A process of forming the pad 23a is performed to contact the resistor 22a formed on the outer circumferential surface. The process of forming the pad 23a using the pad material 23 on the outer circumferential surface of the ceramic rod 31 is formed using a thick film printing method such as the process of forming the resistor 22a.

The order of forming the resistors 22a and the pads 23a can be changed depending on the shape of the pads 23a. When the pad 23a is formed on the outer circumferential surface of the ceramic rod 31, the second mask film 12 is removed from the outer circumferential surface of the ceramic rod 31 and then fired at 500 to 850 ° C. The pad 23a is used to bond the leads 32 electrically connected to the peripheral parts, and is formed of a high resistance material to lower the conductivity when the cylindrical resistor is used in the high voltage region, and a low resistance material when used in the low voltage region. To form.

When the resistor 22a and the pad 23a are formed on the ceramic rod 31, the protective layer shown in FIG. 2D to protect the resistor 22a and the pad 23a formed on the ceramic rod 31 as shown in FIG. 2I. A process of forming the protective layer 24a using the third mask film 15 having the pattern 15b is performed. The process of forming the protective layer 24a using the third mask film 15 uses the thick film printing method in the same manner as the process of forming the resistor 22a and the pad 23a. The material 24 of the protective layer 24a is characterized in that any one of incombustible silicon, epoxy, phenol, and EMC (electric molding compound) is selected and formed. When the protective layer 24a is formed as shown in FIG. 2J, a process of injection molding using a glass material is performed on the protective layer 24a, and the temperature condition is fired at 500 to 600 ° C. FIG.

When the resistor 22a, the pad 23a, and the protective layer 24a are formed on the outer circumferential surface of the ceramic rod 31, the process of assembling the lead 32 to the pad 23a is performed as shown in FIG. 3A. When the lead 32 is adhered to the pad 23a, a process of assembling the cover 33 having the through holes 33a formed at both ends of the ceramic rod 31 so as to penetrate the lead 32 as shown in FIG. To complete the assembly of the cylindrical resistor. When the assembly of the cylindrical resistor is completed, a process of trimming the leads 32 assembled at both ends of the ceramic rod 31 is performed.

When the trimming of the lead 32 to adjust the resistance value is completed, the manufacturing process of the cylindrical resistor shown in FIG. 1 is completed. When the resistors 22a and the pads 23a are formed on the outer circumferential surface of the ceramic rod 31 and the resistors are adjusted using the resistors 22a, the size of the cylindrical resistor does not increase as a whole even when a high resistance value is realized. In this state, high resistance value can be realized.

The ceramic rod 31 may use a hollow ceramic rod 41 having a hollow interior shown in FIG. 4, and the assembly method of the cylindrical resistor using the hollow ceramic rod 41 will be described below. First, the insertion rod 42 having screws formed at both ends is inserted into the hollow ceramic rod 41, and when the insertion rod 42 is inserted into the hollow ceramic rod 41, the hollow ceramic rod 41 is inserted into the hollow ceramic rod 41. Assemble circular clamp leads 43 at both ends. When the circular clamp leads 43 are assembled at both ends of the hollow ceramic rod 41, the insulating rings 44 are installed on both sides of the hollow ceramic rod 43, and the insulating rings 44 are formed on both sides of the hollow ceramic rod 41. If installed, the L-shaped clamp 45 is installed in the insulating ring 44. When the insulating ring 44 and the L-shaped clamp 45 are installed on both sides of the hollow ceramic rod 41, the nut 46 is assembled to the screws formed at both ends of the insertion rod 42.

When using a resistance wire wound around the outer circumferential surface of the hollow ceramic rod 41 or the ceramic rod 31, a cylindrical resistor can be used as a heating element, and when the resistance wire is used as a heating element, the target temperature reaching time can be shortened. As a result, the exothermic temperature can be realized uniformly.

The high voltage and RF circuits of various power supplies, heating elements such as copiers, heating elements of industrial equipment, laser equipment and motor control, etc. are eliminated by removing inductive components and realizing high resistance values and using them as heating elements. It can be applied to a circuit.

As described above, the present invention can ensure the reliability of the circuit when used in a precision circuit such as an RF circuit by forming the resistor so that the inductive component is removed, and can implement a high resistance value at a low resistance value according to the pattern of the resistor. It can be used stably in high voltage circuits, and when used as a heating element, it can provide the effect of quickly reaching the target heat generation temperature.

Claims (9)

delete In the method of manufacturing the cylindrical resistor, Manufacturing a first mask film having a resistor pattern; Manufacturing a second mask film having a pad pattern; Forming a resistor on an outer circumferential surface of the ceramic rod by a thick film printing method using the first mask film; Forming a pad in contact with a resistor formed on an outer circumferential surface of the ceramic rod by a thick film printing method using the second mask film; Bonding a lead to the pad when the pad is formed on the outer circumferential surface of the ceramic rod; Assembling a cover having a through groove formed at both ends of the ceramic rod when the lead is attached to the pad so as to penetrate the lead; And When the cover is assembled to both ends of the ceramic rod is configured to trim the lead to have a predetermined resistance value, In the process of manufacturing the first mask film having the resistor pattern, the resistor pattern formed on the first mask film may be spaced apart from each other by a U-shaped pattern formed to continuously connect a plurality of U-shaped patterns at a predetermined interval above the U-shaped pattern. And a first linear pattern connected to be connected to each other, and a second linear pattern spaced apart from each other at a predetermined interval on the lower side of the U-shaped pattern to form a connection. The resistance value of the resistor formed in the process of forming the resistor on the outer circumferential surface of the ceramic rod by the thick film printing method using the first mask film is the resistance of the U-shaped pattern, the first straight pattern and the second straight pattern. A method of manufacturing a cylindrical resistor, characterized in that it is adjusted to the length of the width. In the method of manufacturing the cylindrical resistor, Manufacturing a first mask film having a resistor pattern; Manufacturing a second mask film having a pad pattern; Forming a resistor on an outer circumferential surface of the ceramic rod by a thick film printing method using the first mask film; Forming a pad in contact with a resistor formed on an outer circumferential surface of the ceramic rod by a thick film printing method using the second mask film; Bonding a lead to the pad when the pad is formed on the outer circumferential surface of the ceramic rod; Assembling a cover having a through groove formed at both ends of the ceramic rod when the lead is attached to the pad so as to penetrate the lead; And When the cover is assembled to both ends of the ceramic rod is configured to trim the lead to have a predetermined resistance value, In the process of forming the pad so as to contact the resistor formed on the outer circumferential surface of the ceramic rod by the thick film printing method using the second mask film, the pad is formed of a high resistance material when used at high voltage, and is formed of a low resistance material when used at low voltage. Method of producing a cylindrical resistor. In the method of manufacturing the cylindrical resistor, Manufacturing a first mask film having a resistor pattern; Manufacturing a second mask film having a pad pattern; Forming a resistor on an outer circumferential surface of the ceramic rod by a thick film printing method using the first mask film; Forming a pad in contact with a resistor formed on an outer circumferential surface of the ceramic rod by a thick film printing method using the second mask film; Bonding a lead to the pad when the pad is formed on the outer circumferential surface of the ceramic rod; Assembling a cover having a through groove formed at both ends of the ceramic rod when the lead is attached to the pad so as to penetrate the lead; And When the cover is assembled to both ends of the ceramic rod is configured to trim the lead to have a predetermined resistance value, The outer circumferential surface in the process of forming a resistor on the outer peripheral surface of the ceramic rod by the thick film printing method using the first mask film and the pad formed in contact with the resistor formed on the outer circumferential surface of the ceramic rod by the thick film printing method using the second mask film. The ceramic rod in which the resistor and the pad are sequentially formed in the manufacturing method of the cylindrical resistor, characterized in that the hollow hollow ceramic rod is used. The method of claim 5, wherein the hollow ceramic rod is a process of inserting a screw rod is formed at both ends inside the hollow ceramic rod; Assembling circular clamp leads to both ends of the hollow ceramic rod when the insertion rod is inserted into the hollow ceramic rod; Installing insulating rings on both sides of the hollow ceramic rod when circular clamp leads are assembled at both ends of the hollow ceramic rod; And If the insulating ring is installed on both sides of the hollow ceramic rod, L-shaped clamp is installed in the insulating ring and then assembled by tightening the nut on the screw formed on both ends of the rod. In the method of manufacturing the cylindrical resistor, Manufacturing a first mask film having a resistor pattern; Manufacturing a second mask film having a pad pattern; Forming a resistor on an outer circumferential surface of the ceramic rod by a thick film printing method using the first mask film; Forming a pad in contact with a resistor formed on an outer circumferential surface of the ceramic rod by a thick film printing method using the second mask film; Bonding a lead to the pad when the pad is formed on the outer circumferential surface of the ceramic rod; Assembling a cover having a through groove formed at both ends of the ceramic rod when the lead is attached to the pad so as to penetrate the lead; And When the cover is assembled to both ends of the ceramic rod is configured to trim the lead to have a predetermined resistance value, In the process of forming a resistor on the outer peripheral surface of the ceramic rod by the thick film printing method using the first mask film and the pad in contact with the resistor formed on the outer peripheral surface of the ceramic rod by the thick film printing method using the second mask film A method of manufacturing a cylindrical resistor, characterized in that the third mask film having a protective layer pattern is added to protect the resistor and the pad formed on the outer peripheral surface of the ceramic rod. 8. The method of claim 7, wherein the pad is formed on the outer circumferential surface of the ceramic rod in the process of forming the pad in contact with the resistor formed on the outer circumferential surface of the ceramic rod by the thick film printing method using the second mask film. A method of manufacturing a cylindrical resistor characterized in that the protective layer is formed on the resistor and the pad is added. The method of claim 8, wherein the protective layer is formed by selecting any one of non-combustible silicon, epoxy, phenol, and EMC.

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