KR100760930B1 - Lcd 패널 및 그 제조 방법 - Google Patents
Lcd 패널 및 그 제조 방법 Download PDFInfo
- Publication number
- KR100760930B1 KR100760930B1 KR1020000063697A KR20000063697A KR100760930B1 KR 100760930 B1 KR100760930 B1 KR 100760930B1 KR 1020000063697 A KR1020000063697 A KR 1020000063697A KR 20000063697 A KR20000063697 A KR 20000063697A KR 100760930 B1 KR100760930 B1 KR 100760930B1
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- South Korea
- Prior art keywords
- substrate
- lcd panel
- manufacturing
- sacrificial layer
- glass
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000004973 liquid crystal related substance Substances 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 229920001721 polyimide Polymers 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 16
- 239000010409 thin film Substances 0.000 claims abstract description 10
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 24
- 239000010408 film Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910001362 Ta alloys Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (6)
- 삭제
- 칼라 필터가 형성된 제 1 기판과 화소 당 각각 박막 트랜지스터가 형성된 제 2 기판을 갖고, 상기 두 기판 사이의 전압에 따라 빛의 투과량을 조절하여 디스플레이하는 LCD 패널 제조 방법에 있어서,글레스 위에 순차적으로 희생층 및 폴리이미드막을 형성하여 상기 제 2 기판을 제조하는 단계;상기 제 2 기판의 폴리이미드막상에 상기 화소 당 각각 단위 박막 트랜지스터를 형성하는 단계;상기 제 1 기판과 상기 제 2 기판을 합착하는 단계;상기 제 2 기판으로부터 상기 희생층 및 글레스를 제거하는 단계를 포함하여 이루어짐을 특징으로 하는 LCD 패널 제조 방법.
- 제 2 항에 있어서,상기 희생층은 SiNX , SiOX 중 어느 하나로 형성함을 특징으로 하는 LCD 패널 제조 방법.
- 제 2 항에 있어서,상기 희생층은 100∼200℃ 에서 플라즈마 CVD(plasma chemical vapor deposition)방법에 의해 적층하여 형성함을 특징으로 하는 LCD 패널 제조 방법.
- 제 2 항에 있어서,상기 폴리이미드막은 디핑(dipping), 스핀 코팅(spin coating), 롤 코팅(roll coating) 중 어느 하나로 형성됨을 특징으로 하는 LCD 패널 제조 방법.
- 제 2 항에 있어서, 상기 희생층 및 글레스는 HF 용액으로 제거됨을 특징으로 하는 LCD 패널 제조 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000063697A KR100760930B1 (ko) | 2000-10-28 | 2000-10-28 | Lcd 패널 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000063697A KR100760930B1 (ko) | 2000-10-28 | 2000-10-28 | Lcd 패널 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020032930A KR20020032930A (ko) | 2002-05-04 |
KR100760930B1 true KR100760930B1 (ko) | 2007-09-21 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020000063697A KR100760930B1 (ko) | 2000-10-28 | 2000-10-28 | Lcd 패널 및 그 제조 방법 |
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KR (1) | KR100760930B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100647631B1 (ko) * | 2004-11-05 | 2006-11-23 | 삼성에스디아이 주식회사 | 박막 트랜지스터를 구비한 기판의 제조방법 및 상기방법을 이용한 평판 디스플레이 장치의 제조방법 |
KR100822210B1 (ko) * | 2006-11-14 | 2008-04-17 | 삼성에스디아이 주식회사 | 플렉서블 디스플레이 장치의 제조방법 |
KR20090042352A (ko) * | 2007-10-26 | 2009-04-30 | 엘지이노텍 주식회사 | 액정표시장치 및 이의 제조방법 |
KR101686096B1 (ko) * | 2010-04-27 | 2016-12-14 | 엘지디스플레이 주식회사 | 양면표시장치 및 그의 제조방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960042142A (ko) * | 1995-05-31 | 1996-12-21 | 엄길용 | 액정표시장치 |
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- 2000-10-28 KR KR1020000063697A patent/KR100760930B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960042142A (ko) * | 1995-05-31 | 1996-12-21 | 엄길용 | 액정표시장치 |
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KR20020032930A (ko) | 2002-05-04 |
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