KR100744572B1 - Transfering apparatus of semiconductor and glass substrate - Google Patents

Transfering apparatus of semiconductor and glass substrate Download PDF

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KR100744572B1
KR100744572B1 KR1020060012940A KR20060012940A KR100744572B1 KR 100744572 B1 KR100744572 B1 KR 100744572B1 KR 1020060012940 A KR1020060012940 A KR 1020060012940A KR 20060012940 A KR20060012940 A KR 20060012940A KR 100744572 B1 KR100744572 B1 KR 100744572B1
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substrate
fluid
contact
swirl flow
flow generating
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KR1020060012940A
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Korean (ko)
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천풍환
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(주)멕스코리아아이엔씨
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An apparatus for transferring a glass and a semiconductor substrate is provided to induce rotation of a substrate in a constant direction by generating horizontal force due to the area difference between a first bottom surface and a second bottom surface. An apparatus for transferring a glass and a semiconductor substrate includes at least one fluid insertion section and a cylindrical pivot flow generating section(28). The fluid insertion section includes a fluid passage so that a fluid can be introduced into a concave interior space. The pivot flow generating section is provided between a first bottom surface(24) and a second bottom surface(26). The first bottom surface makes contact with the substrate on the bottom surface of the concave space and has a small area. The second bottom surface makes contact with the substrate and has a large area. The periphery of the pivot flow generating section has an inclined surface on the outer side thereof.

Description

유리 및 반도체 기판반송장치{TRANSFERING APPARATUS OF SEMICONDUCTOR AND GLASS SUBSTRATE}Glass and Semiconductor Substrate Transfer Equipment {TRANSFERING APPARATUS OF SEMICONDUCTOR AND GLASS SUBSTRATE}

도1은 종래의 기판반송장치를 나타낸 저면도이다. 1 is a bottom view showing a conventional substrate transfer apparatus.

도2는 종래의 기판반송장치를 나타낸 단면도이다. 2 is a cross-sectional view showing a conventional substrate transfer apparatus.

도3은 본 발명에 따른 유리 및 반도체 기판반송장치의 단면도이다. 3 is a cross-sectional view of the glass and semiconductor substrate transport apparatus according to the present invention.

도4은 본 발명에 따른 기판반송장치의 회전 방향을 나타낸 사시도이다. Figure 4 is a perspective view showing the rotation direction of the substrate transport apparatus according to the present invention.

도5은 본 발명에 따른 기판반송장치의 회전의 다른 실시예를 나타낸 사시도이다. Figure 5 is a perspective view showing another embodiment of the rotation of the substrate transport apparatus according to the present invention.

도6은 본 발명에 따른 비접촉 기판반송장치의 실시예를 나타낸 사시도이다. 6 is a perspective view showing an embodiment of a non-contact substrate transport apparatus according to the present invention.

도7은 본 발명에 따른 비접촉 기판반송장치에 따른 로보트 핸드의 정면도 및 단면도이다. 7 is a front view and a cross-sectional view of the robot hand according to the non-contact substrate transport apparatus according to the present invention.

도8은 본 발명에 따른 비접촉 기판반송장치에 따른 로보트 핸드의 다른 실시예를 나타낸 정면도이다. 8 is a front view showing another embodiment of the robot hand according to the non-contact substrate transport apparatus according to the present invention.

※ 도면의 주요부분에 대한 부호의 설명 ※※ Explanation of code about main part of drawing ※

2: 종래 비접촉 반송장치 4: 선회류 형성체2: Conventional non-contact conveying apparatus 4: Swirl flow formation body

6: 폐쇄끝면 8: 평탄형 끝면6: closed end face 8: flat end face

10: 오목부 12: 분출구10: recess 12: jet port

14: 유체통로 20: 유체 삽입부14: fluid passage 20: fluid insertion portion

22: 유체통로 24: 제1바닥면22: fluid passage 24: first bottom surface

26: 제2바닥면 28: 선회류 생성부26: second bottom surface 28: swirl flow generating unit

30: 경사면30: slope

본 발명은 빠른 유체의 흐름 구간에서 압력이 낮아지는 베르누이원리를 이용한 비접촉 기판 파지 장치에 있어서 기판과 접촉하는 면적을 달리하여 면적차이에 의한 베르누이 효과에 의한 기판에 수직으로 작용하는 부압의 크기의 차이에 의해 발생하는 비접촉 패드의 부압의 방향과 수직으로 작용하는 수평력을 이용하여 기판 회전시 일정한 방향이 유도되는 것을 특징으로 하는 유리 및 반도체 기판반송장치에 관한 것이다. The present invention is a non-contact substrate holding device using the Bernoulli principle that the pressure is lowered in the flow section of the fast fluid, the difference of the negative pressure acting perpendicular to the substrate due to the Bernoulli effect by the area difference It relates to a glass and semiconductor substrate transport apparatus characterized in that a certain direction is induced during the rotation of the substrate using a horizontal force acting perpendicular to the direction of the negative pressure of the non-contact pad generated by the.

종래의 기판 반송장치는 도1에 도시된 바와 같이, 공기의 송입구에 연통하면서 공기의 선회류가 발생하는 선회실을 포함하여, 상기 선회실과 연통하는 동시에 피반송물과 대향하는 대향면을 갖는 벨마우스를 설치하고, 상기 벨마우스와 피반송물 사이에 발생하는 공기류에 의해 발생하는 베르누이 효과를 이용하여 비접촉으로 피반송물을 유지하도록 구성되었다. The conventional substrate conveying apparatus, as shown in Fig. 1, includes a swing chamber in which swirl flow of air is generated while communicating with an air inlet port, and has a bell surface having an opposite surface facing the conveyed material while communicating with the swing chamber. The mouse was installed and configured to hold the transported object in a non-contact manner using the Bernoulli effect generated by the air flow generated between the bell mouse and the transported object.

이러한 종래의 비접촉 기판반송장치는 도2의 단면도에 도시된 바와 같이, 유체통로(14)는 선회류형성체(4)의 폐쇄끝면(6)에 설치한 유체도입구로부터, 폐쇄끝면(6)에 대해서 수직으로 형성되고, 또한 수평으로 형성되어, 오목부(10)의 내주면에 면하는 분출구(12)에 도달하고 있다. 즉, 유체통로(14)는 유체도입구와 분출구(12)를 연통하고, 공급유체를 분출구(12)로부터 오목부(10)내로 그 둘레방향을 따라 토출시키고 있다. 이 공급유체에 의해 오목부(10)내부에는 선회류가 발생한다. 내부에 공기를 1라인 또는 2라인을 통해 유입할 경우 베르누이의 원리로 부압이 발생하여 기판을 흡착할 수 있으므로, 나선 방향의 회전에 의한 와류 효과로 회전방향을 갖는 효과가 있으나 이 경우 이탈장지 가이드를 필요로 하였다.In the conventional non-contact substrate conveying apparatus, as shown in the cross-sectional view of FIG. 2, the fluid passage 14 is connected to the closed end surface 6 from the fluid inlet provided in the closed end surface 6 of the swirl flow-forming body 4. It is formed vertically with respect to the surface, and is formed horizontally, and reaches the jet port 12 which faces the inner peripheral surface of the recess 10. That is, the fluid passage 14 communicates the fluid introduction port and the jet port 12, and discharges the supply fluid from the jet port 12 into the recess 10 along the circumferential direction thereof. Swirl flow is generated in the recess 10 by this supply fluid. When inflowing air through 1 or 2 lines inside, the negative pressure is generated by Bernoulli's principle, so the substrate can be adsorbed. Needed.

또한, 중심으로부터 상하좌우 평행한 와류에 의하여 기판면과 수직하는 방향을 갖는 중심점으로부터의 원을 그리는 일정한 나선방향의 회전력과 기판면과 수직한 방향의 힘만을 갖기 때문에 기판으로의 먼지의 부착 방지 및 기계적인 접촉에 의한 기판의 손상방지등의 효과는 얻을 수 있는 효과적인 비접촉 방법으로 제안되었지만, 기판의 수평방향의 원할한 이동기능은 제공하지 못하고 용이한 조작의 어려움이 있었다.In addition, since it has only a constant spiral rotational force drawing a circle from a center point having a direction perpendicular to the substrate surface by vortices parallel to the substrate surface and a force in a direction perpendicular to the substrate surface, preventing dust from adhering to the substrate. The effect of preventing damage to the substrate by mechanical contact, etc. has been proposed as an effective non-contact method that can be obtained, but it does not provide a smooth movement function of the substrate in the horizontal direction and there is a difficulty in easy operation.

상기의 문제점을 해결하기 위하여 본 발명은 바닥면의 면적차이에 의하여 수평력으로 기판 회전시 일정한 방향이 유도되는 것을 특징으로 하는 기판반송장치를 제공하는 것을 그 목적으로 한다. 종래의 비접촉 패드에서 유체가 토출될때 기판면과 평행하게 형성되는 유체이동구간 즉, 베르누이원리의 유체 통로의 길이(24,26)를 다르게 구성함으로써 얻어지는 기판과 접촉하는 면적이 달라지고 면적차이에 의한 베르누이 효과에 의한 기판에 수직으로 작용하는 부압의 크기의 차이에 의해 생성된 비접촉 패드의 부압의 방향과 수직한 방향으로 작용하는 수평력을 이용하여 기판 회전시 일정한 방향이 유도되는 것을 특징으로 하는 유리 및 반도체 기판반송장치를 제공하는 것을 그 목적으로 한다.In order to solve the above problems, an object of the present invention is to provide a substrate transport apparatus characterized in that a predetermined direction is induced when the substrate is rotated by a horizontal force by the area difference of the bottom surface. When the fluid is discharged from the conventional non-contact pad, the area in contact with the substrate obtained by differently configuring the fluid movement section formed in parallel with the surface of the substrate, that is, the fluid passages 24 and 26 of Bernoulli's principle is changed and is caused by the area difference. Glass, characterized in that a certain direction is induced during the rotation of the substrate by using a horizontal force acting in a direction perpendicular to the direction of the negative pressure of the non-contact pad generated by the difference in the amount of negative pressure perpendicular to the substrate by the Bernoulli effect and It is an object of the present invention to provide a semiconductor substrate transport apparatus.

본 발명은 웨이퍼를 비접촉으로 유지하는 반송장치에 있어서, 凹 형상의 오목한 내부에 유체를 삽입하도록 유체통로(22)를 포함하여 이루어진 1개 이상의 유체 삽입부(20)와 상기 凹 형상의 바닥면에서 기판과 접하는 면적이 좁은 제1바닥면(24)과 상기 기판과 접하는 면적이 넓은 제2바닥면(26) 사이의 내부에 있는 원주형상의 선회류 생성부(28)와 상기 선회류 생성부(28) 가장자리는 외측으로 경사면(30)을 가지도록 이루어진다. The present invention relates to a conveying apparatus for holding a wafer in a non-contact manner, comprising: a fluid passageway (22) including a fluid passageway (22) for inserting a fluid into a concave-shaped concave interior, A circumferential swirl flow generating unit 28 and the swirl flow generating unit are disposed between the first bottom surface 24 having a narrow area in contact with the substrate and the second bottom surface 26 having a large area in contact with the substrate. 28) The edge is made to have an inclined surface 30 outward.

상기 제1바닥면(24)과 제2바닥면(26)의 면적은 상기 선회류 생성부(28)의 지름을 1로 할 때, 0.8:2.5로 이루어지는 것을 특징으로 한다. The area of the first bottom surface 24 and the second bottom surface 26 is 0.8: 2.5 when the diameter of the swirl flow generating unit 28 is 1.

이하, 본 발명의 상세한 설명은 첨부된 도면과 함께 상세히 설명하면 다음과 같다. Hereinafter, the detailed description of the present invention will be described in detail with the accompanying drawings.

도3은 본 발명에 따른 기판반송장치의 단면도이다. 3 is a cross-sectional view of the substrate transport apparatus according to the present invention.

凹 형상의 오목한 내부에 유체를 삽입하도록 유체통로(22)를 포함하여 이루어진 1개 이상의 유체 삽입부(20)와, At least one fluid insertion section 20, including a fluid passageway 22, for inserting a fluid into the concave-shaped concave interior,

상기 凹 형상의 바닥면에서 기판과 접하는 면적이 좁은 제1바닥면(24)과, 상기 기판과 접하는 면적이 넓은 제2바닥면(26) 사이의 내부에 있는 원주형상의 선회류 생성부(28)와, A cylindrical swirl flow generation unit 28 is provided between the first bottom surface 24 having a narrow area in contact with the substrate and the second bottom surface 26 having a large area in contact with the substrate. )Wow,

상기 선회류 생성부(28) 가장자리는 외측으로 경사면(30)을 가지도록 이루어진다. An edge of the swirl flow generating unit 28 is formed to have an inclined surface 30 outward.

상기 선회류 생성부(28)는 기판과 접하는 면적 제1바닥면(24)과 제2바닥면(26)을 다르게 하여 면적차이에 의한 수평력(B)을 생성시켜, 상기 기판이 회전 시에도 일정방향으로 유도될 수 있도록 구성되어 있습니다. The swirl flow generating unit 28 generates the horizontal force B due to the area difference by making the area of the first bottom surface 24 and the second bottom surface 26 in contact with the substrate different from each other so that the substrate is rotated evenly. It is configured to guide in the direction.

상기 제1바닥면(24)과 제2바닥면(26)의 면적은 0.8:2.5의 비율로 이루어지는 것을 특징으로 한다. The area of the first bottom surface 24 and the second bottom surface 26 is characterized in that the ratio of 0.8: 2.5.

또한, 상기 경사면(30)은 실시에 따라서 경사 각 없이 상긱 선회류 생성부(28)와 바닥면(24,26) 사이의 각을 수직으로 하거나, In addition, the inclined surface 30 is perpendicular to the angle between the Sangwi swirl flow generation unit 28 and the bottom surface 24, 26 without the inclination angle, or

상기 선회류 생성부(28) 가장자리와 바닥면(24,26) 사이에 경사 각을 주어 가공하는 모따기(Chamfer) 또는 모난 부분을 깎아 다듬는 모깍기 가공방법으로 가공하여 실시 가능하다. It can be carried out by processing by a chamfer (Chamfer) for processing by giving an inclination angle between the edge of the swirl flow generating unit 28 and the bottom surface (24,26) or by cutting the angular portion.

도4은 본 발명에 따른 기판반송장치의 회전 방향을 나타낸 사시도이다. Figure 4 is a perspective view showing the rotation direction of the substrate transport apparatus according to the present invention.

상기 유체삽입부의 유체통로(22)에 유체(예: 공기)를 삽입하여 선회류 생성부(28) 내부에 회전력(C)이 발생하고, 도3에 도시된 바와 같이 선회류 생성부(28) 내측 상부로 기판인가 부압(A)이 발생하도록 이루어진다. By inserting a fluid (eg, air) into the fluid passage 22 of the fluid insertion unit, a rotational force C is generated inside the swirl flow generating unit 28, and the swirl flow generating unit 28 is illustrated in FIG. 3. Substrate application negative pressure (A) is generated to the inner upper portion.

또한, 상기 선회류 생성부(28)의 가장자리는 외측으로 확대되도록 경사면(30)을 가지므로 내부에 발생한 회전력(C)이 빠르게 유출된다. In addition, since the edge of the swirl flow generating unit 28 has an inclined surface 30 so as to extend outward, the rotational force C generated therein flows out quickly.

도5은 본 발명에 따른 기판반송장치의 회전의 다른 실시예를 나타낸 사시도이다. Figure 5 is a perspective view showing another embodiment of the rotation of the substrate transport apparatus according to the present invention.

본 발명의 반송장치를 상하 대칭되도록 배치할 경우 각 발생하는 회전력(C)은 반대방향으로 상쇄되고, 기판인가 부압과 수평방향의 진행방향의 힘(B)만이 남아 기판을 일정한 방향으로 유도하도록 이루어진다. When the conveying apparatus of the present invention is disposed to be symmetrical, each generated rotational force (C) is canceled in the opposite direction, and only the substrate (negative pressure) and the force (B) in the horizontal direction of travel are left to guide the substrate in a constant direction. .

또한, 본 발명의 다른 실시예로서 각 반송장치를 좌우 대칭되게 배치를 하면 각 반송장치의 수평방향의 이동이 서로 반대방향으로 상쇄되므로 정지시킬 수 있다.In addition, according to another embodiment of the present invention, when the conveying apparatuses are symmetrically arranged, the horizontal movements of the conveying apparatuses may be canceled in opposite directions.

도6은 본 발명에 따른 비접촉 기판반송장치의 실시예를 나타낸 사시도이다. 6 is a perspective view showing an embodiment of a non-contact substrate transport apparatus according to the present invention.

웨이퍼의 중심을 기준으로 비접촉패드의 면적을 제1 바닥면 0.8 : 1(선회류 생성부(28)): 제2 바닥면 2.5 적용하여 수평방향의 힘 방향이 웨이퍼 중심을 향하게 배치하고 각각의 패드에 공급되는 유체(예:공기)의 방향을 시계방향으로 적용한 경우 베르누이 원리에 의하여 비접촉 상태에서 이탈 방지 지지 핀 없이도 효과적으로 웨이퍼의 손상 없이 시계방향으로 회전시킬 수 있다.The area of the non-contact pad relative to the center of the wafer is applied to the first bottom surface 0.8: 1 (swirl flow generating unit 28): the second bottom surface 2.5 so that the horizontal force direction is directed toward the wafer center and each pad In the case of applying the direction of the fluid (eg air) supplied to the clockwise direction, Bernoulli principle can be rotated clockwise effectively without damaging the wafer without leaving the support pin in the non-contact state.

또한, 반대의 회전력을 주기 위한 패드에 공급되는 유체(예:공기)의 방향을 반시계 방향으로 설계한 패드를 추가 배치할 경우, 회전의 멈춤도 조절이 가능하며, 이때 수량과 각각의 패드에 공급할 유체(예:공기) 양 및 속도는 시계방향과 반시계 방향의 공급시간 및 크기로 조절할 수 있다. In addition, when additional pads designed counterclockwise to the direction of the fluid (for example, air) supplied to the pads to give the opposite rotational force are arranged, the stoppage of the rotation can be adjusted. The amount and speed of fluid (eg air) to be supplied can be controlled by the supply time and size in clockwise and counterclockwise directions.

도7은 본 발명에 따른 비접촉 기판반송장치에 따른 로보트 핸드의 정면도 및 단면도이다. 7 is a front view and a cross-sectional view of the robot hand according to the non-contact substrate transport apparatus according to the present invention.

제1 바닥면(24)과 제2바닥면(26)의 면적 차이에 의하여 수평방향의 힘만을 이용하고자 할 경우에는 도7에 도시된 바와 같이 패드에 공급되는 유체(예:공기)의 방향을 시계방향으로 한 패드와 반시계 방향으로 한 패드의 조합으로 회전방향의 힘을 상쇄시키고 수평방향으로 이동하는 것도 구현할 수 있으며, 도6과 도7에 도시된 바와 같이 반대방향에 상기 수평방향과 반대되게 배치하여 수평방향의 힘의 멈춤도 조절 가능하다. When only the force in the horizontal direction is to be used by the area difference between the first bottom surface 24 and the second bottom surface 26, as shown in FIG. 7, the direction of the fluid (eg, air) supplied to the pad is adjusted. The combination of one pad in the clockwise direction and one pad in the counterclockwise direction can be implemented to cancel the force in the rotational direction and move in the horizontal direction, as shown in FIGS. 6 and 7 in the opposite direction to the opposite of the horizontal direction. It can be arranged so that the stopping of the horizontal force can be adjusted.

이때 수량과 각각의 패드에 공급할 유체(예:공기) 양 및 속도는 시계방향과 반시계 방향의 공급시간 및 크기로 조절하도록 이루어진다. At this time, the amount and the amount of fluid (eg air) to be supplied to each pad and the speed are adjusted to supply time and size in the clockwise and counterclockwise directions.

수평(좌/우), 수직(상/하) 및 시계방향과 반시계방향의 회전을 모두 구현하고자 할 경우에는 상기 도6과 도7의 실시예를 참고하여 도8에 도시된 바와 같이 실시할 수 있다. 상기 도8은 본 발명에 따른 비접촉 기판반송장치에 따른 로보트 핸드의 다른 실시예를 나타낸 정면도이다. In order to implement both horizontal (left / right), vertical (up / down), and clockwise and counterclockwise rotation, the embodiment may be implemented as shown in FIG. 8 with reference to the embodiments of FIGS. 6 and 7. Can be. 8 is a front view showing another embodiment of the robot hand according to the non-contact substrate transport apparatus according to the present invention.

이상의 실시예들은 본 발명을 설명하기 위한 것으로, 본 발명의 범위는 실시예에 한정되지 않으며, 첨부된 청구범위에 의거하여 정의되는 본 발명의 범주내에 당업자들에 의하여 변형 또는 수정될 수 있다. 예를들면, 본 발명의 실시예에 구체적으로 나타난 각 구성의 요소의 형상 및 구조는 변형하여 실시할 수 있다는 것이다. The above embodiments are only for explaining the present invention, and the scope of the present invention is not limited to the embodiments, and may be modified or modified by those skilled in the art within the scope of the present invention defined by the appended claims. For example, the shape and structure of the elements of each component specifically shown in the embodiments of the present invention can be modified.

본 발명의 상기의 제1바닥면(24)과 제2바닥면(26)의 면적 차이로 인하여 수평력이 발생하므로 기판 회전시에 일정한 방향을 유도할 수 있는 효과가 있다. Since a horizontal force is generated due to the area difference between the first bottom surface 24 and the second bottom surface 26 of the present invention, there is an effect of inducing a constant direction during substrate rotation.

또한, 본 발명의 기반반송장치를 대칭적으로 배치하는 경우에는 수평방향의 이동을 정지시킬 수 있는 효과가 있다. In addition, when the base transport apparatus of the present invention is arranged symmetrically, there is an effect that can stop the movement in the horizontal direction.

Claims (2)

웨이퍼를 비접촉으로 유지하는 반송장치에 있어서, A conveying apparatus for holding a wafer in a non-contact manner, 凹 형상의 오목한 내부에 유체를 삽입하도록 유체통로(22)를 포함하여 이루어진 1개 이상의 유체 삽입부(20);At least one fluid insertion section 20 including a fluid passageway 22 for inserting a fluid into the concave inward shape; 상기 凹 형상의 바닥면에서 기판과 접하는 면적이 좁은 제1바닥면(24)과 상기 기판과 접하는 면적이 넓은 제2바닥면(26) 사이의 내부에 있는 원주형상의 선회류 생성부(28);Circumferential swirl flow generation unit 28 that is located between the first bottom surface 24 having a narrow area in contact with the substrate and the second bottom surface 26 having a large area in contact with the substrate at the bottom surface of the fin. ; 상기 선회류 생성부(28) 가장자리는 외측으로 경사면을 가지는 것을 특징으로 하는 유리 및 반도체 기판반송장치. Edge of the swirl flow generating unit 28 has an inclined surface to the outside, characterized in that the glass and semiconductor substrate transport apparatus. 제 1 항에 있어서,The method of claim 1, 상기 제1바닥면(24)과 제2바닥면(26)의 면적은 상기 선회류 생성부(28)의 지름을 1로 할 때, 0.8:2.5의 비율로 이루어지는 것을 특징으로 하는 유리 및 반도체 기판반송장치.The area of the first bottom surface 24 and the second bottom surface 26 has a ratio of 0.8: 2.5 when the diameter of the swirl flow generating unit 28 is 1, wherein the glass and semiconductor substrates are formed in a ratio of 0.8: 2.5. Conveying device.
KR1020060012940A 2006-02-10 2006-02-10 Transfering apparatus of semiconductor and glass substrate KR100744572B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627766U (en) * 1992-09-17 1994-04-12 住友金属工業株式会社 Sample holder
JPH09252041A (en) * 1996-03-15 1997-09-22 Sony Corp Wafer transfer method
JP2002064130A (en) 2000-06-09 2002-02-28 Harmotec Corp Non-contact transfer device
JP2005251948A (en) 2004-03-03 2005-09-15 Izumi Akiyama Non-contact holding device and non-contact holding/conveying device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627766U (en) * 1992-09-17 1994-04-12 住友金属工業株式会社 Sample holder
JPH09252041A (en) * 1996-03-15 1997-09-22 Sony Corp Wafer transfer method
JP2002064130A (en) 2000-06-09 2002-02-28 Harmotec Corp Non-contact transfer device
JP2005251948A (en) 2004-03-03 2005-09-15 Izumi Akiyama Non-contact holding device and non-contact holding/conveying device

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