KR100740724B1 - Substrate assembling method and device - Google Patents

Abstract

In order to assemble and transport the upper substrate and the lower substrate according to the present invention, a first carrier and a second carrier are used to load the upper substrate and the lower substrate on the upper station and the lower station mounted in the vacuum chamber. The first carrier comprises a plurality of first upper-suction-plates and a plurality of lower-suction-plates, while the second carrier comprises a plurality of second upper-suction-plates. Loading the lower substrate on the lower station by the second carrier while simultaneously loading the substrate assembly formed in the previous step onto the lower station. Thus, the first carrier simultaneously completes the loading of the upper substrate and the lower substrate together with the second carrier without any further movement. As a result, the manufacturing process is effectively simplified. Therefore, manufacturing time is shortened and a yield is increased.

Board, Carrier, Vacuum Chamber, Plate, Suction

Description

Substrate assembling method and device

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to

1 is a flow chart for the present invention.

2 is a perspective view of the present invention.

3 is a perspective view showing a first carrier according to the present invention.

4A and 4B are a plan view and a side view of a first carrier according to the present invention.

5 is a perspective view showing a second carrier according to the present invention.

6A and 6B are a plan view and a side view of a second carrier according to the present invention.

7 is a schematic diagram illustrating the process steps of the present invention.

8 is a schematic diagram showing another process step of the present invention.

9 is a schematic diagram illustrating subsequent process steps of FIG. 8.

10 is a schematic diagram showing subsequent process steps of the present invention.

11 is a schematic diagram illustrating subsequent process steps of the present invention.

The present invention relates to a substrate assembly method, and more particularly to a substrate assembly method suitable for a liquid crystal display (LCD) panel.

In recent years, LCD technology has been gradually developed, and as a result, traditional cathode ray (CRT) is gradually being replaced by LCD.

In the traditional process of assembling LCDs, the larger the size of the display panel, the greater the manufacturing difficulties. In the prior art process, the upper substrate and the lower substrate are joined and a spacer is arranged between the two substrates. In addition, a UV-cured photopolymer adhesive on a spacer between the two substrates is applied, and then liquid crystal is injected through the holes formed in the spacer.

Then, the two substrates are each placed in a vacuumed empty vacuum chamber. After the vacuuming is completed, the two substrates are immersed in a liquid crystal container mounted inside the vacuum chamber. The liquid crystal in the liquid crystal container is injected into the two substrates through the holes. Finally, the hole is filled and the substrate is cleaned.

The process described above is common and widely applied to the manufacture of LCD panels. However, as the manufacturing time is longer and the size of the display panel is larger, manufacturing difficulties and defects increase. Accordingly, the manufacturing process of the prior art is not satisfactory for mass production. Thus, in recent years, improved techniques for liquid crystal injection have been provided.

In the conventional improved substrate assembly method, while the lower substrate is adsorbed onto the lower stage in the vacuum chamber, the upper substrate placed on the lower substrate is adsorbed onto the upper stage. The peripheral edge of the lower substrate is applied with a photopolymer adhesive. Subsequently, a spacer is arranged on the lower substrate. The liquid crystal is injected into the central region limited by the photopolymer adhesive and the spacer on the lower substrate. Then, the upper stage is lowered to bond the upper substrate and the lower substrate. Thus, the liquid crystal injection process is completed, and a display panel is formed.

Although the improved technique improves the problem of long manufacturing time, increased difficulty and low yield in relation to the prior art, a robot that transfers the upper substrate and the lower substrate to the upper stage and the lower stage, respectively, provided inside the vacuum chamber. The same carrier as the arm must be employed. That is, the robot arm must be operated several times during the manufacturing process. In addition, the improved technology also takes time. This waste of time adversely affects the yield of manufacturers who make LCD panels by mass production methods.

Accordingly, there is a need for an improved substrate assembly method and assembly apparatus that obviates or mitigates the problems described above.

It is an object of the present invention to provide a substrate assembly method and an assembly apparatus for increasing the yield by simplifying the process to easily manufacture the substrate assembly of the LCD panel.

In order to achieve the above object, a substrate assembly method according to the present invention includes a substrate assembly method performed in a vacuum chamber having an upper stage and a lower stage, comprising: (A) loading an upper substrate on the upper stage; Loading an upper substrate on the upper stage by a first carrier comprising a plurality of first lower-suction-plates and a first lower surface on which the first lower-suction-plate is mounted; (B) withdrawing the substrate assembly completed in the previous step onto the lower stage by the first carrier and simultaneously loading the lower substrate onto the lower stage by a second carrier; (C) dropping a liquid crystal on the lower substrate; And (D) stacking the upper substrate on the lower substrate to complete a substrate assembly.

When the substrate is assembled, the upper substrate and the lower substrate are transferred to the upper stage and the lower stage mounted inside the vacuum chamber through the respective first carrier and the second carrier. As the lower substrate is loaded on the lower stage by the second carrier, the assembled substrate panel on the lower stage made in the previous work or the previous process is simultaneously drawn out by the first carrier.

Thus, by the mechanism and configuration described above, the first carrier effectively loads the upper substrate and the lower substrate together with the second carrier without further movement such as rotation. Since the loading of the upper substrate and the loading (or withdrawal) of the lower substrate are performed in the same process, the manufacturing process is effectively simplified. The manufacturing time is thus shortened and the yield is increased.

The first carrier includes a plurality of first suction plates and an upper surface on which the first suction plates are mounted. In addition, the plurality of first suction-plates of the first carrier are in communication with the first upper air passage, respectively. The plurality of first sub-suction-plates are in communication with the first lower air passages, respectively. The first upper-air passage and the first lower-air passage are in communication with the outside, respectively.

The second carrier includes a second top-suction-plate and a second top surface on which the second top-suction-plate is mounted. The lower substrate is loaded onto the lower stage by the second upper-suction-plate of the second carrier.

In addition, in step (A), the upper substrate comprises an upper-substrate-front and an upper-substrate-back which is adsorbed to the first carrier. Also in step (B), the lower substrate comprises a lower-substrate-front and a lower-substrate-back which is adsorbed on the second carrier. Such a configuration enables the design of the first upper-suction-plate of the first carrier and the first lower-suction-plate and the second upper-suction-plate of the second carrier.

The reason for the configuration as described above is to prevent the position of the suction plate to be restricted. In general, in order to increase the yield, the upper and lower substrates are made larger than the dimensions to be manufactured. The upper substrate and the lower substrate are cut into individual small size pieces. In this case, there are six small upper and lower substrates. Therefore, a plurality of scribing lines are formed on the front surface of the upper substrate and the front surface of the lower substrate. If the first upper-suction-plate and the first lower-suction-plate of the first carrier and the second upper-suction-plate of the second carrier are respectively mounted on the upper-substrate-front and the lower-substrate-front, respectively. The suction nozzle can only be located on the scribing line. This is to limit the position of the suction nozzle. On the other hand, if the suction nozzle is mounted directly on the upper-substrate-back and the lower-substrate-back, the suction position will not be particularly limited. Thus, the first upper-suction-plate, the first lower-suction-plate and the first lower-suction-plate and the first lower-suction-plate without causing damage to the upper-substrate-front and lower-substrate-front and without adversely affecting the quality of the upper and lower substrates. 2 The variety of top-suction-plate designs can be increased.

On the other hand, in step A, the upper stage mounted in the vacuum chamber includes a plurality of upper-stage-suction-plates capable of sucking the upper substrate thereon. Similarly, in step (B) the lower stage includes a plurality of lower-stage-suction-plates that can adsorb the substrate assembly completed in the previous step, while adsorbing the lower substrate.

Furthermore, in step (C) the photopolymer adhesive is filled on the surrounding area of the lower substrate. Thus, the upper substrate and the lower substrate are substantially bonded to each other.

In view of the above process steps, the substrate assembly apparatus according to the present invention is assembled in a vacuum chamber. The vacuum chamber includes an upper stage and a lower stage. In addition, the substrate assembly apparatus according to the present invention includes a first frame, a second frame, a first carrier, a second carrier.

The first and second frames are provided in a vacuum chamber. The first carrier rotatably mounted on the first frame includes a plurality of first top-suction-plates, a plurality of first bottom-suction-plates, a first top surface on which the first top-suction-plate is mounted, And a first bottom surface on which the first bottom suction-plate is mounted.

In addition, the second carrier is rotatably mounted on the second frame.

The first carrier includes a first upper air passage in communication with each first upper-suction-plate and a first lower air passage in communication with each first lower-suction-plate, wherein the first upper air passage And both of the first lower air passages communicate with the outside. In addition, the second carrier includes a plurality of second top-suction-plates and a second top surface on which the second top-suction-plate is mounted.

In addition, the substrate is adsorbed by the first carrier and loaded on an upper stage mounted in a vacuum chamber. In particular, the upper substrate is adsorbed by the first lower-suction-plate in the first carrier and loaded into the upper stage.

Similarly, the substrate assembly completed in the previous step is drawn out to the lower stage by the first carrier, and the lower substrate is loaded into the lower stage mounted in the vacuum chamber by the second carrier. The substrate assembly completed in the previous step is withdrawn onto the lower stage by the first upper-suction-plate of the first carrier, and the lower substrate is lowered by the second upper-suction-plate of the first carrier. Loaded on the stage.

Other objects, benefits, and novel features of the invention will be more clearly understood from the following detailed description with reference to the accompanying drawings.

2, a perspective view of the present invention is shown. As shown, a vacuum chamber 1 is provided. The upper stage 11 and the lower stage 12 are mounted in the vacuum chamber 1. According to this embodiment the upper stage 11 comprises a plurality of upper-stage-suction-plates 111 and at the same time the lower stage 12 comprises a plurality of lower-stage-suction-plates 121.

3 is a perspective view showing a first carrier according to the present invention, and FIGS. 4A and 4B are a plan view and a side view showing the first carrier of the present invention. 2, 3, 4A and 4B, a first frame 5 is further provided in the vacuum chamber 1. The rotatable first carrier 2 is mounted rotatably on the first frame 5. In the present embodiment, the first carrier 2 includes a first upper surface 21 having a plurality of first upper-suction-plates 211 and a plurality of first lower-suction-plates 221. It includes a first lower surface 22 having. The plurality of first upper-suction-plates 211 are respectively communicated with the first upper air passages 212, and the plurality of first lower-suction-plates 221 is connected with the first lower air passages 222. Each is in traffic. The first upper air passage 212 and the first lower air passage 222 are in communication with the outside, respectively, so that the plurality of first upper suction-plates 211 and the first lower suction-plates 221. Gas is supplied to ensure that the adsorption function is achieved.

5 is a perspective view showing a second carrier according to the present invention, and FIGS. 6A and 6B are a plan view and a side view showing a second carrier of the present invention. 2, 5, 6a and 6b, the second frame 6 is further provided in the vacuum chamber (1). The rotatable second carrier 4 is rotatably mounted on the second frame 6. In this embodiment, the second carrier 4 comprises a second top face 41 having a plurality of second top-suction-plates 411.

1 is a flow chart of the present invention, and FIG. 7 is a schematic diagram showing the process steps of the present invention. 1, 2, 3, 4A, 4B, and 7, when the manufacture of the LCD panel starts, the upper substrate 31 is adsorbed by the first carrier 2 to form the vacuum chamber ( It is loaded on the upper stage 11 mounted in 1) (SA). The upper substrate 31 includes an upper substrate-front 311 and an upper substrate-back 312. The substrate 31 has an upper-substrate-back surface 312 adsorbed onto a plurality of first lower-suction-plates 221 in the first carrier 2 to be loaded into the upper stage 11, Accordingly, the upper-substrate-back side 312 of the upper substrate 31 is adsorbed by the plurality of upper-stage-suction-plates 111 in the upper stage 11. The reason for adsorbing the upper substrate-back surface 312 of the upper substrate 31 is to avoid unwanted impact on the upper substrate-front surface 311 of the upper substrate 31.

8 is a schematic diagram showing another process step of the present invention, and FIG. 9 is a schematic diagram showing a subsequent process step of FIG. 1, 2, 3, 4a, 4b, 5, 6, 8, and 9, the lower substrate 32 is adsorbed and mounted in the vacuum chamber 1 ( 12) is loaded onto. The lower substrate 32 includes a lower substrate-front 321 and a lower substrate-back 322. The lower substrate 32 has its lower-substrate-back surface 322 adsorbed onto a plurality of second upper-suction-plates 411 in the second carrier 4 and loaded into the lower stage 12, Accordingly, the bottom-substrate-back surface 322 of the bottom substrate 32 is adsorbed by the plurality of bottom-stage-suction-plates 121 in the bottom stage 12. Similarly, the reason for adsorbing the bottom-substrate-back 322 of the bottom substrate 32 is to avoid impacting the bottom-substrate-back 322 of the bottom substrate 32.

It should be noted that in the above steps, first, the plurality of first upper-sides in the first carrier 2 has the substrate assembly 30 adsorbed onto the lower-stage-suction-plate 121 completed in the previous step. It is adsorbed by the suction plate 211 and withdrawn onto the lower stage 12, and then the lower substrate 32 by the plurality of second suction plate 411 in the second carrier 4. Is to be loaded onto the lower stage 12 (SB). Therefore, the first carrier 2 effectively loads the upper substrate 31 and the lower substrate 32 together with the second carrier 4 without additional movement such as rotational movement. This is done simultaneously in a single process step, thus effectively simplifying the manufacturing process. Therefore, manufacturing time is shortened and a yield is increased.

10 is a schematic diagram showing subsequent process steps of the present invention. 1, 2, and 10, the liquid crystal 7 is dropped on the lower substrate 32 (SC). Photopolymer adhesive 8 is also filled in the peripheral region of the lower substrate 32.

11 is a schematic diagram illustrating subsequent process steps of the present invention. 1, 2, and 11, the upper stage 11 is lowered so that the upper substrate 31 is stacked on the lower substrate 32 (SD). Thus, the substrate assembly 33 is completed and the LCD panel manufacturing method is implemented.

While the present invention has been described using embodiments which are presently considered to be the most practical and desirable, it is to be understood that the present invention is not limited to the disclosed embodiments. On the contrary, the invention includes various modifications and similar constructions included in the spirit and scope of the appended claims. The claims are to be accorded the broadest understanding so as to encompass constructions similar to these various modifications.

As described above, the substrate assembly method and the assembly apparatus according to the present invention has the following effects.

First, the manufacturing process is greatly simplified.

Second, manufacturing time is shortened and yield is increased.

Claims (18)

In the substrate assembly method performed in a vacuum chamber having an upper stage and a lower stage, (A) the upper substrate is lifted by a first carrier comprising a plurality of first lower-suction-plates for mounting the upper substrate on the upper stage and a first lower surface on which the first lower-suction-plate is mounted. Loading to an upper stage; (B) withdrawing the substrate assembly completed in the previous step onto the lower stage by the first carrier and simultaneously loading the lower substrate onto the lower stage by a second carrier; (C) dropping a liquid crystal on the lower substrate; And (D) stacking the upper substrate on the lower substrate to complete a substrate assembly. The method of claim 1, In the step (A), the first carrier, A plurality of first top-suction-plates; And And a first top surface on which the first top suction plate is mounted. The method of claim 1, In the step (B), the second carrier, A plurality of second upper-suction-plates for loading the lower substrate on the lower stage; And And a second upper surface on which the second upper suction-plate is mounted. The method of claim 1, In step (A), the first bottom-suction-plates communicate with the first bottom air passage respectively, And the first lower air passage communicates with the outside. The method of claim 2, In said step (A), said first upper suction-plates are respectively communicated with a first upper air passage, And the first upper air passage communicates with the outside. The method of claim 1, In the step (A), the upper substrate comprises an upper-substrate-front and an upper-substrate-back, Wherein said top-substrate-back is adsorbed by said first carrier. The method of claim 1, In step (A), The lower substrate comprises a bottom-substrate-front and a bottom-substrate-back, And said bottom-substrate-back is adsorbed by said second carrier. The method of claim 1, In the step (A), the upper stage, And a plurality of bottom-stage-suction-plates for adsorbing the upper substrate thereon. The method of claim 1, In the step (B), the lower stage, And a plurality of lower-stage-suction-plates for adsorbing the substrate assembly on the lower stage completed in the previous step. The method of claim 1, In the step (B), the lower stage, And a plurality of lower-stage-suction-plates for adsorbing the lower substrate thereon. The method of claim 1, In said step (C), filling a photopolymer adhesive on a peripheral region of said lower substrate. In the substrate assembly apparatus provided in the vacuum chamber provided with the upper stage and the lower stage, A first frame configured inside the vacuum chamber; A second frame configured in the vacuum chamber; A rotatably mounted on the first frame, a plurality of first upper-suction-plates, a plurality of first lower-suction-plates, a first upper surface on which the first upper-suction-plate is mounted, and A first carrier comprising a first bottom surface on which the first bottom suction-plate is mounted; And And a second carrier rotatably mounted on the second frame. The method of claim 12, The second carrier, A plurality of second upper-suction-plates; And And a second upper surface on which the second upper suction-plate is mounted. The method of claim 12, The first carrier, A first upper air passage in communication with each of the first upper-suction-plates; And A first lower air passage in communication with each of the first lower-suction-plates; And both the first upper air passage and the first lower air passages communicate with the outside. The method of claim 12, And the upper substrate is adsorbed by the first carrier and loaded on the upper stage. The method of claim 15, And the upper substrate is adsorbed by the first lower-suction-plate of the first carrier and loaded on the upper stage. The method of claim 13, And the substrate assembly completed in the previous step is drawn out onto the lower stage by the first carrier and the lower substrate is loaded onto the lower stage by the second carrier. The method of claim 17, The substrate assembly completed in the previous step is drawn out onto the lower stage by the first upper-suction-plate of the first carrier while the lower substrate is lifted by the second upper-suction-plate of the second carrier. Substrate assembly apparatus, characterized in that loaded on the lower stage.

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