KR100740241B1 - Forming device of fine wire without drawing dies and forming method thereof - Google Patents

Abstract

The present invention relates to an apparatus and method for forming ultrafine wires used in general industrial fields such as electrical and electronics, semiconductors, home appliances, information and communication devices, aerospace, and medical devices. By using a tensioning roller or the like to reduce the diameter by pulling continuously without drawing dies, the tensioning roller has a diameter continuously changing within the elongation range to determine the desired diameter of the ultra fine wire, used in the conventional process It is an object of the present invention to provide an ultra-fine wire forming apparatus and method that does not use a drawing die that can form a high productivity and high quality ultra fine wire compared to the existing process because no drawing die and intermediate annealing heat treatment process are required.

In order to achieve the above object, the present invention, a pair of at least one molded part for molding the wire to be supplied into a fine wire of a predetermined diameter; A supply part provided at one side of the molding part to supply wire to the molding part; A driving part connected to the molding part to drive the molding part so that the wire rod supplied from the supply part may be molded into a micro wire having a predetermined diameter by the molding part; A recovery part provided at a corresponding position of the supply part so as to recover an ultrafine wire molded to a predetermined diameter through a molding part operated by the driving part; An insulator for insulating the wire rod from outside air under a predetermined condition when the wire rod is continuously drawn by the molding unit and molded into an ultrafine wire; And a control unit for controlling the insulation to control the wire positioned in the insulation in a state suitable for molding. In addition, the present invention is provided with a supply unit in which the wire rod is located on one side; The wire rod supplied through the supply portion is provided at an appropriate position of at least one pair of forming portions in accordance with a target area reduction rate for forming into a micro wire having a predetermined diameter; Insulated from outside air under predetermined conditions in the insulating section so that the wire rod supplied to the forming section is continuously drawn and formed into a micro wire having a predetermined diameter; Controlling the wire rod positioned in the insulation unit in a state suitable for molding; Operating a drive unit connected to the forming unit to continuously form a wire rod into an ultrafine wire; Provided is an ultra-fine wire molding method that does not use a drawing die for recovering an ultra-fine wire molded to a predetermined diameter by the molding part in a recovery part.

Ultra fine wire, forming part, tension forming roller, supply part, recovery part, insulation part

Description

Forming device of fine wire without drawing dies and forming method

1 is a schematic view showing a thin wire drawing using a drawing mold according to the prior art.

Figure 2 is a front view showing a micro-wire molding apparatus in a state in which the entire molding portion is insulated from the outside under specific conditions in the micro-wire molding apparatus and method that does not use a drawing die according to an embodiment of the present invention.

3 is a configuration diagram schematically showing the ultra-fine wire forming apparatus of FIG.

Figure 4 is a cross-sectional view showing a tensioning roller for continuous drawing in the ultra-fine wire forming apparatus and method not using a drawing die according to the present invention.

Figure 5 is a schematic view showing a micro-wire forming apparatus in a state insulated from the outside with only certain wires located between the molding portion in a specific condition in the ultra-fine wire forming apparatus and method using no drawing dies according to another embodiment of the present invention Degree.

* Explanation of symbols for main parts of drawings *

100: wire rod 200: molding part

210: tensile molding roller 300: supply part

400: drive unit 500: recovery unit

600, 600 ': Insulation part 700: Guide part

The present invention relates to a device and a method for forming ultra-fine wires used in the overall industry, such as electrical and electronics, semiconductors, home appliances, information and communication devices, aerospace and medical devices, and more particularly, to a temperature suitable for deformation of the wire rod After adjusting the conditions, using a tensioning roller or the like to reduce the diameter by pulling continuously without drawing dies, the tensioning roller has a diameter that continuously changes within the elongation range can determine the desired ultrafine wire diameter, Since the drawing die used in the process and the intermediate annealing heat treatment process is not necessary, the present invention relates to an ultra-fine wire forming apparatus and method that does not use a drawing die capable of forming high productivity and high quality ultra fine wire compared to the existing process.

In general, with the development of the nano-industry, bio-industry, semiconductor industry, etc., a situation in which fine or fine wire processing technology having a wire diameter of several tens of micrometers (μm) used for ultra-fine filters or catalysts is required. Such fine wires are used as semiconductor bonding wires, magnet wires, electronic materials, or electrode wires for electric discharge machining, and as the precision of micromachines or precision devices is advanced, the demand for fine wires will increase significantly.

Hereinafter, a conventional micro wire molding apparatus and method will be described with reference to the accompanying drawings. 1 is a schematic view showing a thin wire drawing using a drawing mold according to the prior art.

As shown in FIG. 1, in general, micro-fine wires used as conductive wires, precision filters, catalysts, etc. in general industrial fields such as electrical and electronics, semiconductors, home appliances, information and communication devices, and medical devices are used in molds (ie, drawing It is shape | molded by the drawing process using the dice | dies 20.

In general, a method of forming an ultrafine wire is made through hundreds of drawing processes and annealing processes in consideration of an extrusion process and a precision due to abrasion of a mold.

Such a fine wire forming method is a method of drawing using a drawing die 20 having an inner diameter equal to the outer diameter of a fine wire to be obtained, and drawing a wire 10 having a diameter slightly larger than the inner diameter of the mold 20. It is a method to reduce the diameter by passing through a mold and then drawing it out. At this time, the maximum area reduction rate that can be reduced by one drawing process is about 10%, depending on the material.

 Here, the drawing process has to go through several steps due to the limitation of the drawing ratio, which should be made of a low area reduction ratio due to the molding limit of the material. need.

In other words, in order to obtain a fine wire of several tens of micrometers in diameter, it is necessary to go through this drawing process a number of times, and during this drawing process, the material is hardened, so that the cross-sectional reduction rate is significantly lowered and reaches a state that cannot be formed. It must go through a very complicated process, such as the treatment process involved, due to this there is a problem that the production time for the production time is reduced, the production cost is reversely high. On the other hand, even if a plurality of drawing process as described above, there is a problem that can not obtain a fine line of several tens of micrometer diameter required due to the scratches and surface oxidation formed during the drawing process.

In addition, it is difficult to manufacture the drawing mold itself for forming the ultra-fine wire, there is also a problem that the minimum inner diameter of the mold that can be implemented due to the limitation of the cutting technology is limited.

In addition, due to the increase in the surface area to the volume of the material, the frictional force occupies a large portion of the total molding load, and as the wire size becomes finer, the area reduction rate that can be obtained by one drawing process is lowered, resulting in delayed production time and production cost. There is also a problem that causes an increase.

As described above, the conventional technology is not only able to obtain the fine wire of the tens of micrometer diameter required, but also due to the above problems, the processing cost is increased to increase the price of the product and the productivity is lowered. There is also a problem.

Accordingly, the present invention has been proposed to solve the above problems, and, unlike the conventional drawing process, without using a mold, after adjusting the molding conditions to a temperature suitable for deformation of the wire rod using a draw molding roller or the like It can be pulled out continuously to reduce the diameter, and the tensile forming roller has a diameter continuously changing within the elongation range to determine the desired diameter of the ultra fine wire, and the drawing dies and intermediate annealing heat treatment processes used in the conventional process It is an object of the present invention to provide an ultra-fine wire forming apparatus and method that does not use a drawing die, which is capable of forming high productivity and high quality ultra-fine wire compared to an existing process.

In addition, the present invention can form a micro wire of several micrometers diameter smaller than any conventional method, and does not use a drawing die that can realize a relatively short production time, production cost reduction and economical ultra fine wire Another object is to provide an ultrafine wire forming apparatus and method.

In order to achieve the above object, the present invention, a pair of at least one molded part for molding the wire to be supplied into a fine wire of a predetermined diameter; A supply part provided at one side of the molding part to supply wire to the molding part; A driving part connected to the molding part to drive the molding part so that the wire rod supplied from the supply part may be molded into a micro wire having a predetermined diameter by the molding part; A recovery part provided at a corresponding position of the supply part so as to recover an ultrafine wire molded to a predetermined diameter through a molding part operated by the driving part; An insulator for insulating the wire rod from outside air under a predetermined condition when the wire rod is continuously drawn by the molding unit and molded into an ultrafine wire; And a control unit for controlling the insulation to control the wire rod positioned in the insulation to provide a micro wire forming apparatus that does not use a drawing die.

Herein, the present invention provides a heating part provided between the pair of molding parts to partially form the wire rod by induction heating to improve moldability; And a guide part provided between the pair of molding parts to guide the position of the wire rod when the wire rod is molded.

The heating unit and the guide unit according to the present invention may be made of a guide roller on which the wire rod is directly seated.

The molding part includes a tension forming roller having a change in appearance along the axial direction so that the wire rod may be molded into a fine wire having a predetermined diameter, and the groove is formed in a portion where the wire rod of the tension forming roller is seated to separate the wire rod. To prevent.

In addition, the supply portion and the recovery portion is provided with a roller to smoothly supply the wire rod to the forming portion, and to recover the fine wire of a predetermined diameter formed by the forming portion, the supply portion and the recovery portion to target the wire rod smoothly The positions of the supply part and the recovery part are made variable so that they can be supplied to the position of the molded part according to the area reduction rate, and can be recovered at the position of the molded part from which the target area reduction rate is obtained by a fine line of a predetermined diameter formed by the molding part. Can be.

In addition, the insulating part may insulate the whole of the one or more pairs of molding parts or only local parts between the pair of molding parts so as to insulate the wire rod from the outside air under predetermined conditions to be molded into a micro wire having a predetermined diameter.

The micro wire having a predetermined diameter formed through the molding part may be 30 micrometers or less, and a predetermined condition for insulating the outside air from the insulating part is to improve the formability and prevent the formation of an oxide film when forming the wire rod into the micro wire. It can be made in a temperature distribution suitable for molding and in an atmospheric state.

In addition, the present invention is provided with a supply unit in which the wire rod is located on one side; The wire rod supplied through the supply portion is provided at an appropriate position of at least one pair of forming portions in accordance with a target area reduction rate for forming into a micro wire having a predetermined diameter; Insulated from outside air under predetermined conditions in the insulating section so that the wire rod supplied to the forming section is continuously drawn and formed into a micro wire having a predetermined diameter; Controlling the wire rod positioned in the insulation unit in a state suitable for molding; Operating a drive unit connected to the forming unit to continuously form a wire rod into an ultrafine wire; Provided is an ultra-fine wire molding method that does not use a drawing die for recovering an ultra-fine wire molded to a predetermined diameter by the molding part in a recovery part.

Here, the present invention is to partially improve the moldability by heating the wire rod by induction heating in the heating portion provided between the pair of the forming portion; It may further include inducing the position of the wire rod during the molding of the wire rod in the guide portion provided between the pair of the forming portion.

The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a front view showing a micro-wire molding apparatus in a state in which the entire molding portion is insulated from the outside under specific conditions in a micro-wire molding apparatus and method that does not use a drawing die according to an embodiment of the present invention, Figure 3 FIG. 4 is a schematic view showing the ultrafine wire forming apparatus of FIG. 2, and FIG. 4 is a cross-sectional view showing a tension forming roller for continuous drawing in the ultrafine wire forming apparatus and method without using a drawing die according to the present invention, and FIG. In the ultra-fine wire forming apparatus and method without using a drawing die according to another embodiment of the present invention is a schematic diagram showing the ultra-fine wire forming apparatus in a state insulated from the outside air only under a specific condition.

According to the present invention, unlike the conventional drawing process, the micro wire is formed by continuous drawing using a tensile molding roller or the like under the optimum molding conditions of the material without using a mold, and does not use the drawing die according to the present invention. As shown in Figs. 2 to 5, the ultra fine wire forming apparatus includes a pair of one or more molding parts 200 for molding the wire rod 100 to be supplied into a micro wire having a predetermined diameter; A supply unit 300 provided on one side of the molding unit 200 to supply the wire 100 to the molding unit 200; A driving part connected to the molding part 200 to drive the molding part 200 so that the wire rod 100 supplied from the supply part 300 may be molded into a micro wire having a predetermined diameter by the molding part 200. 400); A recovery part 500 provided at a corresponding position of the supply part 300 so as to recover the ultrafine wires formed to a predetermined diameter through the molding part 200 operated by the driving part 400; When the wire member 100 is continuously drawn by the forming unit 200 to be molded into an ultrafine wire, the insulation units 600 and 600 ′ for insulating the wire member 100 from the outside under predetermined conditions; And a controller (not shown) for controlling the insulating parts 600 and 600 'in order to control the wire 100 positioned in the insulating parts 600 and 600' to a state suitable for molding.

Here, the ultra-fine wire forming apparatus according to the present invention is a heating portion (not shown) provided between the pair of the forming portion 200 to improve the moldability by partially heating the wire 100 by induction heating. ; And a guide part 700 provided between the pair of molding parts 200 to guide the position of the wire rod when the wire rod 100 is molded.

In addition, the ultra-fine wire forming method without using the drawing die according to the present invention is provided to the supply unit 300, the wire rod 100 is located on one side; The wire rod 100 supplied through the supply portion 300 is provided at an appropriate position of the one or more pairs of the molded portions 200 according to the target area reduction rate for forming into a fine wire having a predetermined diameter; Insulating the insulation (600, 600 ') with the outside air in a predetermined condition so that the wire 100 supplied to the forming section 200 is continuously drawn to be molded into a fine wire of a predetermined diameter; A control part (not shown) controls the wire rod 100 positioned in the insulation parts 600 and 600 'in a state suitable for molding; Operating the driving unit 400 connected to the forming unit 200 to continuously form the wire rod 100 into an ultrafine wire; The ultrafine wire formed by the molding part 200 to a predetermined diameter is recovered by the recovery part 500.

Here, the ultra-fine wire forming method according to the present invention by heating the wire rod 100 in part by induction heating in a heating unit (not shown) provided between the pair of the forming portion 200 to improve the formability ; The guide part 700 provided between the pair of molding parts 200 may further include inducing the position of the wire rod 100 when the wire rod is molded.

In the ultra-fine wire forming apparatus and method according to the present invention, the one or more pairs of the molded part 200 may be formed in a plurality of pairs, and as shown in FIG. 4, the molded part 200 has a wire rod 100 having a predetermined diameter. In order to be molded into a fine line, it includes a tension forming roller 210 having a shape change along the axial direction, that is, a shape in which the outer diameter gradually enlarges to continuously extend the wire rod.

The tensile molding roller 210 is mounted by winding the wire rod 100 at an appropriate position according to the target area reduction rate. In this case, in order to prevent the wire rod 100 from being separated, It is preferable that a plurality of grooves 211 having curved edges are formed, and a portion in which the wire rod 100 is initially wound on the outer circumference of the tension forming roller 210 causes heating tension to be generated to improve formability. .

In the process of mounting the wire rod on the tensile molding roller 210, a specific pitch may be selectively used to reduce the area of the wire rod 100 in various ways. In addition to the pair of tensile molding roller 210, the wire rod may be used. Additional members (ie, the heating unit and the guide unit 700) may be provided for efficient heating and wire rod induction, and the driving unit 400 may be formed of a motor.

Here, the heating part and the guide part 700 may be formed of a guide roller on which the wire rod is directly seated.

In addition, the supply part 300 and the recovery part 500 supplies the wire rod to the molding part 200 smoothly, and the roller 310 so that the fine wire of the predetermined diameter formed by the molding part 200 can be recovered. 510. The supply part 300 and the recovery part 500 supply the wire rod 100 to a position of the molding portion (that is, the position of the tension forming roller 210) according to the area reduction rate for smoothly targeting the wire rod 100, and the molding portion 200. Of the supply part 300 and the recovery part 500 so that a fine line of a predetermined diameter formed by the step can be recovered at the position of the forming part (ie, the position of the tension forming roller 210) at which the target area reduction rate is obtained. It is preferable that the position is made variable.

The insulating parts 600 and 600 ′ according to the present embodiment insulate the wire 100 from outside air so as to have a temperature distribution suitable for molding and an atmospheric state in order to improve moldability and prevent oxide film formation, that is, in an inactive state. To form a fine wire of a predetermined diameter. At this time, the insulating portion 600, 600 ', as shown in Figures 3 and 5, to insulate (600) the whole of the one or more of the molding portion (that is, the tension forming roller 210 and the wire 100, etc.). Alternatively, only local portions (ie, the wire rod 100) between the pair of molding parts 200 may be insulated 600 ′.

The ultra-fine wire of a predetermined diameter formed through the forming part 200 according to the present embodiment aims at 30 micrometers (μm) or less, and the temperature distribution and the atmosphere within the insulated condition of the insulating parts 600 and 600 '. The composition is preferably controlled in a state suitable for molding for each material, and various materials such as copper (Cu), aluminum (Al), gold (Au), or silver (Ag) may be used as the wire rod 100. .

Hereinafter, in the ultra-fine wire forming apparatus and method configured as described above, the operation and effects will be further described with reference to the accompanying drawings.

The ultra-fine wire forming apparatus and method according to the present invention undergoes a general drawing process such as extrusion and drawing, thinning the wire 100 to approximately 100 μm, and using the ultra-fine wire forming apparatus and method according to the present invention, 30 microns. Realizes fine lines of meters (μm) or less. In order to obtain such fine wires of several tens of micrometers, not only a general drawing process (extrusion, drawing, etc.) can be achieved, but also expensive costs are required. Here, thinning the wire rod 100 to approximately 100 μm is possible even in a general process.

The ultra-fine wire forming apparatus and method according to the present invention is a process of reducing the diameter of the wire rod without a mold, unlike the process of drawing by using a mold, and before and after the cross-sectional reduction portion of the wire rod 100 (front and rear of the molding part 200). The difference in the moving speed of the wire rod 100 in the deformed by the relative displacement difference is to cause a reduction in cross-section therefrom.

Since the moldless drawing apparatus and method do not require a mold (drawing die), the process error due to mold surface defect or poor shape can be fundamentally blocked in the ultra-fine wire drawing process according to the present embodiment. In addition, in the case of the conventional precision molding, since the mold is very expensive, not only the cost of the product is increased but also the productivity is reduced, whereas the ultra fine wire drawing process according to the present invention is an economic process. In addition, the ultra-fine wire forming apparatus and method according to the present invention has the advantage that can be freely adjusted by reducing the cross-sectional reduction ratio by adjusting the feed rate of the wire rod before and after deformation in consideration of the formability of each wire rod (100).

The ultrafine wire forming apparatus and method according to the present embodiment insulates the wire 100 from the outside in the insulation parts 600 and 600 'to realize an optimal state (temperature or atmosphere, etc.) suitable for forming the ultrafine wires. By further providing, the moldability of the wire rod can be further improved, and the cross-sectional reduction ratio of the wire rod 100 can be controlled by changing the inclination angle of the molding portion (tension forming roller 210).

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

As described above, according to the present invention, unlike the conventional drawing process, the molding conditions are adjusted to a temperature suitable for the wire rod to be deformed without using a mold, and then, by using a tensile roller or the like, it is continuously pulled out without drawing dies to reduce the diameter. Outgoing, the tension forming roller has a diameter that continuously changes in the elongation range has the effect of achieving the desired ultrafine wire diameter.

In addition, the present invention does not require the drawing die and the intermediate annealing heat treatment process used in the conventional process has the effect of forming a high productivity and high quality fine wire compared to the existing process.

In addition, the present invention can form a micro fine wire of several micrometers diameter smaller than any conventional method, there is an effect that can realize a relatively short production time, production cost reduction and economical ultra fine wire.

In addition, the present invention provides a higher productivity compared to the conventional process by stretching the wire without a mold using a tensioning roller under the optimum molding state of the material, and can reduce the cost of the ultra-fine wire product by reducing the unit cost of production costs There is also an effect.

Claims (16)

One or more pairs of molded parts for molding the wire rod to be supplied into an ultrafine wire; A supply part provided at one side of the molding part to supply wire to the molding part; A driving part connected to the molding part to drive the molding part so that the wire rod supplied from the supply part may be molded into a micro fine line by the molding part; A recovery part provided at a corresponding position of the supply part to recover the ultrafine wires formed through the molding part operated by the driving part; An insulator for insulating the wire rod from the outside when the wire rod is continuously drawn by the molding unit and molded into an ultrafine wire; And Control unit for controlling the insulator to control the wire rod located in the insulator to be molded Ultra-fine wire molding apparatus that does not use a drawing die including a. The method of claim 1, A heating part provided between the pair of molding parts to partially heat the wire rod by induction heating to improve moldability; And Guide portion provided between the pair of molded parts for guiding the position of the wire rod when forming the wire rod Ultra-fine wire molding apparatus that does not use a drawing die, including more. The method of claim 2, The heating part and the guide part are made of a guide roller on which the wire rod is directly seated. Ultra-fine wire forming apparatus without drawing dies. The method of claim 1, The molding part Tensile molding roller having a plurality of grooves formed in the part where the wire rod is seated to have a change in appearance along the axial direction so that the wire rod can be molded into an ultra fine wire and to prevent the wire rod from being separated Ultra-fine wire molding apparatus that does not use a drawing die including a. The method of claim 1, The supply part and the recovery part The roller which supplies the said wire rod to a shaping | molding part, and collect | recovers the micro wire formed by the shaping | molding part. Micro-wire molding apparatus that does not use a drawing die provided with. The method of claim 5, The supply part and the recovery part are made to be variable in position, and supply the wire rod to the molding part according to the position of the variable supply part, and the ultra-fine wires formed by the molding part according to the position of the variable recovery part are formed in the molding part. Recovered Ultra-fine wire forming apparatus without drawing dies. The method of claim 1, The insulation part To insulate the whole of one or more pairs of molding parts so as to insulate the wires from the outside and to form the micro wires, or to insulate only the portions between the pair of molding parts. Ultra-fine wire forming apparatus without drawing dies. The method of claim 7, wherein Insulating the wire rod from the outside in the insulating portion to improve the formability when forming the wire rod to the ultra-fine wires and to prevent the formation of oxide film Ultra-fine wire forming apparatus without drawing dies. The method of claim 7, wherein The diameter of the ultra fine wire formed through the molding portion is made of less than 30 micrometers Ultra-fine wire forming apparatus without drawing dies. The wire rod is provided to a supply unit located at one side; The wire rod supplied through the supply portion is provided in one or more pairs of molding portions for forming into a micro wire; Continuous wire drawing of the wire material supplied to the molding part to insulate the outside air from the insulating part to be molded into an ultrafine wire; A control part of the insulating part so that the wire rod positioned in the insulating part can be molded; Operating a drive unit connected to the forming unit to continuously form a wire rod into an ultrafine wire; Recovering the ultrafine wires formed by the molding part in a recovery part Ultra-fine wire molding method without drawing dies. The method of claim 11, Heating the wire rod partially between the pair of molding parts by induction heating to improve moldability; Inducing the position of the wire rod during the molding of the wire rod in the guide portion provided between the pair of the molded portion The ultra-fine wire molding method which does not use the drawing die which contains further. The method of claim 11, Forming the heating portion and the guide portion with a guide roller to directly seat the wire rod on the guide roller Ultra-fine wire molding method without drawing dies. The method of claim 10, The molded part is formed of a tension forming roller having a change in appearance along the axial direction so that the wire can be molded into an ultrafine wire, and the plurality of grooves are formed in a portion where the wire is seated in the tension forming roller to prevent separation of the wire. Formed Ultra-fine wire molding method without drawing dies. The method of claim 10, The supply part and the recovery part have rollers, supply the wire rod to the molding part by the roller, and recover the micro fine wires formed by the molding part; The supply part and the recovery part are supplied to the forming part according to the position of the supply part and the positions of the supply part and the recovery part are variably so that the fine wire formed by the molding part can be recovered from the forming part according to the position of the recovery part. Made up Ultra-fine wire molding method without drawing dies. The method of claim 10, The insulating portion insulates the wire rod into an ultrafine wire by insulating the whole of one or more pairs of molding portions or by insulating only a portion between the pair of molding portions from an outside air; Insulating the wire rod from the outside in order to improve the formability when forming the wire rod into an ultra fine wire and to prevent the formation of oxide film Ultra-fine wire molding method without drawing dies. The method of claim 15, The wire rod is molded through a molding part so that the diameter of the micro wire is 30 micrometers or less. Ultra-fine wire molding method without drawing dies.

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