KR100734526B1 - 오버레이 제어 에러들을 보정하기 위한 방법, 장치, 및/또는 저장 장치 - Google Patents
오버레이 제어 에러들을 보정하기 위한 방법, 장치, 및/또는 저장 장치 Download PDFInfo
- Publication number
- KR100734526B1 KR100734526B1 KR1020027001937A KR20027001937A KR100734526B1 KR 100734526 B1 KR100734526 B1 KR 100734526B1 KR 1020027001937 A KR1020027001937 A KR 1020027001937A KR 20027001937 A KR20027001937 A KR 20027001937A KR 100734526 B1 KR100734526 B1 KR 100734526B1
- Authority
- KR
- South Korea
- Prior art keywords
- control input
- step size
- input parameters
- semiconductor devices
- response
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/371,550 | 1999-08-10 | ||
| US09/371,550 US6405096B1 (en) | 1999-08-10 | 1999-08-10 | Method and apparatus for run-to-run controlling of overlay registration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020020964A KR20020020964A (ko) | 2002-03-16 |
| KR100734526B1 true KR100734526B1 (ko) | 2007-07-03 |
Family
ID=23464424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020027001937A Expired - Fee Related KR100734526B1 (ko) | 1999-08-10 | 2000-04-18 | 오버레이 제어 에러들을 보정하기 위한 방법, 장치, 및/또는 저장 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6405096B1 (https=) |
| EP (1) | EP1208592A1 (https=) |
| JP (1) | JP4666858B2 (https=) |
| KR (1) | KR100734526B1 (https=) |
| WO (1) | WO2001011678A1 (https=) |
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| US7804994B2 (en) * | 2002-02-15 | 2010-09-28 | Kla-Tencor Technologies Corporation | Overlay metrology and control method |
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| KR20050026099A (ko) | 2002-08-01 | 2005-03-14 | 어플라이드 머티어리얼즈 인코포레이티드 | 고급 처리 제어 시스템 내의 부정확한 계측 데이터의 취급방법, 시스템 및 매체 |
| US6735485B1 (en) * | 2002-11-08 | 2004-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay registration correction method for multiple product type microelectronic fabrication foundry facility |
| DE10252605A1 (de) * | 2002-11-12 | 2004-06-24 | Infineon Technologies Ag | Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses |
| WO2004046835A2 (en) | 2002-11-15 | 2004-06-03 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US6823231B1 (en) * | 2002-11-25 | 2004-11-23 | Advanced Micro Devices, Inc. | Tuning of a process control based upon layer dependencies |
| US6815232B2 (en) * | 2002-11-26 | 2004-11-09 | Advanced Micro Devices, Inc. | Method and apparatus for overlay control using multiple targets |
| US6912433B1 (en) * | 2002-12-18 | 2005-06-28 | Advanced Mirco Devices, Inc. | Determining a next tool state based on fault detection information |
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| US7608468B1 (en) | 2003-07-02 | 2009-10-27 | Kla-Tencor Technologies, Corp. | Apparatus and methods for determining overlay and uses of same |
| US7346878B1 (en) | 2003-07-02 | 2008-03-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for providing in-chip microtargets for metrology or inspection |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US6978191B2 (en) * | 2003-09-06 | 2005-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay registration control system and method employing multiple pilot lot in-line overlay registration measurement |
| US7031794B2 (en) * | 2003-09-26 | 2006-04-18 | Taiwan Semiconductor Manufacturing Co. Ltd. | Smart overlay control |
| TWI269943B (en) * | 2003-12-25 | 2007-01-01 | Promos Technologies Inc | Photolithographic parameter feed back system and control method |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US7260442B2 (en) * | 2004-03-03 | 2007-08-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for mask fabrication process control |
| US20050209818A1 (en) * | 2004-03-17 | 2005-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for predicting a parameter for a lithography overlay first lot |
| US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
| US7437404B2 (en) * | 2004-05-20 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for improving equipment communication in semiconductor manufacturing equipment |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| TWI266154B (en) * | 2004-09-21 | 2006-11-11 | Promos Technologies Inc | Method and system for determining lithography overlay offsets |
| US8676538B2 (en) * | 2004-11-02 | 2014-03-18 | Advanced Micro Devices, Inc. | Adjusting weighting of a parameter relating to fault detection based on a detected fault |
| US7305634B2 (en) * | 2004-11-23 | 2007-12-04 | Lsi Corporation | Method to selectively identify at risk die based on location within the reticle |
| JP2006278767A (ja) * | 2005-03-29 | 2006-10-12 | Toshiba Corp | オーバーレイ制御システム及びオーバーレイ制御方法 |
| JP4541237B2 (ja) * | 2005-06-29 | 2010-09-08 | リンテック株式会社 | 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置 |
| TW200941010A (en) * | 2008-03-24 | 2009-10-01 | Promos Technologies Inc | Method and system for processing test wafer in photolithography process |
| US8350337B2 (en) * | 2009-12-29 | 2013-01-08 | United Microelectronics Corp. | Semiconductor device and method of forming the same |
| US9927718B2 (en) | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| KR101522478B1 (ko) | 2010-09-28 | 2015-05-21 | 인터내셔널 비지네스 머신즈 코포레이션 | 복수의 요소를 그룹화하는 방법, 프로그램 및 장치 |
| US10890436B2 (en) | 2011-07-19 | 2021-01-12 | Kla Corporation | Overlay targets with orthogonal underlayer dummyfill |
| US10295993B2 (en) | 2011-09-01 | 2019-05-21 | Kla-Tencor Corporation | Method and system for detecting and correcting problematic advanced process control parameters |
| WO2018089217A1 (en) * | 2016-11-11 | 2018-05-17 | Applied Materials, Inc. | Hybrid laser and implant treatment for overlay error correction |
| EP3918420A1 (en) | 2019-01-29 | 2021-12-08 | ASML Netherlands B.V. | Method for decision making in a semiconductor manufacturing process |
| CN119535898A (zh) * | 2023-08-30 | 2025-02-28 | 上海华力微电子有限公司 | 监控光刻机照明系统残影效应的方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186151A (ja) * | 1995-12-27 | 1997-07-15 | Samsung Electron Co Ltd | 半導体素子の酸化装置及びこれを用いた酸化膜形成方法 |
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| JPH06349706A (ja) * | 1993-06-08 | 1994-12-22 | Nikon Corp | 位置合わせ方法 |
| JPH06349707A (ja) * | 1993-06-14 | 1994-12-22 | Nikon Corp | 位置合わせ方法 |
| JPH06291021A (ja) * | 1993-04-06 | 1994-10-18 | Nikon Corp | 位置合わせ方法 |
| JPH06302496A (ja) * | 1993-04-13 | 1994-10-28 | Nikon Corp | 位置合わせ方法 |
| JPH06310403A (ja) * | 1993-04-21 | 1994-11-04 | Nikon Corp | 位置合わせ方法 |
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| US6405096B1 (en) * | 1999-08-10 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run controlling of overlay registration |
| US6535774B1 (en) * | 1999-08-12 | 2003-03-18 | Advanced Micro Devices, Inc. | Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller |
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| US6248602B1 (en) * | 1999-11-01 | 2001-06-19 | Amd, Inc. | Method and apparatus for automated rework within run-to-run control semiconductor manufacturing |
| US6405144B1 (en) * | 2000-01-18 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for programmed latency for improving wafer-to-wafer uniformity |
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-
1999
- 1999-08-10 US US09/371,550 patent/US6405096B1/en not_active Expired - Lifetime
-
2000
- 2000-04-18 KR KR1020027001937A patent/KR100734526B1/ko not_active Expired - Fee Related
- 2000-04-18 WO PCT/US2000/010249 patent/WO2001011678A1/en not_active Ceased
- 2000-04-18 JP JP2001516238A patent/JP4666858B2/ja not_active Expired - Fee Related
- 2000-04-18 EP EP00926042A patent/EP1208592A1/en not_active Withdrawn
-
2002
- 2002-05-31 US US10/160,963 patent/US6622061B1/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186151A (ja) * | 1995-12-27 | 1997-07-15 | Samsung Electron Co Ltd | 半導体素子の酸化装置及びこれを用いた酸化膜形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020020964A (ko) | 2002-03-16 |
| US6622061B1 (en) | 2003-09-16 |
| US6405096B1 (en) | 2002-06-11 |
| JP2003506898A (ja) | 2003-02-18 |
| EP1208592A1 (en) | 2002-05-29 |
| JP4666858B2 (ja) | 2011-04-06 |
| WO2001011678A1 (en) | 2001-02-15 |
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St.27 status event code: A-5-5-R10-R18-oth-X000 |
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