KR100727892B1 - Plastic shooting out of carbonization prevention a blackout structure - Google Patents

Plastic shooting out of carbonization prevention a blackout structure Download PDF

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Publication number
KR100727892B1
KR100727892B1 KR1020060105369A KR20060105369A KR100727892B1 KR 100727892 B1 KR100727892 B1 KR 100727892B1 KR 1020060105369 A KR1020060105369 A KR 1020060105369A KR 20060105369 A KR20060105369 A KR 20060105369A KR 100727892 B1 KR100727892 B1 KR 100727892B1
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South Korea
Prior art keywords
plastic injection
injection molding
rod
plating
current
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KR1020060105369A
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Korean (ko)
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김문식
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김문식
금문산업(주)
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/7207Heating or cooling of the moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/7626Measuring, controlling or regulating the ejection or removal of moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A carbonization preventing shield structure for a plastic injection molded product is provided to prevent an edge of a plastic injection molded product from being carbonized due to concentration of current during plating. A connection ring(12) is integrally coupled to both edges of the rear surface of a plastic injection molded product(10). A shield rod(11) is integrally coupled to the connection ring. The shield rod includes an upper distribution rod(11a) and a lower distribution rod(11b) spaced from an upper surface(10a) and a lower surface(10b) of the plastic injection molded product. The edges of the plastic injection molded product are prevent from being carbonized, by collecting current on the upper and lower distribution rods.

Description

플라스틱사출물의 탐 방지용 차폐구조{Plastic shooting out of carbonization prevention a blackout structure}Plastic shooting out of carbonization prevention a blackout structure

도 1은 종래의 플라스틱사출물이 도금 되어지는 원리를 나타낸 평면도.1 is a plan view showing the principle that the conventional plastic injection plated.

도 2는 종래의 플라스틱사출물의 도금시에 전류가 응집되는 현상을 나타낸 정면도.Figure 2 is a front view showing a phenomenon that the current is agglomerated during plating of the conventional plastic injection molding.

도 3은 본 발명의 차폐봉이 형성된 플라스틱사출물의 도금시에 전류가 응집되는 과정을 나타낸 정면도.Figure 3 is a front view showing a process of the current is agglomerated during plating of the plastic injection formed shielding rod of the present invention.

도 4는 본 발명의 차폐봉 연결 구조를 보인 배면 사시도.Figure 4 is a rear perspective view showing a shielding rod connection structure of the present invention.

<도면의 주요부분에 대한 부호의 설명> <Description of the symbols for the main parts of the drawings>

10 : 플라스틱사출물 20 : 랙크 10: plastic injection molding 20: rack

30 : 운송리프트 40 : 도금탱크 30: transportation lift 40: plating tank

50 : 도금 금속재료 (니켈, 크롬, 함인동)50: plated metal materials (nickel, chrome, copper alloy)

11 : 차례봉 11a : 상측분산봉 11b : 하측분산봉 11: turn rod 11a: upper dispersion rod 11b: lower dispersion rod

12 : 연결고리 12: link

본 발명은 플라스틱사출물의 탐 방지용 차폐구조에 관한 것으로, 보다 상세하게는 자동차, 가전기기 등의 외장부품으로 사용되는 각종 플라스틱사출물의 모서리 양끝단부에 차폐봉을 일체형으로 구성하여, 도금공정시에 플라스틱사출물의 모서리부분으로 전류가 응집되어 발생하는 탐 현상을 방지함으로서 제품 불량률을 최소화하고, 동시에 생산성을 극대화할 수 있는 플라스틱사출물의 탐 방지용 차폐구조에 관한 것이다.The present invention relates to a shielding structure for preventing tamping of plastic injections, and more particularly, a shielding rod is integrally formed at both ends of corners of various plastic injection moldings used as exterior parts for automobiles, home appliances, and the like during the plating process. The present invention relates to a tamper resistant shielding structure for plastic injection molding which can minimize product defect rate and maximize productivity at the same time by preventing a phenomenon caused by agglomeration of currents into the corners of the injection molding.

일반적으로, 도금의 주목적은 녹슬음 방지와 표면을 아름답고 고급스럽게 하는 것이다. 더욱 세부적으로는 경도를 향상시키고, 내마모성을 높이며, 사출물의 표면을 매끄럽고 내약품성 및 내열성의 표면을 얻기 위함이다. 상기 도금의 종류는 크게 몇 가지로 나누어지고 있으나 본 발명의 플라스틱사출물의 도금은 전기도금 방법으로 도금이 이루어지게 된다.In general, the main purpose of plating is to prevent rust and to make the surface beautiful and elegant. More specifically, to improve hardness, increase wear resistance, and smooth the surface of the injection molding and obtain a chemical and heat resistant surface. The type of the plating is largely divided into several kinds, but the plating of the plastic injection of the present invention is plated by the electroplating method.

상기 전기도금은 전기분해의 원리를 이용하여 제품 표면에 금속이온을 환원 석출시켜 얇은 피막을 입히는 표면처리 방법으로서, 전해질의 수용액이나 용융염 등에 직류 전류를 통하면 전해질은 두 전극에 화학변화를 일으키는데 이를 전기분해라고 하며 전해질의 수용액 중에서 전기분해가 일어날 때 용액 중의 양이온은 음극으로 이동하고 음이온은 양극으로 이동하게 된다. The electroplating is a surface treatment method of coating a thin film by reducing and depositing metal ions on the surface of the product using the principle of electrolysis. When a direct current is applied to an aqueous solution or a molten salt of the electrolyte, the electrolyte causes chemical changes to the two electrodes. This is called electrolysis. When electrolysis occurs in an aqueous solution of an electrolyte, cations in the solution move to the cathode and anions move to the cathode.

즉, 전기도금의 원리는 도금시키려는 금속의 염류를 주성분으로 하는 수용액인 전해용액이 담아있는 도금용액 속에서 도금할 피도금물체에 음극을 연결하고, 도금시키려는 금속과 동일하거나 다른 금속에 양극을 연결한 후 직류를 통전해주게 되면 용액내의 용해된 금속이 제품 표면에 석출되면서 금속의 피막이 입혀지게 되 는 것이다.That is, the principle of electroplating is to connect the negative electrode to the plated object to be plated in the plating solution containing the electrolytic solution, which is an aqueous solution mainly composed of salts of the metal to be plated, and connect the positive electrode to the same or different metal as the metal to be plated. After the direct current is applied, the molten metal in the solution is deposited on the surface of the product and the metal film is coated.

상기 전기도금의 원리를 이용하여 플라스틱사출물(10)의 도금이 이루어지는데, 도 1은 종래의 플라스틱사출물이 도금 되어지는 원리를 나타낸 것이며, 도 2는 종래의 플라스틱사출물의 도금시에 전류가 응집되는 현상을 나타낸 것으로, 전해용액이 담겨진 도금탱크(40)에 도금 시키려는 니켈, 크롬, 함인동 등의 도금금속재료(50)를 채우게되며, 여기서 도금금속재료는 각각의 도금탱크가 별도로 준비된다. 도금할 피도금물체가 되는 플라스틱사출물(10)은 도금탱크(40) 상부에 구비된 랙크(20)에 걸어서 도금탱크에 담겨지게 된다. 상기 랙크(20)는 자동 이송되되록 운송리프트(30)에 장착되어있으며, (-)전류를 랙크를 통하여 플라스틱사출물에 공급하고, 니켈, 크롬, 함인동 등의 금속 도금재료에 (+)전류를 공급하여 직류전류가 통전됨으로서 음극인 플라스틱사출물로 금속 도금재료에 인가한 금속이온인 양이온이 전기적 인력에 의해 이동하여 음극에서 전자를 받아 금속의 피막이 플라스틱사출물에 입혀지면서 도금이 이루어진다. Plating of the plastic injection molding 10 is performed by using the principle of the electroplating. FIG. 1 shows a principle of plating a conventional plastic injection molding, and FIG. 2 shows that current is agglomerated when plating of the conventional plastic injection molding. As a phenomenon, a plating metal material 50, such as nickel, chromium, and phosphorus copper, to be plated on the plating tank 40 containing the electrolytic solution, is filled, where the plating metal material is prepared for each plating tank separately. The plastic injection product 10 to be plated to be plated is immersed in the plating tank by hanging on the rack 20 provided on the plating tank 40. The rack 20 is mounted on the transport lift 30 to be automatically transported, and supplies (-) current to the plastic injection through the rack, and (+) current to the metal plating material such as nickel, chromium, copper phosphorus, etc. As the DC current is supplied by supplying the metal current, the cation, which is the metal ion applied to the metal plating material, is applied to the metal plating material by the electric attraction force, receives electrons from the cathode, and the metal film is coated on the plastic injection material.

이 때에 도금이 이루어지기 위하여 가하게 되는 직류전류의 세기가 전압2~10(V), 전류 100~1000(A)의 전기적 성질을 가하게 되며, 상기와 같이 통전되는 전류의 세기에 따라 음이온이 흐르는 플라스틱사출물에 양이온이 받아드려 지면서 금속 피막이 입혀지게 된다.At this time, the strength of the DC current applied to the plating is applied to the electrical properties of the voltage 2 ~ 10 (V), the current 100 ~ 1000 (A), the plastic in which the anion flows according to the strength of the electric current as described above As the cation is accepted by the injection, the metal film is coated.

이 때에 음이온과 양이온이 가지는 전류의 흐름에 특성상 플라스틱사출물에 형성되어진 양쪽 끝단부에 전류가 응집되게 되며, 이로 인하여 도 2의 플라스틱사출물과 같이 양쪽 끝단부에 'O' 부분과 같이 모서리가 형성되어 있으면, 플라스틱 사출물에 금속의 피막이 입혀지는 과정에서 전류가 플라스틱사출물의 끝단부에서 응집되어 회피할 공간이 없으므로 모서리와 같은 부위를 타고 넘지 못하여 양이온과 음이온이 충돌하면서 끝단부의 모서리 부분에 탐 현상(타는 현상 즉 탄화현상을 말하는 것으로, 이하 " 탐 "이라고 줄여서 표기한다.)이 발생되었다. At this time, the current is agglomerated at both ends formed in the plastic injection due to the flow of currents in the anion and the cation. As a result, edges are formed at both ends as in the plastic injection of FIG. If there is a metal coating on the plastic injection molding, the current is agglomerated at the end of the plastic injection molding, so there is no space to avoid, so the cation and anion collide with each other. The phenomenon, that is, carbonization, is abbreviated as "Tom".)

이와같이 종래의 플라스틱사출물의 도금시에 플라스틱사출물의 형상이 (

Figure 112006078544020-pat00001
)요홈부분은 피복력이 약해지는 문제점과 (
Figure 112006078544020-pat00002
) 돌출부분은 도금표면에 탐 현상이 발생되는 문제점이 있었다. 또한 크롬도금 시에 순간적으로 전류가 흘렀다 다시 흘러 도금이 되면 도금의 색이 밝지않고 회백색으로 나타나는 문제점이 있었다. 상기와 같은 문제점을 줄이기 위해서 종래에는 도금시에 전류를 약하게 하고 도금공정시간을 늘려서 작업이 이루어져야 했으며, 이로 인하여 생산성 및 경제적인 측면에서 많은 손실이 발생되었다. As such, the shape of the plastic injection molding in the conventional plastic injection molding is
Figure 112006078544020-pat00001
The groove part has a problem of weak covering power.
Figure 112006078544020-pat00002
) The protruding part has a problem that a tom phenomenon occurs in the plating surface. In addition, when chromium plating was instantaneously flowed and flowed again, the plating was not bright and grayed out. In order to reduce the problems as described above, the work had to be made by weakening the current at the time of plating and increasing the plating process time, resulting in a lot of losses in terms of productivity and economics.

따라서 본 발명의 목적은 상기와 같은 종래의 여러 가지 문제점을 개선시키기 위하여 안출한 것으로, 플라스틱사출물의 도금공정시에 복잡한 형상이나 모서리와 같이 각이진 형상을 가지는 플라스틱사출물의 끝단부 모서리 부위에 전류의 응집으로 탐(타는) 현상이 발생하는 문제점을 해결하기 위하여 플라스틱사출물의 도금공정시에 전류가 응집될 수 있는 별도의 차폐봉을 일체로 구성함으로서 플라스틱사출물의 모서리 부위가 타는 것을 방지할 수 있는 차폐구조를 제공함에 그 목적이 있다.Therefore, an object of the present invention is to devise to improve the various problems as described above, the current of the end portion of the plastic injection molding having an angled shape, such as a complex shape or corners during the plating process of the plastic injection Shielding to prevent burning of the edges of plastic injections by integrating a separate shielding rod that can agglomerate current during the plating process of plastic injections in order to solve the problem that the burning phenomenon occurs due to the aggregation. The purpose is to provide a structure.

상기 본 발명의 또 다른 목적은 기존 작업공정에 영향을 미치지 않고, 설치 및 제거가 용이하도록 차폐봉을 플라스틱사출물에 구성하는데 목적이 있다.Another object of the present invention is to configure the shielding rod in the plastic injection molding so as to facilitate installation and removal without affecting the existing work process.

본 발명은 플라스틱사출물(10)의 탐 방지용 차폐구조(11)에 관한 것으로, 보다 상세하게는 자동차, 가전기기 등의 외장부품으로 사용되는 각종 플라스틱사출물(10)의 모서리 양끝단부에 차폐봉(11)을 일체형으로 구성하여, 도금공정시에 플라스틱사출물(10)의 양 끝단부에 형성되어진 모서리부분으로 전류가 응집되어 발생하는 탐현상을 방지함으로서 제품불량률을 최소화하는 동시에 생산성을 극대화할 수 있는 플라스틱사출물(10)의 탐 방지용 차폐구조에 관한 것이다.     The present invention relates to a tamper resistant shielding structure (11) of the plastic injection molding 10, and more particularly, the shielding rod (11) at both ends of corners of various plastic injection molding (10) used as exterior parts such as automobiles and home appliances. ) As an integral type, and prevents the phenomenon caused by agglomeration of currents into the corners formed at both ends of the plastic injection molding 10 during the plating process, thereby minimizing product defect rate and maximizing productivity. It relates to a tamper resistant shielding structure of the injection molding (10).

상기와 같은 목적을 달성하기 위한 본 발명의 구성을 첨부한 도면을 통하여 더욱 상세히 설명하면 다음과 같다. When described in more detail through the accompanying drawings, the configuration of the present invention for achieving the above object are as follows.

도 3은 차폐봉(11)이 형성된 플라스틱사출물(10)의 도금시에 전류가 응집되는 현상을 정면도로 나타낸 것으로, 모서리가 형성되어져 있는 플라스틱사출물(10)의 양측 끝단부에 일체형으로 차폐봉(11)이 형성되어져 있다.3 is a front view illustrating a phenomenon in which current is agglomerated during plating of the plastic injection molding 10 having the shielding rod 11 formed thereon, and the shielding rod is integrally formed at both ends of the plastic injection molding 10 having the corners formed. 11) is formed.

상기 차폐봉(11)은 플라스틱사출물(10)의 끝단부 모서리부위로 연결고리(12)에 의해 플라스틱사출물(10)과 일체형으로 사출하여 구성이 된다. 플라스틱사출물(10)에 일체형으로 형성되는 차폐봉(11)은 상측분산봉(11a)과 하측분산봉(11b)으로 구성되며, 상측분산봉(11a)과 하측분산봉(11b)은 각각 플라스틱사출물(10) 상면과 저면의 끝단부 모서리 부분과 일정간격을 두고 위치하게 된다.The shielding rod 11 is formed by injecting integrally with the plastic injection molding 10 by the connecting ring 12 to the edge portion of the plastic injection molding 10. Shielding rod (11) formed integrally with the plastic injection (10) is composed of an upper dispersion rod (11a) and a lower dispersion rod (11b), the upper dispersion rod (11a) and the lower dispersion rod (11b), respectively, plastic injection (10) The edges of the upper and lower ends are positioned at regular intervals.

상기 플라스틱사출물(10)과 차폐봉(11)을 연결해주는 연결고리(12)는, 플라스틱 사출물(10)의 도금이 완료된 후에 차폐봉(11)과 연결고리(12)를 제거하게 되면 플라스틱사출물(10)과 연결고리(12)의 연결 부분에 자국이 남겨진다. The connecting ring 12 connecting the plastic injection molding 10 and the shielding rod 11 has a plastic injection molding after removing the shielding rod 11 and the connecting ring 12 after plating of the plastic injection molding 10 is completed. 10) and marks on the connecting portion of the connecting ring (12).

그러므로, 플라스틱사출물(10)쪽의 연결고리(12)는 사용자들의 시선에서 보이지 않는 플라스틱사출물(10)의 배면 (A) 부분에 연결 구성되도록 한다. Therefore, the connecting ring 12 toward the plastic injection molding 10 is configured to be connected to the back portion A of the plastic injection molding 10 which is not visible from the eyes of the users.

상기와 같이 플라스틱사출물(10)의 차폐봉(11)을 일체형으로 형성하여 플라스틱사출물(10)을 도금하면, 플라스틱사출물(10)과 도금금속재료에 각각 음극과 양극의 전류를 통전하여 용해된 도금금속재료가 플라스틱사출물(10)의 표면에 석출되어 금속의 피막이 입혀지면서 양이온과 음이온의 전류가 도 3과 같이 플라스틱사출물(10)의 상면(10a)과 저면(10b)을 경유하여 끝단부 모서리쪽으로 이동하게 된다. When the shielding rod 11 of the plastic injection molding 10 is integrally formed as described above, the plastic injection molding 10 is plated, and plating is performed by energizing the current of the cathode and the anode to the plastic injection molding 10 and the plating metal material, respectively. As the metal material is deposited on the surface of the plastic injection molding 10 and the metal coating is coated, currents of positive and negative ions are directed toward the end edges of the plastic injection molding via the top surface 10a and the bottom surface 10b of the plastic injection molding 10 as shown in FIG. 3. Will move.

상기에 플라스틱사출물(10)의 상면(10a)과 저면(10b)을 경유하여 끝단부로 이동하는 양이온과 음이온의 전류는 플라스틱사출물(10)의 모서리부분을 넘어 연결고리(12)를 경유하여 플라스틱사출물(10)의 상면(10a)에 일정간격을 두고 위치하는 상측분산봉(11a)과, 플라스틱사출물(10)의 저면(10b)에 일정간격을 두고 위치하는 하측분산봉(11b)의 끝부분으로 분산, 응집하여 차폐봉(11)에서 임의적으로 탐현상이 이루어지도록 유도하므로서 종래에 플라스틱사출물(10)의 모서리 부분에 발생되는 탐 현상을 방지하여 플라스틱사출물(10)에 형성된 각이진 부분이나 모서리 부분을 보호할 수 있다. The current of the positive and negative ions moving to the ends via the top surface (10a) and the bottom surface (10b) of the plastic injection molding 10 is over the edge of the plastic injection molding (10) via the connecting ring (12) To the end of the upper dispersing rod (11a) positioned at a predetermined interval on the upper surface (10a) of (10) and the lower dispersing rod (11b) positioned at a predetermined interval on the bottom surface (10b) of the plastic injection product (10). By dispersing and agglomerating to induce a random phenomenon in the shielding rod (11) by preventing the phenomena that occur in the corner portion of the conventional plastic injection molding (10) by forming an angle or a corner portion formed in the plastic injection (10) Can protect.

도 4는 본 발명의 차폐봉(11) 연결 구조를 보인 배면 사시도를 나타낸 것으로, 플라스틱사출물(10)의 배면 (A) 부분에 연결고리(12)가 형성되어져 있으며, 도금이 완료되고 나면 차폐봉(11)의 연결고리(12)를 한쪽으로 젖혀주면 플라스틱사출물(10)로부터 쉽게 제거되는 것이며, 기존 작업공정에 영향을 미치지 않고, 설치 및 제거가 용이하도록 구성되어 있다. Figure 4 shows a rear perspective view showing a shielding rod 11 connection structure of the present invention, the connecting ring 12 is formed in the rear (A) portion of the plastic injection molding 10, the shielding rod after plating is completed When the link ring (12) of 11 is flipped to one side, it is easily removed from the plastic injection product 10, and is configured to be easy to install and remove without affecting the existing work process.

상기와 같이 기존 작업공정에 영향을 미치지 않고, 설치 및 제거가 용이하도록 차폐봉(11)을 연결고리(12)에 의해 플라스틱사출물(10)과 일체형으로 구성되도록 함으로서 도금공정시에 플라스틱사출물(10)의 모서리부에 전류가 응집되어 발생하는 탐 현상으로부터 사출물의 모서리부분을 보호할 수 있음은 물론 전류의 세기를 높여서 고정적인 전압을 통전시킬 수 있다. 이에 따라 공정시간을 단축시켜 높은 생산성을 달성할 수 있는 동시에 한층 더 고급화된 도금제품을 생산할 수 있는 것이다. As described above, the shielding rod 11 is integrally formed with the plastic injection molding 10 by the connecting ring 12 so as to facilitate installation and removal without affecting the existing work process. It can protect the edge of the injection molding from the tom phenomenon caused by the aggregation of the current at the edge of), and can also apply a fixed voltage by increasing the strength of the current. Accordingly, the process time can be shortened to achieve high productivity while at the same time producing more advanced plating products.

이상에서와 같이 본 발명은 비록 상기에 한하여 설명하였지만 반드시 여기에만 한정되는 것은 아니며 본 발명의 범주와 사상을 벗어나지 않는 범위 내에서 다양한 변형실시가 가능함은 물론이다.As described above, although the present invention has been described above, it is not necessarily limited thereto, and various modifications may be made without departing from the scope and spirit of the present invention.

전술한 구성 및 본 발명은 플라스틱사출물의 탐방지용 차폐구조에 관한 것으로, 플라스틱사출물에 차폐봉을 일체형으로 구성함으로 인하여 도금공시에 별도의 전압을 응집시킬 수 있도록 하여 제품의 외관에 탐 현상으로 인하여 불량의 원인이 되던 문제점을 해결하여 제품에 품질을 개선할 수 있다. 또한 도금시에 2~10(V) 고정적인 전압으로 전류를 통전할 수 있음으로 인하여 공정시간을 단축시켜 생산성의 향상을 얻을수 있는 효과가 있다.     The above-described configuration and the present invention relates to a shielding structure for preventing the injection of plastic injections, and by integrating a shielding rod integrally with the plastic injections, it is possible to agglomerate a separate voltage in the plating process so that defects due to the appearance of the product The quality of the product can be improved by solving the problem that caused the problem. In addition, since the current can be supplied at a fixed voltage of 2 to 10 (V) during plating, the process time can be shortened, thereby improving productivity.

Claims (1)

플라스틱사출물을 도금하는데 있어서, In plating plastic injection molding, 플라스틱사출물(10)의 배면 양측 모서리부에는 연결고리(12)를 일체로 결합하고,The coupling ring 12 is integrally coupled to both side edges of the rear surface of the plastic injection molding 10, 상기 연결고리(12)에는 플라스틱사출물(10)의 상면(10a)과 저면(10b)에 각각 일정간격을 두고 위치하는 상측분산봉(11a)과 하측분산봉(11b)으로 구성된 차폐봉(11)을 일체로 결합하여, The connecting ring 12 has a shielding rod 11 composed of an upper dispersing rod 11a and a lower dispersing rod 11b positioned at predetermined intervals on the top surface 10a and the bottom surface 10b of the plastic injection product 10, respectively. By combining 상측분산봉(11a)과 하측분산봉(11b)의 끝부분으로 전류를 분산, 응집되도록하여 플라스틱사출물(10)의 모서리부가 타는 것을 방지할 수 있도록 한 것을 특징으로 하는 플라스틱사출물의 탐 방지용 차폐구조.Shield structure for preventing the plastic injection, characterized in that the edge of the plastic injection molding 10 to prevent burning by dispersing the current to the ends of the upper dispersion rod (11a) and the lower dispersion rod (11b). .
KR1020060105369A 2006-10-28 2006-10-28 Plastic shooting out of carbonization prevention a blackout structure KR100727892B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101374793B1 (en) * 2011-12-16 2014-03-17 지금강 주식회사 Electorde auxiliary substrate for prevention burning deposition of plastic electroplating

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100256339B1 (en) 1995-12-29 2000-05-15 이구택 Device and method for decreasing edge-burning of the electroplating bath
KR200206017Y1 (en) * 1996-04-08 2000-12-01 이구택 Corner over-plating prevention device of electroplated steel
KR100550292B1 (en) 2001-12-22 2006-02-08 주식회사 포스코 Burning preventing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100256339B1 (en) 1995-12-29 2000-05-15 이구택 Device and method for decreasing edge-burning of the electroplating bath
KR200206017Y1 (en) * 1996-04-08 2000-12-01 이구택 Corner over-plating prevention device of electroplated steel
KR100550292B1 (en) 2001-12-22 2006-02-08 주식회사 포스코 Burning preventing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101374793B1 (en) * 2011-12-16 2014-03-17 지금강 주식회사 Electorde auxiliary substrate for prevention burning deposition of plastic electroplating

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