KR100726939B1 - 유기 전계발광 표시장치 및 그 제조방법 - Google Patents
유기 전계발광 표시장치 및 그 제조방법 Download PDFInfo
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- KR100726939B1 KR100726939B1 KR1020050094021A KR20050094021A KR100726939B1 KR 100726939 B1 KR100726939 B1 KR 100726939B1 KR 1020050094021 A KR1020050094021 A KR 1020050094021A KR 20050094021 A KR20050094021 A KR 20050094021A KR 100726939 B1 KR100726939 B1 KR 100726939B1
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- light emitting
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- 238000000034 method Methods 0.000 title claims description 9
- 238000005401 electroluminescence Methods 0.000 title description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000565 sealant Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 238000005192 partition Methods 0.000 description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (6)
- 유기발광셀이 매트릭스 형태로 배열된 유기전계발광어레이와;상기 유기발광셀에 스캔신호를 전달하는 스캔 신호라인과;상기 유기발광셀에 데이터 신호를 전달하는 데이터 신호라인을 구비하고,상기 스캔 신호라인 및 상기 데이터 신호라인 중 적어도 어느 하나는 제1 도전라인과, 상기 제1 도전라인을 덮도록 형성되어 상기 제1 도전라인을 외부로부터 밀폐시키는 제2 도전라인을 구비하는 것을 특징으로 하는 유기전계발광표시장치.
- 제 1 항에 있어서,상기 스캔 신호라인 및 데이터 신호라인 중 적어도 어느 하나와 접촉되는 실런트를 통해 상기 기판과 합착되어 상기 유기전계발광어레이를 외부로부터 보호하는 캡을 더 구비하는 것을 특징으로 하는 유기전계발광표시장치.
- 제 1 항에 있어서,상기 유기발광셀은유기발광층을 사이에 두고 위치하는 애노드 전극 및 캐소드 전극을 포함하고,상기 스캔라인은 상기 유기전계발광어레이를 우회하여 상기 캐소드 전극과 접속되는 것을 특징으로 하는 유기전계발광표시장치.
- 유기발광셀이 매트릭스 형태로 배열된 유기전계발광어레이에 구동신호를 전달하는 데이터 신호라인 및 스캔 신호라인을 형성하는 단계를 포함하는 유기전계발광표시장치의 제조방법에 있어서,데이터 신호라인 및 스캔 신호라인 중 적어도 어느 하나를 형성하는 단계는기판 상에 제1 도전라인을 형성하는 단계와;상기 제1 도전라인을 덮도록 형성되어 상기 제1 도전라인을 외부로부터 밀폐시키는 제2 도전라인을 형성하는 단계를 포함하는 것을 특징으로 하는 유기전계발광표시장치의 제조방법.
- 제 4 항에 있어서,유기전계발광어레이를 외부로부터 보호하기 위한 캡을 상기 스캔 신호라인 및 데이터 신호라인 중 적어도 어느 하나와 접촉되는 실런트를 통해 상기 기판과 합착하는 단계를 더 포함하는 것을 특징으로 하는 유기전계발광표시장치의 제조방법.
- 제 4 항에 있어서,상기 유기발광셀은 유기발광층을 사이에 두고 위치하는 애노드 전극 및 캐소드 전극을 포함하고,상기 제1 도전라인은 상기 애노드 전극과 동일물질로 동시에 형성되는 것을 특징으로 하는 유기전계발광표시장치의 제조방법.
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KR1020050094021A KR100726939B1 (ko) | 2005-10-06 | 2005-10-06 | 유기 전계발광 표시장치 및 그 제조방법 |
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KR1020050094021A KR100726939B1 (ko) | 2005-10-06 | 2005-10-06 | 유기 전계발광 표시장치 및 그 제조방법 |
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KR20070038755A KR20070038755A (ko) | 2007-04-11 |
KR100726939B1 true KR100726939B1 (ko) | 2007-06-14 |
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KR20050082961A (ko) * | 2004-02-20 | 2005-08-24 | 엘지전자 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
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KR20050082961A (ko) * | 2004-02-20 | 2005-08-24 | 엘지전자 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
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