KR100720117B1 - A conductive adhesive and its making method - Google Patents
A conductive adhesive and its making method Download PDFInfo
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- KR100720117B1 KR100720117B1 KR1020050016610A KR20050016610A KR100720117B1 KR 100720117 B1 KR100720117 B1 KR 100720117B1 KR 1020050016610 A KR1020050016610 A KR 1020050016610A KR 20050016610 A KR20050016610 A KR 20050016610A KR 100720117 B1 KR100720117 B1 KR 100720117B1
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- 239000000853 adhesive Substances 0.000 title claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 25
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 22
- 239000004917 carbon fiber Substances 0.000 claims abstract description 22
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002270 dispersing agent Substances 0.000 claims abstract description 13
- 239000003755 preservative agent Substances 0.000 claims abstract description 12
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 9
- 230000002335 preservative effect Effects 0.000 claims abstract description 9
- 230000009477 glass transition Effects 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 20
- 239000004925 Acrylic resin Substances 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000052 comparative effect Effects 0.000 description 12
- 230000005611 electricity Effects 0.000 description 9
- 239000000047 product Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000003068 static effect Effects 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000002421 anti-septic effect Effects 0.000 description 2
- -1 antifoams Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000003444 anaesthetic effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F11/00—Treatment of sludge; Devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D22/00—Producing hollow articles
- B29D22/003—Containers for packaging, storing or transporting, e.g. bottles, jars, cans, barrels, tanks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/06—PE, i.e. polyethylene
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
수성 아크릴계 전도성 접착제 조성물 및 이의 제조방법에 관한 것으로서, 보다 상세하게는 유성이 아닌 수성이면서도 높은 전도성과 접착력이 강화된 전도성 접착제 및 이의 제조방법을 제공하는 것이다. The present invention relates to an aqueous acrylic conductive adhesive composition and a method for preparing the same, and more particularly, to an aqueous adhesive, which is not oily, but which has a high conductivity and adhesive strength, and a method for manufacturing the same.
본 발명의 수성 전도성 접착제 조성물은 유리전이온도(Tg)가 약 -70℃의 수분산 아크릴 수지 100중량부에 대해서 분산제 0.1∼1중량부, 소포제 0.03∼1중량부, 방부제 0.1∼1중량부, 충진제 30∼50중량부, 접착부여제 10∼30중량부 및 전도성물질로서 카본화이바 0.2∼2중량부, 카본 0.5∼5중량부, 금속분말 0.3∼3중량부, 전도성보조제 0.1∼3중량부를 포함한다. The aqueous conductive adhesive composition of the present invention has a glass transition temperature (Tg) of 0.1 to 1 parts by weight of a dispersant, 0.03 to 1 parts by weight of antifoaming agent, 0.1 to 1 part by weight of preservative, 30 to 50 parts by weight of a filler, 10 to 30 parts by weight of an adhesive imparting agent and 0.2 to 2 parts by weight of carbon fiber, 0.5 to 5 parts by weight of carbon, 0.3 to 3 parts by weight of metal powder, and 0.1 to 3 parts by weight of a conductive aid do.
전도성 접착제, 수성 Conductive adhesive, aqueous
Description
수성 아크릴계 전도성 접착제 조성물 및 이의 제조방법에 관한 것으로서, 보다 상세하게는 유성이 아닌 수성이면서도 높은 전도성과 접착력이 강화된 전도성 접착제 및 이의 제조방법을 제공하는 것이다. The present invention relates to an aqueous acrylic conductive adhesive composition and a method for preparing the same, and more particularly, to an aqueous adhesive, which is not oily, but which has a high conductivity and adhesive strength, and a method for manufacturing the same.
최근 반도체 산업, 첨단전자산업, 정보통신 산업 등 정미기기를 생산하는 공장과 사용하는 장소에서 정전기 발생으로 불량품이 발생하거나 기기 오작동으로 인한 피해 등으로 인해 산업 각 분야에서 날로 심각한 문제를 야기하고 있는데, 그 해결책으로 반도체, 전자제품 또는 부품 생산 공장이나 정밀기기 설치장소에 바닥재로 정전기 제어를 할 수 있는 전도성 타일을 시공하는 데, 이 때 전도성 접착제를 사용하게 된다. Recently, in the semiconductor industry, high-tech electronics industry, information and communication industry, factories that produce and use rice milling devices are causing serious problems in each industry due to the occurrence of defective products or damages caused by malfunction of devices. As a solution, conductive adhesives can be used to control static electricity from flooring to semiconductors, electronics or component manufacturing plants or precision equipment installations.
즉, 전도성 접착제는 여러가지 원인으로 인하여 발생된 정전기를 지면으로 흡수시켜 없애야 하는 곳에 주로 사용되는 데, 반도체 공장의 클린룸 시설, 병원 수술실, 마취실, 전산실 등 정전기가 발생되면 정밀 기기의 오동작을 일으키는 장소에서 지면에 접지시켜 정전기가 지면으로 흐를 수 있도록 각종 타일 등을 부착하 는 데 사용된다. In other words, the conductive adhesive is mainly used where the static electricity generated by various causes must be absorbed and removed from the ground. If the static electricity is generated, such as a clean room facility of a semiconductor factory, a hospital operating room, an anesthetic room, or a computer room, it causes malfunction of precision equipment. It is used to attach various tiles to ground to ground at the place so that static electricity can flow to the ground.
일반적으로 전도성 접착제는 수성 또는 유성으로 나누어지는데, 유성 타입의 전도성 접착제는 전도성과 접착성이 우수하나 톨루엔을 주성분으로 하고 있음으로 환경오염의 주범으로 인식되고 있으며, 또한, 접착제 냄새가 심하게 발생하여 쾌적한 환경을 제공하지 못하며, 클린 룸 환경을 유지하여야 하는 반도체 시설 내에서는 반도체 칩을 손상시키는 원인이 된다. In general, conductive adhesives are divided into aqueous or oily type. The oil-based conductive adhesives are excellent in conductivity and adhesiveness, but are recognized as the main culprit of environmental pollution because they contain toluene as the main ingredient. In a semiconductor facility that does not provide an environment and must maintain a clean room environment, it causes damage to the semiconductor chip.
전도성 접착제는 높은 전도성과 함께 높은 접착력을 유지하고 있어야 한다. 그러나, 종래의 수성 타입의 전도성 접착제는 전도성 물질을 많이 첨가하면 전도성은 높아지나 접착력이 낮아지는 결과를 낮아, 높은 전도성과 높은 접착력이라는 2가지 요구 사항을 충족시키지 못하고 있다. Conductive adhesive must maintain high adhesion with high conductivity. However, the conventional water-based conductive adhesive has a high conductivity, but a low adhesive force due to the addition of a large amount of the conductive material, does not meet the two requirements of high conductivity and high adhesion.
현재, 수성 아크릴계 전도성 접착제는 전도성 물질로 카본 화이바만을 사용하는 경우와 카본만을 사용하는 경우로 크게 구분된다. 이는 국내 뿐만아니라 해외 제품에서도 마찬가지이다. Currently, aqueous acrylic conductive adhesives are largely classified into a case of using only carbon fiber and a case of using only carbon as a conductive material. The same is true for overseas as well as domestic products.
그러나, 카본 화이바만을 단독으로 사용하는 경우에, 카본 화이바는 섬유상이기 접착제 제조시 일정량 이상을 넣게 되면 분산이 잘 되지 않고 뭉치는 현상이 생기며, 이는 접착제를 이용하여 타일을 시공시 화이바끼리 뭉쳐서 작업을 어렵게 한다는 단점이 있었다. However, in the case of using only carbon fibers alone, carbon fibers are fibrous, and if more than a certain amount is added during the manufacture of the adhesive, the dispersion does not occur well, which results in agglomeration of the fibers. There was a disadvantage of making it difficult.
한편, 카본만을 단독으로 사용하는 경우에, 카본은 일정량 이상 들어가면 접착력을 급격하게 하락시키는 성질이 있어 특히 동절기 시공시에 시공후 하루 또는 수개월 후 접착력 부족으로 인한 타일의 들뜸현상이 발생하게 되어 시공 불량이 생 기게 되었다. On the other hand, in the case of using only carbon alone, carbon has a property of rapidly lowering the adhesive strength when a certain amount of carbon enters, and in particular, the lifting of the tile occurs due to the lack of adhesion after one or several months after construction in winter. This occurred.
본 발명의 상기의 문제점을 해결하기 위해서 안출된 것으로서, 상기 발명의 목적은 높은 전도성을 가지는 온도에 상관없이 높은 접착력을 가지는 수성 전도성 접착제 및 이의 제조방법을 제공하는 것이다. In order to solve the above problems of the present invention, an object of the present invention is to provide an aqueous conductive adhesive having a high adhesive strength regardless of the temperature having a high conductivity and a method for producing the same.
본 발명자는 상기의 문제점을 해결하고자 전도성 물질로서 카본 화이바 또는 카본 단독으로 사용하는 것이 두 물질을 적정량 함께 혼합하여 서로 단점을 보완함과 동시에, 금속을 첨가하여 전도성을 보완하였으며, 전도성 보조제를 추가로 삽입하여 각각의 전도성 물질들을 연결시켜 주는 역할을 하도록 함으로써, 소량의 카본 화이바 및 카본의 사용만으로 높은 전도성을 가지는 수성 전도성 접착제 조성물을 발명하게 되었다. In order to solve the above problems, the present inventors use carbon fiber or carbon alone as a conductive material to mix the two materials together in an appropriate amount to compensate for the disadvantages of each other, and at the same time, supplement the conductivity by adding a metal, and additionally, a conductive aid. By inserting and connecting the respective conductive materials, an aqueous conductive adhesive composition having a high conductivity can be invented using only a small amount of carbon fiber and carbon.
본 발명의 수성 전도성 접착제 조성물은 유리전이온도(Tg)가 약 -70℃의 수분산 아크릴 수지 100중량부에 대해서 분산제 0.1∼1중량부, 소포제 0.03∼1중량부, 방부제 0.1∼1중량부, 충진제 30∼50중량부, 접착부여제 10∼30중량부 및 전도성물질로서 카본화이바 0.2∼2중량부, 카본 0.5∼5중량부, 금속분말 0.3∼3중량부, 전도성보조제 0.1∼3중량부를 포함한다. The aqueous conductive adhesive composition of the present invention has a glass transition temperature (Tg) of 0.1 to 1 parts by weight of a dispersant, 0.03 to 1 parts by weight of antifoaming agent, 0.1 to 1 part by weight of preservative, 30 to 50 parts by weight of a filler, 10 to 30 parts by weight of an adhesive imparting agent and 0.2 to 2 parts by weight of carbon fiber, 0.5 to 5 parts by weight of carbon, 0.3 to 3 parts by weight of metal powder, and 0.1 to 3 parts by weight of a conductive aid do.
바람직하게는 상기 충진제는 탄산칼슘, 탈크 및 이의 혼합물로 이루어진 군으로부터 선택된 충진제이며,, 상기 전도성 보조제는 OH기를 갖는 전도성 보조제가 사용된다. Preferably the filler is a filler selected from the group consisting of calcium carbonate, talc and mixtures thereof, wherein the conductive aid is a conductive aid having an OH group.
카본 화이바는 섬유임으로 선으로 전기를 통하게 하는 연결시켜 주는 역할을 하며, 카본과 금속분말은 유기, 무기물이 점으로 터널효과에 의해서 전기가 통하도록 연결시켜 주는 역할을 한다. 본 발명의 전도성 물질은 카본 화이바, 카본, 및 금속분말을 포함하고 있으므로 선으로도 전기를 연결시켜 주며, 점으로 전기를 연결시켜 원활한 전도성을 가지게 한다. 한편, 본 발명에서는 액체 상태의 전도성 보조제가 추가로 포함되는 데, 전도성 보조제는 OH 기를 가지고 있어, 각 성분의 전도성 물질의 H(수소)를 끌어 당김으로 각 전도성 물질들을 연결시켜 전도성 상승 작용을 일으킴으로 장기 저항에 유리하게 하는 역할을 수행한다. 이와 같이, 본 발명에서는 카본, 카본 화이바 뿐만아니라, 금속, 전도성 보조제를 추가로 사용하여 전기의 전도성을 높이고, 동시에 각 성분별로 한계 량 이하로 투입됨으로 접착력이 우수하며, 시공성을 향상시키게 된다. Carbon fiber is a fiber that connects electricity through wires, and carbon and metal powders play a role of connecting electricity and organic matter by tunnel effect. Since the conductive material of the present invention includes carbon fibers, carbon, and metal powders, the conductive materials are also connected by wires, and the conductive materials are connected by dots to have smooth conductivity. On the other hand, in the present invention, a liquid conductive aid is further included, the conductive aid has an OH group, by connecting the respective conductive materials by attracting H (hydrogen) of the conductive material of each component to cause a conductive synergy It plays a role in favor of long-term resistance. As described above, in the present invention, as well as carbon and carbon fiber, a metal and a conductive auxiliary agent are additionally used to increase the conductivity of electricity, and at the same time, the component is added below the limit amount for each component, thereby improving the adhesion and improving the workability.
이하에서는 본 발명에 따른 수성 아크릴계 전도성 접착제 조성물의 제조방법에 대해서 설명하기로 한다. Hereinafter, a method for preparing an aqueous acrylic conductive adhesive composition according to the present invention will be described.
먼저, 유리전이온도 약 -70℃인 수분산 아크릴 수지 100중량부 중 일부에 1차 전도성 물질인 카본 0.5∼5중량부과 금속분말 0.3∼3중량부를 강제 분산시킨다. 즉, 반응기에 카본이나 금속분말을 투입하기 전에 먼저 강제 분산시킬 필요가 있다. 만약, 카본이나 금속분말을 분산제, 소포제, 방부제 및 수분산 아크릴 수지에 한꺼번에 투입하여 교반하는 경우에는 서로 엉끼고 덩어리가 형성되어 쉽게 분산되지 않기 때문이다. 이는 카본과 금속분말이 친수성인 수분산 아크릴 수지에 쉽게 분산되지 않기 때문이다. 따라서, 강제로 수분산 아크릴 수지에 분산시킨 후 이를 반응기에 투입한다.First, 0.5 to 5 parts by weight of carbon as the primary conductive material and 0.3 to 3 parts by weight of the metal powder are forcibly dispersed in a part of 100 parts by weight of the water-dispersible acrylic resin having a glass transition temperature of about -70 ° C. That is, it is necessary to forcibly disperse first before injecting carbon or metal powder into the reactor. If the carbon or metal powder is added to the dispersant, the antifoaming agent, the preservative, and the water-dispersible acrylic resin at the same time and stirred, they are entangled with each other and agglomerates are formed so that they are not easily dispersed. This is because carbon and metal powder are not easily dispersed in the hydrophilic water-dispersible acrylic resin. Therefore, it is forcibly dispersed in the water-dispersible acrylic resin and then injected into the reactor.
유리전이온도 약 -70℃인 수분산 아크릴 수지 100중량부에 대해서, 분산제 0.1∼1중량부, 소포제 0.03∼1중량부, 방부제 0.1∼1중량부도 반응기에 투입한다. 투입후 약 30분 ∼ 1시간 30분 동안 충분히 교반시킨다. 0.1-1 weight part of a dispersing agent, 0.03-1 weight part of antifoamers, and 0.1-1 weight part of antiseptic | preservatives are also thrown into a reactor with respect to 100 weight part of water dispersion acrylic resins whose glass transition temperature is about -70 degreeC. After the addition, the mixture is sufficiently stirred for about 30 minutes to 1 hour 30 minutes.
다음으로, 상기 혼합물에 충진제 30∼50중량부를 3회 나누어 20분 간격으로 투입하면서 계속 교반시킨다. 충진제 역시 한꺼번에 많은 양을 투입하면 엉킴 현상이 발생함으로 조금씩 나누어서 투입한다. Next, the mixture is added to the mixture at 30 to 50 parts by weight three times, and the stirring is continued at 20 minute intervals. Fillers are also added in small portions because entanglement occurs when a large amount is added at once.
다음으로 접착부여제를 투입하고 역시 30분 ∼ 1시간 30분 동안 교반시킨다. Next, the tackifier is added and stirred for 30 minutes to 1 hour and 30 minutes.
다음으로, 상기 혼합물에 2차 전도성 물질인 카본화이바 0.2∼2중량부, 전도성보조제 0.1∼3중량부를 투입하고 30분 ∼ 1시간 30분 동안 교반시킨다. Next, to the mixture, 0.2 to 2 parts by weight of carbon fiber, a secondary conductive material, and 0.1 to 3 parts by weight of a conductive assistant are added and stirred for 30 minutes to 1 hour and 30 minutes.
카본 화이바 및 전도성 보조제를 맨 나중에 투입하는 이유는 카본 화이바가 섬유이기 때문에 과도한 교반으로 엉김현상을 유발시킬 수 있기 때문이다. The reason for the last addition of the carbon fiber and the conductive aid is that the carbon fiber is a fiber and can cause entanglement due to excessive stirring.
마지막으로 교반을 멈추고 진공을 이용하여 기포를 제거한다. 기포를 제거하고 물성 조절 후 포장을 함으로써 제품을 완성하게 된다. Finally, stirring is stopped and the bubbles are removed using a vacuum. The product is completed by removing bubbles and adjusting the physical properties before packing.
이와 같이,여러단계의 구분을 두어 반응기에 재료를 투입하는 이유는 각 재료의 물성을 고려한 것으로 한꺼번에 여러성분을 한꺼번에 투입하여 교반하는 경우에는 기포의 발생으로 제품의 품질이 현저히 떨어지며, 엉김현상의 발생하여 제품으로서의 역할을 할 수 없게 된다. As such, the reason for putting the material into the reactor by dividing the various stages is to consider the properties of each material. In case of stirring by adding several components at once, the quality of the product is significantly reduced due to the generation of bubbles, and the occurrence of entanglement phenomenon. As a result, the product cannot function as a product.
아하에서는 본 발명의 실시예를 들어 보다 상세히 설명하기로 한다. In the following, an embodiment of the present invention will be described in more detail.
실시예 1Example 1
유리전이온도 대략 -70℃의 수분산 아크릴 수지에 카본, 금속분말을 투입하여 강제 분산시켰다. 이를 반응기에 투입하고, 동일성분의 수분산 아크릴 수지, 분산제, 소포제, 방부제를 투입하였다. 유리전이온도 -70℃의 수분산 아크릴 수지의 총량은 100중량부(1Kg)이 투입되었으며, 카본은 1.3 중량부, 금속분말 0.8중량부, 분산제 0.3중량부, 소포제 0.05중량부, 방부제 0.3중량부가 투입되었다. 상기 성분을 투입후 약 1시간동안 교반하였다. Carbon and metal powder were added to the water-dispersible acrylic resin having a glass transition temperature of approximately −70 ° C. to be forcibly dispersed. This was put into a reactor, and the water-dispersive acrylic resin, a dispersing agent, an antifoamer, and a preservative of the same component were added. 100 parts by weight (1 Kg) was added to the total amount of the water-dispersible acrylic resin having a glass transition temperature of -70 ° C, 1.3 parts by weight of carbon, 0.8 parts by weight of metal powder, 0.3 parts by weight of dispersant, 0.05 parts by weight of antifoam, and 0.3 parts by weight of preservative. Committed. The ingredient was stirred for about 1 hour after the addition.
상기 혼합물에 충진제 40 중량부를 3회 나누어 20분 간격으로 투입하면서 계속 교반하면서 1시간동안 교반하였다. 그리고 다시, 상기 혼합물에 접착부여제 20중량부를 투입하고 1시간동안 교반한 후, 마지막으로 상기 혼합물에 2차 전도성 물질인 카본화이바 0.5중량부, 전도성보조제 0.5중량부를 투입하고 1시간 교반하였다. 그런 후, 진공을 이용하여 기포를 제거하여, 본 발명의 수성 아크릴계 전도성 접착제 조성물을 얻었다. 40 parts by weight of the filler was added to the mixture three times at 20 minute intervals, followed by stirring for 1 hour with continued stirring. Then, 20 parts by weight of a tackifier was added to the mixture and stirred for 1 hour. Finally, 0.5 parts by weight of carbon fiber, a secondary conductive material, and 0.5 parts by weight of a conductive aid were added to the mixture, followed by stirring for 1 hour. Thereafter, bubbles were removed using a vacuum to obtain an aqueous acrylic conductive adhesive composition of the present invention.
비교예 1Comparative Example 1
전도성 물질로서 카본 화이바만을 첨가하여 수성 아크릴계 전도성 접착제를 제조하였다. 아크릴 수지, 분산제, 소포제, 방부제, 충진제, 접착부여제는 실시예 1에서와 같은 동일한 성분 및 동일한 량을 첨가하였다. 단, 카본 화이바는 실시예 1보다 많은 량인 2중량부를 첨가하였다. As the conductive material, only carbon fiber was added to prepare an aqueous acrylic conductive adhesive. Acrylic resins, dispersants, antifoams, preservatives, fillers, tackifiers were added with the same components and the same amount as in Example 1. However, carbon fiber was added 2 weight part which is a quantity more than Example 1.
즉, 아크릴 수지, 분산제, 소포제, 방부제를 먼저 넣고 1시간동안 교반후, 여기서 충진제를 첨가하여 다시 1시간동안 교반하고, 다시 접착부여제를 넣고 교반한 후, 마지막으로 카본 화이바 2중량부를 첨가하여 1시간 동안 교반하였다. 그런 후, 진공을 이용하여 기포를 제거하여 비교예 1의 수성 접착제를 제조하였다. That is, the acrylic resin, dispersant, antifoaming agent, and preservative are added first and stirred for 1 hour, and then the filler is added and stirred for 1 hour, and then the adhesive agent is added and stirred, and finally, 2 parts by weight of carbon fiber is added. Stir for 1 hour. Thereafter, bubbles were removed using a vacuum to prepare the aqueous adhesive of Comparative Example 1.
비교예 2Comparative Example 2
전도성 물질로서 카본만을 첨가하여 수성 아크릴계 전도성 접착제를 제조하였다. 아크릴 수지, 분산제, 소포제, 방부제, 충진제, 접착부여제는 실시예 1에서와 같은 동일한 성분 및 동일한 량을 첨가하였다. 단, 카본은 실시예 1에서 보다 많은 량인 3중량부를 첨가하였다. 카본의 량은 실시예 1에서 사용된 전체 전도성물질(카본화이바, 카본, 금속분말, 전도성 보조제)의 량과 거의 비슷한 량이다. Only aqueous carbon was added as the conductive material to prepare an aqueous acrylic conductive adhesive. Acrylic resins, dispersants, antifoams, preservatives, fillers, tackifiers were added with the same components and the same amount as in Example 1. However, carbon was added 3 parts by weight, which is a larger amount than in Example 1. The amount of carbon is about the same as that of the total conductive material (carbon fiber, carbon, metal powder, conductive aid) used in Example 1.
즉, 먼저, 아크릴 수지에 카본 3중량부를 강제 분산시킨 후, 분산제, 소포제, 방부제를 넣고 1시간동안 교반후, 여기서 충진제를 첨가하여 다시 1시간동안 교반하고, 다시 접착부여제를 넣고 교반한 1시간 동안 교반하였다. 그런후, 진공을 이용하여 기포를 제거하여 비교예 2의 수성 접착제를 제조하였다. That is, first, after dispersing 3 parts by weight of carbon in the acrylic resin, the dispersant, antifoaming agent, preservative was added and stirred for 1 hour, and then the filler was added and stirred for 1 hour, and then the adhesive additive was added and stirred 1 Stir for hours. Thereafter, bubbles were removed using a vacuum to prepare the aqueous adhesive of Comparative Example 2.
하기의 표 1의 실시예 1, 비교예 1, 및 비교예 2에서 사용된 조성비(함량:중량부)를 나타낸다. The composition ratio (content: weight part) used by Example 1 of the following Table 1, the comparative example 1, and the comparative example 2 is shown.
표 1Table 1
〔전도성 실험방법〕[Conductivity Test Method]
전도성 접착제의 저항치는 대략 2.5×104∼106Ω 이하에서 적당한 데, 전기저항이 너무 크면 전도성 접착제로서의 기능을 하지 못하여 클린룸 내의 정전기 등을 제거할 수 없다는 문제가 있다. 접착제를 도포하고 난 후 시간이 흘러도 상기의 저항치 이상으로 증가하지 않아야 양호한 전도성을 가진다고 할 수 있다. The resistance value of the conductive adhesive is appropriate at about 2.5 × 10 4 to 10 6 Pa or less, but if the electrical resistance is too large, there is a problem in that it cannot function as a conductive adhesive and remove static electricity and the like in the clean room. It can be said that it has good conductivity if it does not increase beyond the above resistance even after time after applying the adhesive.
1) 초기저항 실험방법1) Initial resistance test method
습기가 없는 합판에 OPP 테이프를 부착하여 습기를 차단한 후 각각의 제조방법에 의해서 제조된 전도성 접착제를 헤라를 이용하여 각각 도포(0.3∼0.35g/m2)시켰다. 상온에서 대기시간(Open Time)을 10분 동안 준 후 시공용 동 테이프(Copper Tape)을 10cm 간격으로 바른다. 10분 후 저항측정기를 이용하여 125볼트에서 저항을 측정하였다. After the OPP tape was attached to the moisture-free plywood to block moisture, the conductive adhesive prepared by the respective manufacturing method was applied (0.3 to 0.35 g / m 2 ) using HERA. After giving 10 minutes of open time at room temperature, apply copper tape for 10cm intervals. After 10 minutes, the resistance was measured at 125 volts using a resistance meter.
2) 장기저항 실험방법2) Long-term resistance test method
초기저항을 체크한 시편을 1일, 2일, 3일, 7일 후 시간이 지남에 따라 저항값을 변화치를 측정하였다. The specimens whose initial resistance was checked were measured after 1 day, 2 days, 3 days, and 7 days.
하기의 표 2는 저항의 측정치를 나타낸다. Table 2 below shows the measurement of the resistance.
표 2TABLE 2
상기 표에서 알 수 이는 바와 같이, 전도성 물질로서 카본 화이바만을 사용한 경우(비교예 1) 및 카본만을 사용한 경우(비교예 2)는 초기저항은 비교적 양호하였으나, 시간이 흐름에 따라 저항치가 기준 이상으로 증가하였고, 3일후부터는 아예 전기가 통하지 않았다. 그러나, 실시예 1의 경우에는 7일이 지난 후에도 양호한 전기저항을 갖었다. As can be seen from the above table, when only carbon fiber was used as a conductive material (Comparative Example 1) and when only carbon was used (Comparative Example 2), the initial resistance was relatively good. It increased, and after three days electricity did not flow at all. However, in the case of Example 1, even after 7 days had a good electrical resistance.
본 발명의 수성 아크릴계 전도성 접착제 조성물은 높은 전도성과 높은 접착력을 가지고 있으므로, 반도체 시설의 클린 룸에서와 같이 전도성 접착제가 필요한 곳이 널리 사용될 수 있다. 본 발명의 접착제는 시간이 경과함에도 전도성이 떨어지지 않는다는 장점이 있다. Since the aqueous acrylic conductive adhesive composition of the present invention has high conductivity and high adhesion, a place where a conductive adhesive is required, such as in a clean room of a semiconductor facility, can be widely used. The adhesive of the present invention has the advantage that the conductivity does not drop even with time.
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| JPH08319467A (en) * | 1995-05-25 | 1996-12-03 | Soken Chem & Eng Co Ltd | Conductive particle and anisotropically conductive adhesive |
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| JPH08319467A (en) * | 1995-05-25 | 1996-12-03 | Soken Chem & Eng Co Ltd | Conductive particle and anisotropically conductive adhesive |
| KR20030063245A (en) * | 2003-03-24 | 2003-07-28 | 주식회사화성 | Aqueous acrylic conductive adhesive composition for conductive pvc tile and preparing method thereof |
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