KR100716844B1 - Serial type connector board module and mobile communication device - Google Patents

Abstract

The present invention relates to a connector substrate and a mobile communication device including the same, and more particularly, to transmit multimedia-related large-capacity data at high speed by allowing data signals transmitted in the connector substrate to be transmitted in a serial manner. The present invention relates to a serial connector board, and a mobile communication device including the same, to provide a flexible connector board mounted with a serial mode chip to transmit data in a serial manner within the connector module. By changing the data transmission system in serial, it is possible to easily cope with the multimedia dedicated mobile communication device requiring the transmission of a large amount of data, and furthermore, since the structure of the flexible board unit can be reduced while transmitting a large amount of data at a high speed. Mobile communication devices It can also help reduce the size of the whole.

Serial Mode Chips, Connector Boards, Motherboards, Subboards, LCD Modules, Multimedia Chips, Electromagnetic Interference, Mobile Communication Devices

Description

Serial connector board and a mobile communication device including the same {Serial type connector board module and mobile communication device}

1 is a schematic plan view of a conventional connector substrate;

2 is a schematic side view of the connector board of FIG. 1;

3 is a schematic plan view of a connector board according to an embodiment of the present invention;

4 is a schematic side view of the connector board of FIG. 3;

5A and 5B are graphs for experimentally comparing signal quality states by parallel and serial methods, respectively; And

6 is a block diagram illustrating a configuration of a mobile communication device including the connector board of FIG. 3 according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

110a, 110b: rigid substrate portion 120a, 120b: connector

130: flexible substrate section 140a, 140b: serial mode chip

200: connector board

210: main body 220: main board

222, 252: Connector 224: Keypad

226 multimedia processor chip 228 modem

240: LCD 250: sub-board

254 LCD Module 256 Camera

300: mobile communication device

The present invention relates to a connector substrate and a mobile communication device including the same, and more particularly, to transmit multimedia-related large-capacity data at high speed by allowing data signals transmitted in the connector substrate to be transmitted in a serial manner. The present invention relates to a serial connector substrate and a mobile communication device including the same.

A mobile communication device such as a cellular phone has a keypad formed in a structure such as a folder type or a slide type in a structure in which a keypad and an LCD module are integrally combined, such as a bar type and a flip type. The LCD unit formed with the LCD module is separated, and the LCD unit is moving relative to the main body.

As such, as the LCD unit moves relative to the main body, the importance of the connector module interposed between the main body and the LCD unit and responsible for the transmission of electrical signals is increasing.

For example, in a clamshell structure in which the LCD unit rotates around the hinge, the connector module is fastened to the hinge and is responsible for the transmission of electrical signals between the main body and the LCD unit. In this case, the connector module is a flexible board that can respond to the rotation of the hinge. Should be made with The same applies to the slide-type structure in which the LCD unit slides with respect to the main body, and thus the connector module connecting the LCD unit and the main body is made of a rigid-flexible PCB (RF PCB).

One example of such a connector module is shown in top and side views in FIGS. 1 and 2. 1 and 2, an example of a conventional connector module will be described schematically.

The conventional connector module 100 includes a pair of rigid substrate portions 10a and 10b provided with the connectors 20a and 20b and a flexible substrate portion 30 interposed therebetween. In the conventional case, the flexible substrate portion 30 may simply be a flexible cable that can be bent, which can be understood as having a degree of flexibility that can correspond to the relative movement between the main body and the LCD portion.

Here, each of the connectors 20a and 20b is connected to parts such as a keypad, a multimedia processor chip, etc. formed on the main body side, and parts such as an LCD module, a camera, etc. formed on the LCD side, and electrically connects these parts.

  The size of the conventional connectors 20a and 20b is, for example, 30 pin or more, and data is transmitted in a parallel interface manner between the connectors. The number of pins of the connector depends on the amount of data transmitted therebetween. For example, a connector of about 65 pins is used to transmit data of a camera having 1.3 mega pixels of pixels, and the connector The flexible substrate portion formed between them should be formed in a structure of at least six layers or more.

As such, as the amount of data transmitted between the main body and the LCD increases, the connector module also has constraints such as an increase in the number of pins and a complicated structure of the flexible board, and a connector that can support the increase in the amount of data transmission in the future. The availability of modules is a hot topic.

On the other hand, the connector module of the above structure is not easy to cope with the development rate of the multimedia-based mobile communication device of the recent trend that a large amount of data to be transmitted at high speed.

In addition, as the amount of data to be transmitted increases, the number of connector pins must continuously increase, and the structure of the flexible board portion interposed between the connectors also results in a structure having a larger number of layers. It may cause a problem that leads to a decrease in the bending performance of the substrate portion. For example, when a flexible substrate portion having a larger number of layers is used as compared to the case where a flexible substrate portion having a six-layer structure is used, the bending performance may be reduced in proportion thereto.

In addition, since the data transmission method in the current connector module uses a parallel interface method, problems such as electromagnetic interference (EMI) caused therefrom are further increased.

SUMMARY OF THE INVENTION The present invention provides a connector module for use in a mobile communication device, wherein the connector module is configured to allow data to be transmitted in a serial interface manner.

In addition, the present invention is to provide a mobile communication device that can transmit a large amount of multimedia data at high speed, including a serial connector module.

In order to achieve these objects, the present invention provides a pair of hard board portions on which a connector is mounted; A flexible substrate portion integrally formed with the rigid substrate portion between the pair of rigid substrate portions; And a serial mode chip mounted respectively on a pair of rigid substrate parts adjacent to the flexible substrate part, wherein the serial mode chip is configured to perform a signal transmission between the serial mode chips in a serial manner.

In the present invention, the serial mode chip is characterized in that switching between the parallel signal and the serial signal.

In addition, in the present invention, the pair of serial mode chip is characterized in that the high-speed transmission between the pair of serial mode chip by converting the parallel-type multimedia signal connected to the connector to the serial signal of the pair .

In the present invention, the connector is connected to the multimedia chip, the multimedia chip is characterized in that for outputting parallel signals.

The present invention also provides a main body including a main board including a keypad; An LCD unit electrically connected to the main board of the main body through a connector module, the LCD unit including a sub-board on which the LCD module is mounted; And additional multimedia chips mounted on any one of the main board and the sub board, wherein the connector module is the above-described serial connector board.

In the present invention, further multimedia chips are characterized as comprising a modem, a camera and a multimedia processor chip.

In the present invention, the multimedia processor chip is mounted on the main board, the multimedia processor chip and the LCD module is characterized in that it is electrically connected through the connector module.

In the present invention, the camera is mounted on the sub-board, the multimedia processor chip and the camera is characterized in that it is electrically connected through a connector module.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

First, FIGS. 3 and 4 are schematic plan and side views, respectively, of a connector substrate 200 according to an embodiment of the present invention.

The connector board 200 according to an embodiment of the present invention includes a pair of rigid board parts 110a and 110b provided with the connectors 120a and 120b and a flexible board part 130 interposed therebetween. do. In addition, the serial mode chips 140a and 140b may be mounted at ends of the rigid substrates 110a and 110b adjacent to the flexible substrate 130.

The connector board 200 having such a structure has a feature that the number of connector pins is basically reduced as compared with the conventional case, and the number of layers of the flexible board portion is reduced despite the same amount of data transmission. For example, in the conventional module 100, the connectors 10a and 10b (see FIG. 1) are configured with about 30 pins, while the connectors 110a and 110b of the connector board 200 according to the present invention are about It can be configured to have 15 pins. In addition, the flexible substrate unit 130 may also be configured to have a lower number of layer structures than the conventional flexible substrate unit 30 (see FIG. 1).

This is primarily due to the change of data transmitted between the connectors of the connector board from the conventional parallel method to the serial method. To this end, the present invention provides a serial mode chip in each of the parts of the rigid board part adjacent to both ends of the flexible board part. Provided are structures in which 140a and 140b are mounted.

The serial mode chips 140a and 140b of the present invention may be used in a range of known functions in which a parallel signal received through a connector is converted into a serial signal, transmitted, and then converted into a parallel signal and outputted. have. Although in FIG. 4, the serial mode chips 140a and 140b are shown in the form of a BGA package, they are not limited or limited thereto, but are merely shown as an embodiment.

However, for example, the data received through the connector 120a connected to the main body side is converted into a serial signal through the serial mode chip 140a, and then another serial mode chip connected through the flexible board unit 130. After being transmitted to 140b, it is necessary to satisfy the configuration outputted through the other connector 120b connected to the LCD unit side by converting the data of the serial type back to the parallel type of data.

As described above, the data transfer of the parallel interface can be changed to the data transfer of the serial interface.

First, since the connector of the lower pin number and the flexible board portion having the smaller layer structure are used, the size of the connector substrate can be reduced based on the same data transfer amount, and in the same sense, the size of the connector substrate can be reduced. In this case, more data can be transferred.

In addition, since the path of data transmission within the connector substrate is relatively short, the transmission speed can be maintained quickly by serial data transmission. For example, even in the case of serial data transmission, it may be noted that a problem may occur in the case of a longer transmission path in terms of transmission speed.

Next, since serial data transmission is taken as compared with conventional parallel data transmission, electromagnetic interference (EMI) also occurs in data transmission through a pattern of a cable or a substrate (also referred to as EMI). The effect can be reduced. This may be supported through the bars shown in FIGS. 5A and 5B.

5A and 5B are diagrams showing transmission quality in transmitting data in parallel and serial manners, respectively, whereby strong electromagnetic interference appears in the periphery when transmitted in parallel and relatively serial. In case of transmission, it is confirmed that weaker electromagnetic interference appears in comparison with parallel transmission. Of course, less noise is generated in the case of the series than in the case of the parallel.

6 is a block diagram illustrating a mobile communication device 300 according to another embodiment of the present invention, wherein the connector board 200 according to the present invention is used as a connector module.

According to FIG. 6, the mobile communication device 300 according to the present invention includes an LCD unit 240 having a main body 210 and an LCD module 254 on which a keypad 224 is attached, and a main body 210 and an LCD. It is configured to include a connector module 200 for connecting the unit 240.

The main body 210 includes a main board 220 on which a connector 222, a keypad 224, a multimedia processor chip 226, a modem 228, and the like are mounted. The LCD unit 240 includes a connector 252, And a sub-substrate 240 on which the LCD module 254 and the camera 256 are mounted. The connector 222 of the main board is connected to the connector 120a of the connector module 200 and the connector 252 of the sub-substrate. ) Is connected to the connector 120b of the connector module, the main board 210 and the sub-substrate 240 are interconnected.

The connector module is the connector board 200 of FIG. 3. Accordingly, data transmitted / received from the main board 210 and the sub-substrate 240 may be transmitted in a serial manner in the connector board 200 to transmit a large amount of multimedia data. .

In the present invention, the multimedia processor chip 226 does not have a function of serial / parallel switching of data separately, and may only transmit data in a serial manner through the serial mode chips 140a and 140b in the connector module 200. .

As such, the present invention is characterized by mounting a serial mode chip on a connector module. A plurality of chips (eg, a multimedia processor chip, a camera, an LCD module, a modem, a keypad, etc.) mounted on a main board and a sub-board are all used. Even when not configured to output serial data signals, the use of the connector board according to the present invention provides the advantage that the data transfer between the main board and the sub-substrate can be performed in a serial manner.

In addition, in view of the recent trend of increasing the number of pixels of the LCD liquid crystal of the LCD module, the number of pixels of the camera, and the increase in performance of transmitting and receiving data through a modem, the present invention is characterized in that a large amount of data is transmitted in a serial manner. Compared to the parallel connector module, it provides superior transmission speed and reduces electromagnetic interference.

In addition, even when a multimedia processor chip or the like does not additionally include a serial / parallel switching circuit, since serial data transmission can be realized, a relatively low-cost chip without a serial / parallel switching circuit can be used. It can bring about cost savings.

As such, in the present invention, the above advantages can be obtained by changing the data transmission scheme in the connector module serially, which can be supported by the implementation of a serial mode chip that is responsible for serial / parallel switching of data signals between the connectors.

In addition, since data is transmitted in a serial manner by using a serial mode chip, it is possible to easily cope with a multimedia dedicated mobile communication device requiring a large data transfer.

In addition, it is possible to reduce the size of the entire mobile communication device because it can simplify the layer structure (for example, the number of layers smaller than the six-layer structure) while transmitting a large amount of data at high speed. .

Claims (8)

A pair of rigid board parts on which connectors are mounted; A flexible substrate portion integrally formed with the rigid substrate portion between the pair of rigid substrate portions; And And a pair of serial mode chips mounted on the pair of hard substrates adjacent to the flexible substrate, respectively, for converting a parallel signal and a serial signal to each other. The pair of serial mode chip is a serial connector, characterized in that for converting the parallel-type multimedia signal connected to the connector into a serial signal to transmit a high speed in series between the pair of serial mode chip Board. delete delete The connector board of claim 1, wherein the connector is connected to a multimedia chip, and the multimedia chip outputs parallel signals. A main body including a main board including a keypad; An LCD unit electrically connected to the main board of the main body through a connector module, the LCD unit including a sub-board on which the LCD module is mounted; And And additional multimedia chips mounted on any one of the main board and the sub board, The connector module is a mobile communication device, characterized in that the serial connector board according to claim 1. 6. The mobile communication device of claim 5, wherein the additional multimedia chips comprise a modem, a camera and a multimedia processor chip. The mobile communication device of claim 6, wherein the multimedia processor chip is mounted on the main board, and the multimedia processor chip and the LCD module are electrically connected through the connector module. The mobile communication device of claim 7, wherein the camera is mounted on the sub-board, and the multimedia processor chip and the camera are electrically connected through the connector module.

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