CN217643329U - Signal transmission circuit and electronic device - Google Patents

Abstract

The disclosure relates to a signal transmission circuit and an electronic device. The signal transmission circuit of the present disclosure includes: the circuit comprises a main board circuit, an auxiliary board circuit and a connecting circuit for connecting the main board circuit and the auxiliary board circuit, wherein the main board circuit and the auxiliary board circuit transmit signals through the connecting circuit; and the impedance matching circuit is arranged in the main board circuit and/or the auxiliary board circuit and is used for offsetting the interference caused by the connecting circuit in the signal transmission process. The method and the device can enable the main board circuit and the accessory board circuit to be in impedance matching with each other when the signals are transmitted, and the signals are not distorted within an acceptable range in the transmission process of the connecting circuit, so that the problem of discontinuous signal transmission between the main board circuit and the accessory board circuit can be avoided, and the integrity of the signal transmission between the main board circuit and the accessory board circuit can be further guaranteed.

Description

Signal transmission circuit and electronic device

Technical Field

The present disclosure relates to the field of signal transmission circuits, and in particular, to a signal transmission circuit and an electronic device.

Background

With the development of communication technology, in order to meet the increasing use requirements of users, the forms of electronic devices are more and more diversified, and foldable or wearable electronic devices are appeared.

In such electronic devices, because signal transmission and foldable and wearable functions are simultaneously satisfied, a plurality of different circuit boards need to be used, and the materials, layers and the like of the circuit boards may be different, so that impedance among the circuit boards is discontinuous, and problems such as unstable signals or incomplete signals may occur.

SUMMERY OF THE UTILITY MODEL

To overcome the problems in the related art, the present disclosure provides a signal transmission circuit and an electronic device.

According to a first aspect of embodiments of the present disclosure, there is provided a signal transmission circuit including: the circuit comprises a main board circuit, an auxiliary board circuit and a connecting circuit for connecting the main board circuit and the auxiliary board circuit, wherein the main board circuit and the auxiliary board circuit transmit signals through the connecting circuit; and an impedance matching circuit is arranged in the main board circuit and/or the auxiliary board circuit and is used for offsetting the interference brought by the connecting circuit in the signal transmission process.

In one embodiment, in the motherboard circuit, the impedance matching circuit is disposed near a plug element in the motherboard circuit; and/or, in the board-attached circuit, the impedance matching circuit is arranged near the plug element in the board-attached circuit.

In one embodiment, the main board circuit is connected with the connection circuit through a first connector, and the impedance matching circuit is connected with the first connector in series; and/or the board circuit is connected with the connecting circuit through a second connector, and the impedance matching circuit is connected with the second connector in series.

In one embodiment, the control chip is connected in series with the impedance matching circuit.

In an embodiment, the impedance matching circuit is connected in series between the receiving end circuit and the conversion chip, and the conversion chip is connected in series with the second connector.

In an embodiment, the impedance matching circuit comprises at least one terminating resistor connected in series in the main board circuit and/or the accessory board circuit.

In one embodiment, the main board circuit comprises a plurality of main board sub-circuits electrically connected through the plug element; and/or the board-attached circuit comprises a plurality of board-attached sub-circuits which are electrically connected through the plug element.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device including the signal transmission circuit according to any one of the preceding embodiments.

In one embodiment, when the electronic device is a pair of smart glasses, the main board circuit is disposed on a first temple of the pair of smart glasses; the auxiliary board circuit is arranged on a second glasses leg of the intelligent glasses; the connecting circuit is arranged on a lens support of the intelligent glasses.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: this is disclosed through increased impedance matching circuit in signal transmission circuit, impedance matching circuit can offset the interference that is brought by connecting circuit among the signal transmission process, thereby can make impedance matching mutually when transmitting signal between mainboard circuit and the accessory plate circuit, such signal does not take place the distortion in acceptable within range in connecting circuit's transmission process, thereby can avoid the discontinuous problem of signal transmission between mainboard circuit and the accessory plate circuit, and then can ensure the integrality of signal transmission between mainboard circuit and the accessory plate circuit.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a block diagram illustrating a signal transmission circuit according to an example embodiment.

Fig. 2 is a block diagram illustrating a signal transmission circuit according to an example embodiment.

Fig. 3 is a circuit diagram illustrating an impedance matching circuit connected to a first connector according to an example embodiment.

Fig. 4 is a circuit diagram illustrating a control chip of a motherboard circuit according to an example embodiment.

Fig. 5 is a circuit diagram illustrating a second connector according to an exemplary embodiment.

Fig. 6 is a circuit diagram illustrating a conversion chip according to an example embodiment.

Fig. 7 is a circuit diagram illustrating a receiving-end circuit of a board-attached circuit according to an exemplary embodiment.

Fig. 8 is a schematic diagram illustrating a configuration of a signal transmission circuit assembly according to an example embodiment.

Fig. 9 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure as detailed in the claims.

With the development of communication technology, in order to meet the increasing use requirements of users, the forms of electronic devices are more and more diversified, and foldable or wearable electronic devices are appeared.

In such electronic devices, because signal transmission and foldable and wearable functions are simultaneously satisfied, a plurality of different circuit boards need to be used, and the material, the layer number and the like of the circuit boards may be different, so that impedance between the circuit boards is discontinuous, and problems such as unstable signals or incomplete signals may occur.

To overcome the problems in the related art, the present disclosure provides a signal transmission circuit, a signal transmission circuit and an electronic device.

The present disclosure provides a signal transmission circuit including: the circuit comprises a main board circuit, an auxiliary board circuit and a connecting circuit for connecting the main board circuit and the auxiliary board circuit, wherein the main board circuit and the auxiliary board circuit transmit signals through the connecting circuit; and the impedance matching circuit is arranged in the main board circuit and/or the auxiliary board circuit and is used for offsetting the interference caused by the connecting circuit in the signal transmission process.

This is disclosed through increased impedance matching circuit in signal transmission circuit, impedance matching circuit can offset the interference that is brought by connecting circuit among the signal transmission process, thereby can make impedance matching mutually when transmitting signal between mainboard circuit and the accessory plate circuit, such signal does not take place the distortion in acceptable within range in connecting circuit's transmission process, thereby can avoid the discontinuous problem of signal transmission between mainboard circuit and the accessory plate circuit, and then can ensure the integrality of signal transmission between mainboard circuit and the accessory plate circuit.

Fig. 1 is a block diagram illustrating a signal transmission circuit according to an example embodiment. Fig. 2 is a block diagram illustrating a signal transmission circuit according to an example embodiment. Fig. 3 is a circuit diagram illustrating an impedance matching circuit connected to a first connector according to an example embodiment. Fig. 4 is a circuit diagram illustrating a control chip of a motherboard circuit according to an example embodiment. Fig. 5 is a circuit diagram illustrating a second connector according to an exemplary embodiment. Fig. 6 is a circuit diagram illustrating a conversion chip according to an example embodiment. Fig. 7 is a circuit diagram illustrating a receiving-end circuit of a board-attached circuit according to an exemplary embodiment.

In the present disclosure, as shown in fig. 1 to 7, the signal transmission circuit may include a main board circuit 100, an accessory board circuit 200, and a connection circuit 300. A control module, such as a control chip 110, may be included in the motherboard circuit 100. The main board circuit 100 may send a control signal to the attached board circuit 200. Meanwhile, the main board circuit 100 may also receive signals including various information transmitted by the sub-board circuit 200, and generate corresponding control signals based on the signals. In the present disclosure, the control chip 110 may be a quad-core a53 chip.

In the present disclosure, the connection circuit 300 may be electrically connected to an output terminal of the main board circuit 100 and to an input terminal of the sub-board circuit 200. In this case, the signal emitted from the main board circuit 100 is transmitted from the input terminal of the board-attached circuit 200 to the board-attached circuit 200 via the connection circuit 300 by the output terminal of the main board circuit 100.

However, the disclosure is not limited thereto, and in another embodiment, the connection circuit 300 is electrically connected to the input terminal of the motherboard circuit 100 at the same time of being electrically connected to the output terminal of the motherboard circuit 100. And the connection circuit 300 is electrically connected to both the output terminal and the input terminal of the attached board circuit 200. In this case, the main board circuit 100 may send a control signal to the attached board circuit 200. Meanwhile, the main board circuit 100 may also receive signals including various information transmitted by the attached board circuit 200, and generate corresponding control signals based on the signals.

In one embodiment, one connection circuit may electrically connect the output terminal of the motherboard circuit 100 and the input terminal of the daughter board circuit 200, and the other connection circuit may electrically connect the input terminal of the motherboard circuit 100 and the output terminal of the daughter board circuit 200. The present disclosure is not particularly limited as long as the purpose that the main board circuit 100 can perform information transmission through the connection circuit 300 and the auxiliary board circuit 200 can be achieved.

In the exemplary embodiment of the present disclosure, the impedance matching circuit is configured to match the impedance between the main board circuit 100 and the connection circuit 300, so that the problems of unstable impedance between the main board circuit 100 and the connection circuit 300 and the like can be eliminated, and thus the problem of discontinuous signal transmission between the main board circuit 100 and the accessory board circuit 200 can be avoided. For example, the impedance between the main board circuit 100 and the connection circuit 300 can be controlled to be around 50 ohms by an impedance matching circuit.

In the present disclosure, the impedance matching circuit may include a terminating resistor. For example, in an embodiment, the impedance matching circuit may include a first terminating resistor 102, and the first terminating resistor 102 may be disposed in the motherboard circuit 100, for example, may be connected in series in the motherboard circuit 100. Such an arrangement can be applied to a case where the connection circuit 300 is electrically connected to the output terminal of the main board circuit 100 and is electrically connected to the input terminal of the sub-board circuit 200.

In the present disclosure, as shown in fig. 1, the main board circuit 100 may include a control chip 110 and a first termination resistor 102, and the first termination resistor 102 may be connected in series with the control chip 110. In the present disclosure, as shown in fig. 1, the signal transmission circuit may further include a connector, and the connector may be an electronic connector.

The connector of the present disclosure may be an electrical connector that may bridge two conductors in a circuit such that current or signals may flow from one conductor to the conductor of the other conductor. An electrical connector is a electromechanical system that provides a separable interface for connecting two sub-electronic systems, simply, the components used to complete the electrical connection between the electronic circuits or machines are called connectors, i.e., the bridge between the two. For example, the connector model of the present disclosure may be WP27D-S030VA3, but the present disclosure is not limited thereto, and in some embodiments, the connector model may be other.

In the present disclosure, the main board circuit 100 may be electrically connected with the connection circuit 300 through the first connector 41, and in this case, the first termination resistor 102 may be connected in series between the first connector 41 and the control chip 110. In the present disclosure, the first connector 41 may be model number WP27D-S030VA3.

In the present disclosure, as shown in fig. 3, the first portion 101 may be a circuit diagram of the first electrical connector.

In the present disclosure, as shown in fig. 2, the main board circuit 100 may include a conversion chip 301, a receiving end circuit 302, and a second termination resistor 103, and the second termination resistor 103 may be connected in series with the conversion chip 301. In the present disclosure, one of the functions of the converting chip 301 is to convert the level, for example, in one embodiment, the converting chip 301 may convert the level from 1.8v to 2.5v.

In the present disclosure, the model of the conversion chip 301 may be AW39204. The disclosure is not limited thereto, and in some embodiments, the model of the conversion chip 301 may be other.

In the present disclosure, the board circuit 200 may be electrically connected with the connection circuit 300 through the second connector 42, and in this case, the second termination resistance 103 may be connected in series between the conversion chip 301 and the receiving-end circuit 302. In the present disclosure, the conversion chip 301 may be connected with the second connector 42. In the present disclosure, the second connector 42 may be model number WP27D-S030VA3.

However, the present disclosure is not limited thereto, and in some embodiments, an impedance matching circuit may be provided in the board-attached circuit 200, and such an arrangement matches the impedance of the board-attached circuit 200 after a signal transmitted from the main board circuit 100 reaches the board-attached circuit 200 after passing through the connection circuit 300.

In the present disclosure, the resistance of the first terminating resistor 102 may be between 0 and 50 ohms. If the signal impedance of the connection circuit 300 and the main board circuit 100 can be controlled to 50 ohms, the first termination resistor 102 resistance can be selected to be 0 ohms. In some embodiments, the resistance of the first termination resistance 102 may be 22 or 33 ohms. It should be noted that the disclosure is not limited specifically, and the resistance value needs to be determined according to the actual measurement effect of the oscilloscope.

In an exemplary embodiment of the present disclosure, the motherboard circuit 100 includes a plurality of motherboard subcircuits. For example, when the information transmission circuit of the present disclosure is applied to a foldable or wearable electronic device, the main board circuit 100 may be disposed on a main board, the main board may include a plurality of circuit boards, or the main board may be composed of a plurality of circuit boards. In this case, a circuit may be provided in each circuit board of the motherboard, and these circuits provided in each layer of the circuit board of the motherboard may be referred to as motherboard subcircuits.

In such an embodiment, the main board circuit may further comprise a plug element, and the plurality of main board sub-circuits may be electrically connected by the plug element. The first terminating resistor 102 may be disposed adjacent to the plug element. The plurality of main board sub-circuits are connected by the plug element, and usually, the impedance at the connection position of the plug element is largely changed, and the impedance matching effect can be maximally exerted by providing the first terminating resistor 102 in the vicinity of the plug element.

In the exemplary embodiment of the present disclosure, as shown in fig. 2, the second terminating resistor 103 may also be included in the attached board circuit 200, for example, the second terminating resistor 103 may be connected in series in the attached board circuit 200. In this case, the connection circuit 300 may be connected to the output terminal of the board-attached circuit 200, and the connection circuit 300 is connected to the input terminal of the main board circuit 100. With this arrangement, it is possible to match the impedance of the connection circuit 300 with the signal emitted from the on-board circuit 200, and in this case, the signal transmitted from the on-board circuit 200 to the main board circuit 100 via the connection circuit 300 is not distorted within a receivable range.

In the present disclosure, the resistance of the second terminating resistor 130 may be between 0 and 50 ohms. If the signal impedance of both the connection circuit 300 and the board circuit 200 can be controlled to 50 ohms, the resistance of the second termination resistor 103 can be selected to be 0 ohms. In some embodiments, the resistance of the second termination resistor may be 22 or 33 ohms. It should be noted that the disclosure is not limited specifically, and the resistance value needs to be determined according to the actual measurement effect of the oscilloscope.

In the exemplary embodiment of the present disclosure, the accessory board circuit 200 may include a plurality of accessory board sub-circuits, for example, when the information transmission circuit of the present disclosure is applied to a foldable or wearable electronic device, the accessory board circuit 200 may be disposed on the accessory board, the accessory board may include a plurality of circuit boards, or the accessory board may be constituted by a plurality of circuit boards. In this case, a circuit may be provided in each circuit board of the attached board, and these circuits provided in each layer of the circuit board of the attached board may be referred to as an attached board sub-circuit.

In such embodiments, the daughterboard circuit 200 may further comprise a plug element by which a plurality of daughterboards may be electrically connected. The second terminating resistor may be disposed adjacent the plug element. The plurality of sub-circuits are connected by the plug element, and usually, the impedance at the connection of the plug element varies greatly, and the second terminating resistor is disposed in the vicinity of the plug element, so that the impedance matching effect can be maximized.

Based on the same concept, the present disclosure also provides a signal transmission circuit assembly comprising the signal transmission circuit as in any one of the preceding embodiments.

Fig. 8 is a schematic structural diagram illustrating a signal transmission circuit assembly according to an exemplary embodiment, and as shown in fig. 8, in an exemplary embodiment of the present disclosure, the signal transmission circuit assembly may include: a main board 10, an accessory board 20, and a connecting board 30.

In the present disclosure, the main board circuit 100 may be provided to the main board 10. The daughter board circuit 200 may be provided to the daughter board 20. The connection circuit 300 may be provided to the connection board 30.

In the present disclosure, the main board 10 may include a plurality of circuit boards arranged in a stacked manner, or the main board may be constituted by a plurality of circuit boards. For example, the motherboard 10 may include an 8-layer circuit board. In this case, a circuit may be provided in each circuit board of the main board, and these circuits provided in each layer of the circuit board of the main board may be referred to as main board sub-circuits.

In such an embodiment, the motherboard circuitry may further include a plug element by which the plurality of motherboard subcircuits may be electrically connected. The first terminating resistor 102 may be disposed adjacent to the plug element. The plurality of main board sub-circuits are connected by the plug element, and usually, the impedance at the connection portion of the plug element varies greatly, and the impedance matching effect can be maximized by providing the first terminating resistor 102 near the plug element.

In one embodiment, the motherboard 10 may include a High Density Interconnect (HDI) board. For example, the motherboard 10 may comprise an 8-layer HDI board.

In the present disclosure, the attachment plate 20 may include a plurality of circuit boards arranged in a stacked manner, or the attachment plate 20 may be constituted by a plurality of circuit boards. For example, the daughter board 20 may include a 4-6 layer circuit board. In this case, a circuit may be provided in each circuit board of the daughter board 20, and these circuits provided in each layer of the circuit board of the daughter board 20 may be referred to as daughter board sub-circuits.

In such embodiments, the satellite circuit 200 may further include a plug element by which the plurality of satellite sub-circuits may be electrically connected. The second terminating resistor may be disposed adjacent the plug element. The plurality of board sub-circuits are connected by the plug element, and usually, the impedance at the connection of the plug element varies greatly, and the impedance matching effect can be maximized by disposing the second terminating resistor 103 in the vicinity of the plug element.

In an exemplary embodiment of the present disclosure, the attached Board 20 may include a Printed Circuit Board (PCB), for example, in an embodiment, the attached Board 20 may include 4 to 6 layers of PCBs.

In the present disclosure, the connection board 30 may include a Flexible Printed Circuit (FPC).

In the present disclosure, as shown in fig. 8, the signal transmission circuit assembly may further include a connector, which may be an electrical connector. The main board 10 may be electrically connected to the connection board 30 by a first connector 41, and the attached board 20 may be electrically connected to the connection board 30 by a second connector 42.

Based on the same concept, the present disclosure also provides an electronic device including the signal transmission circuit assembly as any one of the preceding embodiments.

Fig. 9 is a schematic structural diagram illustrating an electronic device according to an exemplary embodiment, and as shown in fig. 9, in the exemplary embodiment of the present disclosure, the electronic device may be a pair of smart glasses 1. The present disclosure is not so limited and in some embodiments the electronic device may also be a smart watch, smart goggles, a foldable electronic device, or the like.

In the present disclosure exemplary embodiment, the smart glasses 1 may include a first temple 11 and a second temple 21. The main plate 10 may be provided to the first temple 11, and the attachment plate 20 may be provided to the second temple 21. It should be noted that the present disclosure does not limit which temple the main board and the accessory board are respectively disposed on, and in other possible embodiments, the disposition positions of the main board and the accessory board can be interchanged or disposed on other components.

In the exemplary embodiment of the present disclosure, the smart glasses 1 may further include a lens holder 31, the lens holder 31 connects the first temple 11 and the second temple 21, and the connection circuit 300 may be provided to the lens holder 31.

This is disclosed through increased impedance matching circuit in signal transmission circuit, and impedance matching circuit can make mainboard circuit and attach the impedance matching between the board circuit to can avoid the problem of the signal transmission discontinuity between mainboard circuit and the attached board circuit, and then can ensure mainboard circuit and attach the integrality of signal transmission between the board circuit.

In the hardware design of smart glasses, there are many high-speed devices. These high speed devices are powerful, small in size, and high in speed. This results in the changing edge of the pin signal also becoming steeper. And a plurality of connectors are matched with each other to transmit signals, which particularly makes the hardware signal integrity problem of the glasses prominent.

In the design of smart glasses, the main factor affecting the integrity of the signal is the problem of impedance discontinuity, i.e. the problem of impedance matching. One end is a signal sending end, the other end is a micro-signal receiving end, and the two ends are connected through a signal transmission line. On the transmission link, if the impedances of the three are not matched, signal reflection is generated, and the reflected signal and the incident signal are superposed with each other, so that the waveform of the signal is distorted. If the degree of distortion exceeds the tolerance of the receiving end, the signal will not be recognized.

Due to the space limitation of the intelligent glasses, hardware circuits cannot be placed on one side, and part of the circuits need to be placed on the other side of the glasses legs. This inevitably requires a separate design of the circuit and a separate board manufacturing. The main control chip has complicated circuit on one side and more stacks, and at least 8 layers of HDI boards are needed. And the control circuit attached to the other side is relatively simple, and only 4-6 layers of common PCB boards are needed. The two PCB boards are different in stacking arrangement, and impedance is difficult to guarantee to be consistent in the board manufacturing process.

In addition, the two boards are respectively arranged at two sides of the glasses, and the two boards need a medium board to complete the transmission of signals. Smart glasses are wearable devices and have to have the property of being foldable by general glasses. Therefore, a hard board cannot be used as a medium, and therefore, a soft FPC board must be used. The arrangement of the plates in the stack is different from the first two. While the board is folded and unfolded, the degree of compression is different for the signal lines at the corners, which introduces a second point of impedance change.

The connection of the three boards must be made by board connectors, the impedance of the connector and the three boards is not exactly the same, which introduces a third point of impedance variation.

The primary method of eliminating impedance discontinuities is termination resistance. Theoretically, the reflection of the signal will be reduced whether the impedance discontinuity is eliminated at either end of the transmission path. However, of these three elements of the variation of smart glasses, the least controllable is the impedance of the FPC flex, as the flex is limited in size in construction. Meanwhile, the flexibility is required, so that the lamination cannot be too thick, and a lot of signal lines and power lines are stacked in a limited manner, which brings great problems to the drawing of the FPC board. The inevitable part of the wiring has no reference plane, the impedance can be changed, and other signals are mutually transmitted and interfered. While the other two plates are not so constrained. If impedance matching is not appropriate at the strap end. Because the signal is sent from the main board and is distorted after passing through the connector and the FPC, the FPC wire is long, the waveform distortion is more serious after the transmission and the interference of the long flexible wire, the waveform is transmitted to the accessory board through the connector, and the impedance at the moment can only ensure that the distorted waveform is not continuously deteriorated. But the distortion model which cannot be identified is still received by the receiving end. If not, the transmitting end is already impedance matched with the FPC, the signal passes through the FPC with little or no distortion, and the signal reaches the attached board, although the distortion is also small, the distortion is within the tolerance range of the receiving end. Does not affect reception and so for the case of multi-board connections like smart glasses, termination at the source end is required.

The termination method is divided into a series termination and a parallel termination, and since the signal transmission of the glasses is a point-to-point method, the series termination method must be selected. The resistance value of the series is a compromise according to the actual measured conditions and the existing resistance value. If the signal impedances of all three boards can be controlled at 50 ohms, the series resistance can be chosen to be 0 ohms. If the signal lines of the FPC have no reference plane due to various constraints, impedance discontinuity is generated. Then a resistor of fixed value is required in series. Generally, 22 or 33 ohms is selected. If the waveform with the minimum distortion is required to be obtained, the resistance value is required to be determined according to the actual measurement effect of the oscilloscope.

It is to be understood that the signal transmission circuit, the signal transmission circuit component and the electronic device provided by the embodiments of the present disclosure include hardware structures and/or software modules for performing the respective functions in order to realize the functions. The disclosed embodiments can be implemented in hardware or a combination of hardware and computer software, in combination with the exemplary elements and algorithm steps disclosed in the disclosed embodiments. Whether a function is performed in hardware or computer software drives hardware depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

It is understood that "a plurality" in this disclosure means two or more, and other words are analogous. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "first," "second," and the like are used to describe various information and that such information should not be limited by these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the terms "first," "second," and the like are fully interchangeable. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "central," "longitudinal," "lateral," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present embodiment and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation.

It will be further understood that, unless otherwise specified, "connected" includes direct connections between the two without the presence of other elements, as well as indirect connections between the two with the presence of other elements.

It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is to be limited only by the scope of the appended claims.

Claims (9)

1. A signal transmission circuit is characterized by comprising a main board circuit, an auxiliary board circuit and a connecting circuit for connecting the main board circuit and the auxiliary board circuit, wherein the main board circuit and the auxiliary board circuit transmit signals through the connecting circuit;

and an impedance matching circuit is arranged in the main board circuit and/or the auxiliary board circuit and is used for offsetting the interference brought by the connecting circuit in the signal transmission process.

2. The signal transmission circuit of claim 1,

in the motherboard circuit, the impedance matching circuit is disposed near a plug element in the motherboard circuit;

and/or, in the board-attached circuit, the impedance matching circuit is arranged near the plug element in the board-attached circuit.

3. The signal transmission circuit of claim 1,

the main board circuit is connected with the connecting circuit through a first connector, and the impedance matching circuit is connected with the first connector in series; and/or

The attached board circuit is connected with the connecting circuit through a second connector, and the impedance matching circuit is connected with the second connector in series.

4. The signal transmission circuit according to claim 3, wherein the main board circuit comprises:

and the control chip is connected with the impedance matching circuit in series.

5. The signal transmission circuit of claim 3, wherein the daughter board circuit comprises:

the impedance matching circuit is connected in series between the receiving end circuit and the conversion chip, and the conversion chip is connected in series with the second connector.

6. The signal transmission circuit according to any one of claims 1 to 5, wherein the impedance matching circuit comprises at least one terminating resistor connected in series in the main board circuit and/or the additional board circuit.

7. The signal transmission circuit of claim 2,

the main board circuit comprises a plurality of main board sub-circuits which are electrically connected through the plug-in element; and/or

The auxiliary board circuit comprises a plurality of auxiliary board sub-circuits which are electrically connected through the plug-in element.

8. An electronic device, characterized by comprising the signal transmission circuit according to any one of claims 1 to 7.

9. The electronic device of claim 8,

when the electronic device is intelligent glasses, the main board circuit is arranged on a first glasses leg of the intelligent glasses;

the auxiliary board circuit is arranged on a second glasses leg of the intelligent glasses;

the connecting circuit is arranged on the lens support of the intelligent glasses.

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