KR100715007B1 - Method for manufacturing pcb for high power of car - Google Patents

Abstract

In the method of manufacturing a printed circuit board for a high power output of an automobile according to the present invention, a first metal thin film is provided on both surfaces of a central layer, an etching resist layer is formed on a surface of the first metal thin film, and the first metal thin film. Providing a base material having a release film inserted therebetween; Selectively removing the etching resist layer of the base material to form a plating groove to expose the first metal thin film; Forming a connection protrusion by plating the plating groove; Removing the etching resist layer and forming a first insulating layer on the first metal thin film to expose an upper portion of the connecting protrusion; Planarizing an upper portion of the connecting protrusion and the first insulating layer; Forming a second metal thin film on the connection protrusion and the first insulating layer; Separating the first and second printed circuit boards based on the release film; Forming a pattern on the first metal film and the second metal film; And forming a second insulating layer on the window formed as the pattern is formed on the metal thin film.

The height of the first metal thin film and the second metal thin film is preferably 100 ~ 300㎛.

Automotive, high power, printed circuit boards, connecting protrusions

Description

Manufacturing method for printed circuit board for high power of automobile {Method for manufacturing PCB for high power of car}

1 is a manufacturing process diagram for sequentially explaining a manufacturing method of a printed circuit board according to an embodiment of the prior art.

2 and 3 are a manufacturing process diagram and a flow chart showing a manufacturing method of a printed circuit board for a high output of the vehicle according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

20: base material 21: center layer

22: release film 23: the first metal thin film

24: dry film 25: plating groove

26: plating layer 27: connecting projection

28: first insulating layer 29: second metal thin film

30: cutting line 32: circuit pattern

33: window 34: second insulating layer

40,40 ': multilayer printed circuit board

The present invention relates to a printed circuit board for high power output of an automobile, and more particularly, to a method for manufacturing a printed circuit board for generating a high output power in cold weather, such as mounted on a special vehicle.

1 shows a method of manufacturing a multilayer printed circuit board according to the prior art disclosed in Japanese Patent Laid-Open No. 2001-111189. As shown in the drawing, the base material 10 is formed by providing an etching resist layer 13 between the first and second copper layers 11 and 12. The etching resist layer 13 is made of nickel. The first copper layer 11 formed on one surface of the etching resist layer 13 is for forming a connection protrusion 16 for electrically connecting circuit patterns formed on both sides of the multilayer printed circuit board. Thick The second copper layer 12 is a portion in which a circuit pattern is formed and is relatively thin in thickness (see FIG. 2A).

The resist film 14 is formed on both surfaces of the base material 10 as described above. A window 15 from which the etching resist is removed is formed on the first copper layer 11 of the resist film 14. Here, the first copper layer 11 of the portion where the window 15 is formed is removed, and the first copper layer 11 of the remaining portion remains to form the connecting protrusion 16. That is, when the etching process is performed, etching liquid penetrates into the window 15 to remove copper, leaving only the first copper layer 11 in the portion where the resist film 14 is covered to form the cylindrical connecting protrusion 16. do. At this time, since the connecting protrusion 16 is etched sequentially, the base portion is formed to have a larger diameter relative to the distal end portion, and thus the cone is precisely conical. On the other hand, the second copper layer 12 is protected by the upper and lower etching resist layer 13 and the resist film 14 so that the etching solution does not penetrate the second copper layer 12.

After the etching process, the resist film 14 is removed. The etching resist layer 13 is also sequentially removed. This state is shown in FIG. 2D.

Next, the prepreg film 17 is placed on the cylindrical connecting projection 16 and pressed by a roller to compress the prepreg film 17 between the connecting projections 16 as shown in FIG. 2E. Only the tip of the connecting projection 16 is projected to the surface of the prepreg film 17. Then, the connecting protrusions 16 protruding from the surface of the prepreg film 17 are polished and removed, and the third copper layer 18 on which the circuit pattern is to be formed is thermocompressed. This state is shown in FIG. 2F.

In the above state, the second and third copper layers 12 and 18 are electrically connected to each other by the connecting protrusions 16.

1G, a circuit pattern 19 is formed on the copper layers 12 and 18 in a conventional manner.

However, in the printed circuit board manufactured by the method of manufacturing a multilayer printed circuit board according to the related art as described above, the height of the copper layers 12 and 18 is approximately 10 to 20 μm, which is for general vehicles, and used in cold weather. It is not suitable for special vehicles. That is, when driving in a bad road conditions such as cold weather, high output power is required. For this purpose, the height of the copper layers 12 and 18 should be about 100 to 300 μm.

The present invention has been made to solve the above problems, an object of the present invention is to provide a method for manufacturing a printed circuit board for producing a high output power in a special vehicle, such as cold weather.

In addition, the present invention is to set the height of the first and second metal thin film patterned in the printed circuit board to 100 ~ 300㎛.

In addition, the present invention is to protect the metal thin film from external shock by forming an insulating layer on the window formed by the pattern is formed on the first and second metal thin films.

In order to achieve the above object, a method of manufacturing a printed circuit board for high power output of an automobile according to the present invention includes a first metal thin film provided on both surfaces of a central layer, and an etching resist layer formed on a surface of the first metal thin film. Providing a base material having a release film inserted between the first metal thin film and the center layer; Selectively removing the etching resist layer of the base material to form a plating groove to expose the first metal thin film; Forming a connection protrusion by plating the plating groove; Removing the etching resist layer and forming a first insulating layer on the first metal thin film to expose an upper portion of the connecting protrusion; Planarizing an upper portion of the connecting protrusion and the first insulating layer; Forming a second metal thin film on the connection protrusion and the first insulating layer; Separating the first and second printed circuit boards based on the release film; Forming a pattern on the first metal film and the second metal film; And forming a second insulating layer on the window formed as the pattern is formed on the metal thin film.

The height of the first metal thin film and the second metal thin film is preferably 100 ~ 300㎛.

The present invention may further include cutting the edges of the insulating layer including the base material after planarizing an upper portion of the connecting protrusion and the first insulating layer.

The method may further include removing and cleaning the foreign matter generated by cutting the edges of the insulating layer including the base material and the planarization of the connection protrusion and the first insulating layer.

The planarization of the upper part of the connecting protrusion and the upper part of the first insulating layer is preferably performed by a CMP polishing process.

It is preferable that the material of a said 2nd insulating layer is ultraviolet-response ink or resin.

Hereinafter, a method of manufacturing a multilayer printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 are a manufacturing process diagram and a flow chart showing a manufacturing method of a multilayer printed circuit board according to an embodiment of the present invention.

First, as shown in Figure 2a, in order to manufacture a multilayer printed circuit board according to the present invention is provided with a base material (20) (S101).

The base material 20 includes a center layer 21, a release film 22 formed on both surfaces of the center layer 21, a first metal thin film 23 formed on a surface of the release film 22, and the first layer. And a dry film 24 which is an etching resist layer formed on the metal thin film 23 surface.

The base material 20 has a symmetrical structure with respect to the center layer 12.

As the center layer 21, FR-4, etc., in which several layers of glass fibers impregnated with epoxy resin are stacked, may be used.

The release film is formed between the center layer 21 and the first metal thin film 23 to be separated into first and second printed circuit boards.

The material of the first metal thin film 23 may be any metal as long as it has good electrical conductivity, but copper (Cu) may be preferably used.

The thickness of the dry film 24 is preferably to have a relatively larger value than the height of the connecting projection 27 to be described below.

Here, the edges of the center layer 21 and the first metal thin film 23 protrude more than the edges of the release film 22 so that the center layer 21 and the first metal thin film 23 are directly at their edges. Adhesion is not performed at the portion where the release film 22 is provided.

As described above, after configuring the base material 20, in the present invention, as shown in Figure 2b, by selectively removing the dry film 24 through a conventional exposure / development process (S102) plating groove 25 (S103)

The plating groove 25 is formed in the dry film 24 so that the surface of the first metal thin film 23 is exposed.

Thereafter, as shown in FIG. 2C, the plating layer 26 is formed through the plating process on the first metal thin film 23 exposed through the plating groove 25.

That is, the plating layer 26 is formed on the first metal thin film 23, which is the bottom surface of the plating groove 25, and fills the inside of the plating groove 25. The plating layer 26 is then a connecting projection 27. (S104)

After the plating layer 26 is formed in the plating groove 25, the dry film 24 is removed as shown in FIG. 2D. (S105) Then, on the first metal thin film 23. The plating layer 26 formed on the surface is exposed, which is referred to as a connecting protrusion 27.

As described above, after the connecting protrusions are formed, the first insulating layer 28 is formed on the first metal thin film 23 on which the connecting protrusions 27 are formed, as shown in FIG. 2E.

Prepreg is used as the raw material of the first insulating layer 28. When the prepreg is a liquid, it is formed by screen printing. In the case of using a sheet-shaped prepreg film to form the first insulating layer 28, the protrusion 27 is exposed to the surface of the insulating layer 28 by pressing with a roller.

After the first insulating layer 28 is formed, as illustrated in FIG. 2F, the upper portion of the first insulating layer and the connection protrusion are polished and planarized (S107).

The polishing operation is preferably carried out through a chemical mechanical polishing (CMP) process.

Thereafter, the edge of the insulating layer 28 including the base material 20 is cut. (S108) The cutting process may be performed later, but in the present invention, it is preferable to carry out after the planarization process. In addition, the cutting takes place the edge of the product produced by the previous step.

As described above, when the connecting projection and the upper planarization of the first insulating layer and the edge cutting of the insulating layer including the base material are performed, foreign substances such as dust are generated accordingly.

Accordingly, in the present invention, the foreign matter is removed and washed. (S109)

This makes it easier to place the second metal film to be carried out in a later step on the insulating layer and the connecting protrusion, and minimizes the separation of the second metal film from the connecting protrusion in the future.

Then, in the present invention, as shown in Figure 2g, the second metal thin film 29 is formed on the connecting projection 27 and the first insulating layer 28 on both sides of the base material 20. S110)

The second metal thin film 29 is pressed using a hot press method.

Then, the first metal thin film 23 and the second metal thin film 29 are electrically connected to each other by the connecting protrusion 27.

As described above, after the second metal thin film 29 is formed on the connection protrusions 27 and the first insulating layer 28, the first and second printed circuits are based on the release film as shown in FIG. 2H. The substrate 40 is separated into 40 and 40 '. (S111)

Thereafter, a pattern is formed on the first metal thin film 23 and the second metal thin film 29 (S112). As described above, the window 33 is formed as the pattern is formed on the metal thin film.

As described above, after the pattern is formed on the first metal thin film 23 and the second metal thin film 29, a second insulating layer 34 is formed on the window 33 as shown in 2i. (S113)

The height h of the first metal thin film 23 and the second metal thin film 29 is preferably 100 to 300 μm.

It is preferable that the material of the said 2nd insulating layer 34 is ultraviolet-response ink or resin.

As described above, with reference to the preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

Therefore, the present invention, as shown in Figures 2 and 3, by setting the height (h) of the first metal film and the second metal thin film to 100 ~ 300㎛ can produce a high output power in special vehicles such as cold weather have.

In addition, the present invention can protect the metal thin film from external impact by forming an insulating layer in the patterned position (window) of the 1, 2 metal thin film.

Claims (5)

In the manufacturing method of a printed circuit board for high power of the automobile, Providing a base material having a first metal thin film on both sides of the central layer, an etching resist layer formed on a surface of the first metal thin film, and a release film inserted between the first metal thin film and the central layer; ; Selectively removing the etching resist layer of the base material to form a plating groove to expose the first metal thin film; Forming a connection protrusion by plating the plating groove; Removing the etching resist layer and forming a first insulating layer on the first metal thin film to expose an upper portion of the connecting protrusion; Planarizing an upper portion of the connecting protrusion and the first insulating layer; Forming a second metal thin film on the connection protrusion and the first insulating layer; Separating the first and second printed circuit boards based on the release film; Forming a pattern on the first metal film and the second metal film; And And forming a second insulating layer on the window formed by the pattern formed on the metal thin film. The method of claim 1, wherein the height of the first metal thin film and the second metal thin film is 100 to 300 µm. The method according to claim 1 or 2, And planarizing an upper portion of the connecting protrusion and the first insulating layer, and then cutting an edge of the insulating layer including the base material. The method of claim 3, wherein The planarization of the upper portion of the connecting protrusion and the first insulating layer and the edge of the insulating layer including the base material to remove and clean the foreign matter generated by cutting the printed circuit board further comprises the step of Manufacturing method. The method according to claim 1 or 2, The planarization of the upper portion of the connecting protrusion and the upper portion of the first insulating layer is a manufacturing method of a printed circuit board for high power of the automobile, characterized in that carried out by a CMP polishing process.

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