KR100709265B1 - Apparatus and method for sputtering organic matter - Google Patents

Abstract

Provided are an organic material deposition apparatus and a deposition method capable of extending the life of a film thickness sensor. In the deposition method according to the embodiment of the present invention, a shutter is installed at an adjacent lower portion of the film thickness sensor, the shutter is positioned at the deposition position during the deposition time, and the shutter is positioned at the non-deposition position during the non-deposition time. This prevents the deposition material from being deposited on the film thickness sensor during the non-deposition time.

Oid, organic, luminous, deposition, mesh, shutter

Description

Organic material deposition apparatus and deposition method {APPARATUS AND METHOD FOR SPUTTERING ORGANIC MATTER}

1 is a schematic view showing the configuration of an organic material deposition apparatus according to an embodiment of the present invention.

FIG. 2 is a process chart illustrating a deposition method using the organic material deposition apparatus of FIG. 1.

The present invention relates to an organic material deposition apparatus and a deposition method, and more particularly to an organic material deposition apparatus and deposition method that can extend the life of the film thickness sensor.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include Liquid Crystal Display (LCD), Field Emission Display (FED), Plasma Display Panel (PDP) and Organic Light Emitting Display (PDP). Etc.

Among these, the organic light emitting diode display uses a phenomenon in which electrons and holes injected through a cathode and an anode are recombined to form an exciton in an organic thin film, and light of a specific wavelength is generated by energy from the formed excitons. It is a light emitting display device. Such an organic light emitting diode display has advantages of being able to be driven at a low voltage, being lightweight, thin, having a wide viewing angle, and having a fast response speed.

The organic light emitting diode of the organic light emitting diode display is also called an organic light emitting diode (OLED) due to its diode characteristic and includes an anode electrode, an organic layer, and a cathode electrode which are stacked on a substrate.

The organic layer includes an organic emission layer (EML), in which holes and electrons recombine to form excitons and light is generated.

In order to increase the light emission efficiency, holes and electrons must be more smoothly transported to the organic light emitting layer. To this end, an Electron Transport Layer (ETL) may be disposed between the cathode electrode and the organic light emitting layer, and a Hole Transport Layer (HTL) may be disposed between the anode electrode and the organic light emitting layer, and the anode electrode and A hole injection layer (HIL) may be disposed between the hole transport layer, and an electron injection layer (EIL) may be disposed between the cathode electrode and the electron transport layer.

Typical methods for forming a thin film on a substrate include physical vapor deposition (PVD), such as vacuum evaporation, ion plating, and sputtering, and chemical vapor deposition by gas reaction. Law).

Among these, the vacuum vapor deposition method is mainly used for formation of the thin film layer containing the organic film of an organic light emitting element.

In a general deposition apparatus for depositing an organic film using a vacuum deposition method, a substrate is mounted on an upper portion of the deposition chamber, a crucible containing a deposition material is disposed below the deposition chamber, and a heat source for evaporating the deposition material outside the crucible. As a heating wire is arranged.

Here, the crucible is installed in a state of being offset by a predetermined distance from the center of the substrate in consideration of the deposition property of the evaporated material, and the substrate is rotated at a constant rotational speed.

In addition, a mask in which a predetermined pattern may be formed may be disposed below the substrate.

On the other hand, the inside of the chamber is provided with a film thickness sensor for detecting the film thickness of the deposition material is evaporated from the crucible and deposited on the substrate, the film thickness sensor is typically variable depending on the amount of the deposition material is adsorbed Piezoelectric element is generated by generating a piezoelectric frequency and output to the film thickness determination module through the cable.

However, the film thickness sensor having the above-described configuration has a problem in that precision decreases as the deposition amount increases and film thickness variation occurs.

Therefore, in order to suppress the above-mentioned problem, conventionally, a chopper manufactured by forming a plurality of holes having a predetermined size in a disk-shaped plate is installed in an adjacent lower part of the film thickness sensor, and the chopper is made while the deposition material is evaporated. It is rotating at a constant speed.

In this case, the number and size of the holes are set within an appropriate range such that the deposition amount of the deposition material deposited on the film thickness sensor through the hole is 30% or less of the deposition amount of the deposition material deposited on the substrate.

According to this configuration, the chopper is deposited on the film thickness sensor through the hole only while the hole and the film thickness sensor match.

Therefore, since the deposition amount of the deposition material deposited on the film thickness sensor is less than 30% of the deposition amount of the deposition material deposited on the substrate, the sensor life is extended.

However, in the conventional deposition apparatus, the deposition material has a film thickness during a non-deposition time during which no deposition is performed, for example, a time for loading and aligning the substrate to the substrate mounting portion and a time for unloading the substrate from the substrate mounting portion after deposition is completed. There is a problem deposited in the sensing sensor.

Therefore, the conventional deposition apparatus has a problem that the life extension of the film thickness sensor is limited.

The present invention has been made to solve the above problems, and an object thereof is to provide an organic material deposition apparatus and a deposition method that can effectively extend the life of the film thickness sensor.

In order to achieve the above object, the present invention is characterized in that the shutter is installed in the lower portion adjacent to the film thickness sensor, the shutter is placed in the deposition position during the deposition time, and the shutter is placed in the non-deposition position during the non-deposition time. It is done.

In this case, the deposition may be determined by detecting whether the substrate mounting unit is rotating.

In addition, in the practice of the present invention, a chopper may be further installed between the film thickness sensor and the shutter or adjacent to the shutter, and the substrate may be rotated during the deposition time in consideration of deposition characteristics, and the crucible may be It can be installed at offset by a distance from the center.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a schematic view showing the configuration of an organic material deposition apparatus according to an embodiment of the present invention, Figure 2 is a process chart showing a deposition method using the organic material deposition apparatus of FIG.

As shown, the organic material deposition apparatus according to the embodiment of the present invention includes a deposition chamber 10.

The substrate mounting unit 30 for mounting the substrate 20 is installed on the inner upper portion of the deposition chamber 10, and the crucible 40 is disposed below the deposition chamber 10.

The crucible 40 is filled with a deposition material 42, and a heat ray 44 as a heat source for evaporating the deposition material is disposed outside the crucible 40.

In addition, the crucible 40 is installed in a state of being offset by a predetermined distance from the center of the substrate 20 in consideration of deposition characteristics of the evaporated material, and in order to improve film thickness uniformity, the substrate 20 Is rotated at a constant rotational speed by the motor M1.

Although not shown, a film forming mask formed in a predetermined pattern may be disposed below the substrate 20.

Meanwhile, a film thickness sensor 50 is installed in the chamber 10 to detect the film thickness of the deposition material 42 that is evaporated from the crucible 40 and deposited on the substrate 20.

The film thickness sensor 50 includes a piezoelectric element that generates a variable piezoelectric frequency according to the amount of the deposition material adsorbed and outputs the piezoelectric frequency to a controller 60 or a film thickness determination module (not shown) through a cable.

Therefore, the deposition signal of the deposition material deposited on the substrate 20 is calculated by analyzing the output signal of the film thickness sensor 50, and when the deposition amount reaches the set value, the heating wire 44 is controlled to evaporate the deposition material. By stopping the film, a film having a predetermined thickness is deposited on the substrate 20.

In addition, a shutter 70 according to an exemplary embodiment of the present invention is installed at an adjacent lower portion of the film thickness sensor 50.

The shutter 70 may be formed in a disk or other shape plate, and a driving unit such as a motor M2 to enable a position change from the deposition position shown in FIG. 1 to the non-deposition position shown in FIG. 2. Is installed on.

The motors M1 and M2 are electrically connected to the controller 60.

A method of depositing an organic film on a substrate using the organic material deposition apparatus having such a configuration will be described below.

When the control starts, the control unit 60 receives a control signal for operating the motor M1 and detects whether the substrate mounting unit 30 is rotated.

The motor M1 is operated to rotate the substrate 20 only during the deposition time in which the deposition process proceeds.

When the deposition process is started and the substrate mounting unit 30 is rotated by the motor M1, the controller 60 drives the motor M2 to detect the film thickness deposited on the substrate 20. The shutter 70 is positioned at the deposition position shown in FIG.

In addition, when the substrate 20 is loaded or aligned on the substrate mounting unit 30 to proceed with the deposition process, or the substrate 20 is unloaded from the substrate mounting unit 30 after completing the deposition process, the controller 60 Determines that the motor M1 is in the stopped state, and positions the shutter 70 in the non-deposition position shown in FIG. This operation is possible by controlling the motor M2 driving the shutter 70.

In this way, the deposition material evaporated in the crucible 40 during the non-deposition time can be prevented from being deposited on the film thickness sensor 50.

Although not shown, a chopper may be installed between the film thickness sensor and the shutter or adjacent to the shutter. In this case, the chopper may be formed in the same structure as in the prior art, or may be formed in another structure.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the organic material deposition apparatus and the deposition method of the present invention, it is possible to extend the life of the film thickness sensor by preventing the deposition material is deposited on the film thickness sensor during the non-deposition time.

Claims (5)

A deposition chamber; A substrate mounting portion disposed on an inner upper portion of the deposition chamber, the substrate mounting portion being rotated during the deposition time and kept stationary during the non-deposition time; A crucible disposed at an inner lower portion of the deposition chamber at an offset distance from the center of the substrate and filled with a deposition material therein; A film thickness sensor for detecting a film thickness of a deposition material that is evaporated from the crucible and deposited on a substrate of the substrate mounting unit; A shutter installed in an adjacent lower portion of the film thickness sensor; And A control unit for controlling the shutter to detect whether the substrate mounting unit is in a rotational operation and to prevent deposition material from being deposited on the film thickness sensing sensor during the non-deposition time during which the substrate mounting unit is stopped. Organic material deposition apparatus comprising a. delete delete Detects whether the substrate mounting unit is rotating or not and transfers and holds the shutter to the deposition position so that the deposition material evaporated in the crucible is deposited on the film thickness sensor during the deposition time during the deposition process, and the deposition process does not proceed. And depositing and transporting the shutter to the non-deposition position for a period of time. delete

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