KR100705950B1 - Method of forming a metal line in semiconductor device - Google Patents
Method of forming a metal line in semiconductor device Download PDFInfo
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- KR100705950B1 KR100705950B1 KR1020010082470A KR20010082470A KR100705950B1 KR 100705950 B1 KR100705950 B1 KR 100705950B1 KR 1020010082470 A KR1020010082470 A KR 1020010082470A KR 20010082470 A KR20010082470 A KR 20010082470A KR 100705950 B1 KR100705950 B1 KR 100705950B1
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- metal layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76883—Post-treatment or after-treatment of the conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
Abstract
본 발명은 반도체 소자의 금속 배선 형성 방법에 관한 것으로, 비아홀 및 트랜치를 매립하도록 구리 금속층을 증착한 후 고압에서 열처리 공정을 실시하여 비아홀 내부의 구리 금속층의 결정립을 조대화하여 비아홀 내부에서의 구리 금속의 이탈을 억제함으로써 구리 금속층 증착시 형성된 동공과 같은 보이드를 동시에 제거할 수 있는 반도체 소자의 금속 배선 형성 방법을 제시한다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a metal wiring of a semiconductor device, and includes depositing a copper metal layer so as to fill a via hole and a trench, and then performing a heat treatment at a high pressure to coarsen crystal grains of the copper metal layer inside the via hole. The present invention provides a method for forming metal wirings in a semiconductor device capable of simultaneously removing voids such as pores formed during deposition of a copper metal layer by suppressing the separation of the metal.
반도체 소자, 듀얼 다마신, 구리 금속층, 고압 열처리 Semiconductor device, dual damascene, copper metal layer, high pressure heat treatment
Description
도 1a 내지 도 1e는 본 발명의 실시예에 따른 반도체 소자의 금속 배선 형성 방법을 설명하기 위해 도시한 반도체 소자의 단면도.
1A to 1E are cross-sectional views of a semiconductor device for explaining a method for forming metal wirings of a semiconductor device according to an embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명> <Explanation of symbols for the main parts of the drawings>
10 : 반도체 기판 12 : 하부 금속층 10
14 : 제 1 확산 방지막 16 : 제 1 층간 절연막 14 first
18 : 식각 베리어층 20 : 제 2 층간 절연막 18: etching barrier layer 20: second interlayer insulating film
22 : 캡핑층 24 : 제 2 확산 방지막 22 capping layer 24 second diffusion barrier film
26 : 구리 금속층 28 : 구리 금속 배선
26: copper metal layer 28: copper metal wiring
본 발명은 반도체 소자의 금속 배선 형성 방법에 관한 것으로, 특히 듀얼 다마신(Dual damascene) 공정을 이용한 구리 금속 배선 형성 방법에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming metal wirings in semiconductor devices, and more particularly, to a method for forming copper metal wirings using a dual damascene process.
일반적으로, 구리 금속 배선 형성 공정에서는 CMP(Chemical Mechanical Planarization)를 이용한 평탄화 공정시 연마속도를 일정하게 하고, 구리 금속의 결점(Defect) 등을 최소화하기 위해 평탄화 공정의 전처리 공정으로 열처리 공정을 상압 또는 저압에서 실시하고 있다. 그러나, 이 열처리 공정에 의해 구리 금속의 재결정화가 일어나 조대한 결정립(Coarse grain)이 형성되고, 확산 방지막과 구리 금속 간의 접합력이 한계에 이르러 비아홀 내에서 동공 등과 같은 보이드(Void)가 발생하게 된다. In general, in the copper metal wiring forming process, in order to minimize the defects of the copper metal and to minimize the defects of the copper metal during the planarization process using chemical mechanical planarization (CMP), the heat treatment process is performed at atmospheric pressure or It is carried out at low pressure. However, by the heat treatment process, recrystallization of copper metal occurs, coarse grains are formed, and the bonding strength between the diffusion barrier film and the copper metal reaches a limit, and voids such as pores are generated in the via hole.
이러한, 보이드는 구리 금속층 재결정화시 스트레스가 집중되는 비아홀 하부에서 주로 발생하는데, 구리 금속 재결정화와 금속과 절연막의 열팽창 계수의 차이를 야기시켜 비아홀 불량의 원인이 된다. 또한, 비아홀 불량은 금속 배선의 불량을 야기시켜 구리 금속의 소자 특성에 치명적인 영향을 주고 있으며, 특히 층간 절연막으로 초유전율을 사용하거나, 비아홀의 크기가 작을 경우 이러한 문제가 더욱 심하게 발생하게 된다.
These voids are mainly generated in the lower part of the via hole where stress is concentrated upon recrystallization of the copper metal layer, which causes a difference between the thermal expansion coefficients of the copper metal and the insulating layer and causes the via hole defect. In addition, failure of the via hole causes a defect in the metal wiring, which has a fatal effect on the device characteristics of the copper metal. In particular, when the super dielectric constant is used as the interlayer insulating layer or the size of the via hole is small, the problem occurs more seriously.
따라서, 본 발명은 상기 문제를 해결하기 위해 안출된 것으로, 비아홀 및 트랜치를 매립하도록 구리 금속층을 증착한 후 고압에서 열처리 공정을 실시하여 비 아홀 내부의 구리 금속층의 결정립을 조대화하여 비아홀 내부에서의 구리 금속의 이탈을 억제함으로써 구리 금속층 증착시 형성된 동공과 같은 보이드를 동시에 제거할 수 있는 반도체 소자의 금속 배선 형성 방법을 제공하는데 그 목적이 있다
Accordingly, the present invention has been made to solve the above problems, by depositing a copper metal layer to fill the via holes and trenches, and performing a heat treatment at high pressure to coarse the grains of the copper metal layer inside the via hole to It is an object of the present invention to provide a method for forming a metal wiring of a semiconductor device capable of simultaneously removing voids such as pores formed during deposition of a copper metal layer by suppressing detachment of the copper metal.
상술한 목적을 달성하기 위해 본 발명은 하부 도전층 등의 소정의 구조가 형성된 반도체 기판 상부에 층간 절연막을 형성하는 단계; 듀얼 다마신 공정을 실시하여 상기 하부 도전층의 소정 부위가 노출되도록 비아 및 트랜치를 형성는 단계; 상기 비아 및 트랜치를 포함한 전체 구조 상부에 상부 도전층을 증착한 후 고압에서 열처리 공정을 실시하는 단계; 및 상기 상부 도전층을 평탄화하여 상기 비아 및 트랜치를 매립하도록 금속 배선을 형성하는 단계를 포함하여 이루어지는 것을 특징으로 한다.
In order to achieve the above object, the present invention comprises the steps of forming an interlayer insulating film on the semiconductor substrate formed with a predetermined structure, such as a lower conductive layer; Performing a dual damascene process to form vias and trenches to expose predetermined portions of the lower conductive layer; Depositing an upper conductive layer on the entire structure including the vias and trenches, and then performing a heat treatment at a high pressure; And forming metal wirings to planarize the upper conductive layer to fill the vias and trenches.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1a 내지 도 1c는 본 발명의 실시예에 따른 반도체 소자의 구리 금속 배선 형성 방법을 설명하기 위해 도시한 반도체 소자의 단면도이다. 1A to 1C are cross-sectional views of a semiconductor device for explaining a method of forming a copper metal wire in a semiconductor device according to an embodiment of the present invention.
도 1a를 참조하면, 소정의 구조가 형성된 반도체 기판(10) 상에 하부 금속층(12)을 형성한 후 그 상부에 제 1 확산 방지막(14)을 형성한다. 이어서, 제 1 확산 방지막(14) 상에 제 1 층간 절연막(16), 식각 베리어층(18), 제 2 층간 절연막(20) 및 캡핑층(22)을 순차적으로 형성한다. 여기서, 제 1 및 제 2 층간 절연막(16 및 20)은 저유전 물질로 이루어진다. Referring to FIG. 1A, after forming a
이어서, 하부 금속층(12)의 소정 부위가 노출되도록 듀얼 다마신 공정을 실시하여 비아홀 및 트랜치(도시하지 않음)를 형성한 후 비아 및 트랜치를 통해 노출되는 하부 금속층(12)의 상부 표면에 형성된 자연 산화막을 제거한다. 이어서, 비아홀 및 트랜치 내부면을 포함한 전체 구조 상부에 금속층으로 제 2 확산 방지막(24)을 형성한 후 전기 화학적 증착 공정을 실시하여 비아홀 및 트랜치를 매립하도록 전체 구조 상부에 구리 금속층(26)을 증착한다. 이때, 구리 금속층(26)의 결정립계는 도시된 'A'와 같이 미세 결정립으로 이루어진다.Subsequently, a dual damascene process is performed to expose a predetermined portion of the
도 1b를 참조하면, 구리 금속층(26)에 고압에서 열처리 공정을 실시하여 결정립계가 도시된 'B'와 같이 조대화된 결정립을 갖는 구리 금속층(26)을 형성한다. 이때, 열처리 공정은 환원성 분위기에서 1 내지 1000 기압에서 100 내지 450℃의 온도로 30분 내지 3시간 동안 실시하되, 비아홀 및 트랜치를 매립하도록 구리 금속층(26)을 형성한 후 12시간 이내에 실시한다. Referring to FIG. 1B, the
도 1c를 참조하면, 구리 금속층(26)에 CMP를 이용한 평탄화 공정을 실시하여 비아 및 트랜치가 매립되도록 구리 금속 배선(28)을 형성한다.
Referring to FIG. 1C, a planarization process using CMP is performed on the
본 발명은 비아홀 및 트랜치를 매립하도록 구리 금속층을 증착한 후 고압에 서 열처리 공정을 실시하여 비아홀 내부의 구리 금속층의 결정립을 조대화하여 비아홀 내부에서의 구리 금속의 이탈을 억제함으로써 구리 금속층 증착시 형성된 동공과 같은 보이드를 동시에 제거할 수 있다. 따라서, 반도체 소자의 비아홀 수율 불량을 최소화할 수 있다. The present invention is formed during deposition of a copper metal layer by depositing a copper metal layer to fill a via hole and a trench, and then performing a heat treatment at high pressure to coarse grains of the copper metal layer in the via hole to suppress the removal of the copper metal in the via hole. Voids such as pupils can be removed at the same time. Therefore, poor via hole yield of the semiconductor device can be minimized.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101038491B1 (en) * | 2004-04-16 | 2011-06-01 | 삼성테크윈 주식회사 | lead frame and the method for manufacturing the same |
US8551878B2 (en) | 2009-07-13 | 2013-10-08 | Samsung Electronics Co., Ltd. | Metal interconnection method of semiconductor device |
US9496218B2 (en) | 2012-07-17 | 2016-11-15 | Samsung Electronics Co., Ltd. | Integrated circuit device having through-silicon-via structure |
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JPH10112445A (en) * | 1996-10-04 | 1998-04-28 | Toshiba Corp | Manufacture of semiconductor device |
KR20000035140A (en) * | 1998-11-02 | 2000-06-26 | 구마모토 마사히로 | Method of forming interconnect film |
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Patent Citations (3)
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JPH10112445A (en) * | 1996-10-04 | 1998-04-28 | Toshiba Corp | Manufacture of semiconductor device |
KR20000035140A (en) * | 1998-11-02 | 2000-06-26 | 구마모토 마사히로 | Method of forming interconnect film |
KR100610533B1 (en) * | 1998-11-02 | 2006-08-09 | 가부시키가이샤 고베 세이코쇼 | Method of forming interconnect film |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101038491B1 (en) * | 2004-04-16 | 2011-06-01 | 삼성테크윈 주식회사 | lead frame and the method for manufacturing the same |
US8551878B2 (en) | 2009-07-13 | 2013-10-08 | Samsung Electronics Co., Ltd. | Metal interconnection method of semiconductor device |
US9496218B2 (en) | 2012-07-17 | 2016-11-15 | Samsung Electronics Co., Ltd. | Integrated circuit device having through-silicon-via structure |
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