KR100696641B1 - Plasma display device - Google Patents

Abstract

A plasma display device is provided to reduce an influence of convection current and an error rate of detected temperature by mounting a temperature sensor IC on one surface of a first circuit board assembly. One side of a chassis base(17) is attached to a plasma display panel(11) in order to support the plasma display panel. A plurality of circuit board assemblies(15a-15e) are mounted on the other side of the chassis base and are electrically connected with the plasma display panel. A temperature sensor IC(24) is mounted around a projection member which is projected from the chassis base. The temperature sensor IC is disposed near to a top aide of the projection member along a convection current direction.

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view of a plasma display device according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a view showing the flow of air in the vicinity of the temperature sensor IC according to an embodiment of the present invention.

4 is a graph comparing the relationship between the detection temperature and the chamber temperature of the temperature sensor IC according to the embodiment of the present invention.

The present invention relates to a plasma display device capable of stabilizing driving of the plasma display panel.

In general, a plasma display apparatus generates a plasma by gas discharge and displays an image using the plasma (Plasma Display Panel, hereinafter referred to as 'PDP'), a chassis base supporting a PDP, and a chassis base PDP. It includes a plurality of circuit board assemblies mounted on the opposite side and connected to the sustain electrode, the scan electrode and the address electrode, respectively, located inside the PDP through a flexible printed circuit and a connector.

Here, the circuit board assembly includes a sustain circuit board assembly for controlling the sustain electrode, a scan circuit board assembly for controlling the scan electrode, an address buffer board assembly for controlling the address electrode, a control signal necessary for driving the address electrode, and sustain electrodes and scan electrode driving. There is a control board assembly for generating a control signal required for supplying to the address buffer board assembly, the holding circuit board assembly and the scanning circuit board assembly, respectively, and a power board assembly for supplying power for driving the above-described board assemblies.

With such a configuration, the plasma display apparatus generates an plasma by discharging the gas injected into the PDP to implement an image. In the image realization process, heat is generated by gas discharge. When the plasma display device increases the discharge degree to improve luminance, more heat is generated in the PDP.

The heat generated in the PDP is conducted towards the chassis base and affects the circuit board assembly mounted on the rear of the chassis base.

As a result, the control board assembly constituting the circuit board assembly may perform unstable signal processing, and may cause a malfunction of an integrated circuit that processes an electrical signal while driving an actual PDP.

In addition, when the temperature of the PDP is lowered below a predetermined temperature, the discharge start voltage is changed, and as a result, an erroneous discharge phenomenon occurs in which discharge cells which should not be discharged are discharged.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device capable of more accurately detecting the temperature of a PDP and driving the PDP in a more stable state.

In order to achieve the above object, the present invention provides a plasma display panel, a chassis base attached to and supported by a plasma display panel, circuit board assemblies mounted on an opposite side of the panel of the chassis base and electrically connected to the plasma display panel, and a circuit board. It is preferable to include a temperature sensor IC mounted on an opposite surface of the chassis base of the assembly.

The circuit board assemblies are respectively mounted to enclose the first board assembly at a distance from each other at the top, bottom, left, and right positions of the first board assembly and the first board assembly mounted on the center with respect to the plane of the chassis base. It is preferred to include second to fifth board assemblies.

In such a configuration, the temperature sensor IC is preferably mounted on the first board assembly, and when convection is formed from below the chassis base upwards, the temperature sensor IC is located above the convex direction protruding from the chassis base. It is preferable to arrange.

Here, the protruding member may include a boss formed in the chassis base to mount the circuit board assembly, and the temperature sensor IC preferably has a distance from the chassis base.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. While many specific details, such as the following description and the annexed drawings, are shown to provide a more general understanding of the invention, these specific details are illustrated for the purpose of explanation of the invention and are not meant to limit the invention thereto. And a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

1 is a perspective view of a plasma display device according to an embodiment of the present invention, which shows the arrangement of a chassis base and a PDP on which a circuit board assembly is mounted, and FIG. 2 is a cross-sectional view of the embodiment according to the line II-II of FIG. Among the various board assemblies constituting the board assembly, the first board assembly according to the embodiment of the present invention is partially cross-sectioned to illustrate the arrangement of the temperature sensor IC.

A configuration of a plasma display device according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. The plasma display apparatus is attached to the back surface of the PDP 11 and the PDP 11 that display an image by using gas discharge, and conducts heat conduction to conduct and diffuse heat generated in the PDP 11 in the planar direction (x, y-direction). The circuit board assembly 15 (15a-15e) (PBA; Printed circuit Board Assembly) electrically connected to the PDP 11 to drive the sheet 13, the PDP 11, and the PDP 11 on both sides The temperature to be mounted on the surface opposite to the chassis base 17 and the chassis base 17 of the circuit board assembly 15, which are attached and supported by tape 16, and which support and mount the circuit board assemblies 15 on the back thereof. Sensor IC 24.

The plasma display apparatus further includes a driver IC package (not shown) having a driver IC for generating a pulse to be selectively supplied to an electrode of the PDP 11 and connected to the circuit board assembly 15. Consists of a Tape Carrier Package (TCP).

First, the PDP 11 includes a front panel and a rear panel which are integrally bonded by a sealing material. The PDP 11 includes discharge cells therein to provide visible light emission through plasma generation. Implement color images. The PDP 11 is configured to display an image by using gas discharge. Since the present invention relates to the coupling relationship between the PDP 11 and other components, a detailed description of the configuration of the PDP 11 will be omitted. The PDP 11 may be configured in various ways and may be driven in various ways, and includes such PDPs. Therefore, PDP 11 according to an embodiment of the present invention may be applied to a PDP of various configurations and methods.

The thermally conductive sheet 13 is interposed between the PDP 11 and the chassis base 17 so that heat generated by the PDP 11 causing gas discharge can be transferred in the planar direction of the PDP 11 (x, and diverge in the y-direction). The heat conduction sheet 13 may be provided as one sheet for heat dissipation balance of the PDP 11, but may be attached to the back surface of the PDP 11, but the heat conduction sheet may be strengthened by strengthening the bonding force between the PDP 11 and the chassis base 17. 13) and the PDP 11 can be configured in plural (for example, three) so as to maintain close contact.

The circuit board assembly 15 has a first board assembly 15a mounted at the center portion with respect to the plane of the chassis base 17, and the top, bottom, left and right positions of the first board assembly 15a (in FIG. 1). And second to fifth board assemblies 15b to 15e respectively mounted to surround the first board assembly 15a at intervals from each other. In the first to fifth board assemblies 15a to 15e, the first board assembly 15a is a control board assembly, and the second board assembly 15b is an address buffer board assembly for controlling an address electrode, and a third board assembly. 15c is a scan circuit board assembly for controlling the scan electrodes, a fourth board assembly 15d is a sustain circuit board assembly for controlling the sustain electrodes, and a fifth board assembly 15e is a power source for driving the above-described board assemblies. Consists of a power board assembly.

The embodiment of the present invention shows an arrangement structure of the first board assembly 15a and the chassis base 17 in which the temperature sensor IC 24 is mounted among the circuit board assemblies 15, and will be described for convenience. do. The first board assembly 15 is mounted to the boss 18 of the chassis base 17 with a set screw 19. The first board assembly 15 generates a control signal for driving the address electrode and a control signal for driving the sustain electrode and the scan electrode, respectively. It supplies to the 2nd board assembly 15b, the 3rd board assembly 15c, and the 4th board assembly 15d.

The chassis base 17 may be formed by pressing a thin metal material, and in this case, it is preferable to bend the tip or to have a reinforcing member 29 to have mechanical rigidity that can withstand torsional and bending forces. . The reinforcing member 29 may be properly formed at a position to avoid interference with the circuit board assembly 15 installed on the rear surface of the chassis base 17 as shown in FIG. The cover plate 31 is mounted at the tip of the chassis base 17 with the driver IC package 27 and the driver IC 25 interposed therebetween.

The temperature sensor IC 24 is preferably mounted on the first board assembly 15a as shown in FIG. 2 in consideration of the effects of convection occurring between the chassis base 17 and the circuit board assembly 15. . In this respect, the temperature sensor IC 24 is more preferably disposed above the convex direction around the protruding member protruding from the chassis base 17.

Here, the protruding member refers to a member protruding from the chassis base 17 or the first board assembly 15a toward each other on the opposite surface of the chassis base 17 and the first board assembly 15a. One protruding member may be formed of various circuit elements, but the boss 18 mounted to the chassis base 17 for coupling the chassis base 17 and the first board assembly 15a as shown in FIG. 2. It may include.

Taking the boss 18 mounted on the chassis base 17 as an example, the temperature sensor IC 24 is preferably disposed above the boss 18 of the chassis base 17 in the convection direction. Do. Here, the convective direction refers to a flow direction of air generated by heat generated in the PDP 11, and as shown in FIG. 3, a flow direction of air directed from the lower side to the upper side of the first board assembly 15a ( Arrow direction, y direction). 3 is a view showing the flow of air in the vicinity of the temperature sensor IC according to an embodiment of the present invention.

On the other hand, the temperature sensor IC 24 preferably has an interval with the chassis base 17 in order to detect the temperature of the PDP 11 more accurately. That is, in the plasma display device according to the embodiment of the present invention, the temperature sensor IC 24 is mounted on one surface of the first board assembly 15a as shown in FIG. 2 to detect the correct temperature of the PDP 11. Oppose the chassis base 17 at intervals. This interval can prevent the error that the temperature sensor IC 24 is in contact with the chassis base 17 by the foreign matter and thus directly detects the temperature of the chassis base 17.

In addition, the mounting position thereof is arranged above the boss 18 of the chassis base 17 in the convection direction as shown in FIGS. 2 and 3 so that the influence of the convection on one surface of the first board assembly 15a is also relatively high. It is desirable to receive less.

Here, the rear surface of the first board assembly 15a refers to the surface of the cover plate 31 side with respect to the direction (z direction) in which the first board assembly 15a is mounted on the chassis base 17 in FIG. 1. One surface of the first board assembly 15a refers to the surface of the chassis base 17 in FIG. 1.

The temperature detection signal by the temperature sensor IC 24 is applied to the first board assembly 15a. The first board assembly 15a applies signals to the address, holding, and scanning boards according to the detected temperature of the PDP 11 to drive the PDP 11 in accordance with the temperature in each board.

In the above-described process, the embodiment of the present invention can more accurately detect the temperature of the PDP 11 and supply a suitable driving waveform to the PDP 11 according to the temperature of the PDP 11, thereby enabling more stable driving. .

As described above, the accuracy of the temperature detection of the temperature sensor IC 24 is important for detecting the temperature of the PDP 11 and outputting an appropriate waveform for each temperature to stabilize the discharge. In this aspect, the embodiment of the present invention allows the mounting position of the temperature sensor IC 24 to be located on one surface of the first board assembly 15a so that the mounting position of the temperature sensor IC 24 is relatively less affected by convection and the error of temperature detection can be reduced. The temperature measurement data of the detected temperature of the temperature sensor IC 24 and the one surface temperature (Bottom temperature) and the back temperature (Top temperature) of the first board assembly 15a are as shown in FIG. 4.

4 is a graph comparing the relationship between the detection temperature and the chamber temperature of the temperature sensor IC according to the embodiment of the present invention.

The graph of FIG. 4 shows that the temperature of the PDP 11 is detected by changing the temperature in the chamber for a predetermined time while the PDP 11 is driven in a chamber of a constant space. In FIG. 4, the vertical axis represents the back temperature and one surface temperature of the first board assembly 15a and the temperature of the PDP 11 detected from the temperature sensor IC 24, and the horizontal axis represents the temperature in the chamber in which the PDP 11 is located. Indicates. That is, the temperature on the horizontal axis refers to the temperature in the chamber in which the PDP 11 is placed, and the temperature on the vertical axis is the temperature of the PDP 11 detected from the temperature sensor IC 24 mounted on one surface of the first board assembly 15a. Say. For reference, the numbers for dividing and describing the sections on the horizontal axis are not limited because they may give a specific temperature during each section. For example, the temperature of -5 degreeC, 0 degreeC, 5 degreeC, 10 degreeC, 15 degreeC, 20 degreeC, 25 degreeC, 30 degreeC, and 40 degreeC can be set in 1-8 sections of a horizontal axis, respectively. The temperature setting in such a chamber may vary in temperature and temperature through various experiments.

Referring to FIG. 4, when the temperature sensor IC 24 is mounted on one surface of the first board assembly 15a, the temperature detected by the temperature sensor IC 24 is greater than the back temperature of the first board assembly 15a. It can be seen that the temperature closer to one surface of the first board assembly 15a. That is, when the temperature sensor IC 24 is located on one surface of the first board assembly 15a, it can be seen that the detected temperature of the temperature sensor IC 24 is similar to the temperature of one surface of the first board assembly 15a. For this reason, the temperature of the PDP 11 can be detected more accurately through the temperature sensor IC 24 located on one surface of the first board assembly 15a.

As described above, the plasma display apparatus according to the present invention has a temperature sensor IC mounted on one surface of the first board assembly facing the chassis base, thereby being less affected by convection and reducing an error in the detection temperature than other locations. By doing so, the temperature of the PDP can be detected more accurately, and the PDP can be more stably driven by applying a more accurate driving waveform to the PDP in accordance with the accurate temperature detection of the PDP.

Claims (6)

A plasma display panel; A chassis base attached to and supported by the plasma display panel; Circuit board assemblies mounted opposite the panel of the chassis base and electrically connected to the plasma display panel; And A temperature sensor IC mounted around a protruding member protruding from the chassis base on a surface opposite the chassis base of the circuit board assembly, And the temperature sensor IC is disposed close to the upper side of the protruding member in a convection direction. The method of claim 1, The circuit board assemblies A first board assembly mounted to a central portion with respect to the plane of the chassis base; And a second to fifth board assembly mounted to surround the first board assembly at intervals of the first board assembly at upper, lower, left and right positions, respectively. The method of claim 2, And the temperature sensor IC is mounted on the first board assembly. delete The method of claim 1, And the protruding member is a boss formed in the chassis base to mount the circuit board assembly. The method of claim 1, And the temperature sensor IC is spaced apart from the chassis base.

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