KR100692604B1 - CuAu상 ⅠⅢⅥ₂단결정 박막의 형성방법 - Google Patents
CuAu상 ⅠⅢⅥ₂단결정 박막의 형성방법 Download PDFInfo
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- KR100692604B1 KR100692604B1 KR1020060047182A KR20060047182A KR100692604B1 KR 100692604 B1 KR100692604 B1 KR 100692604B1 KR 1020060047182 A KR1020060047182 A KR 1020060047182A KR 20060047182 A KR20060047182 A KR 20060047182A KR 100692604 B1 KR100692604 B1 KR 100692604B1
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- 239000013078 crystal Substances 0.000 title claims abstract description 79
- 239000010409 thin film Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000015572 biosynthetic process Effects 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000001704 evaporation Methods 0.000 claims abstract description 18
- 230000008020 evaporation Effects 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 17
- 229910021476 group 6 element Inorganic materials 0.000 claims abstract description 15
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 28
- 239000000843 powder Substances 0.000 claims description 8
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 238000003955 hot wall epitaxy Methods 0.000 claims description 5
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 238000010549 co-Evaporation Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 238000002109 crystal growth method Methods 0.000 claims 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 18
- 229910052951 chalcopyrite Inorganic materials 0.000 description 15
- 230000010287 polarization Effects 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 5
- 229910005543 GaSe Inorganic materials 0.000 description 4
- 238000005090 crystal field Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000103 photoluminescence spectrum Methods 0.000 description 4
- 238000000985 reflectance spectrum Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005433 particle physics related processes and functions Effects 0.000 description 1
- 230000005610 quantum mechanics Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- WGPCGCOKHWGKJJ-UHFFFAOYSA-N sulfanylidenezinc Chemical compound [Zn]=S WGPCGCOKHWGKJJ-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (15)
- I족 및 Ⅲ족 원소를 포함하는 화합물을 증발원으로 하여 공급하면서 Ⅵ족 원소를 과잉으로 공급하여 기판상에 CuAu상 ⅠⅢⅥ2 화합물의 단결정을 성장시키는 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1에 있어서,상기 증발원으로 ⅠⅢⅥ2 화합물의 결정 분말을 사용하는 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1에 있어서,상기 증발원으로 I2Ⅵ와 Ⅲ2Ⅵ3 화합물 분말을 사용하는 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1에 있어서,상기 증발원으로 I족 원소와 Ⅲ족 원소를 사용하는 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1 내지 4항 중 어느 한 항에 있어서,상기 기판이 GaAs 또는 ZnSe에서 선택된 것임을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 5에 있어서,상기 기판이 GaAs인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1 내지 4항 중 어느 한 항에 있어서,상기 I족 원소는 Cu, Ag에서 선택된 것이고, Ⅲ족 원소는 Ga, Al 또는 In에서 선택된 것이며, Ⅵ족 원소는 Se, S 또는 Te인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 7에 있어서,상기 I족 원소는 Ag이고, Ⅲ족 원소는 Ga이며, Ⅵ족 원소는 Se인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 8에 있어서,상기 기판이 GaAs 또는 ZnSe에서 선택된 것임을 특징으로 하는 CuAu상 ⅠⅢ Ⅵ2 단결정 박막의 형성방법.
- 청구항 9에 있어서,상기 기판이 GaAs인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 1 내지 4항 중 어느 한 항에 있어서,상기 단결정 성장은 HWE(Hot-Wall Epitaxy), MBE(Molecular Beam Epitaxy), MOCVD(Metal Organic Chemical Vapor Deposition), Co-evaporation에서 선택된 방법을 사용하는 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 11에 있어서,상기 I족 원소는 Cu, Ag에서 선택된 것이고, Ⅲ족 원소는 Ga, Al 또는 In에서 선택된 것이며, Ⅵ족 원소는 Se, S 또는 Te인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 12에 있어서,상기 I족 원소는 Ag이고, Ⅲ족 원소는 Ga이며, Ⅵ족 원소는 Se인 것을 특징 으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 13에 있어서,상기 기판이 GaAs 또는 ZnSe에서 선택된 것임을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
- 청구항 14에 있어서,상기 기판이 GaAs인 것을 특징으로 하는 CuAu상 ⅠⅢⅥ2 단결정 박막의 형성방법.
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Cited By (1)
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WO2015174648A1 (ko) * | 2014-05-12 | 2015-11-19 | 엘지전자 주식회사 | 도핑 된 금속 칼코게나이드 박막의 제조 방법 및 그 박막 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0484441A (ja) * | 1990-07-27 | 1992-03-17 | Nippon Seiki Co Ltd | AgGaSe↓2結晶薄膜の形成方法 |
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JPH0484441A (ja) * | 1990-07-27 | 1992-03-17 | Nippon Seiki Co Ltd | AgGaSe↓2結晶薄膜の形成方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015174648A1 (ko) * | 2014-05-12 | 2015-11-19 | 엘지전자 주식회사 | 도핑 된 금속 칼코게나이드 박막의 제조 방법 및 그 박막 |
KR101591833B1 (ko) * | 2014-05-12 | 2016-02-04 | 엘지전자 주식회사 | 도핑 된 금속 칼코게나이드 박막의 제조 방법 및 그 박막 |
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