KR100688688B1 - Apparatus for monitoring a guard-ring in a semiconductor device - Google Patents

Abstract

Disclosed is a monitoring device for a semiconductor chip guard ring.

The present invention provides a monitoring device for a semiconductor chip guard ring in which a guard ring terminal for obtaining electrical data for a guard ring of a chip is provided in a guard ring outside the chip of the semiconductor element.

That is, the present invention implements electrical monitoring of a process or equipment by installing a test terminal at a predetermined position on the guard ring, so that monitoring of all chips can be implemented without additional devices or experiments.

Guard ring

Description

Monitoring device for semiconductor chip guard ring {APPARATUS FOR MONITORING A GUARD-RING IN A SEMICONDUCTOR DEVICE}

1 is a plan view of a semiconductor chip in which a general guard ring is formed;

FIG. 2 is a cross-sectional view of FIG. 1 illustrating a connection hole connecting a guard ring and upper and lower metals;

FIG. 3 is a cross-sectional view of FIG. 1 showing a trench connection line connecting a guard ring and upper and lower metals;

4 is a plan view of a semiconductor chip with a guard ring provided with a test terminal according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a guard ring formed on the outside of a semiconductor chip. More particularly, the present invention relates to a monitoring device for a semiconductor chip guard ring in which test terminals are provided on the guard ring to implement electrical monitoring of a process or equipment. .

In the general semiconductor chip manufacturing process, after the semiconductor chip is manufactured, various reliability evaluation items include a test for durability against humidity under high temperature and pressurization, in which the semiconductor chip is protected to protect the interior of the semiconductor chip against humidity. Guard rings are formed around the chip or on a scribe line according to the chip manufacturing process.

That is, a guard ring is utilized for the purpose of protecting the internal circuit of a semiconductor chip from the pressure, temperature, or humidity at the time of evaluation of a semiconductor chip.

FIG. 1 is a plan view of a semiconductor chip having such a guard ring, and includes a guard ring 10 formed outside the chip 12 and serving as a ground, and a chip 12 including pads, input / output terminals, and a main cell. Include.

FIG. 2 is a cross-sectional view of FIG. 1 and illustrates a connection hole 14 connecting the guard ring 10a and the upper and lower metals, and FIG. 3 is a trench connection line connecting the guard ring 10a and the upper and lower metals. Fig. 16 shows the drawing.

However, the conventional guard ring 10 has not been provided with a method for monitoring the abnormal state of the guard ring 10.

Therefore, a technique for confirming the ground state for each position in the wafer is desired.

The present invention has been made in accordance with the above-described requirements, by installing a test terminal at a predetermined position of the guard ring to implement the electrical monitoring of the process or equipment, semiconductor chip guard ring that implements monitoring for all chips without additional devices or experiments Its purpose is to provide a monitoring device.                         

In order to achieve the above object, the present invention provides a monitoring device for a semiconductor chip guard ring, characterized in that a guard ring terminal for obtaining electrical data for the guard ring of the chip is provided in the guard ring on the outer edge of the semiconductor element. to provide.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

4 is a plan view of a semiconductor chip having a guard ring with a test terminal according to the present invention, and includes a chip 22, a guard ring 20, and a guard ring terminal 24.

As shown in the drawing, the present invention is characterized in that a portion of the guard ring 20 surrounding the outer edge of the chip 22 is short-circuited and a test terminal 24 is provided at each end thereof.

This test terminal 24 is used to obtain electrical data for the guard ring 20 during subsequent chip 22 testing. That is, the ground state of the chip 22 can be checked by measuring the current / voltage of the two terminals 24 shown in FIG.

As mentioned above, although this invention was concretely demonstrated based on the Example, this invention is not limited to this Example, Of course, various changes are possible within the range which does not deviate from the summary.

As described above, the present invention can quantify the ground state of each chip to confirm the ground state for each position in the wafer, and thus, it is possible to easily monitor the test reliability and device / wiring problems.

Claims (3)

In a guard ring outside the chip of the semiconductor device, Device for monitoring a semiconductor chip guard ring, characterized in that the guard ring terminal for obtaining electrical data for the guard ring of the chip is provided. The method of claim 1, And the guard ring terminal is formed at an end of the guard ring in which a predetermined portion is shorted. The method of claim 1, The device, And monitoring the ground state of the chip by measuring a current / voltage of the guard ring terminal.

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