KR100681785B1 - A rim made of teflon for manufacturing the memory foam ear-plug - Google Patents

A rim made of teflon for manufacturing the memory foam ear-plug Download PDF

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KR100681785B1
KR100681785B1 KR1020050009688A KR20050009688A KR100681785B1 KR 100681785 B1 KR100681785 B1 KR 100681785B1 KR 1020050009688 A KR1020050009688 A KR 1020050009688A KR 20050009688 A KR20050009688 A KR 20050009688A KR 100681785 B1 KR100681785 B1 KR 100681785B1
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mold
memory foam
release agent
cover
fluorine resin
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KR1020050009688A
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KR20060088736A (en
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석창성
구재민
김영덕
김상영
배봉국
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성균관대학교산학협력단
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Abstract

본 발명은 금형덮개와 금형틀로 구성되는 불소수지 소재를 가공한 메모리폼 이어플러그용 반응사출성형식 금형에 관한 것으로서,The present invention relates to a reaction injection molding mold for memory foam ear plugs processed with a fluorine resin material composed of a mold cover and a mold mold.

상기 금형틀(21)에서 메모리폼 이어플러그가 성형되는 부분은 비점착성의 불소수지 소재로 구성되고, 상기 금형덮개(22)는 금속으로 구성된 것을 특징으로 하여, 이형제처리나 공압처리 등 별도의 공정이 없이도 이어플러그 등의 제작이 용이하고, 제작시간이 크게 단축되고 재료비용도 절감되며, 이형제의 불균일한 도포로 인해 발생되던 불량률을 낮출 수 있고, 금형작업 시 발생하는 분진의 양을 현저하게 줄임으로써 작업환경을 개선시킬 수 있다는 이점이 있다.Part of the mold mold 21, the memory foam ear plug is formed of a non-adhesive fluorine resin material, and the mold cover 22 is characterized in that the metal, a separate process such as release agent treatment or pneumatic treatment Without this, it is easy to manufacture ear plugs, greatly reduce manufacturing time, reduce material costs, reduce defect rate caused by uneven application of release agent, and significantly reduce the amount of dust generated during mold work. This has the advantage of improving the working environment.

Description

불소수지 소재를 가공한 메모리폼 이어플러그용 반응사출성형식 금형{A RIM MADE OF TEFLON FOR MANUFACTURING THE MEMORY FOAM EAR-PLUG}A RIM MADE OF TEFLON FOR MANUFACTURING THE MEMORY FOAM EAR-PLUG}

도 1은, 종래 메모리폼 이어플러그의 반응사출성형식 금형의 단면도이다.1 is a cross-sectional view of a reaction injection molding die of a conventional memory foam ear plug.

도 2는, 본 발명에 따른 메모리폼 이어플러그 성형용 불소수지 소재(테프론) 반응사출성형식 금형의 단면도이다.2 is a cross-sectional view of a fluororesin material (Teflon) reaction injection molding die for memory foam ear plug molding according to the present invention.

《도면의 주요 부분에 대한 부호의 설명》`` Explanation of symbols for main parts of drawings ''

1: 메모리폼 이어플러그 제품(폴리우레탄)1: Memory foam ear plug products (polyurethane)

11: 종래 메모리폼 이어플러그의 반응사출성형식 금형11: Reaction injection molding mold of conventional memory foam ear plug

12: 도포된 이형제층12: applied release agent layer

13: 금형덮개13: mold cover

14: 공압장치14: Pneumatic

21: 불소수지 소재를 가공한 메모리폼 이어플러그의 반응사출성형식 금형21: Reaction injection molding mold of memory foam ear plug processed with fluorine resin

22: 메모리폼 이어플러그의 반응사출성형식 금형의 덮개22: Cover of reaction injection mold of memory foam earplug

본 발명은 불소수지 소재를 가공한 메모리폼 이어플러그용 반응사출성형식 금형에 관한 것으로서, 특히 이형제를 사용하지 않고도 메모리폼 소재의 이어플러그 등을 용이하게 성형 및 탈형할 수 있도록 한 불소수지 소재 반응사출성형식 금형에 관한 것이다. The present invention relates to a reaction injection mold for a memory foam ear plug processed with a fluorine resin material, and in particular, a fluorine resin material reaction for easily forming and demoulding the ear plug of a memory foam material without using a release agent. An injection molding die.

일반적으로 메모리폼 이어플러그의 재료로는 발포 폴리우레탄이 사용되고 있으며, 성형을 위한 금형으로는 금속재의 반응사출성형식 금형이 많이 사용되고 있다.In general, foamed polyurethane is used as a material of the memory foam earplugs, and a reaction injection molding mold of a metal material is used as a mold for molding.

그런데, 상기 발포 폴리우레탄은 보통 표면 점착성(혹은 끈적임)이 있어, 금형에 쉽게 달라붙기 때문에 메모리폼이 금형틀로부터 쉽게 탈형되지 않는 문제점이 있었다.However, the foamed polyurethane usually has a surface adhesiveness (or stickiness), and thus has a problem in that the memory foam is not easily demolded from the mold because it easily sticks to the mold.

이를 방지하기 위해, 종래에는 메모리폼의 원료주입 이전에 금형의 내부 표면에 이형제를 도포하여 금형과 메모리폼 사이에 분리막을 형성하였고, 탈형과정에서는 금형과 메모리폼의 틈새로 공압을 분사하는 방식이 주로 사용되어 왔다.In order to prevent this, conventionally, a mold release agent was applied to the inner surface of the mold before injection of the raw material of the memory foam to form a separator between the mold and the memory foam. Mainly used.

보다 구체적으로는, 도 1에 나타낸 바와 같이, 먼저, 불소수지 소재(1)를 금형에 주입하기 전에 금형틀(11)과 금형덮개(13)의 내면에 미리 이형제(12)를 도포하여 얇은 막을 형성한다. 메모리폼 이어플러그의 성형후 이형제의 막은 곧 사라지므로, 탈형작업시 금형덮개(13)를 열고 금형틀(11)에 남아 있는 메모리폼 이어플러그(1)를 공압(14)을 이용하여 분리할 필요가 있다.More specifically, as shown in FIG. 1, first, before the fluorine resin material 1 is injected into the mold, the mold release agent 12 is applied to the inner surfaces of the mold mold 11 and the mold lid 13 in advance to obtain a thin film. Form. After molding of the memory foam earplugs, the film of the release agent disappears soon. Therefore, during the demolding operation, it is necessary to open the mold cover 13 and separate the memory foam earplugs 1 remaining in the mold mold 11 using pneumatics 14. There is.

그러나, 이형제의 도포와 공압의 분사작업은 매우 번거로운 공정일 뿐만 아니라, 인체에 유해한 분진과 악취를 발생시켜 열악한 작업환경을 유발할 수 있다는 문제점이 있었다.However, the application of the release agent and spraying of the pneumatic pressure is not only a very cumbersome process, but also has a problem in that it may cause harmful dust and odor to the human body and cause a poor working environment.

또한, 이형제의 도포가 불균일할 경우에는 제품불량의 원인이 되었다.In addition, uneven application of the release agent caused product defects.

본 발명은 상기한 문제점을 해결하기 위해 안출된 것으로서, 발명의 목적은 폴리우레탄으로 구성된 메모리폼 이어플러그을 형성할 때 이형제를 사용하지 않고서도 달라붙는 경우가 없어, 환경오염을 대폭 줄이고 제품의 품질을 크게 향상시킬 수 있는 불소수지 소재를 가공한 메모리폼 이어플러그용 반응사출성형식 금형을 제공하는데 있다.The present invention has been made to solve the above problems, the object of the invention is that when forming a memory foam earplug made of polyurethane, without sticking without using a release agent, significantly reduce environmental pollution and improve the quality of the product To provide a reaction injection molding mold for memory foam earplugs processed with fluorine resin material which can be greatly improved.

상기한 목적을 달성하기 위해, 본 발명에 따른 불소수지 소재를 가공한 메모리폼 이어플러그용 반응사출성형식 금형은,In order to achieve the above object, the reaction injection molding mold for memory foam ear plugs processed fluorine resin material according to the present invention,

금형덮개와 금형틀로 구성되며,It consists of mold cover and mold frame,

상기 금형틀은 폴리테트라플루오르에틸렌(PTFE)과 같은 불소수지 소재를 가공하여 만든 것을 특징으로 한다.The mold is characterized in that made by processing a fluororesin material such as polytetrafluoroethylene (PTFE).

여기서, 상기 금형덮개는 금속으로 구성된 것이 바람직하다.Here, the mold cover is preferably composed of a metal.

그리고, 상기 금형덮개의 표면은 표면처리가 이루어지지 않은 것이 바람직하다.The surface of the mold cover is preferably not surface treatment.

또한, 상기 금형틀은 금속으로 구성된 케이스에 수용되는 것이 바람직하다.In addition, the mold is preferably housed in a case made of metal.

이하, 첨부한 도 2를 참조하여 본 발명의 바람직한 일 실시예를 상세히 설명한다.Hereinafter, with reference to the accompanying Figure 2 will be described in detail a preferred embodiment of the present invention.

도 2는, 불소수지 소재를 가공한 메모리폼 이어플러그의 반응사출성형식 금형의 단면도이다.2 is a cross-sectional view of a reaction injection molding die of a memory foam ear plug processed with a fluorine resin material.

도시된 바와 같이, 본 실시예에 따른 메모리폼 이어플러그의 반응사출성형식 금형은 금형덮개(22)와 금형틀(21)로 구성되어 있다.As shown, the reaction injection molding mold of the memory foam ear plug according to the present embodiment is composed of a mold cover 22 and a mold frame 21.

상기 금형틀(21)은 폴리테트라플루오르에틸렌(PTFE)과 같은 불소수지 소재로 구성되어 있으며, 형상에 맞도록 가공하여 형성된다. 상기 금형틀(21)은 일반 금형용 금속으로 구성된 케이스(23)에 수용되는 것이 강도상 유리하다.The mold 21 is made of a fluorine resin material such as polytetrafluoroethylene (PTFE), and is formed by processing to fit the shape. It is advantageous in strength that the mold die 21 is housed in a case 23 made of a general mold metal.

그리고, 상기 금형틀(21)과 쌍을 이루는 금형덮개(22)는, 표면처리를 하지 않은 금속으로 구성되는 것이 좋다. 이는 메모리폼 상단과의 점착성을 유지하여 탈형을 보다 용이하게 하기 위함이다.The mold cover 22 paired with the mold frame 21 may be made of metal which has not been surface treated. This is to maintain the adhesiveness with the top of the memory foam to facilitate demolding.

상기 금형틀(21)을 구성하는 불소수지 소재는, 메모리폼의 원료인 폴리우레탄과 점착하지 않기 때문에 금형틀(21)의 내면에 이형제를 적용할 필요가 없다.Since the fluorine resin material constituting the mold 21 does not adhere to polyurethane, which is a raw material of the memory foam, it is not necessary to apply a release agent to the inner surface of the mold 21.

더욱이, 상기 금형덮개(22)는 표면처리가 없는 통상적인 금형소재로 구성되어 있고 이형제도 적용되지 않았기 때문에, 메모리폼 이어플러그의 탈형시 금형틀(21)로부터의 분리가 더욱 용이하게 된다(도 2의 오른쪽 도면 참조).Moreover, since the mold cover 22 is made of a conventional mold material without surface treatment and no release agent is applied, the mold cover 22 is more easily separated from the mold frame 21 when demolding the memory foam ear plug (Fig. 2, right side drawing).

이하, 도 2를 참조하여, 메모리폼 이어플러그을 형성하는 순서를 간략히 설 명한다.Hereinafter, the procedure for forming the memory foam ear plug will be briefly described with reference to FIG. 2.

먼저, 폴리우레탄 원료(1)를 금형틀(21)의 내부에 주입한 후 금형덮개(22)로 덮은 상태에서, 노에서 가열하면 기포가 발생되면서 메모리폼의 이어플러그가 생산된다.First, the polyurethane raw material 1 is injected into the mold mold 21 and then covered with a mold lid 22, and when heated in a furnace, air bubbles are generated and earplugs of the memory foam are produced.

이에 따라, 탈형시 금형덮개(22)가 열릴 때, 메모리폼은 표면장력이 거의 없는 금형틀(21)에는 점착하지 않고, 금형덮개(22)에 붙어서 자연스럽게 탈형이 이루어지게 된다.Accordingly, when the mold cover 22 is opened during demolding, the memory foam does not adhere to the mold frame 21 having almost no surface tension, and adheres to the mold cover 22 to naturally demold.

상기한 바와 같은 구성의 본 발명에 따르면, 비점착성이 강한 불소수지(일명 테프론)를 가공하여 금형틀을 만들고, 금형덮개는 표면처리가 이루어지지 않은 일반 금형소재에 의해 점착성을 크게 구성함으로써, 탈형시 메모리폼의 상단이 금형덮개에 부착되어 금형으로부터 쉽게 빠져 나올 수 있다.According to the present invention of the above-described configuration, by forming a mold by processing a non-adhesive fluorine resin (aka Teflon), the mold cover is formed by the large mold by the general mold material without surface treatment, demolding The top of the memory foam is attached to the mold cover so that it can be easily removed from the mold.

이에 따라, 이형제처리나 공압처리 등 별도의 공정이 필요없으므로, 제작시간이 크게 단축되고 재료비용도 절감된다.This eliminates the need for a separate process such as release agent treatment or pneumatic treatment, greatly reducing manufacturing time and reducing material costs.

또한, 이형제의 불균일한 도포로 인해 발생되던 불량률을 낮추고, 금형작업 시 발생하는 분진의 양을 현저하게 줄임으로서 작업환경을 개선시킬 수 있다는 이점도 있다.In addition, there is an advantage that the working environment can be improved by lowering the defect rate caused by uneven application of the release agent and significantly reducing the amount of dust generated during the mold operation.

Claims (4)

삭제delete 삭제delete 금형덮개와 금형틀로 구성되는 메모리폼 이어플러그용 반응사출성형식 금형에 있어서,In the reactive injection molding mold for memory foam ear plug, which consists of a mold cover and a mold frame, 상기 금형틀(21)은 불소수지 소재를 가공하여 만들고,The mold frame 21 is made by processing a fluorine resin material, 상기 금형덮개(22)는 금속으로 구성되어 있되, 상기 금형덮개(22)의 표면은 표면처리가 이루어지지 않은 것을 특징으로 하는 메모리폼 이어플러그용 반응사출성형식 금형.The mold cover 22 is made of a metal, the surface of the mold cover 22, the reaction injection molding mold for a memory foam ear plug, characterized in that the surface treatment is not made. 제3항에 있어서,The method of claim 3, wherein 상기 금형틀(21)은 금속으로 구성된 케이스(23)에 수용되는 것을 특징으로 하는 메모리폼 이어플러그용 반응사출성형식 금형.Reaction injection molding mold for a memory foam ear plug, characterized in that the mold frame 21 is accommodated in the case 23 made of metal.
KR1020050009688A 2005-02-02 2005-02-02 A rim made of teflon for manufacturing the memory foam ear-plug KR100681785B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838137A (en) 1981-08-31 1983-03-05 Shikoku Chem Corp Method of molding epoxy resin
JPS63120634A (en) 1986-11-10 1988-05-25 Sekisui Plastics Co Ltd Foaming mold
JPH01247432A (en) * 1988-03-29 1989-10-03 Nippon Valqua Ind Ltd Production of polytetrafluoroethylene resin molding
JPH05245848A (en) * 1992-03-04 1993-09-24 Shigetoshi Watanabe Release film of mold and method for forming the same
JP2001269938A (en) 2001-03-22 2001-10-02 Sumitomo Electric Ind Ltd Die for rubber: method for manufacturing die for rubber and method molding rubber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838137A (en) 1981-08-31 1983-03-05 Shikoku Chem Corp Method of molding epoxy resin
JPS63120634A (en) 1986-11-10 1988-05-25 Sekisui Plastics Co Ltd Foaming mold
JPH01247432A (en) * 1988-03-29 1989-10-03 Nippon Valqua Ind Ltd Production of polytetrafluoroethylene resin molding
JPH05245848A (en) * 1992-03-04 1993-09-24 Shigetoshi Watanabe Release film of mold and method for forming the same
JP2001269938A (en) 2001-03-22 2001-10-02 Sumitomo Electric Ind Ltd Die for rubber: method for manufacturing die for rubber and method molding rubber

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