KR100673529B1 - Substrate encap process - Google Patents

Abstract

The present invention relates to a process of encapsulating a thin plate on a substrate, the first step of placing the thin plate seated on the robot arm upper surface on the heating plate on which the substrate is placed at a predetermined distance (D1), the thin plate of the upper surface of the robot arm In the second step of picking up the horizontally movable tongs respectively installed on either side of the chamber and lifting the robot arm out of the chamber, the heating plate is raised to the thin plate and the minute gap D2, and the pump is operated to vacuum the chamber. It provides a substrate encap process comprising a third step of forming and a fourth step of opening the grip of the tongs of one side and horizontally moving in the chamber direction, and then horizontally moving the grips of the other tongs in the chamber direction.

Substrate Encap Process, Substrate, Sheet

Description

Substrate Encap Process {SUBSTRATE ENCAP PROCESS}

1 is a schematic side cross-sectional view of a first process operated in a chamber according to one embodiment of the present invention.

2 is a schematic side cross-sectional view of a second process according to an embodiment of the present invention.

3 is a schematic side cross-sectional view of a third process according to an embodiment of the present invention.

4A to 4C are schematic side cross-sectional views of a fourth process according to an embodiment of the present invention.

5 is a schematic view showing a state of encapsulating a thin plate on a substrate according to an embodiment of the present invention.

6A-B are schematic side views of a fourth process operated in a chamber in accordance with another embodiment of the present invention.

Figure 7 is a schematic diagram showing the appearance of encapsulating a thin plate on a substrate according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

10: substrate 20: thin plate

30: robot arm 40: tongs

50: heating plate 52: heating plate support

The present invention relates to a process for encapsulating a thin plate on a substrate, and more particularly, to an improved substrate encapsulation process by solving the problems of the existing encapsulation process.

Recently, with the rapid development of information and communication technology and the expansion of the market, a flat panel display has been spotlighted as a display device. Such flat panel displays include liquid crystal displays, plasma display panels, organic light emitting diodes, and the like.

 Among them, organic light emitting diodes have very good advantages such as fast response speed, lower power consumption than conventional liquid crystal display devices, light weight, no need for a separate back light device, and thus can be made ultra thin and high brightness. It is attracting attention as a next generation display device.

The organic light emitting device is a principle that self-luminescence is formed by applying a voltage difference between the anode and the cathode by applying an anode film, an organic thin film, and a cathode film on a substrate to form an organic energy thin film. That is, the excitation energy left by recombination of injected electrons and holes is generated as light. In this case, since the wavelength of light generated according to the amount of the dopant of the organic material may be adjusted, full color may be realized. In addition, glass substrates used for manufacturing displays are gradually becoming larger due to productivity improvement and larger displays.

The detailed structure of the organic light emitting device is an anode, a hole injection layer, a hole transfer layer, an emitting layer, an electron transfer layer, an electron injection on the substrate A layer (eletron injection layer), a cathode (cathode) is formed by stacking in order. In this case, ITO (Indium Tin Oxide) having a small sheet resistance and good permeability is mainly used as the anode. And an organic thin film is composed of a hole injection layer, a hole transport layer, light emitting layer, an electron transport layer, the electron injection layer, the multi-layer to increase the light emitting efficiency, an organic material used for the light emitting layer is Alq _3, TPD, PBD, m-MTDATA, TCTA. As the cathode, a LiF-Al metal film is used. In addition, since the organic thin film is very weak against moisture and oxygen in the air, a thin thin film is formed on the top to increase the life time of the device.

As a method of forming a thin plate on the conventional EL glass substrate, a process of seating a substrate on a heating plate in a vacuum chamber (Ultra Violet) chamber, a process of heat pressing, and a process of applying a UV adhesive And a method of encaping a thin plate has been performed.

In this case, when using the encapsulation method as described above, equipment for pressing the chamber is required, and thus the production process is complicated, and the cost for the substrate is high.

An object of the present invention to provide a substrate encapsulation process characterized in that the thin plate can be in close contact from the center of the substrate in order to solve the above problems.

In order to achieve the above object, the present invention, the first step of placing the thin plate seated on the robot arm upper surface on the heating plate on which the substrate is placed at a predetermined interval (D1) spaced, the thin plate of the robot arm upper surface of the chamber A second step of picking up the horizontally movable tongs respectively installed on both sides and removing the robot arm from the chamber, raising the heating plate to the thin plate and the minute gap D2, and operating a pump to form the chamber in a vacuum state; And a fourth step of horizontally moving the grips of the other side to the chamber direction by opening the grips of the tongs of the one side and horizontally moving the grips of the other side.

Here, the predetermined interval (D1) of the first step is preferably configured such that the thin plate is 50 to 90mm away from the upper surface of the substrate on the heating plate.

Then, the heating plate of the third process is raised so that the minute spacing D2 between the substrate and the thin plate is 1 to 11 mm.

In addition, according to one aspect of the present invention for achieving the above object, the first step of placing the thin plate seated on the robot arm upper surface on the heating plate on which the substrate is placed in a state spaced apart by a predetermined interval (D1), the robot arm upper surface In the second process of picking up the thin plate with horizontally movable tongs respectively installed on either side of the chamber and lifting the robot arm out of the chamber, the heating plate is raised to the thin plate and the minute interval D2, and a pump is operated to operate the chamber. It provides a substrate encapsulation process comprising a third step of forming a vacuum in the vacuum and a fourth step of horizontally moving each of the tongs portion in the chamber direction at the same time.

Here, the predetermined interval (D1) of the first step is preferably configured such that the thin plate is 50 to 90mm away from the upper surface of the substrate on the heating plate.

In addition, the heating plate of the third process is raised so that the minute spacing D2 between the substrate and the thin plate is 1 to 11 mm.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the specific embodiment of the present invention.

1 is a schematic side cross-sectional view of a first process operated in a chamber according to one embodiment of the present invention. As shown in the drawing, the thin plate 20 is brought into a chamber (not shown) in the robot arm 30 to encap the substrate 10 into the thin plate 20. At this time, the predetermined distance (D1) between the substrate and the thin plate is preferably about 50 to 90mm apart. At this time, tongs 40 made of a horizontally movable grip 40b and a grip support 40a on either side of the chamber (not shown) are prepared for the second process.

2 is a schematic side cross-sectional view of a second process according to an embodiment of the present invention. In the second step, the thin plate 20 on the upper surface of the robot arm 30 is picked up by horizontally movable tongs 40 provided on either side of a chamber (not shown), and the robot arm 30 is held by the chamber. Pull out from burrs (not shown).

3 is a schematic side cross-sectional view of a third process according to the present invention. In the third step, the heating plate 50 on which the substrate 10 is seated is raised to the thin plate 20 and the minute gap D2, and a pump (not shown) is operated to draw out air in the chamber. The chamber is vacuumed. Here, the heating plate 50 is supported by the heating plate support 52 in the form of a shaft (shaft) is installed in the chamber (not shown) to move up and down, the heating plate 50 is raised. At this time, it is preferable to raise the heating plate such that the minute spacing D2 between the substrate 10 and the thin plate 20 seated on the heating plate 50 becomes 1 mm to 11 mm.

4A-4C are schematic side cross-sectional views of a fourth process according to the present invention. In the fourth step, the grip 40b of the forceps 40 on the one side is opened and horizontally moved in the chamber direction, and then the grip 40b of the forceps 40 on the other side is horizontal in the chamber direction of the other side. Move it. 4A shows that the thin plate 20 is about 0.7 mm when the tong portion 40 of the one side is opened, so that the thin plate 20 is very thin so that its center portion sags due to gravity and comes into contact with the substrate. In this case, when the grip unit 40 having the grip 40b opened is horizontally moved in the chamber direction, the grip 40b is brought into close contact with one end at the center of the substrate 10 as shown in FIG. 4B. Thereafter, when the grip 42 of the other side clamping part 40 is opened and horizontally moved in the direction of the chamber on the other side, adhesion occurs from the center of the substrate to the other end as shown in FIG. The process of encapsulating the thin plate 20 is completed.

FIG. 5 schematically shows again that the thin plate 20 is in close contact with the substrate in the fourth process.

6A and 6B are schematic side views according to another embodiment of the fourth process of the present invention.

In the process of opening the grips 42 on each of the tongs 40 at the same time to move horizontally in the direction of each chamber (not shown), when each grip 42 of the tongs 40 is opened at the same time, the thin plate The central portion of the substrate 10 sags and contacts the substrate 20. When the tongs 40 are horizontally moved to the respective chambers, they are brought into close contact with the left and right of the center.

7 is a schematic view showing the thin plate 20 to encapsulate the thin plate on the substrate according to another embodiment of the fourth process of the present invention.

The present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary and various modifications and equivalent other embodiments may be made by those skilled in the art.

According to the substrate encapsulation process according to the present invention, since it is not a process of directly covering all conventional surfaces together, the adhesiveness is remarkably improved as compared with the conventional encapsulation process.

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Claims (6)

A first step of placing a thin plate coated with an adhesive on a heating plate on which a substrate is placed in a state spaced apart by a predetermined interval D1 using a robot arm; A second step of picking up the thin plates of the upper surface of the robot arm with horizontally movable tongs respectively provided on either side of the chamber and removing the robot arm from the chamber; A third step of raising the heating plate to the thin plate and the minute gap D2 and operating a pump to form the chamber in a vacuum state; And a fourth step of opening the grip of the tongs of one side and horizontally moving it in the chamber direction, and then horizontally moving the grip of the other of the tongs in the direction of the other chamber. The method of claim 1, The predetermined interval (D1) of the first step is a substrate encapsulation process, characterized in that the thin plate is 50 to 90mm away from the upper surface of the substrate on the heating plate. The method of claim 2, And raising the heat generating plate of the third process so that a small gap D2 between the substrate and the thin plate is 1 to 11 mm. A first step of placing a thin plate coated with an adhesive on a heating plate on which a substrate is placed in a state spaced apart by a predetermined interval D1 using a robot arm; A second step of picking up the thin plates of the upper surface of the robot arm with horizontally movable tongs respectively provided on either side of the chamber and removing the robot arm from the chamber; A third step of raising the heating plate to the thin plate and the minute gap D2 and operating a pump to form the chamber in a vacuum state; And a fourth process of horizontally moving each of the tongs in the chamber direction. The method according to claim 4, The predetermined interval (D1) of the first step is a substrate encapsulation process, characterized in that the thin plate is 50 to 90mm away from the upper surface of the substrate on the heating plate. The method of claim 5, And raising the heat generating plate of the third process so that a small gap D2 between the substrate and the thin plate is 1 to 11 mm.

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