KR100672629B1 - 스퍼터링 장치 - Google Patents
스퍼터링 장치 Download PDFInfo
- Publication number
- KR100672629B1 KR100672629B1 KR1020010011490A KR20010011490A KR100672629B1 KR 100672629 B1 KR100672629 B1 KR 100672629B1 KR 1020010011490 A KR1020010011490 A KR 1020010011490A KR 20010011490 A KR20010011490 A KR 20010011490A KR 100672629 B1 KR100672629 B1 KR 100672629B1
- Authority
- KR
- South Korea
- Prior art keywords
- target
- substrate
- rod anode
- rod
- sputtering apparatus
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (5)
- 진공 챔버;상기 진공 챔버 내에 배치되며 성막하고자 하는 물질로 이루어진 타겟;상기 타겟과 소정 간격을 두고 배치되며 거친 표면을 갖는 로드 애노드들;상기 로드 애노드와 소정 간격을 두고 배치되어 상기 타겟에서 이탈된 물질이 균일하게 성막되는 기판을 포함하여 구성되는 것을 특징으로 하는 스퍼터링 장치.
- 제 1 항에 있어서, 상기 로드 애노드의 표면은 연속 또는 불연속적인 요철을 갖는 것을 특징으로 하는 스퍼터링 장치.
- 제 1 항에 있어서, 상기 로드 애노드는 상기 타겟의 주위를 따라 형성된 그라운드 실드(Ground shied)에 의해 고정되는 것을 특징으로 하는 스퍼터링 장치.
- 제 1 항에 있어서, 일측이 축으로 고정되어 상승 및 하강이 가능한 기판 지지대를 더 포함하여 구성되는 것을 특징으로 하는 스퍼터링 장치.
- 제 2 항에 있어서, 상기 요철은 첨상 또는 마름모 형상인 것을 특징으로 하는 스퍼터링 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010011490A KR100672629B1 (ko) | 2001-03-06 | 2001-03-06 | 스퍼터링 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010011490A KR100672629B1 (ko) | 2001-03-06 | 2001-03-06 | 스퍼터링 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020071362A KR20020071362A (ko) | 2002-09-12 |
KR100672629B1 true KR100672629B1 (ko) | 2007-01-23 |
Family
ID=27696525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010011490A KR100672629B1 (ko) | 2001-03-06 | 2001-03-06 | 스퍼터링 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100672629B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9340868B2 (en) | 2012-09-18 | 2016-05-17 | Samsung Display Co., Ltd. | Sputtering device |
US11637001B2 (en) | 2020-05-28 | 2023-04-25 | Samsung Display Co., Ltd. | Deposition apparatus and deposition method using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100873032B1 (ko) * | 2007-04-20 | 2008-12-09 | 주식회사 디엠에스 | 저온 폴리 실리콘 결정화용 촉매 금속 도핑 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634874A (en) * | 1983-09-26 | 1987-01-06 | U.S. Philips Corporation | Electron lithography apparatus |
US5098542A (en) * | 1990-09-11 | 1992-03-24 | Baker Hughes Incorporated | Controlled plating apparatus and method for irregularly-shaped objects |
US5269898A (en) * | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
KR970072053A (ko) * | 1996-04-09 | 1997-11-07 | 장진 | 원격 플라즈마 화학기상증착 장비 |
JP2000199060A (ja) * | 1998-12-28 | 2000-07-18 | Sony Corp | 電子サイクロトロン共鳴プラズマスパッタ装置及び薄膜の製造方法 |
-
2001
- 2001-03-06 KR KR1020010011490A patent/KR100672629B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634874A (en) * | 1983-09-26 | 1987-01-06 | U.S. Philips Corporation | Electron lithography apparatus |
US5098542A (en) * | 1990-09-11 | 1992-03-24 | Baker Hughes Incorporated | Controlled plating apparatus and method for irregularly-shaped objects |
US5269898A (en) * | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
KR970072053A (ko) * | 1996-04-09 | 1997-11-07 | 장진 | 원격 플라즈마 화학기상증착 장비 |
JP2000199060A (ja) * | 1998-12-28 | 2000-07-18 | Sony Corp | 電子サイクロトロン共鳴プラズマスパッタ装置及び薄膜の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9340868B2 (en) | 2012-09-18 | 2016-05-17 | Samsung Display Co., Ltd. | Sputtering device |
US11637001B2 (en) | 2020-05-28 | 2023-04-25 | Samsung Display Co., Ltd. | Deposition apparatus and deposition method using the same |
US12051569B2 (en) | 2020-05-28 | 2024-07-30 | Samsung Display Co., Ltd. | Deposition apparatus and deposition method using the same |
Also Published As
Publication number | Publication date |
---|---|
KR20020071362A (ko) | 2002-09-12 |
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